CN105655472A - COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns - Google Patents
COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns Download PDFInfo
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- CN105655472A CN105655472A CN201610073337.4A CN201610073337A CN105655472A CN 105655472 A CN105655472 A CN 105655472A CN 201610073337 A CN201610073337 A CN 201610073337A CN 105655472 A CN105655472 A CN 105655472A
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- metal guide
- guide plume
- light source
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 129
- 239000002184 metal Substances 0.000 title claims abstract description 129
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 238000011900 installation process Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 13
- 239000003292 glue Substances 0.000 abstract description 10
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000008859 change Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002360 explosive Substances 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007850 degeneration Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns. The COB LED light source comprises at least one LED chip (2) arranged in a light emitting area (11) of a substrate, wherein a fluorescent glue layer (31) is bonded at the light emitting area (11) of the substrate, at least one metal heat-conducting column (4) is also arranged at the light emitting area (11) of the substrate; and the fluorescent glue layer (31) covers the LED chip (2) and the metal heat-conducting columns (4). The COB LED light source disclosed by the invention has the effects that heat of fluorescent glue covering on the LED lamp chip is conducted to the substrate by the metal heat-conducting columns, so that the temperature of PN junctions of the LED chip is reduced. The COB LED light source has the advantages of being fast in heat dissipation, high in light-emitting efficiency and easy in industrialization.
Description
Technical field
The invention belongs to illumination optical technical field of lamps, particularly relate to a kind of metal guide plume COBLED light source.
Background technology
COBLED light source is on a kind of mirror metal substrate that LED chip is placed directly against high reflecting rate, adopt the integrated area source of specular removal that COB encapsulation technology is bonded with circuit board by bonding wire, it is relative to the LED light source of other structures, there is rapid heat dissipation, be easy to luminous intensity distribution, exempt from reflow soldering, reduce the advantages such as Design of Luminaires difficulty, be therefore increasingly widely applied in LED encapsulation technology field.
In the market that high power, COBLED light source requirements highly integrated, specular removal is more and more extensive, and the COBLED light source of high power, highly integrated, specular removal, its fluorescent glue surface temperature relatively can be higher, when being in higher temperature, the easy degeneration of fluorescent glue, the translucent effect that aging, jaundice affects LED, and cause that LED chip PN junction junction temperature increases therewith, and increase the loss of LED chip thus causing the degeneration of photoelectric parameter, so, the light extraction efficiency of COBLED light source and the reliability of product it are greatly lowered. Prior art is mainly replaced on material according to the different different structure to LED lamp of the heat conductivity of different materials, or by adding the liquid such as heat-conducting medium such as water, limited use in improving radiating efficiency in lamp interior space.
A kind of COBLED lamp cylinder with radiator structure of the patent disclosure of patent No. ZL201420193759.1, including a radiator structure, described cooling mechanism includes radiator and heat conductive silica gel, described radiator includes a mid portion and the circle radiating fin being connected by many rib with mid portion, and described heat conductive silica gel is placed in described radiator mid portion. The fitting structure relative complex of the program, installs inconvenience, and radiator structure is distant with LED light source, and heat conduction is insufficient, it is impossible to effectively reduce the PN junction junction temperature of LED light source.
Summary of the invention
For the technological deficiency that can not reduce luminescence chip PN junction junction temperature that prior art exists, it is an object of the invention to provide a kind of to fluorescent glue good heat dissipation effect, reduce the temperature of LED chip PN junction, improve the metal guide plume COBLED light source in product service life, including at least one LED chip 2 being arranged on substrate luminous zone 11, fluorescent adhesive layer 31 bonds described substrate luminous zone 11;
Wherein, described substrate luminous zone 11 is additionally provided with at least one metal guide plume 4, and described fluorescent adhesive layer 31 covers described LED chip 2 and described metal guide plume 4.
Preferably, described metal guide plume 4 vertically or is obliquely installed relative to described substrate luminous zone 11 by a junction point 41.
Preferably, described metal guide plume 4 is the one of following shape along its length:
-cylindrical;
-cuboid;
-cone;
-triangular pyramidal; Or
-trapezoidal shape.
Preferably, described metal guide plume 4 is of a size of following one:
-described metal guide plume 4 along its length cylindrically shaped, and the diameter of the cross section of described metal guide plume 4 is 0.5mil��50mil;
-described metal guide plume 4 along its length be shaped as cuboid, and the cross-sectional area of described metal guide plume 4 is 0.25mil2��2500mil2��
Preferably, described metal guide plume 4 is fixed on described substrate luminous zone 11 by least two junction point 41 and is formed bridge architecture.
Preferably, the cross sectional shape of described metal guide plume 4 is rectangle, trapezoidal, cylindrical or oval.
Preferably, the cross sectional shape of described metal guide plume 4 is circular, and the diameter of described metal guide plume is 0.5mil��20mil.
Preferably, described metal guide plume 4 is fixed on described substrate luminous zone 11 by two junction points 41, and described metal guide plume 4 along its length be shaped as rectangle, trapezoidal, arc or waveform.
Preferably, described COBLED light source also includes substrate 1, and described LED chip 2 is arranged on substrate 1 by formal dress or reverse installation process;
Wherein, described substrate 1 being provided with the first connecting portion 111, described lens 34 are provided with the second connecting portion 112, described first connecting portion 111 and the second connecting portion 112 structure matching and are connected with each other.
The present invention plants metal guide plume by the LED chip periphery in PCB substrate, and metal guide plume is coated with by fluorescent glue, by metal guide plume, the heat of fluorescent glue is conducted to substrate, can effectively reduce the PN junction junction temperature of LED chip, thus adding the reliability of COBLED light source and improve the light extraction efficiency of COBLED light source, there is production technology simultaneously simple, it is easy to the advantage of industrialization.
Accompanying drawing explanation
By reading detailed description non-limiting example made with reference to the following drawings, the other features, objects and advantages of the present invention will become more apparent upon:
Fig. 1 illustrates a kind of detailed description of the invention of the present invention, the explosive view of a kind of metal guide plume COBLED light source;
Fig. 2 illustrates a kind of embodiment of the present invention, the explosive view of a kind of metal guide plume COBLED light source;
Fig. 3 illustrates the scattergram of one embodiment of the present of invention, metal guide plume and LED chip;
Fig. 4 illustrates the scattergram of one embodiment of the present of invention, metal guide plume and LED chip; And
Fig. 5 illustrates the scattergram of one embodiment of the present of invention, metal guide plume and LED chip.
Detailed description of the invention
In order to better make technical scheme clearly show, below in conjunction with accompanying drawing, the present invention is described further. Skilled artisan understands that, structural representation shown in accompanying drawing is mainly in order to illustrate embodiment, assembly in figure is not drawn to scale, its shape and structure are mainly in order to represent each assembly and mutual relation thereof, and those skilled in the art are referred to accompanying drawing illustrated embodiment and realize the technology contents of the present invention.
Fig. 1 illustrates a kind of detailed description of the invention of the present invention, a kind of explosive view of metal guide plume COBLED light source, it will be appreciated by those skilled in the art that Fig. 1 is simply according to the one of the present invention preferably technique of painting, described metal guide plume COBLED light source can also have other forms of expression.
Specifically, Fig. 1 illustrates a kind of to fluorescent glue good heat dissipation effect, reduce LED chip PN junction junction temperature, improve the explosive view of the metal guide plume COBLED light source in product service life, including, substrate luminous zone 11, at least one LED chip 2, at least one metal guide plume 4 and fluorescent adhesive layer 31, wherein, described LED Fluorescence chip 2 and described metal guide plume 4 are arranged on described substrate luminous zone 11, and described fluorescent adhesive layer 31 bonds described substrate luminous zone 11 cover and be arranged on LED chip 2 and the metal guide plume 4 of described substrate luminous zone 11. Specifically, described LED chip 2 can pass through formal dress or be inverted on described substrate luminous zone 11, and with the connection of described substrate luminous zone 11, skilled artisan understands that, above-mentioned installation method is the fixed form that this area LED chip is conventional, in actual applications, it is possible to select any one mounting means as required, do not repeat them here.
It will be appreciated by those skilled in the art that positive cartridge chip is generally used for the encapsulation of low-power LED chip, and the encapsulation of high-power LED chip generally adopts controlled collapsible chip connec-tion to encapsulate. Specifically, formal dress technique adopts gold thread to be connected with support both positive and negative polarity by the PN junction of described LED chip; Reverse installation process is by the both positive and negative polarity eutectic bonding on direct for the PN junction of LED chip and substrate, it does not have use gold thread. More specifically, it will be appreciated by those skilled in the art that the formal dress of described LED chip or reverse installation process belong to prior art, those skilled in the art according to the technology contents of the existing techniques in realizing present invention, can not repeat them here.
Further, adopt the mode that described LED chip is fixed on described substrate luminous zone 11 by COB encapsulation technology mainly to include below scheme, the first step, adopt dilator by LED wafer thin film uniform expansion, make to be attached to the compact arranged LED grain of film surface to pull open, in order to thorn crystalline substance; Next adopt point gum machine by appropriate crystal-bonding adhesive point on substrate; Then it is fixed on substrate by LED chip vacuum slot to have put the position of crystal-bonding adhesive; Further, described crystal-bonding adhesive is dried and makes it solidify, specifically, it is possible to described substrate is placed in calorstat process a period of time; Next spun gold or aluminium wire bonding machine is adopted to be bonded by the pad that LED chip is corresponding with on substrate. Described substrate is preferably round, square, regular hexagon or other regular polygons, the material of described substrate is preferably aluminium base, described aluminium base is the copper-clad plate that a kind of heat sinking function is good, including line layer, thermally conductive insulating layer and metal-based layer, described LED chip 2 pastes adornment at described line layer, described line layer forms printed circuit through over etching, the heat that in use procedure, LED chip produces is transmitted to metal-based layer by described insulating barrier, it is diffused into module-external again, it is achieved heat radiation by metal basal board. Wherein, the particular polymer that described insulating barrier is filled by the ceramic dielectric of high heat conduction, high insulation is constituted. Further, it will be appreciated by those skilled in the art that described substrate can also is that substrate prepared by copper or other metal material substrates or pottery, silicon raw material.
Further, at least one described LED chip 2 is distributed on described substrate 1, and those skilled in the art can arbitrarily set the described LED chip 2 arrangement mode on described substrate 1 as required. Specifically, Fig. 1 illustrates that 3 LED chips 2 are linearly distributed on described substrate luminous zone 11, Fig. 2 to Fig. 5 illustrates that 4 LED chips 2 are rectangular and is distributed on described substrate luminous zone 11, and those skilled in the art can do different changes on this basis, meets different application needs.It will be appreciated by those skilled in the art that plurality of LEDs integrated chip can be encapsulated by employing COB packaging LED chips, the shape forming area source and described area source can change as required, makes uniform in light emission, light soft.
Further, metal guide plume 4 described at least one is fixed on described substrate luminous zone 11, and the two ends of described metal guide plume 4 are preferably by being weldingly fixed on described substrate luminous zone 11. Described metal guide plume is preferably the high metal of the rate of heat dissipation such as copper, aluminum or their alloy. Described metal guide plume 4 is distributed in described LED chip 2 periphery, specifically, skilled artisan understands that, described LED chip 2 is evenly spaced on described substrate luminous zone 11 at center, described substrate luminous zone 11 to external radiation, and described heat dissipation metal post 4 is distributed in the surrounding in region, described LED chip areal area. Specifically, Fig. 2 to Fig. 5 has four described heat dissipation metal posts 4 in illustrating, and described heat dissipation metal post 4 is placed in the both sides of described LED chip 2. Changing as one, described LED chip 2 and described heat dissipation metal post 4 are staggered and uniformly distributed on described substrate luminous zone 11. In another change case, other the vacant position beyond described heat dissipation metal post 4 LED chip 2 layout area described in described substrate luminous zone 11 is uniformly distributed. As more change, described LED chip 2 can be made various deformation with the number of described heat dissipation metal post 4 and the arrangement mode in described substrate luminous zone 11 by those skilled in the art as required, does not repeat them here.
Further, described fluorescent adhesive layer 31 covers described LED chip 2. Specifically, adopt COB encapsulation technology, after described LED chip 2 is fixed on described substrate 1, carry LED chip 2 relevant position with point gum machine again and inject appropriate fluorescent glue formation fluorescent adhesive layer 31, again described fluorescent adhesive layer is carried out cured, even if described fluorescent adhesive layer covers described LED chip 2 and described metal guide plume 4 and fixing with described substrate 1 is connected. Further, the colloidal materials of described fluorescent adhesive layer 31 selects epoxy resin, silica gel or other macromolecule resin materials, described fluorescent adhesive layer 31 prepares by being mixed into fluorescent material when preparing described colloid in described colloid raw material, and the color of described fluorescent material can be red, yellow or green and other colors. Further, it will be appreciated by those skilled in the art that employing silica gel has the not easily advantage such as aging, anti-ultraviolet radiation and excellent light transmittance, refractive index, corrosion resistance, thermostability as the material of described fluorescent adhesive layer 31.
Further, as shown in Figures 1 to 5, single described fluorescent adhesive layer 31 covers whole described LED chip 2 simultaneously, specifically, one described fluorescent adhesive layer 31 covers whole described LED chip 2 and whole described metal guide plume 4, described LED chip 2 is uniformly distributed on described substrate 1, and described metal guide plume is distributed in described LED chip 2 periphery, the hemispherical dome structure that described fluorescent adhesive layer 31 is. More specifically, described fluorescent adhesive layer be shaped as ellipse. In one preferably change case, being shaped as of described fluorescent adhesive layer 31 is square, in such embodiments, correspondingly, described LED chip be shaped as square block so that described fluorescent adhesive layer 31 and described LED chip adapt better.
Further, the shape of the colloid end face of described fluorescent adhesive layer 31 can be convex surface, concave surface or plane, skilled artisan understands that, the change of interface curvature can change the shooting angle of emergent ray, thus light distribution and light emission rate on emergent light produce impact, those skilled in the art according to actual needs, can select the described end face of fluorescent adhesive layer 31 or the shape at other positions and curvature are made various deformation, do not repeat them here.
In a change case, multiple fluorescent adhesive layers can also be passed through and cover whole described LED chips 2 and whole described metal guide plume 4, such as there are two fluorescent adhesive layers independent of each other, one fluorescent adhesive layer covers a part of described LED chip 2 and a part of described metal guide plume 4, and another fluorescent adhesive layer covers LED chip 2 described in another part and metal guide plume 4 described in another part. Again such as, three fluorescent adhesive layers independent of each other, each fluorescent adhesive layer correspondence are had to cover the described metal guide plume 4 of described LED chip 2 and 1/3 quantity of 1/3 quantity. Those skilled in the art can do different changes on this basis, does not repeat them here.
Further, as depicted in figs. 1 and 2, described metal guide plume 4 vertically or is obliquely installed relative to described substrate luminous zone 11 by a junction point 41. Specifically, described metal guide plume can be fixed on described substrate luminous zone 11 by usual manners such as bonding or eutectic welding. More specifically, the described junction point 41 shown in Fig. 1 and Fig. 2 is point-like, changes as one, and described junction point 41 can also is that planar, and the heat being so more beneficial for described metal guide plume 4 is delivered to described substrate luminous zone 11 by described junction point 41.
Further, described metal guide plume 4 shown in Fig. 1 is perpendicular to described substrate luminous zone 11, described metal guide plume 4 shown in Fig. 2 favours described substrate luminous zone 11, and the shape that the described metal guide plume shown in Fig. 1 and Fig. 2 is along its length is strip, as some changes, described metal guide plume 4 can be cylinder, cuboid, cone, triangular pyramidal or trapezoidal shape. It will be appreciated by those skilled in the art that described metal guide plume 4 is more big near the cross section of the part of described substrate luminous zone 11, be then more conducive to heat to be transmitted to described substrate luminous zone 11.
Further, the size of described metal guide plume 4 cross section can do different changes according to different applicable cases, such as, when described metal guide plume 4 along its length cylindrically shaped, the diameter of the cross section of described metal guide plume 4 is 0.5mil��50mil. Again such as, when described metal guide plume 4 along its length be shaped as cuboid, the cross-sectional area of described metal guide plume 4 is 0.25mil2��2500mil2��
In a change case, described metal guide plume 4 is fixed on described substrate luminous zone 11 by least two junction point 41 and is formed bridge architecture. Specifically, described junction point 41 is two end points of described heat dissipation metal post 4, and two described junction points 41 are fixed on described substrate luminous zone 11 by the mode welded, and other position of described metal guide plume 4 is unsettled is arranged on top, described substrate luminous zone 11. In such embodiments, described heat dissipation metal post 4 forms a bridge architecture with described substrate luminous zone 11. Change as one, this described metal guide plume 4 has multiple end points, such as there are 3,4,5 even more end points, the multiple described end points of described metal guide plume 4 is chosen 3,4 or more and described substrate luminous zone 11 is fixed and is connected to form bridge architecture. It will be appreciated by those skilled in the art that the number of described metal guide plume is unsuitable too much, it is to avoid cause that the illumination effect of LED chip and quantity are affected.
In a preferred embodiment, the cross sectional shape of described metal guide plume 4 is circular, skilled artisan understands that, when the cross sectional shape of described metal guide plume 4 is circular, described metal guide plume has maximum specific surface area, in such embodiments, advantageously absorb heat in described metal guide plume 4 and be conducted to substrate.Specifically, the cross sectional shape of described metal guide plume can also be rectangle or trapezoidal or oval, skilled artisan understands that, the cross sectional shape of described metal guide plume 4 is preferably the shapes such as the polyhedron of rule, technique can be made simple, be beneficial to described metal guide plume 4 simultaneously and dispel the heat and do not affect the appearance.
Further, when the cross sectional shape of described metal guide plume 4 is circular, the diameter of described metal guide plume is 0.5mil, 10mil, 20mil or any any number between 0.5mil to 20mil. skilled artisan understands that, when the diameter of described metal guide plume 4 is too small, such as, less than 0.5mil, the requirement of the production technology of described metal guide plume 4 can be greatly improved, it is unfavorable for the industrialization of product, simultaneously, when the diameter of described heat dissipation metal post 4 is less than 0.5mil, can cause that the surface area of described heat dissipation metal post 4 is little, thus radiating effect is greatly reduced, and improve, by increasing the length of described heat dissipation metal post 4, the space increase that rate of heat dissipation can make heat dissipation metal post take, affect the illumination effect of described LED chip 2, simultaneously, in this case, the intensity of described heat dissipation metal post 4 also can decline, cause easily snapping off, especially the loss of described heat dissipation metal post is further speeded up in high temperature environments, when the diameter of described heat dissipation metal post 4 is excessive, such as, during more than 20mil, the bending process that not easily passs through of described heat dissipation metal post 4 shapes the shape obtaining needing, simultaneously, diameter is excessive, can cause the increase that takes up room, thus affecting described LED chip 2 to be distributed in number and the illumination effect of described substrate luminous zone 11.
Further, when described metal guide plume 4 is by being fixed on described substrate luminous zone 11, as shown in Figures 1 to 4, described metal guide plume shape along its length can rectangle, trapezoidal, arc or waveform. Skilled artisan understands that, described metal guide plume 4 geometric figure being preferably shaped to rule along its length, in such embodiments, described metal guide plume is prone to processing, and it is readily available corresponding shape, simultaneously, it is to avoid cause the space tying up substrate light-emitting zone thus affecting the illumination effect of described LED chip 2 because shape is excessively complicated. Specifically, the shape of described heat dissipation metal post 4 as required, can be carried out arranging arbitrarily and deformation, but this have no effect on technical scheme, does not repeat them here by those skilled in the art. Further, the height of described metal guide plume or radian height as far as possible, specifically, skilled artisan understands that, the height of described metal guide plume 4 is higher than described LED chip 2, but the height of described metal guide plume 4 is without departing from described fluorescent adhesive layer, causes that described fluorescent adhesive layer is impaired to avoid described metal guide plume 4 to contact with described fluorescent adhesive layer 31 and break. It will be appreciated by those skilled in the art that described metal guide plume can make described metal guide plume closer to described fluorescent adhesive layer higher than described LED chip 2, be beneficial to the heat of described fluorescent adhesive layer 31 by described metal guide plume 31 conduction to described substrate 1.
Further, skilled artisan understands that, the substrate 1 of described metal guide plume COBLED light source is also equipped with radiator, the heat being transmitted on described substrate 1 can be transmitted in environment by described radiator further, by the dual function with described metal guide plume, strengthen the radiating effect of described metal guide plume COBLED light source further, it is to avoid each parts, because of the overheated fault caused, improve service life and the illuminating effect of product.
Above specific embodiments of the invention are described. It is to be appreciated that the invention is not limited in above-mentioned particular implementation, those skilled in the art can make various deformation or amendment within the scope of the claims, and this has no effect on the flesh and blood of the present invention.
Claims (9)
1. a metal guide plume COBLED light source, it is characterised in that include at least one LED chip (2) being arranged on substrate luminous zone (11), fluorescent adhesive layer (31) bonds described substrate luminous zone (11);
Wherein, described substrate luminous zone (11) is additionally provided with at least one metal guide plume (4), and described fluorescent adhesive layer (31) covers described LED chip (2) and described metal guide plume (4).
2. COBLED light source according to claim 1, it is characterised in that described metal guide plume (4) is vertical relative to described substrate luminous zone (11) by a junction point (41) or is obliquely installed.
3. COBLED light source according to claim 2, it is characterised in that described metal guide plume (4) is the one of following shape along its length:
-cylindrical;
-cuboid;
-cone;
-triangular pyramidal; Or
-trapezoidal shape.
4. the COBLED light source according to Claims 2 or 3, it is characterised in that described metal guide plume (4) is of a size of following one:
-described metal guide plume (4) along its length cylindrically shaped, and the diameter of the cross section of described metal guide plume (4) is 0.5mil��50mil;
-described metal guide plume (4) along its length be shaped as cuboid, and the cross-sectional area of described metal guide plume (4) is 0.25mil2��2500mil2��
5. COBLED light source according to claim 1, it is characterised in that described metal guide plume (4) is fixed on described substrate luminous zone (11) by least two junction point (41).
6. COBLED light source according to claim 5, it is characterised in that the cross sectional shape of described metal guide plume (4) is following one:
-rectangle;
-trapezoidal;
-cylindrical; Or
-oval.
7. COBLED light source according to claim 6, it is characterized in that, described metal guide plume (4) is fixed on described substrate luminous zone (11) by two junction points (41), and described metal guide plume (4) along its length be shaped as following one:
-rectangle;
-trapezoidal;
-arc; Or
-waveform.
8. the COBLED light source according to any one of claim 5 to 7, it is characterised in that the cross sectional shape of described metal guide plume (4) is circular, and the diameter of described metal guide plume (4) is 0.5mil��20mil.
9. COBLED light source according to claim 8, it is characterised in that described COBLED light source also includes substrate (1), and described LED chip (2) is arranged on substrate by formal dress or reverse installation process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610073337.4A CN105655472A (en) | 2016-02-02 | 2016-02-02 | COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610073337.4A CN105655472A (en) | 2016-02-02 | 2016-02-02 | COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105655472A true CN105655472A (en) | 2016-06-08 |
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| CN201610073337.4A Pending CN105655472A (en) | 2016-02-02 | 2016-02-02 | COB (Chip On Board) LED (Light Emitting Diode) light source with metal heat-conducting columns |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200965886Y (en) * | 2006-08-07 | 2007-10-24 | 陈盈君 | LED light source package structure for low temperature co-fired ceramic with thermo separation design |
| US20080179612A1 (en) * | 2006-03-03 | 2008-07-31 | Kyung Ho Shin | Light-Emitting Diode Package and Manufacturing Method Thereof |
| CN101578473A (en) * | 2007-01-11 | 2009-11-11 | 松下电器产业株式会社 | Light source |
| CN103929925A (en) * | 2013-01-16 | 2014-07-16 | 欧司朗有限公司 | Radiation device, electronic device comprising same and lighting device comprising same |
| CN205429008U (en) * | 2016-02-02 | 2016-08-03 | 上海鼎晖科技股份有限公司 | Metal heat conduction post COB LED light source |
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- 2016-02-02 CN CN201610073337.4A patent/CN105655472A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080179612A1 (en) * | 2006-03-03 | 2008-07-31 | Kyung Ho Shin | Light-Emitting Diode Package and Manufacturing Method Thereof |
| CN200965886Y (en) * | 2006-08-07 | 2007-10-24 | 陈盈君 | LED light source package structure for low temperature co-fired ceramic with thermo separation design |
| CN101578473A (en) * | 2007-01-11 | 2009-11-11 | 松下电器产业株式会社 | Light source |
| CN103929925A (en) * | 2013-01-16 | 2014-07-16 | 欧司朗有限公司 | Radiation device, electronic device comprising same and lighting device comprising same |
| CN205429008U (en) * | 2016-02-02 | 2016-08-03 | 上海鼎晖科技股份有限公司 | Metal heat conduction post COB LED light source |
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Application publication date: 20160608 |