CN105618414A - Double-end cleaning gun of semiconductor silicon wafer cleaning machine - Google Patents
Double-end cleaning gun of semiconductor silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN105618414A CN105618414A CN201610145371.8A CN201610145371A CN105618414A CN 105618414 A CN105618414 A CN 105618414A CN 201610145371 A CN201610145371 A CN 201610145371A CN 105618414 A CN105618414 A CN 105618414A
- Authority
- CN
- China
- Prior art keywords
- jet orifice
- cleaning machine
- jet
- jet hole
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
- B05B12/04—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery for sequential operation or multiple outlets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/035—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material to several spraying apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a double-end cleaning gun of a semiconductor silicon wafer cleaning machine. The double-end cleaning gun comprises a fixed base, a pressurization cylinder is arranged on the fixed base and is provided with a first jet hole and a second jet hole, a control pressing sheet is arranged on the first jet hole and the second jet hole, the first jet hole is a linear jet hole, and the second jet hole is an atomization jet hole. According to the double-end cleaning gun of the semiconductor silicon wafer cleaning machine, a body is provided the fixed base, the pressurization cylinder is arranged on the fixed base and is provided with the two jet holes, one is the linear jet hole, the other is the atomization jet hole, the two jet holes are matched, and therefore the cleaning efficiency of the double-end cleaning gun of the semiconductor silicon wafer cleaning machine is greatly improved.
Description
Technical field
The present invention relates to a kind of double end cleaning device, more properly say, be a kind of semi-conductor silicon chip cleaning machine double end cleaning device.
Background technology
Semi-conductor silicon chip cleaning machine a kind of uses commonplace industrial equipments in industrial production, has comparatively wide application prospect. But, the cleaning device cleaning efficiency of the semi-conductor silicon chip cleaning machine generally used at present is not high.
Summary of the invention
The present invention mainly solves the technical problem existing for prior art, thus provides a kind of semi-conductor silicon chip cleaning machine double end cleaning device with higher cleaning efficiency.
The above-mentioned technical problem of the present invention is mainly solved by following technical proposals:
A kind of semi-conductor silicon chip cleaning machine double end cleaning device, comprise a fixing base, described fixing base is provided with a pressurized cylinder, described pressurized cylinder is provided with one first jet orifice and one the 2nd jet orifice, the first described jet orifice and the 2nd jet orifice are provided with a control compressing tablet.
As preferred embodiment of the present invention, the first described jet orifice is linear jet orifice.
As preferred embodiment of the present invention, the 2nd described jet orifice is atomised jet mouth.
Owing to the semi-conductor silicon chip cleaning machine double end cleaning device of the present invention is provided with a fixing base on body, this fixing base is provided with a pressurized cylinder, pressurized cylinder is provided with two jet orifices, a jet orifice is straight line jet orifice, another one jet orifice is atomised jet mouth, two jet orifices cooperatively interact, thus substantially increase the cleaning efficiency of semi-conductor silicon chip cleaning machine double end cleaning device.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, it is briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the perspective view of the semi-conductor silicon chip cleaning machine double end cleaning device of the present invention;
Fig. 2 is the perspective view of the semi-conductor silicon chip cleaning machine double end cleaning device in Fig. 1, is now another visual angle.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention are made more explicit defining.
The present invention provides a kind of semi-conductor silicon chip cleaning machine double end cleaning device with higher cleaning efficiency.
As shown in Figure 1 and Figure 2, a kind of semi-conductor silicon chip cleaning machine double end cleaning device 1, comprise a fixing base 2, described fixing base 2 is provided with a pressurized cylinder 3, described pressurized cylinder 3 is provided with one first jet orifice 41 and one the 2nd jet orifice 42, the first described jet orifice 41 and the 2nd jet orifice 42 are provided with a control compressing tablet 5.
As shown in Figure 1 and Figure 2, the first described jet orifice 41 is linear jet orifice.
As shown in Figure 1 and Figure 2, the 2nd described jet orifice 42 is atomised jet mouth.
The semi-conductor silicon chip cleaning machine double end cleaning device of this invention is provided with a fixing base on body, this fixing base is provided with a pressurized cylinder, pressurized cylinder is provided with two jet orifices, a jet orifice is straight line jet orifice, another one jet orifice is atomised jet mouth, two jet orifices cooperatively interact, thus substantially increase the cleaning efficiency of semi-conductor silicon chip cleaning machine double end cleaning device.
The mentality of designing of the present invention is below only described in one embodiment, and when system allows, the present invention can expand to external more function module simultaneously, thus expands its function to greatest extent.
The above, be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any change of expecting without creative work or replacement, all should be encompassed within protection scope of the present invention. Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim book limits.
Claims (3)
1. semi-conductor silicon chip cleaning machine double end cleaning device (1), comprise a fixing base (2), it is characterized in that, described fixing base (2) is provided with a pressurized cylinder (3), described pressurized cylinder (3) is provided with one first jet orifice (41) and one the 2nd jet orifice (42), described the first jet orifice (41) and the 2nd jet orifice (42) are provided with a control compressing tablet (5).
2. semi-conductor silicon chip cleaning machine double end cleaning device according to claim 1, it is characterised in that, described the first jet orifice (41) is linear jet orifice.
3. semi-conductor silicon chip cleaning machine double end cleaning device according to claim 2, it is characterised in that, the 2nd described jet orifice (42) is atomised jet mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145371.8A CN105618414A (en) | 2016-03-15 | 2016-03-15 | Double-end cleaning gun of semiconductor silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610145371.8A CN105618414A (en) | 2016-03-15 | 2016-03-15 | Double-end cleaning gun of semiconductor silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105618414A true CN105618414A (en) | 2016-06-01 |
Family
ID=56033978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610145371.8A Pending CN105618414A (en) | 2016-03-15 | 2016-03-15 | Double-end cleaning gun of semiconductor silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105618414A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104075A (en) * | 1996-06-05 | 1998-01-06 | Samsung Electron Co Ltd | Apparatus and method for cleaning semiconductor wafer |
| CN201711304U (en) * | 2010-06-28 | 2011-01-19 | 渭南安信电子技术有限公司 | Wafer cleaning machine used for cleaning monocrystalline silicon wafers |
| CN102194657A (en) * | 2010-03-18 | 2011-09-21 | 大日本网屏制造株式会社 | Device for cleaning and treating substrate |
| CN203316419U (en) * | 2013-05-23 | 2013-12-04 | 王月芳 | Semiconductor cleaner |
| CN203983246U (en) * | 2014-08-21 | 2014-12-03 | 浙江辉弘光电能源有限公司 | A kind of silicon chip cleaning device |
| CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
-
2016
- 2016-03-15 CN CN201610145371.8A patent/CN105618414A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104075A (en) * | 1996-06-05 | 1998-01-06 | Samsung Electron Co Ltd | Apparatus and method for cleaning semiconductor wafer |
| CN102194657A (en) * | 2010-03-18 | 2011-09-21 | 大日本网屏制造株式会社 | Device for cleaning and treating substrate |
| CN201711304U (en) * | 2010-06-28 | 2011-01-19 | 渭南安信电子技术有限公司 | Wafer cleaning machine used for cleaning monocrystalline silicon wafers |
| CN203316419U (en) * | 2013-05-23 | 2013-12-04 | 王月芳 | Semiconductor cleaner |
| CN203983246U (en) * | 2014-08-21 | 2014-12-03 | 浙江辉弘光电能源有限公司 | A kind of silicon chip cleaning device |
| CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160601 |