CN105525312A - Tin plating solution and preparation method thereof - Google Patents
Tin plating solution and preparation method thereof Download PDFInfo
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- CN105525312A CN105525312A CN201510911722.7A CN201510911722A CN105525312A CN 105525312 A CN105525312 A CN 105525312A CN 201510911722 A CN201510911722 A CN 201510911722A CN 105525312 A CN105525312 A CN 105525312A
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- plating solution
- methylsulphonic acid
- tin
- tin plating
- potassium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to the technical field of electroplating and particularly discloses a tin plating solution and a preparation method thereof. The tin plating solution contains the following components: sodium gluconate or potassium gluconate, potassium methanesulfonate or ammonium methanesulfonate, sodium citrate, sodium tartrate, dodecyl dimethyl benzyl ammonium chloride, ammonia water and tin methanesulfonate. Compared with the existing tin plating solution, the tin plating solution can be used for electroplating production at the temperature of 25-35 DEG C, can be used for electroplating a non-acidic solution, is very wide in application range and can be used for increasing the current by 100% and increasing the plating speed by 100% during electroplating and reducing the electroplating cost by 20%.
Description
Technical field
The present invention relates to electroplating technology field, be specifically related to a kind of tin plating solution and preparation method thereof.
Background technology
Tin plating solution is a kind of dedicated liquid for zinc-plated industry, can be used for alloy surface and carries out zinc-plated, and tin coating is bright silvery white, can increase the weldability of metal and ornamental, not affect electroconductibility, can be used for electronic industry, household goods, the aspects such as food product pack.
But current tin plating solution pH value is 2-4, subacidity, easily spread when high electric current plating, plating solution will be refrigerated to 20-28 DEG C of use, and during plating, electric current is little, and speed is slow, and plating solution processing range is little.Therefore, existing tin plating solution uses and is limited to, and causes Electroplating Production cost high further.
Summary of the invention
Technical problem to be solved by this invention is, in order to overcome the above-mentioned deficiency of prior art, provides a kind of tin plating solution.
Above-mentioned technical problem to be solved by this invention is achieved by the following technical programs: a kind of tin plating solution, comprises following composition: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate, dodecyl benzyl dimethyl ammonium chloride, ammoniacal liquor and tin methane sulfonate.
Preferably, described tin plating solution, comprises the composition of following weight percent: Sunmorl N 60S or Potassium Gluconate 2%-30%, methylsulphonic acid potassium or methylsulphonic acid ammonium 0.3%-10%, Trisodium Citrate 0.1%-10%, sodium tartrate 0.1%-10%, dodecyl benzyl dimethyl ammonium chloride 0.03%-3%, ammoniacal liquor 0.1%-10% and tin methane sulfonate 0.2%-5%.
More preferably, described tin plating solution, comprises the composition of following weight percent: Sunmorl N 60S or Potassium Gluconate 5%-20%, methylsulphonic acid potassium or methylsulphonic acid ammonium 1%-5%, Trisodium Citrate 1%-5%, sodium tartrate 1%-5%, dodecyl benzyl dimethyl ammonium chloride 0.1%-1%, ammoniacal liquor 0.1%-1% and tin methane sulfonate 2%-5%.
Most preferably, described tin plating solution, comprises the composition of following weight percent: Sunmorl N 60S or Potassium Gluconate 15%, methylsulphonic acid potassium or methylsulphonic acid ammonium 4.5%, Trisodium Citrate 2%, sodium tartrate 2%, dodecyl benzyl dimethyl ammonium chloride 0.1%, ammoniacal liquor 0.2% and tin methane sulfonate 3.5%.
The preparation method of described tin plating solution, comprise following steps: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water dissolving together, then dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor, fully mix.
Preferably, the preparation method of described tin plating solution, comprise following steps: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 25-35 DEG C of dissolving, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
Beneficial effect: (1) the invention provides a kind of tin plating solution of brand-new formula; (2) tin plating solution described in can carry out Electroplating Production at 25-35 DEG C, and than existing tin plating solution 20-28 DEG C, degree temperature range is wide and temperature is high; (3) tin plating solution described in can carry out Electroplating Production under pH value 4-7, wider than the scope of the pH value (3-3.5) of existing tin plating solution, can be used for nonacidic solutions plating, is of wide application; (4) compared with existing tin plating solution, when tin plating solution of the present invention is electroplated, electric current can improve 100%, and plating speed improves 100%; Electroplating cost reduces by 20%.
Embodiment
Explain the present invention further below in conjunction with specific embodiment, but embodiment does not limit in any form to the present invention.
Embodiment 1 tin plating solution weight percent is filled a prescription: Sunmorl N 60S 30%, methylsulphonic acid potassium or methylsulphonic acid ammonium 0.3%%, Trisodium Citrate 0.1%%, sodium tartrate 0.1%%, dodecyl benzyl dimethyl ammonium chloride 0.03%, ammoniacal liquor 0.1% and tin methane sulfonate 0.2%, surplus are water.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
Embodiment 2 tin plating solution weight percent is filled a prescription: Sunmorl N 60S or Potassium Gluconate 30%, methylsulphonic acid potassium or methylsulphonic acid ammonium 10%, Trisodium Citrate 10%, sodium tartrate 10%, dodecyl benzyl dimethyl ammonium chloride 3%, ammoniacal liquor 10% and tin methane sulfonate 2.5%.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
Embodiment 3 tin plating solution weight percent is filled a prescription: Sunmorl N 60S or Potassium Gluconate 2%, methylsulphonic acid potassium or methylsulphonic acid ammonium 10%, Trisodium Citrate 10%, sodium tartrate 10%, dodecyl benzyl dimethyl ammonium chloride 3%, ammoniacal liquor 10% and tin methane sulfonate 2.5%.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
Embodiment 4 tin plating solution weight percent is filled a prescription: Sunmorl N 60S or Potassium Gluconate 5%, methylsulphonic acid potassium or methylsulphonic acid ammonium 5%, Trisodium Citrate 5%, sodium tartrate 5%, dodecyl benzyl dimethyl ammonium chloride 2%, ammoniacal liquor 5% and tin methane sulfonate 1%.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, methylsulphonic acid successively
Tin, ammoniacal liquor, fully mix.
Embodiment 5 tin plating solution weight percent is filled a prescription: Sunmorl N 60S or Potassium Gluconate 5%, methylsulphonic acid potassium or methylsulphonic acid ammonium 1%, Trisodium Citrate 1%, sodium tartrate 1%, dodecyl benzyl dimethyl ammonium chloride 0.3%, ammoniacal liquor 1% and tin methane sulfonate 2%.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, methylsulphonic acid successively
Tin, ammoniacal liquor, fully mix.
embodiment 6tin plating solution weight percent is filled a prescription: Sunmorl N 60S 15%, methylsulphonic acid potassium or methylsulphonic acid ammonium 4.5%%, Trisodium Citrate 2%%, sodium tartrate 2%%, dodecyl benzyl dimethyl ammonium chloride 0.1%, ammoniacal liquor 0.2% and tin methane sulfonate 3.5%, surplus are water.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
embodiment 7tin plating solution weight percent is filled a prescription: Sunmorl N 60S or Potassium Gluconate 15%, methylsulphonic acid potassium or methylsulphonic acid ammonium 4.5%, Trisodium Citrate 2%, sodium tartrate 2%, dodecyl benzyl dimethyl ammonium chloride 0.1%, ammoniacal liquor 0.2% and tin methane sulfonate 3.5%.
Preparation method: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 30 DEG C of dissolvings, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
Be proven tin plating solution in above-described embodiment compared with existing tin plating solution, can carry out Electroplating Production at 25-35 DEG C, than existing tin plating solution 20-28 DEG C, degree temperature range is wide and temperature is high; Electroplating Production can be carried out under pH value 4-7, wider than the scope of the pH value (3-3.5) of existing tin plating solution, can be used for nonacidic solutions plating, be of wide application; When electroplating, electric current can improve 100%, and plating speed improves 100%; Electroplating cost reduces by 20%.
Claims (6)
1. a tin plating solution, is characterized in that, comprises following composition: Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate, dodecyl benzyl dimethyl ammonium chloride, ammoniacal liquor and tin methane sulfonate.
2. tin plating solution according to claim 1, is characterized in that, comprises the composition of following weight percent:
Sunmorl N 60S or Potassium Gluconate 2%-30%, methylsulphonic acid potassium or methylsulphonic acid ammonium 0.3%-10%, Trisodium Citrate 0.1%-10%, sodium tartrate 0.1%-10%, dodecyl benzyl dimethyl ammonium chloride 0.03%-3%, ammoniacal liquor 0.1%-10% and tin methane sulfonate 0.2%-5%.
3. tin plating solution according to claim 2, is characterized in that, comprises the composition of following weight percent:
Sunmorl N 60S or Potassium Gluconate 5%-20%, methylsulphonic acid potassium or methylsulphonic acid ammonium 1%-5%, Trisodium Citrate 1%-5%, sodium tartrate 1%-5%, dodecyl benzyl dimethyl ammonium chloride 0.1%-1%, ammoniacal liquor 0.1%-1% and tin methane sulfonate 2%-5%.
4. tin plating solution according to claim 2, is characterized in that, comprises the composition of following weight percent:
Sunmorl N 60S or Potassium Gluconate 15%, methylsulphonic acid potassium or methylsulphonic acid ammonium 4.5%, Trisodium Citrate 2%, sodium tartrate 2%, dodecyl benzyl dimethyl ammonium chloride 0.1%, ammoniacal liquor 0.2% and tin methane sulfonate 3.5%.
5. the preparation method of the tin plating solution described in any one of claim 1 ~ 4, is characterized in that, comprises following steps:
Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water dissolving together, and then dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor, fully mix.
6. the preparation method of tin plating solution according to claim 5, is characterized in that, comprises following steps:
Sunmorl N 60S or Potassium Gluconate, methylsulphonic acid potassium or methylsulphonic acid ammonium, Trisodium Citrate, sodium tartrate are added to the water together, 25-35 DEG C of dissolving, then add dodecyl benzyl dimethyl ammonium chloride, tin methane sulfonate, ammoniacal liquor successively, fully mix.
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| CN201510911722.7A CN105525312B (en) | 2015-12-11 | 2015-12-11 | A kind of tin plating solution and preparation method thereof |
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| CN201510911722.7A CN105525312B (en) | 2015-12-11 | 2015-12-11 | A kind of tin plating solution and preparation method thereof |
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| CN105525312B CN105525312B (en) | 2017-12-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107914009A (en) * | 2017-12-15 | 2018-04-17 | 宁波广新纳米材料有限公司 | A kind of production method of tin plating copper powder |
| CN111962050A (en) * | 2020-09-11 | 2020-11-20 | 江苏佳华金属线有限公司 | Formula of tinning liquid for copper wire with good conductive effect |
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| US20030150743A1 (en) * | 2001-09-20 | 2003-08-14 | Daiwa Fine Chemicals Co., Ltd. | Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath |
| TW200706707A (en) * | 2005-04-28 | 2007-02-16 | Meltex Inc | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
| JP2007239076A (en) * | 2006-03-10 | 2007-09-20 | Meltex Inc | Tinning coat, tinning liquid for forming tinning coat, method for forming tinning coat and chip type electronic parts formed of electrode with tinning coat |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| JP2009191335A (en) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | Plating solution and electronic parts |
| JP2010275613A (en) * | 2009-05-29 | 2010-12-09 | Tdk Corp | Tin electroplating solution and method of manufacturing electronic component |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
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2015
- 2015-12-11 CN CN201510911722.7A patent/CN105525312B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030150743A1 (en) * | 2001-09-20 | 2003-08-14 | Daiwa Fine Chemicals Co., Ltd. | Tin or tin alloy plating bath, tin salt solution and acid or complexing agent solution for preparing or controlling and making up the plating bath, and electrical and electric components prepared by the use of the plating bath |
| TW200706707A (en) * | 2005-04-28 | 2007-02-16 | Meltex Inc | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
| JP2007239076A (en) * | 2006-03-10 | 2007-09-20 | Meltex Inc | Tinning coat, tinning liquid for forming tinning coat, method for forming tinning coat and chip type electronic parts formed of electrode with tinning coat |
| CN101358361A (en) * | 2007-08-01 | 2009-02-04 | 太阳化学工业株式会社 | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit |
| JP2009191335A (en) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | Plating solution and electronic parts |
| JP2010275613A (en) * | 2009-05-29 | 2010-12-09 | Tdk Corp | Tin electroplating solution and method of manufacturing electronic component |
| CN102051648A (en) * | 2011-01-20 | 2011-05-11 | 广州市二轻工业科学技术研究所 | Cyanogen-free plating method of zinc alloy die casting |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107914009A (en) * | 2017-12-15 | 2018-04-17 | 宁波广新纳米材料有限公司 | A kind of production method of tin plating copper powder |
| CN111962050A (en) * | 2020-09-11 | 2020-11-20 | 江苏佳华金属线有限公司 | Formula of tinning liquid for copper wire with good conductive effect |
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| CN105525312B (en) | 2017-12-29 |
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