CN105493637B - Distributing board assembly and its manufacturing method - Google Patents
Distributing board assembly and its manufacturing method Download PDFInfo
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- CN105493637B CN105493637B CN201480047948.0A CN201480047948A CN105493637B CN 105493637 B CN105493637 B CN 105493637B CN 201480047948 A CN201480047948 A CN 201480047948A CN 105493637 B CN105493637 B CN 105493637B
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- hole
- wiring pattern
- reinforcing plates
- metal reinforcing
- board assembly
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- 238000004519 manufacturing process Methods 0.000 title description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 136
- 239000002184 metal Substances 0.000 claims abstract description 136
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 129
- 238000007639 printing Methods 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 84
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 72
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 238000000576 coating method Methods 0.000 claims description 75
- 239000011248 coating agent Substances 0.000 claims description 73
- 238000000034 method Methods 0.000 description 106
- 230000008569 process Effects 0.000 description 90
- 229910000679 solder Inorganic materials 0.000 description 41
- 238000009434 installation Methods 0.000 description 22
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive effect Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000011120 plywood Substances 0.000 description 5
- -1 polyethylene terephthalate Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
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- 238000005422 blasting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001548 drop coating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
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Abstract
Distributing board assembly (1) has：Flexible printing patch panel (2) at least has the insulative substrate (5) for possessing through hole (53) and is set to insulative substrate (5) and extends to the Wiring pattern (61,62) of the peripheral part (531n, 532n) of through hole (53)；Metal reinforcing plates (3) are installed on flexible printing patch panel (2), and opposed with through hole (53)；And Wiring pattern (61,62) and metal reinforcing plates (3) are electrically connected by scolding tin interconnecting piece (4), the internal face (534) of covering through hole (53).
Description
Technical field
The present invention relates to the distributing board assemblies and its manufacturing method that have flexible printing patch panel and metal reinforcing plates.
For recognizing the specified country of the reference based on reference literature, by referring on October 1st, 2013 in Japanese publication
Content recorded in the Patent 2014-58224 of Japanese publication of Patent 2013-206501 and on March 20th, 2014
And it is referenced to this specification, make the part recorded in this specification.
Background technology
There is known be bonded made of metal reinforcing plate with circuit board main body by using isotropic conductivity bonding sheet to make
Make the technology for the circuit board for having effectiveness (referring for example to patent document 1).
In addition, there is known use the high conductivity bonding for changing the concentration for having adjusted electroconductive particle in view of the above technology
Technology that earthed circuit is connect by agent and high adherence adhesive both conductive adhesives with metal reinforcing plates (such as
With reference to patent document 2).
Patent document 1：Japanese Unexamined Patent Publication 2007-189091 bulletins
Patent document 2：Japanese Unexamined Patent Publication 2009-218443 bulletins
The circuit board of patent document 1 needs the ladder for removing circuit when isotropic conductivity bonding sheet is laminated
There is productivity difference in the process etc. of the bubble in portion.
In addition, in the flexible printing patch panel of patent document 2, need setting be used to form high conductivity adhesive and
There is productivity difference in printing process, drop coating process of high adherence adhesive etc..
Invention content
The present invention project to be solved is to provide the distributing board assembly of highly productive and its manufacturing method.
[1] distributing board assembly according to the present invention is characterized in that having：Flexible printing patch panel at least has
There is the insulative substrate for possessing at least one first through hole and be set to above-mentioned insulative substrate and extend to above-mentioned first and passes through
The Wiring pattern of the periphery of through-hole；Metal reinforcing plates are installed on above-mentioned flexible printing patch panel, with above-mentioned first through hole pair
It sets；And scolding tin interconnecting piece, the first internal face of above-mentioned first through hole is covered, by above-mentioned Wiring pattern and above-mentioned metal
Reinforcing plate is electrically connected.In the present invention, it is formed in first through hole by because melting scolding tin on the first through hole
Scolding tin interconnecting piece the Wiring pattern of flexible printing patch panel is electrically connected with metal reinforcing plates, therefore wiring board group can be improved
Fill the productivity of body.
[2] in the present invention as stated above, can also be configured to above-mentioned insulative substrate also has at least one second through hole, should
Second internal face of the second through hole is not covered by above-mentioned scolding tin interconnecting piece, and above-mentioned distributing board assembly also has at least one company
Access, the access are installed between above-mentioned flexible printing patch panel and above-mentioned metal reinforcing plates, and above-mentioned access is by above-mentioned
One through hole is connected to above-mentioned second through hole.In this case, scolding tin cover the first through hole when, the first through hole it is interior
Pressure is discharged via access from the second through hole.Scolding tin is easy to be brought into metal reinforcing plates side as a result, can further increase
The connection reliability of Wiring pattern and metal reinforcing plates.
[3] in the present invention as stated above, above-mentioned second internal face that can also be configured to above-mentioned second through hole exposes.In the feelings
Under condition, scolding tin will not enter the second inside through holes, to block the second through hole.Thereby, it is possible to by the first through hole
Internal pressure discharged via access and from the second through hole, thus scolding tin is easy to be brought into metal reinforcing plates side, can be further
Improve the connection reliability of Wiring pattern and metal reinforcing plates.
[4] in the present invention as stated above, can also be configured to above-mentioned Wiring pattern includes：First Wiring pattern, is set to
State the first interarea of insulative substrate；And second Wiring pattern, it is set to the second interarea of above-mentioned insulative substrate, it is above-mentioned
Also there is flexible printing patch panel coating, the coating to cover above-mentioned first interarea and with being open, and above-mentioned opening has：
First part, the peripheral part pair with above-mentioned first through hole and above-mentioned first through hole of above-mentioned first Wiring pattern
It sets；Second part, it is opposed with above-mentioned second through hole；And Part III, by above-mentioned first part and above-mentioned second
Connection, above-mentioned access is divided to be delimited by above-mentioned opening, above-mentioned metal reinforcing plates are installed on above-mentioned coating, above-mentioned scolding tin interconnecting piece
Above-mentioned first Wiring pattern, above-mentioned second Wiring pattern and above-mentioned metal reinforcing plates are electrically connected.In this case, first matches
Line pattern and the second Wiring pattern are electrically connected with metal reinforcing plates, and thus, it is possible to assign being electromagnetically shielded to flexible printing patch panel
Effect.
[5] in the present invention as stated above, can also be configured to above-mentioned Wiring pattern includes：First Wiring pattern, is set to
State the first interarea of insulative substrate；And second Wiring pattern, it is set to the second interarea of above-mentioned insulative substrate, it is above-mentioned
Flexible printing patch panel also has a coating, and the coating is with above-mentioned the of above-mentioned first through hole and above-mentioned first Wiring pattern
The mode that the peripheral part of one through hole is exposed covers above-mentioned first interarea, and above-mentioned metal reinforcing plates are installed on above-mentioned coating,
Above-mentioned first Wiring pattern, above-mentioned second Wiring pattern and above-mentioned metal reinforcing plates are electrically connected by above-mentioned scolding tin interconnecting piece.
In this case, the first Wiring pattern and the second Wiring pattern are electrically connected with metal reinforcing plates, thus, it is possible to match to flexible printing
Line plate assigns effectiveness.
[6] in the present invention as stated above, above-mentioned scolding tin interconnecting piece can also be configured to cover in above-mentioned metal reinforcing plates in projection
State at least part in the region of the first through hole.In this case, the flexible printing patch panel based on scolding tin interconnecting piece and gold
The area for belonging to the coupling part of reinforcing plate expands, reliable thus, it is possible to further increase the connection of Wiring pattern and metal reinforcing plates
Property.
[7] in the present invention as stated above, can also be configured to above-mentioned first internal face has the coat of metal.In this case, energy
Enough connection reliability for improving Wiring pattern and metal reinforcing plates based on scolding tin interconnecting piece.
[8] in the present invention as stated above, can also be configured to above-mentioned insulative substrate has multiple above-mentioned first through holes.At this
In the case of, when forming scolding tin interconnecting piece, scolding tin is easy to be brought into metal reinforcing plates side, can further increase Wiring pattern with
The connection reliability of metal reinforcing plates.
[9] in the present invention as stated above, can also be configured to above-mentioned metal reinforcing plates has the interior of above-mentioned first through hole of insertion
The protrusion in portion.In this case, the face of the coupling part of flexible printing patch panel and metal reinforcing plates based on scolding tin interconnecting piece
Product expands, and thus, it is possible to further increase the connection reliability of Wiring pattern and metal reinforcing plates.
[10] manufacturing method of distributing board assembly according to the present invention is characterized in that, has following process：First
Process prepares flexible printing patch panel in this process, which, which at least has, possesses the exhausted of the first through hole
It edge substrate and is set to above-mentioned insulative substrate and extends to the Wiring pattern of the periphery of above-mentioned first through hole；Second work
Sequence is installed on above-mentioned flexible printing patch panel from side by metal reinforcing plates in this process；The third step, in this process,
From the other side to the above-mentioned first through hole printed solder paste of above-mentioned flexible printing patch panel；And the fourth step, in the process
In, by making above-mentioned solder(ing) paste melting be electrically connected above-mentioned Wiring pattern with above-mentioned metal reinforcing plates.It in the present invention, can be with
Wiring pattern is electrically connected by solder(ing) paste when using installation with metal reinforcing plates, and need not in addition be arranged in the connection to
The process etc. of metal reinforcing plates coated with flux.Therefore, it is possible to improve the productivity of distributing board assembly.
According to the present invention, pass through the scolding tin being formed in because melting scolding tin on the first through hole in first through hole
The Wiring pattern of flexible printing patch panel can be electrically connected by interconnecting piece with metal reinforcing plates, therefore can improve distributing board assembling
The productivity of body.
Description of the drawings
Fig. 1 is the sectional view for the distributing board assembly for indicating the first embodiment of the present invention.
Fig. 2 (A) and Fig. 2 (B) is cuing open for the variation for the distributing board assembly for indicating the first embodiment of the present invention
View.
Fig. 3 is the sectional view of the variation for the distributing board assembly for indicating the first embodiment of the present invention.
Fig. 4 (A)~Fig. 4 (E) is cuing open for the manufacturing process for the distributing board assembly for indicating the first embodiment of the present invention
View.
Fig. 5 is the sectional view of the variation for the distributing board assembly for indicating the first embodiment of the present invention.
Fig. 6 (A) and Fig. 6 (B) is the figure for the distributing board assembly for indicating second embodiment of the present invention, wherein Fig. 6
(A) it is vertical view, Fig. 6 (B) is the sectional view along the VIB-VIB lines of Fig. 6 (A).
Fig. 7 is the figure for the first coating for indicating second embodiment of the present invention, is the VII-VII lines along Fig. 6 (B)
Sectional view.
Fig. 8 (A) and Fig. 8 (B) is the figure of the variation for the distributing board assembly for indicating second embodiment of the present invention,
Wherein, Fig. 8 (A) is vertical view, and Fig. 8 (B) is the sectional view along the VIIIB-VIIIB lines of Fig. 8 (A).
Fig. 9 (A) and Fig. 9 (B) is the figure for the distributing board assembly for indicating third embodiment of the present invention, wherein Fig. 9
(A) it is vertical view, Fig. 9 (B) is the sectional view along the IXB-IXB lines of Fig. 9 (A).
Figure 10 is the sectional view for the distributing board assembly for indicating the 4th embodiment of the present invention.
Specific implementation mode
Hereinafter, based on attached drawing, embodiments of the present invention will be described.
<<First embodiment>>
As shown in Figure 1, the distributing board assembly 1 of present embodiment has flexible printing patch panel 2, is installed on flexibility print
The metal reinforcing plates 3 and scolding tin interconnecting piece 4 of brush distributing board 2.
Flexible printing patch panel 2 have insulative substrate 5, be set to the first Wiring pattern 61 of the insulative substrate 5 with
And second Wiring pattern 62, the first coating 71 and the second coating 72.In addition, as shown in Fig. 2 (A), Fig. 2 (B), can save
Either one slightly in the first Wiring pattern 61 or the second Wiring pattern 62.
Insulative substrate 5 is made of the substrate of flexible insulating properties, can be with as the material of substrate as composition
Exemplify polyimides, polyethylene terephthalate, polyethylene naphthalate etc..
As shown in Figure 1, the insulative substrate 5 in present embodiment is provided with through hole 53, which penetrates through this absolutely
In the figure of edge substrate 5 in interarea 51 (hereinafter also referred to as the first interarea 51) and the figure of downside upside interarea 52 (hereinafter,
Referred to as the second interarea 52) between, it is formed along vertical direction (Z-direction in figure).The through hole 53 in the first interarea 51
One opening, 531 opening, and in 532 opening of the second opening of the second interarea 52.In addition, 53 phase of through hole in present embodiment
When an example of the first through hole in the present invention.
First interarea 51 of insulative substrate 5 is provided with the first Wiring pattern 61 by formation such as copper foils.This first is matched
Line pattern 61 is arranged with extending to the peripheral part 531n for the first opening 531 being set in the through hole 53 of insulative substrate 5.Separately
Outside, downside is provided with the first coating 71 in the figure of the first Wiring pattern 61, and first coating 71 is to first wiring diagram
First interarea 51 of case 61 and insulative substrate 5 is covered.
First coating 71 is such as by polyimides, polyethylene terephthalate, polyethylene naphthalate
Insulating film constitute, as shown in Figure 1, with make through hole 53 first be open 531 peripheral part 531n expose through hole
712.Moreover, the first coating 71 covers the of insulative substrate 5 in such a way that the through hole 712 is corresponding with the first opening 531
One interarea 51 and the first Wiring pattern 61, first coating 71 are installed on the first interarea 51 and first by adhesive 711
Wiring pattern 61.In addition, as adhesive 711, epoxy resin, acrylic adhesive may be exemplified out.
In addition, the second interarea 52 in insulative substrate 5 is provided with the second Wiring pattern 62 by formation such as copper foils.This
Two Wiring patterns 62 are set with extending to the peripheral part 532n for the second opening 532 being set in the through hole 53 of insulative substrate 5
It sets.Upside is provided with the second coating 72 in the figure of the second Wiring pattern 62, and second coating 72 is to second wiring diagram
Second interarea 52 of case 62 and insulative substrate 5 is covered.
Second coating 72 is formed by material identical with the first coating 71, as shown in Figure 1, with making in through hole 53
Second opening 532 peripheral part 532n expose through hole 722.Moreover, the second coating 72 is with the through hole 722 and second
The 532 corresponding modes that are open cover the second interarea 52 and the second Wiring pattern 62 of insulative substrate 5, and second coating 72 is logical
It crosses adhesive 711 and is installed on the second interarea 52 and the second Wiring pattern 62.
In addition, the first and second coating 71,72 protects the first and second Wiring pattern 61,62 respectively, and use
In the insulation for ensuring the first and second Wiring pattern 61,62.Therefore, in the case where omitting the first Wiring pattern 61, such as Fig. 2
(A) shown in, the first coating 71 can also omit.Similarly, in the case where omitting the second Wiring pattern 62, such as Fig. 2 (B) institute
Show, the second coating 72 can also omit.
In addition, in the present embodiment, the first and second Wiring pattern 61,62 is formed as shielding relative to flexibility
The ground wire of the electromagnetic noise of printing distributing board 2.Though it is not particularly illustrated, it is different from first and second Wiring pattern 61,62,
It is formed with signal wiring in the first interarea 51 of insulative substrate 5 and the second interarea 52.Incidentally, such as second match
Line pattern 62 is linear pattern, and the first Wiring pattern 61 can be linear pattern or blanket pattern (so-called solid pattern).
In the present embodiment, as shown in Figure 1, the first coating in the flexible printing patch panel 2 of mistake described above
71 are equipped with metal reinforcing plates 3 by epoxy resin, acrylic adhesive 30.The metal reinforcing plates 3 are by 31 He of basal substrate
Coating 32 is constituted, wherein the basal substrate 31 is formed in by the formation such as aluminium, the coating 32 on the basal substrate 31, and by nickel
(Ni), the formation such as tin (Sn).The metal reinforcing plates 3 are installed on flexible print in such a way that the coating 32 is opposed with the first coating 71
Brush distributing board 2.In addition, in the case where omitting the first Wiring pattern 61, it, can also be in insulative substrate 5 as shown in Fig. 2 (A)
The first interarea 51 install metal reinforcing plates 3.
In addition, the distributing board assembly 1 in present embodiment has scolding tin interconnecting piece 4, the scolding tin interconnecting piece 4 covering insulation
The internal face 534 of the through hole 53 of property substrate 5.As shown in Figure 1, peripheral part 531n of the scolding tin interconnecting piece 4 in the first opening 531
It contacts with the first Wiring pattern 61, and is contacted with the second Wiring pattern 62 in the peripheral part 532n of the second opening 532.In addition,
The lower end 41 of scolding tin interconnecting piece 4 is contacted with the coating 32 of metal reinforcing plates 3.First Wiring pattern 61, the second Wiring pattern as a result,
62 and metal reinforcing plates 3 be electrically connected to each other by scolding tin interconnecting piece 4.
It incidentally, can be with as shown in figure 3, scolding tin be filled in through hole 53 in scolding tin interconnecting piece 4.In addition, weldering
Loading of the tin into through hole 53 is not particularly limited, though being not particularly illustrated, for example, in scolding tin interconnecting piece 4, can also be incited somebody to action
Scolding tin is only filled in the bottom of through hole 53.That is, scolding tin interconnecting piece 4 may be in scolding tin covering metal reinforcing plates 3 projecting passing through
The state in the region of through-hole 53.
In addition, as shown in Fig. 2 (A), scolding tin broadens in the bottom of through hole 53, and can make the one of metal reinforcing plates 3
Expose from scolding tin interconnecting piece 4 part.That is, scolding tin interconnecting piece 4 may be in scolding tin covering metal reinforcing plates 3 projecting through hole 53
Region a part state.
In addition, in the case where omitting the first Wiring pattern 61 (in the case of Fig. 2 (A)), the second Wiring pattern 62 and gold
Belong to reinforcing plate 3 to be electrically connected to each other by scolding tin interconnecting piece 4.In addition, in the case where omitting the second Wiring pattern 62 (Fig. 2's (B)
In the case of), the first Wiring pattern 61 is electrically connected to each other with metal reinforcing plates 3 by scolding tin interconnecting piece 4.
Next, being illustrated to the manufacturing method of the distributing board assembly 1 in present embodiment.Present embodiment is matched
The manufacturing method of line plate assembly 1 has the preparatory process of flexible printing patch panel, the installation procedure of metal reinforcing plates, solder(ing) paste
Printing process and reflow process process.
In addition, the preparatory process of the flexible printing patch panel of present embodiment is equivalent to one of the first step of the present invention
Example, the installation procedure of the metal reinforcing plates of present embodiment are equivalent to an example of the second step of the present invention, this implementation
The printing process of solder(ing) paste in mode is equivalent to an example of the third step of the present invention, the Reflow Soldering in present embodiment
Treatment process is equivalent to an example of the fourth step of the present invention.
In the preparatory process of flexible printing patch panel, prepare plywood, shown in the plywood such as Fig. 4 (A), such as in thickness
Degree is pasted with the copper foil for being for example 12 μm~18 μm or so by thickness for the two sides of 12.5 μm~25 μm or so of insulative substrate 5
The electroconductive component 60 of equal formation.In addition, in the explanation of manufacturing method below, if electroconductive component 60 carries out for copper foil
Explanation.
Next, as shown in Fig. 4 (B), tool is for example formed in ready above-mentioned plywood using drill bit, UV-YAG laser
There is the through hole 53 of the diameter of 0.1mm~5mm or so.At this point, in the case where forming through hole 53 using drill bit, in order not to produce
Raw hole bur, suitably adjusts penetration rate, the rotating speed of drill bit.
In the case where forming through hole 53 using UV-YAG laser, laser energy, irradiation time are adjusted using Gaussian beam
Number, depth of focus etc. make through hole 53 become desirable shape.At this point, there are electroconductive components 60 because of the heat based on laser
The case where melting and splashing, therefore by carrying out such as 0.5 μm~1 μm or so of erosion to the electroconductive component 60 after laser processing
Quarter keeps the surface shape of electroconductive component 60 smooth.
Next, the electroconductive component 60 in 51 side of the first interarea of insulative substrate 5 forms the first Wiring pattern 61.Tool
For body, first, by acrylic acid series dry film photoresist for example under conditions of temperature is 70 DEG C~110 DEG C, pressure is 0.5MPa
Hot pressing is to the electroconductive component 60 in such a way that bubble does not enter it between the surface of electroconductive component 60.Next, will match
It closes the characteristic of dry film photoresist and the eurymeric or minus photomask that select are installed on the surface of dry film photoresist by vacuumizing, shines
Penetrate UV light.
It is constituted with film in addition, the photomask used at this time portrays pattern by base material and chromium film, latex film etc., wherein base material
It is wide according to manufacturing cost, circuit by formation, above-mentioned constituent materials such as polyethylene terephthalate (PET) film, glass dry plates
Degree tolerance, dimensional tolerance etc. properly select.
Next, removing the dry film photoresist for the cross-linking reaction that the irradiation based on above-mentioned UV light does not occur and developing, thus
Form the dry film photoresist of circuitry shapes.In addition, development at this time for example can be by by the sodium carbonate (Na of 1.0%wt2CO3)
Aqueous solution etc. alkalinity liquid according to the surface spraying stipulated time from the pressure of 0.1MPa~0.25MPa to dry film photoresist come into
Row.
Next, the dry film photoresist of circuitry shapes is used as mask, electroconductive component 60 is etched, first is consequently formed and matches
Line pattern 61.The etching for example can be by including iron chloride to electroconductive component 60 according to the air spraying of 0.25MPa
(FeCl3), copper chloride (CuCl2) etc. the liquid stipulated time carry out.
After etching, removed by being again dipped into above-mentioned alkaline liquid dry film photoresist is made to be swollen, thus, it is possible to
It is enough to form the first Wiring pattern 61 in electroconductive component 60.In an identical manner, in 52 side of the second interarea of insulative substrate 5
Electroconductive component 60 forms the second Wiring pattern 62.
Next, as shown in Fig. 4 (C), being glued by what resinoid was constituted for 20 μm~25 μm or so of thickness is used
Mixture 711 for example will be installed on the first wiring with 12.5 μm or so of thickness by the first coating 71 that polyimides is constituted
Lower surface in the figure of pattern 61.In addition, the second coating that will there is same structure with the first coating 71 using adhesive 711
72 are installed on upper surface in the figure of the second Wiring pattern 62.
Specifically, first, in the first coating 71, making insulative substrate 5 by diesinker, laser, metal mold formation
First opening 531 peripheral part 531n expose through hole 712.Then, with through hole 712 and the first of insulative substrate 5
The 531 corresponding modes that are open configure the first coating 71 via adhesive 711, local heating and first coating 71 is interim
It is fixed.Next, such as hot pressing 2 hours under conditions of 160 DEG C, 40kgf in this state, are not thus entered with bubble above-mentioned
Mode between first coating 71 and the first interarea 51 carries out the fixation of the first coating 71.
In an identical manner, the peripheral part for the second opening 532 for making insulative substrate 5 is also formed in the second coating 72
The through hole 722 that 532n exposes covers in such a way that the through hole 722 is corresponding with the second opening 532 of insulative substrate 5 to second
Cap rock 72 is configured, is fixed.
The preparation of flexible printing patch panel 2 is carried out in the manner described above.In addition, as shown in figure 5, when forming through hole 53
The internal face 534 in (stage of Fig. 4 (B)), the through hole 53 can have such as the shape by copper of 5 μm~12 μm or so of thickness
At the coat of metal 54.In this case, the first Wiring pattern 61 and shape of the first interarea 51 of insulative substrate 5 are formed in
It is electrically connected to each other by the coat of metal 54 between the second Wiring pattern 62 of the second interarea 52.In addition, at this point, for reality
The electroconductive component 60 can be etched 0.5 μm~1 μm by the roughening and cleaning on the surface of the electroconductive component 60 after being now electroplated
Left and right.
Next, the installation procedure to metal reinforcing plates illustrates.
In the installation procedure of metal reinforcing plates, first, such as with 10 μm~25 μm or so of thickness and it will be processed into
The adhesive 30 of desirable shape (single sheet, band-like etc.) being made of resinoid etc. is configured at flexible printing wiring
Lower surface (lower surface in Fig. 4 (D) of the first coating 71) in Fig. 4 (D) of plate 2.Then, in this state, by using ironing
Iron etc. is heated locally to 200 DEG C or more to carry out being fixed temporarily for adhesive 30.In addition, being clipped in separated type material in adhesive 30
Form in the case of, be processed by laser or metal mold etc. in the state that adhesive 30 is clipped in the separated type material desired
Shape, the separated type material of one side of stripping makes adhesive show out and be fixed temporarily.
Next, lateral dominance clips 2 side of flexible printing patch panel for being fixed temporarily adhesive 30 with the good film of release
Carry out vacuum drop stamping.At this point, for example make vacuum degree be -70cmHg or less it is for 10 seconds~60 seconds, in 120 DEG C, 10kgf/cm2
~20kgf/cm2Under conditions of pressurize 10 seconds~120 seconds, thus carry out hot pressing.
Next, by metal mold, laser etc. by 2 cutting off processing of flexible printing patch panel of hot pressing adhesive 30 at institute
Shape desired.
Next, the gold of nickel plating (Ni) or tin (Sn) etc. and the thickness with 0.1mm~1mm or so will be implemented to surface
Belong to reinforcing plate 3 be configured at adhesive 30 lower surface desirable position, and using soldering iron etc. be heated locally to 200 DEG C with
On, thus carry out being fixed temporarily for the metal reinforcing plates 3.
Then, lateral dominance clips flexible printing patch panel 2 with the good film of release and 3 side of metal reinforcing plates carries out Vacuum Heat
Punching press.At this point, for example make vacuum degree be -70cmHg or less it is for 10 seconds~60 seconds, in 120 DEG C, 10kgf/cm2~20kgf/cm2
Under conditions of pressurize 10 seconds~120 seconds, thus carry out hot pressing.Later, keep adhesive 30 solid using 150 DEG C~180 DEG C of baking oven
Change, thus metal reinforcing plates 3 are installed on to the first coating 71 (with reference to Fig. 4 (D)) of flexible printing patch panel 2.
Next, in the printing process of solder(ing) paste, as shown in Fig. 4 (E), with second opening 532 of the covering of solder(ing) paste 40
Solder(ing) paste 40 is printed onto through hole 53 by the mode of peripheral part 532n.As the solder(ing) paste 40 for printing, such as may be exemplified
Go out the cream of the materials such as -0.5% copper (Cu) of -3.0% silver (Ag) of tin (Sn) composition.In addition, the printing process as solder(ing) paste 40, it can
To exemplify stencil printing, intaglio offset print process etc..
Next, in reflow process process, its solidification is set to connect to form scolding tin after the melting of solder(ing) paste 40 by making
Thus first and second Wiring pattern 61,62 is electrically connected by socket part 4 with metal reinforcing plates 3.As such reflow process
The condition of process, such as with 130 DEG C~190 DEG C preheat within 60 seconds~90 seconds, later, 30 are carried out with 220 DEG C or more of temperature
Second~Reflow Soldering in 50 seconds.In this case, it is within 240 DEG C~250 DEG C for 10 seconds to make the peak temperature of heating curves.
Next, being illustrated to the effect of distributing board assembly 1 and its manufacturing method in present embodiment.
In the manufacturing process of the distributing board assembly 1 of present embodiment, used as in the printing process of solder(ing) paste
Solder(ing) paste 40, can use installation when solder(ing) paste.In addition, by making the solder(ing) paste 40 melt, cure on through hole 53
First and second Wiring pattern 61,62 can be electrically connected with metal reinforcing plates 3.Therefore, there is no need in addition be arranged for into
The device of the row connection, process, can improve the productivity of distributing board assembly 1.
In addition, it is assumed that carrying out the installation of metal reinforcing plates after the printing process of solder(ing) paste and reflow process process
In the case of process, to when flexible printing patch panel installation, connection, need in addition to be arranged solder flux by metal reinforcing plates
(flux) it is coated on the process etc. of the metal reinforcing plates.
In this regard, in the present embodiment, into row metal before the printing process of solder(ing) paste and reflow process process
The installation procedure of reinforcing plate.In addition process etc. to 3 coated with flux of metal reinforcing plates need not be set as a result, in addition, installation gold
Position adjustment when belonging to reinforcing plate 3, which becomes, to be easy.Therefore, it is possible to further increase the productivity of distributing board assembly 1.
In addition, for the distributing board assembly 1 of present embodiment, in the reflow process process of its manufacturing process,
Can be carried out at the same time the first Wiring pattern 61 and metal reinforcing plates 3 be electrically connected and the second Wiring pattern 62 is reinforced with metal
The electrical connection of plate 3.Therefore, it is possible to further increase the productivity of distributing board assembly 1.
Moreover, the first and second Wiring pattern 61,62 as ground wire is electrically connected with metal reinforcing plates 3, thus, it is possible to
Effectiveness is assigned to flexible printing patch panel 2.Particularly, in the present embodiment, on the two sides of insulative substrate 5
51,52 it is formed with ground wire, thus, it is possible to play more effective effectiveness.
In addition, in the case where the internal face 534 of through hole 53 has the coat of metal 54 as shown in Figure 5, flowing back
It welds in treatment process, can more reliably carry out being electrically connected for the first and second Wiring pattern 61,62 and metal reinforcing plates 3.
<<Second embodiment>>
Fig. 6 (A) and Fig. 6 (B) is the figure for the distributing board assembly for indicating second embodiment of the present invention, wherein Fig. 6
(A) it is vertical view, Fig. 6 (B) is the sectional view along the VIB-VIB lines of Fig. 6 (A).
As shown in Fig. 6 (A) and Fig. 6 (B), the distributing board assembly 1B of present embodiment has flexible printing patch panel
2B, the metal reinforcing plates 3 for being installed on flexible printing patch panel 2B, scolding tin interconnecting piece 4 and access 8.
In the present embodiment, in the 1B settings of distributing board assembly there are one this point of access 8 and in insulative substrate
There are one the second through hole 55, this point is different from first embodiment for 5B settings.
In addition, the metal reinforcing plates 3 for constituting distributing board assembly 1B and scolding tin interconnecting piece 4 in second embodiment with
Each structure that distributing board assembly 1 in first embodiment has is identical, and and the description is omitted.
The first Wiring pattern that flexible printing patch panel 2B has insulative substrate 5B, is set to insulative substrate 5B
61B and the second Wiring pattern 62B, the first coating 71B and the second coating 72B.
The insulative substrate 5 illustrated in insulative substrate 5B and first embodiment is same, by flexible insulation
Property substrate constitute, as the material of substrate as composition, may be exemplified out material identical with insulative substrate 5.
As shown in Fig. 6 (A) and Fig. 6 (B), there are two through holes for the insulative substrate 5B settings of present embodiment.First
Through hole 53 is penetrated through in a manner of same as the first embodiment between first interarea 51 and the second interarea 52, along vertical direction
(Z-direction in figure) and formed.First through hole 53 is open in the first opening 531 of the first interarea 51, and in the second interarea 52
Second opening 532 opening.
Second through hole 55 penetrates through between the first interarea 51 and the second interarea 52, along vertical direction (Z-direction in figure)
It is formed.Second through hole 55 is open in the first opening 551 of the first interarea 51, and in the second opening of the second interarea 52
552 openings.The diameter of such second through hole 55 is not particularly limited, but the diameter preferably than the first through hole 53 is small, such as
Preferably 0.2mm or less.Thereby, it is possible to inhibit area of first opening 551 shared by the first interarea 51.In addition, can inhibit
Area of second opening 552 shared by the second interarea 52.Like this, by inhibiting opening in the first interarea 51 and the second interarea
Area shared by 52 can ensure the installation region of wide electronic unit, therefore can install wiring diagram with higher density
Case.
In the present embodiment, as shown in Fig. 6 (B), the first internal face 534 of the first through hole 53 is by scolding tin interconnecting piece 4
Covering.On the other hand, the second internal face 553 of the second through hole 55 is not covered by scolding tin interconnecting piece 4, the second internal face 553
Expose.
In addition, the second through hole 55 of present embodiment is equivalent to an example of the second through hole of the present invention.
The first interarea 51 of insulative substrate 5B is provided with the first Wiring pattern 61B by formation such as copper foils.This first
Wiring pattern 61B extend to the first through hole 53 for being set to insulative substrate 5B first opening 531 peripheral part 531n, with
And second through hole 55 first opening 551 and be arranged.In addition, downside is provided in Fig. 6 (B) of the first Wiring pattern 61B
The first interarea 51 of first coating 71B, the first coating 71B to the first Wiring pattern 61B and insulative substrate 5B
It is covered.
First coating 71B is made of with the first coating 71 illustrated in first embodiment identical material, is covered
The first interarea of lid 51.As shown in Fig. 6 (B), first coating 71B has opening 713, and the opening 713 is with along vertical direction
The mode that (Z-direction in figure) penetrates through first coating 71B is formed.
As shown in fig. 7, the opening 713 has first part 714, second part 715 and Part III under vertical view
716.The first part 714 is opposed with the peripheral part 531n of the first opening 531 of the first through hole 53.In addition, second part 715
It is opposed with the first opening 551 of the second through hole 55.In addition, Part III 716 connects first part 714 and second part 715
It is logical.The first coating 71B is installed on the first interarea 51 and the first Wiring pattern 61B via adhesive 711.
In addition it is also possible to instead of the opening 713 of the first coating 71B, and as shown in Fig. 8 (A) and Fig. 8 (B), it is formed with
An opening 717 including first part 714, second part 715 and Part III 716.In this case, opening can be made
For simpler shape, therefore it can realize the simplification of the manufacturing process of distributing board assembly 1B.
Second coating 72B is made of with the second coating 72 illustrated in first embodiment identical material.Such as
Shown in Fig. 6 (A) and Fig. 6 (B), second coating 72B has through hole 722B and through hole 723, they are with along vertical
The mode that direction (Z-direction in figure) penetrates through second coating 72B is formed.
Through hole 722B is opposed with the peripheral part 532n of the second opening 532 of the first through hole 53.Through hole 723 and second
Second opening 552 of through hole 55 is opposed.In addition, through hole 722B, 723 so that the first through hole 53 second opening 532
And second through hole 55 second opening 552 expose mode formed.
Be formed with such through hole 722B, 723 the second coating 72B be installed on the second interarea via adhesive 711
The 52 and second Wiring pattern 62B.
In addition it is also possible to instead of the above-mentioned through hole 722B of the second coating 72B, 723, and such as Fig. 8 (A) and Fig. 8 (B)
Shown, formation includes their through hole 724.In this case, it is simpler shape that can make opening, therefore can
Realize the simplification of the manufacturing process of distributing board assembly 1B.
Access 8 is by insulative substrate 5B, metal reinforcing plates 3, the opening 713 for being set to the first coating 71B and glues
Mixture 711 delimited, and be installed between insulative substrate 5B and metal reinforcing plates 3.The access 8 is by the first through hole 53 and second
Through hole 55 is connected to.
Like this, access 8 is set in distributing board assembly 1B, thus when scolding tin covers the first through hole 53, first
The internal pressure of through hole 53 is discharged via the access 8 from the second through hole 55.Scolding tin is easy to be brought into metal reinforcing plates as a result,
3 sides can further increase the connection reliability of Wiring pattern 61B, 62B and metal reinforcing plates 3.
In addition, in the present embodiment, in insulative substrate 5B settings, there are one the first through hole 53 and one second
Through hole 55, but it is not particularly limited in this.Specifically, insulative substrate 5B can be provided with multiple first through holes 53 with
And second through hole 55.Alternatively, can be provided with multiple first through holes 53 in insulative substrate 5B and be provided with multiple
Second through hole 55.
In addition, in this case, as long as the first through hole 53 is connected to by access 8 with the second through hole 55, with
Line plate assembly 1B can be provided with multiple.If at this point, the first through hole 53 is connected to by access 8 with the second through hole 55,
Multiple first through holes 53 can be communicated with each other.Alternatively, multiple second through holes 55 can also be communicated with each other.In addition,
In the case that multiple access 8 are arranged in distributing board assembly 1B, the width of each access 8 mutually can be different.
In addition, in the present embodiment, as shown in Fig. 6 (B), the peripheral part of the second opening 532 of the first through hole 53
The width L1 of 532n (L1 ＜ L2) smaller than the distance between the first through hole 53 and the second through hole 55 (distance between inner wall) L2.
Like this, by enabling L1 ＜ L2 to prevent solder(ing) paste 40 from entering in the second through hole 55 in printed solder paste 40
Portion and block the second through hole 55.The internal pressure of the first through hole 53 is discharged via access 8 and from the second through hole 55 as a result,
Therefore scolding tin is easy to be brought into 3 side of metal reinforcing plates, can further increase Wiring pattern 61B, 62B and metal reinforcing plates 3
Connection reliability.
Next, being illustrated to the manufacturing method of the distributing board assembly 1B of present embodiment.Present embodiment is matched
The manufacturing method of line plate assembly 1B also has the preparatory process of flexible printing patch panel, the installation procedure of metal reinforcing plates, weldering
The printing process and reflow process process of tin cream.
First, the preparation of flexible printing patch panel is carried out with first embodiment by identical process.At this point, second passes through
Through-hole 55 is formed by method identical with the forming method of the through hole 53 illustrated in first embodiment.
In addition, at this time in the first coating 71B settings opening 713.The opening 713 is by first part 714, second part
715 and Part III 716 delimit.The first part 714 is with the peripheral part 531n with the first of the first through hole 53 the opening 531
Opposed mode is formed.In addition, second part 715 is formed in a manner of opposed with the opening 551 of the first of the second through hole 55.Separately
Outside, Part III 716 is formed in a manner of being connected to first part 714 with second part 715.
The preparation of flexible printing patch panel 2B is carried out in the manner described above.Next, the installation of metal reinforcing plates and first
Embodiment is carried out by identical process.
Next, in solder(ing) paste printing process, in a manner of the second opening 532 for covering the first through hole 53 to this
One through hole 53 carries out the printing of solder(ing) paste 40.
Next, in reflow process process, solder(ing) paste 40 is made to melt.At this point, being formed in the first through hole in bridge like
Solder(ing) paste 40 on 53 is bent, into the inside of the first through hole 53.Like this, solder(ing) paste 40 is bent, into the first through hole
In 53, to which the air in the first through hole 53 is compressed, the internal pressure of the first through hole 53 rises.In addition, because solder(ing) paste 40
Melting heat, the air in the first through hole 53 heated.Air expansion in first through hole 53 as a result, to which first passes through
The internal pressure of through-hole 53 is further up.
In this case, access 8 is set in distributing board assembly 1B, the second through hole is set in insulative substrate 5B
55.The internal pressure of the first through hole 53 is discharged via access 8 from the second through hole 55 as a result, therefore scolding tin is easy to be brought into gold
Belong to 3 side of reinforcing plate, the connection reliability of Wiring pattern 61B, 62B and metal reinforcing plates 3 can be further increased.
Later, by being solidified to form scolding tin interconnecting piece 4, thus by first and second Wiring pattern 61B, 62B and gold
Belong to reinforcing plate 3 to be electrically connected.
In the manufacturing process of the distributing board assembly 1B of present embodiment, also need not in addition be arranged for by first with
And second Wiring pattern 61B, 62B be electrically connected with metal reinforcing plates 3 device, process, and the connection can be carried out, so as to
Improve the productivity of distributing board assembly 1B.
In addition, in the present embodiment, gold is also carried out before the printing process of solder(ing) paste and reflow process process
Belong to the installation procedure of reinforcing plate.Therefore, it is possible to further increase the productivity of distributing board assembly 1B.
In addition, in the present embodiment, in reflow process process, can also be carried out at the same time the first Wiring pattern 61B
With being electrically connected for metal reinforcing plates 3 and being electrically connected for the second Wiring pattern 62B and metal reinforcing plates 3.Therefore, it is possible to further
Improve the productivity of distributing board assembly 1B.
In addition, in the present embodiment, insulative substrate 5B is provided at least one first through hole 53, at least one
Second through hole 55, at least one access 8.As a result, when scolding tin covers the first through hole 53, the internal pressure of the first through hole 53
Also it can be discharged via access 8 and from the second through hole 55, therefore scolding tin is easy to be brought into 3 side of metal reinforcing plates, Neng Goujin
One step improves the connection reliability of Wiring pattern 61B, 62B and metal reinforcing plates 3.
Moreover, first and second Wiring pattern 61B, 62B as ground wire is electrically connected with metal reinforcing plates 3, thus, it is possible to
It is enough to assign effectiveness to flexible printing patch panel 2B.
In addition, in the present embodiment, the internal face 534 of the first through hole 53 can also have metal-plated shown in fig. 5
The coat of metal as layer 54.In this case, the internal face 534 of the first through hole 53 has the coat of metal 54, thus is returning
In fluid welding treatment process, first and second Wiring pattern 61B, 62B and metal reinforcing plates 3 further can be more reliably carried out
Electrical connection.In addition, identical as the first through hole 53, though being not particularly illustrated, the second internal face 553 of the second through hole 55 also may be used
With with the coat of metal.
<<Third embodiment>>
In the present embodiment, multiple (in this case, it is 2) through holes this points is provided with first in insulative substrate
Embodiment is different, but identical with first embodiment in addition to this.Hereinafter, only pair part different from first embodiment into
Row explanation marks identical reference numeral to part same as the first embodiment, omits the description.
As shown in Fig. 9 (A) and Fig. 9 (B), in the flexible printing wiring for the distributing board assembly 1C for constituting present embodiment
The insulative substrate 5C of plate 2C is provided with the first through hole 53A and the second through hole 53B.It is set in addition, insulative substrate 5C is removed
Except the quantity for the through hole set, with 5 structure having the same of insulative substrate illustrated in first embodiment.
First and second through hole 53A, 53B is formed along vertical direction (Fig. 9 (A) and Fig. 9 (B) in Z-direction).
The first interarea 51 of insulative substrate 5C is formed with the peripheral part 531An and second of the first opening 531A of the first through hole 53A
The repeating portion 531C that the peripheral part 531Bn of the first opening 531B of through hole 53B is repeated.
In addition, similarly, the second opening of the first through hole 53A is formed in the second interarea 52 of insulative substrate 5C
The repeating portion 532C that the peripheral part 532Bn of the second opening 532B of the peripheral part 532An of 532A and the second through hole 53B is repeated.
In the present embodiment, the width D 1 of the first through hole 53A (D1=equal with the width D 2 of the second through hole 53B
D2).In addition, the width of the width D 3 to the first of repeating portion 532C (and repeating portion 531C) and second through hole 53A, 53B
D1, D2 small (D3≤D1, D3≤D2).Furthermore it is preferred that the width D 3 of repeating portion 532C (and repeating portion 531C) be 0.1mm~
0.5mm.In addition, the width D 3 be preferably the width D 1 of first and second through hole 53A, 53B, D2 50%~100%
Width.In this case, can inhibit to be formed in the scolding tin interconnecting piece 4B between repeating portion 531C and metal reinforcing plates 3 empty
Gap, so as to prevent from generating crack in scolding tin interconnecting piece 4B due tos expansion of the air in the gap etc..
The the first through hole 53A and the second through hole 53B of present embodiment are equivalent to the first through hole of the present invention
One example.In addition, the quantity for being set to the through hole of insulative substrate can also be 2 or more.In addition, being set to insulating properties base
The width of multiple through holes of plate can also be respectively mutually different.
The peripheral part 531An or second that first Wiring pattern 61 extends to the first opening 531A of the first through hole 53A is passed through
The peripheral part of at least one party of the peripheral part 531Bn of the first opening 531B in through-hole 53B.Similarly, the second Wiring pattern 62
Also extend to the second opening 532B of the peripheral part 532An or the second through hole 53B of the second opening 532A of the first through hole 53A
Peripheral part 532Bn at least one party peripheral part.
In the present embodiment, as shown in Fig. 9 (B), scolding tin interconnecting piece 4B is covered each by the first and second through hole
The internal face of 53A, 53B.In addition, in repeating portion 531C, 532C, scolding tin interconnecting piece 4B covers the first and second Wiring pattern
61,62 and positioned at the insulative substrate 5C (insulative substrate 50 in figure) between them.
Next, being illustrated to the manufacturing method of the distributing board assembly 1C of present embodiment.Present embodiment is matched
The manufacturing method of line plate assembly 1C also has the preparatory process of flexible printing patch panel, the installation procedure of metal reinforcing plates, weldering
The printing process and reflow process process of tin cream.
It is same as first embodiment in the preparatory process of flexible printing patch panel, first, prepare plywood, the layer
Lamination is pasted with the electroconductive component 60 of copper foil etc. on the two sides of insulative substrate 5C.
Next, forming the first through hole 53A and the second through hole 53B in ready plywood.Above-mentioned first with
And second the forming method of through hole 53A, 53B use forming method phase with the through hole 53 illustrated in first embodiment
Same method.
Next, being matched in the formation of electroconductive component 60 using method identical with the method illustrated in first embodiment
Line pattern 61,62.
Next, be arranged through hole 712C in the first coating 71C, through hole 712B makes the of the first through hole 53A
The peripheral part 531Bn of the first opening 531B of the peripheral part 531An and the second through hole 53B of one opening 531A expose.Then,
By first in such a way that through hole 712C is corresponding with first opening 531A, 531B of first and second through hole 53A, 53B
Coating 71C is installed on the first interarea 51.
Similarly, through hole 722C is set in the second coating 72C, through hole 722C makes the of the first through hole 53A
The peripheral part 532Bn of the second opening 532B of the peripheral part 532An and the second through hole 53B of two opening 532A expose.Then,
By second in such a way that through hole 722C is corresponding with second opening 532A, 532B of first and second through hole 53A, 53B
Coating 72C is installed on the second interarea 52.
In addition, the first coating 71C is in addition to through hole 712C, first covered with what is illustrated in first embodiment
71 structure having the same of cap rock.Similarly, the second coating 72C is in addition to through hole 722C, with first embodiment
Middle 72 structure having the same of the second coating illustrated.In addition, first and second coating 71C, 72C is installed respectively
Side identical with the method illustrated in first embodiment is also used in the method for the first and second Wiring pattern 61,62
Method.
The preparation of flexible printing patch panel 2C is carried out in the manner described above.Next, in the installation procedure of metal reinforcing plates
In, metal reinforcing plates 3 are installed on flexible printing patch panel 2C.Installation of the metal reinforcing plates 3 to flexible printing patch panel 2C
It is carried out in method same as the first embodiment.
Next, in the printing process of solder(ing) paste, with cover simultaneously the first through hole 53A the second opening 532A and
The mode of the second opening 532B of second through hole 53B carries out solder(ing) paste 40 to first and second through hole 53A, 53B
Printing.
Next, in reflow process process, its solidification is set to connect to form scolding tin after the melting of solder(ing) paste 40 by making
Thus first and second Wiring pattern 61,62 is electrically connected by socket part 4B with metal reinforcing plates 3.
In the manufacturing process of the distributing board assembly 1C of present embodiment, also need not in addition be arranged for by first with
And second Wiring pattern 61,62 be electrically connected with metal reinforcing plates 3 device, process, and the connection can be carried out, so as to carry
The productivity of high distributing board assembly 1C.
In addition, in the present embodiment, gold is also carried out before the printing process of solder(ing) paste and reflow process process
Belong to the installation procedure of reinforcing plate.Therefore, it is possible to further increase the productivity of distributing board assembly 1C.
In addition, in the present embodiment, in reflow process process, can also be carried out at the same time the first Wiring pattern 61 with
The electrical connection of metal reinforcing plates 3 and the second Wiring pattern 62 are electrically connected with metal reinforcing plates 3.Therefore, it is possible to further carry
The productivity of high distributing board assembly 1C.
In addition, in the present embodiment, insulative substrate 5C be provided with multiple (in this case, it is 2) through hole 53A,
53B.As a result, when making solder(ing) paste 40 melt during process is disposed in Reflow Soldering, the scolding tin of melting is easy to be brought into because of capillary phenomenon
51 side of the first interarea of insulative substrate 5C.In addition, by scolding tin connection between metal reinforcing plates 3 and flexible printing patch panel 2C
Partial area expands.Therefore, it is possible to more reliably carry out the first and second Wiring pattern 61,62 and metal reinforcing plates 3
Electrical connection and mechanical connection.
Moreover, the first and second Wiring pattern 61,62 as ground wire is electrically connected with metal reinforcing plates 3, thus, it is possible to
Effectiveness is assigned to flexible printing patch panel 2C.
In addition, in the present embodiment, the internal face of first and second through hole 53A, 53B can also be respectively provided with figure
The coat of metal as the coat of metal 54 shown in 5 in reflow process process, can further more may be used in this case
Being electrically connected for the first and second Wiring pattern 61,62 and metal reinforcing plates 3 is carried out by ground.
<<4th embodiment>>
In the present embodiment, metal reinforcing plates be provided with protrusion this put it is different from first embodiment, but remove this with
Outside, identical with first embodiment.Hereinafter, only a pair part different from first embodiment illustrates, pair implement with first
The identical part of mode marks identical reference numeral, omits the description.
Figure 10 is the sectional view for the distributing board assembly for indicating present embodiment.
As shown in Figure 10, the metal reinforcing plates 3B for constituting the distributing board assembly 1D of present embodiment has protrusion 33, packet
Including upper surface in the figure of the metal reinforcing plates 3B of the protrusion 33 has coating 32.
The protrusion 33 has the cylindrical shape formed along vertical direction (Z-direction in figure), and is formed as convex under overlooking
The center in portion 33 is configured in a manner of corresponding with the first of through hole 53 the opening 531 and the center of the second opening 532.Protrusion 33
Width D 4 it is smaller than the width D 5 of through hole 53 (D4 ＜ D5), protrusion 33 is inserted into the inside of through hole 53.In addition, the shape of protrusion
Shape is not particularly limited.For example, protrusion can have rectangle (cuboid, cube), pyrometric cone, the shapes such as circular cone.
In the present embodiment, the surface of the protrusion 33 of metal reinforcing plates 3B is covered by scolding tin interconnecting piece 4C, and is insulated
Property substrate 5 in through hole 53 internal face 534 also by scolding tin interconnecting piece 4C cover.
Next, being illustrated to the manufacturing method of the distributing board assembly 1D of present embodiment.Present embodiment is matched
The manufacturing method of line plate assembly 1D has the preparatory process of flexible printing patch panel, the installation procedure of metal reinforcing plates, scolding tin
The printing process and reflow process process of cream.
In the preparatory process of flexible printing patch panel, in a manner of same as the first embodiment carrying out flexible printing matches
The preparation of line plate 2.
Next, in the installation procedure of metal reinforcing plates, first, in the basal substrate 31B for constituting metal reinforcing plates 3B
The convex form for being used to form protrusion 33 is set.As the method that the convex form is arranged, it is mechanical to may be exemplified out blasting treatment etc.
Processing, chemical etching etc..
Next, forming coating 32 in basal substrate 31B.Then, passing through for flexible printing patch panel 2 is inserted into protrusion 33
The mode of through-hole 53 installs metal reinforcing plates 3B.The forming method of coating 32 and metal reinforcing plates 3B are to flexible printing patch panel
2 installation method is carried out by method identical with the method illustrated in first embodiment.
Next, in the printing process of solder(ing) paste, with the side of the peripheral part 532n of second opening 532 of the covering of solder(ing) paste 40
Formula prints solder(ing) paste 40 to through hole 53.
Next, in reflow process process, scolding tin is formed by making its solidification after making the melting of solder(ing) paste 40
Thus first and second Wiring pattern 61,62 is electrically connected by interconnecting piece 4C with metal reinforcing plates 3B.
In the manufacturing process of the distributing board assembly 1D of present embodiment, also need not in addition be arranged for by first with
And second Wiring pattern 61,62 be electrically connected with metal reinforcing plates 3B device, process, and the connection can be carried out, so as to
Improve the productivity of distributing board assembly 1D.
In addition, in the present embodiment, gold is also carried out before the printing process of solder(ing) paste and reflow process process
Belong to the installation procedure of reinforcing plate.Therefore, it is possible to further increase the productivity of distributing board assembly 1D.
In addition, in the present embodiment, in reflow process process, can also be carried out at the same time the first Wiring pattern 61 with
The electrical connection of metal reinforcing plates 3B and the second Wiring pattern 62 are electrically connected with metal reinforcing plates 3B's.Therefore, it is possible to further
Improve the productivity of distributing board assembly 1D.
In addition, in the present embodiment, being formed with protrusion 33 in metal reinforcing plates 3B, which is inserted into insulating properties base
The through hole 53 of plate 5.As a result, Reflow Soldering dispose process in make solder(ing) paste 40 melt when, can expand metal reinforcing plates 3B with
The area of coupling part based on scolding tin between flexible printing patch panel 2.Therefore, it is possible to more reliably carry out first and second
Wiring pattern 61,62 and metal reinforcing plates 3B be electrically connected and mechanical connection.
Furthermore it is preferred that being formed in the height H1 and flexible printing patch panel 2 to second of the protrusion 33 of metal reinforcing plates 3B
The height H2 of the upper surface of Wiring pattern 62 it is equal (H1=H2, referring to Fig.1 0).In this case, in the printing process of solder(ing) paste
In, the printing of solder(ing) paste 40 improves, therefore further can reliably carry out the first and second Wiring pattern 61,62 with
Electrical connection between metal reinforcing plates 3B and mechanical connection.In addition, the height H1 of protrusion 33 can be than flexible printing patch panel 2
The upper surface to the second Wiring pattern 62 height H2 low (H1 ＜ H2), flexible printing patch panel 2 to the second Wiring pattern
The height H2 of 62 upper surface can also be lower than the height H1 of protrusion 33 (H2 ＜ H1).
Moreover, the first and second Wiring pattern 61,62 as ground wire is electrically connected with metal reinforcing plates 3B, thus, it is possible to
Effectiveness is assigned to flexible printing patch panel 2.
In addition, in the present embodiment, there are the feelings of the coat of metal 54 as shown in Figure 5 in the internal face of through hole 53
Under condition, in reflow process process, the first and second Wiring pattern 61,62 and gold also further can be more reliably carried out
Belong to the electrical connection of reinforcing plate 3B.
In addition, the embodiment of mistake described above is recorded to make the understanding of the present invention become easy, rather than it is
It limits the present invention and records.Therefore, purport is that each element disclosed in the above embodiment further includes belonging to the present invention
Whole design alterations of range of technology, equivalent.
Reference sign：
1,1B, 1C, 1D... distributing board assembly；2,2B, 2C... flexible printing patch panel；5,5B, 5C... insulating properties base
Plate；51... the first interarea；52... the second interarea；53, the first through hole of 53A, 53B...；531,531A, 531B... first is opened
Mouthful；The peripheral part 531n, 531An, 531Bn...；532,532A, 532B... second is open；532n, 532An, 532Bn... periphery
Portion；534... internal face；54... the coat of metal；55... the second through hole；551... the first opening；552... the second opening；
553... internal face；61, the first Wiring patterns of 61B...；62, the second Wiring patterns of 62B...；71, the first coatings of 71B...；
713... opening；714... first part；715... second part；716... Part III；72, the second coatings of 72B...；
3,3B... metal reinforcing plates；33... protrusion；4,4B, 4C... scolding tin interconnecting piece；40... solder(ing) paste；8... access.
Claims (6)
1. a kind of distributing board assembly, which is characterized in that have：
Flexible printing patch panel at least has the insulative substrate for possessing at least one first through hole and is set to described exhausted
Edge substrate and extend to first through hole periphery Wiring pattern；
Metal reinforcing plates are installed on the flexible printing patch panel, and opposed with first through hole；And
Scolding tin interconnecting piece covers the first internal face of first through hole, the Wiring pattern and the metal is added
Strong plate electrical connection,
The insulative substrate also has at least one second through hole, and the second internal face of second through hole is not by the weldering
Tin interconnecting piece covers,
Also there is the distributing board assembly at least one access, the access to be installed in the flexible printing patch panel and institute
Between stating metal reinforcing plates,
First through hole is connected to by the access with second through hole,
The Wiring pattern includes：
First Wiring pattern is set to the first interarea of the insulative substrate；And
Second Wiring pattern is set to the second interarea of the insulative substrate,
Also there is the flexible printing patch panel coating, the coating to cover first interarea and have opening,
The opening has：
First part, the peripheral part with first through hole and first through hole of first Wiring pattern
It is opposed；
Second part, it is opposed with second through hole；And
The first part is connected to by Part III with the second part,
The access delimited by the opening,
The metal reinforcing plates are installed on the coating,
First Wiring pattern, second Wiring pattern and the metal reinforcing plates are electrically connected by the scolding tin interconnecting piece
It connects.
2. distributing board assembly according to claim 1, which is characterized in that
The coating is revealed with the peripheral part of first through hole and first through hole of first Wiring pattern
The mode gone out covers first interarea.
3. distributing board assembly according to claim 1, which is characterized in that
First internal face has the coat of metal.
4. distributing board assembly according to claim 1, which is characterized in that
The insulative substrate has multiple first through holes.
5. distributing board assembly according to any one of claims 1 to 4, which is characterized in that
The metal reinforcing plates have the protrusion for the inside for being inserted into first through hole.
6. a kind of distributing board assembly, which is characterized in that have：
Flexible printing patch panel at least has the insulative substrate for possessing at least one first through hole and is set to described exhausted
Edge substrate and extend to first through hole periphery Wiring pattern；
Metal reinforcing plates are installed on the flexible printing patch panel, opposed with first through hole；And
Scolding tin interconnecting piece, covers the first internal face of first through hole, and by the Wiring pattern and the metal
Reinforcing plate is electrically connected,
The metal reinforcing plates have the protrusion for the inside for being inserted into first through hole.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-206501 | 2013-10-01 | ||
| JP2013206501 | 2013-10-01 | ||
| JP2014058224A JP5681824B1 (en) | 2013-10-01 | 2014-03-20 | Wiring board assembly and manufacturing method thereof |
| JP2014-058224 | 2014-03-20 | ||
| PCT/JP2014/076052 WO2015050111A1 (en) | 2013-10-01 | 2014-09-30 | Wiring board assembly and method for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105493637A CN105493637A (en) | 2016-04-13 |
| CN105493637B true CN105493637B (en) | 2018-08-31 |
Family
ID=
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1792125A (en) * | 2003-05-22 | 2006-06-21 | 电力波技术公司 | Circuit board assembly employing solder vent hole |
| CN101262735A (en) * | 1996-11-20 | 2008-09-10 | 揖斐电株式会社 | Printed circuit board |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101262735A (en) * | 1996-11-20 | 2008-09-10 | 揖斐电株式会社 | Printed circuit board |
| CN1792125A (en) * | 2003-05-22 | 2006-06-21 | 电力波技术公司 | Circuit board assembly employing solder vent hole |
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Granted publication date: 20180831 |