CN105470199A - Separation method for package part with cooling fins - Google Patents

Abstract

The invention discloses a separation method for a package part with cooling fins. The package part comprises a carrier plate, a chip, a plastic package body and the cooling fins. In a separation process of the package part, the cooling fins are slotted by adopting laser or a cutter and are etched, and then a product is separated by using the cutter. According to the separation method, the problem of burrs of the cooling fins caused by direct use of the cutter for cutting in the separation process of the package part is solved.

Description

A kind of separation method with fin packaging part

Technical field

The invention belongs to integrated antenna package field, specifically a kind of separation method with fin packaging part.

Background technology

Integrated circuit is the core of information industry and new and high technology, and integrated antenna package is the chief component of integrated circuit technique.

Current partial encapsulation product heat-sinking capability is not enough, needs on plastic-sealed body, to increase fin to improve heat-sinking capability, fin and plastic-sealed body is directly combined, and completes in a procedure, substantially increase production efficiency.But in the separation process of packaging part, directly use cutter cutting can cause fin Burr Problem.

Summary of the invention

For above-mentioned prior art Problems existing, the invention provides a kind of separation method with fin packaging part, the method is in packaging part separation process, laser or cutter fluting are first adopted to fin, again to its etching, then use cutter products of separated, this invention solves in packaging part separation process, cuts because directly using cutter the fin Burr Problem caused.

With a separation method for fin packaging part, packaging part there is fin, specifically carries out in accordance with the following steps:

The first step: lbg: adopt laser to fin antioxidation coating fluting, groove depth is 1um to 10um;

Second step: etching bath: adopt liquor ferri trichloridi to etch fin, until fin is separated completely;

3rd step: cutter cuts: along etching bath cutter, plastic-sealed body, support plate are separated, complete packaging part separation of products process.

The alternative steps of the described first step is: cutter is slotted: adopt cutter to fin antioxidation coating fluting, groove depth is 1um to 10um.

Accompanying drawing explanation

Fig. 1 is the support plate figure in the present invention;

Fig. 2 is product profile after upper core in the present invention;

Fig. 3 is product profile after pressure welding in the present invention;

Fig. 4 is profile after plastic packaging in the present invention;

Fig. 5 is to (groove depth is 1um to 10um) profile after fin surface fluting in the present invention;

Fig. 6 is the profile of (degree of depth is fin thickness) after fin fluting after etching in the present invention;

Fig. 7 is the product profile after cutting with cutter again after etching in the present invention.

In figure: 1-fin, 2-plastic-sealed body, 3-bonding wire, 4-chip, 5-support plate, 6-upper core glue, 7-etching bath, 8-lbg.

Embodiment

Add a manufacture method for the packaging part of fin, specifically carry out in accordance with the following steps:

The first step: prepare support plate 5; As shown in Figure 1;

Second step: wafer is thinning, thinning scope is 50um-250um;

3rd step: scribing, forms single chips 4;

4th step: upper core, in employing, chip 4 is connected on support plate 5 by core glue 6; As shown in Figure 2;

5th step: pressure welding, adopts bonding wire 3 to connect chip 4 and support plate 5; As shown in Figure 3;

6th step: plastic packaging, plastic-sealed body 2 surrounds the top of chip 4, upper core glue 6 and support plate 5, and plastic packaging fin 1, then solidifies simultaneously; As shown in Figure 4;

7th step: print, cut, pack.

With regard to the cutting technique of above-mentioned 7th step, i.e. a kind of separation method with fin packaging part, specifically carry out in accordance with the following steps:

The first step: lbg 8: adopt laser to fin antioxidation coating fluting, groove depth is 1um to 10um; As shown in Figure 5;

Second step: etching bath 7: adopt liquor ferri trichloridi to etch fin, until fin is separated completely; As shown in Figure 6;

3rd step: cutter cuts: along etching bath cutter, plastic-sealed body, support plate are separated, complete packaging part separation of products process.As shown in Figure 7.

The alternative steps of the described first step is: cutter is slotted: adopt cutter to fin antioxidation coating fluting, groove depth is 1um to 10um.

Claims (2)

1. the separation method with fin packaging part, packaging part has fin, it is characterized in that: specifically carry out in accordance with the following steps:

The first step: lbg: adopt laser to fin antioxidation coating fluting, groove depth is 1um to 10um;

Second step: etching bath: adopt liquor ferri trichloridi to etch fin, until fin is separated completely;

3rd step: cutter cuts: along etching bath cutter, plastic-sealed body, support plate are separated, complete packaging part separation of products process.

2. a kind of separation method with fin packaging part according to claim 1, is characterized in that:

The alternative steps of the described first step is: cutter is slotted: adopt cutter to fin antioxidation coating fluting, groove depth is 1um to 10um.