CN105449221B - The preparation method of collector - Google Patents
The preparation method of collector Download PDFInfo
- Publication number
- CN105449221B CN105449221B CN201410269132.4A CN201410269132A CN105449221B CN 105449221 B CN105449221 B CN 105449221B CN 201410269132 A CN201410269132 A CN 201410269132A CN 105449221 B CN105449221 B CN 105449221B
- Authority
- CN
- China
- Prior art keywords
- carbon nanotube
- layer
- nanotube layer
- metal layer
- collector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 134
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 126
- 229910052751 metal Inorganic materials 0.000 claims abstract description 118
- 239000002184 metal Substances 0.000 claims abstract description 118
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 111
- 239000002131 composite material Substances 0.000 claims abstract description 36
- 229910021645 metal ion Inorganic materials 0.000 claims description 16
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 239000002238 carbon nanotube film Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000002071 nanotube Substances 0.000 claims description 4
- 238000005411 Van der Waals force Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 15
- 239000007772 electrode material Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000003792 electrolyte Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000013528 metallic particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000009335 monocropping Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000011149 active material Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- -1 metals ion Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cell Electrode Carriers And Collectors (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The present invention relates to a kind of preparation method of collector, including：A carbon nanotube layer is provided, the carbon nanotube layer includes multiple micropores and relative first surface and second surface；A first metal layer is electroplated in the first surface of the carbon nanotube layer；A second metal layer is electroplated in the second surface of the carbon nanotube layer, forms a CNT composite bed；And tear the CNT composite bed, the carbon nanotube layer is set to be divided into the first sub- carbon nanotube layer and the second sub- carbon nanotube layer, the first sub- carbon nanotube layer is attached at the surface of the first metal layer, and the second sub- carbon nanotube layer is attached at the surface of the second metal layer.
Description
Technical field
The present invention relates to a kind of preparation method of collector, more particularly to a kind of collector based on carbon nano tube structure
Preparation method.
Background technology
Collector is an important chief component of electrochemical cell.In an electrochemical cell, collection liquid surface leads to
Often carry electrode active material and contact electrolyte, electron channel can be provided for electrochemical reaction, to accelerate electronics transfer, and will
Electric transmission forms electric current to external circuit.Therefore, the performance of collector and the performance of electrochemical cell are closely related.
Existing collector is generally prepared by conductive metal layer, such as copper foil and aluminium foil.However, these metal levels are easy to
One layer of passivating film is oxidized to form, or is corroded to form an insulating barrier in the electrolytic solution, the passivating film or insulating barrier are very big
Ground adds the contact resistance of electrode active material and the metal level, so as to reduce the capacity of electrochemical cell and energy conversion
Efficiency.
The content of the invention
In view of this, it is necessory to provide a kind of collector with smaller contact resistance between electrode active material
Preparation method.
A kind of preparation method of collector, including：A carbon nanotube layer is provided, the carbon nanotube layer has relative
One surface and second surface, the carbon nanotube layer include multiple CNTs, at least part CNT be arranged at intervals to be formed it is more
Individual micropore；A first metal layer is electroplated in the first surface of the carbon nanotube layer, in the second surface of the carbon nanotube layer
A second metal layer is electroplated, forms a CNT composite bed；And the CNT composite bed is torn, make the CNT
Layer is divided into the first sub- carbon nanotube layer and the second sub- carbon nanotube layer, and the first sub- carbon nanotube layer is attached at described first
The surface of metal level, the second sub- carbon nanotube layer are attached at the surface of the second metal layer.
A kind of preparation method of collector, including：One the first metal layer is provided；A carbon nanotube layer is provided, the carbon is received
Mitron layer includes relative first surface and second surface, and the first surface of the carbon nanotube layer is attached at into first gold medal
Belong to the surface of layer；A second metal layer is electroplated in the second surface of the carbon nanotube layer, forms a CNT composite bed；And
The CNT composite bed is torn, the carbon nanotube layer is formed one first sub- carbon nanotube layer and is attached at first gold medal
Belong to the surface of layer, one second sub- CNT is attached at the surface of the second metal layer layer by layer, forms two collectors.
Compared with prior art, the preparation method of collector provided by the present invention, made by way of plating described
CNT is firmly held between the first metal layer and second metal layer, and the mode then separated again forms collector, can
More than two collectors are once obtained, the carbon nanotube layer is firmly fixed and the first metal layer or the second metal
Layer surface, and blocked metal level directly to be contacted with electrolyte, so as to prevent the corrosion between electrolyte and metal level anti-
Should, reduce influence of the corrosion product to the contact resistance between collector and electrode material layer, the battery capacity of raising and turn
Change efficiency.
Brief description of the drawings
Fig. 1 is the flow chart of the preparation method for the collector that first embodiment of the invention provides.
Fig. 2 is the structural representation of carbon nano-tube film in the collector that first embodiment of the invention provides.
Fig. 3 is the structural representation of carbon nanotube layer in the collector that first embodiment of the invention provides.
Fig. 4 is flow chart of the first embodiment of the invention in the carbon nanotube layer electroplating surface metal layer.
Fig. 5 is to tear the CNT composite bed in the preparation method for the collector that first embodiment of the invention provides
Flow chart.
Fig. 6 is the flow chart of the preparation method for the collector that second embodiment of the invention provides.
Main element symbol description
| Collector | 10 |
| Carbon nanotube layer | 110 |
| The first metal layer | 120 |
| Second metal layer | 130 |
| First surface | 111 |
| Micropore | 112 |
| Second surface | 113 |
| CNT composite bed | 11 |
| First sub- carbon nanotube layer | 114 |
| Second sub- carbon nanotube layer | 116 |
| Electrode slice | 140 |
Specific examples below will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Below in conjunction with the accompanying drawings and the specific embodiments, collector provided by the invention and preparation method thereof is made further
Describe in detail.
Referring to Fig. 1, the present invention also provides a kind of preparation method of collector 10, comprise the following steps：
Step S10, there is provided a carbon nanotube layer 110, the carbon nanotube layer 110 include relative first surface 111 and
Second surface 113；
Step S11, a first metal layer 120 is electroplated in the first surface 111 of the carbon nanotube layer 110, in the carbon
The second surface 113 of nanotube layer 110 electroplates a second metal layer 130, forms a CNT composite bed 11；And
Step S12, the CNT composite bed 11 is torn, the carbon nanotube layer 110 is divided into the first sub- carbon and receive
114 and second sub- carbon nanotube layer 116 of mitron layer, the first sub- carbon nanotube layer 114 are attached at the first metal layer 120
Surface, the second sub- carbon nanotube layer 116 is attached at the surface of the second metal layer 130.
In step slo, the carbon nanotube layer 110 may be disposed at a substrate（It is not shown）Surface, can also pass through one
Fixed frame is vacantly set, so that the carbon nanotube layer 10 can vacantly be set in follow-up solution.The substrate can be
Insulated substrate or electrically-conductive backing plate.Because the carbon nanotube layer 110 is a self supporting structure, therefore spaced branch can be passed through
Support body is supported, and the carbon nanotube layer 110 is vacantly set.The carbon nano tube structure may include that the carbon of multilayer laminated setting is received
Mitron film, the multilayer carbon nanotube film layer is folded and arranged in a crossed manner, between the CNT in different layers carbon nano-tube film mutually
Interweave and form a network structure.Each carbon nano-tube film includes multiple CNTs, and the multiple CNT is in the same direction
It is arranged of preferred orient.The preferred orientation refers to the basic court of overall bearing of trend of most of CNTs in carbon nano-tube film
Same direction.Moreover, the overall bearing of trend of most of CNTs is basically parallel to the surface of carbon nano-tube film.Enter one
Step, most CNTs are joined end to end by Van der Waals force in the carbon nano-tube film.The carbon nanotube layer 110 includes
Multiple micropores 112, the multiple micropore 112 run through the carbon nanotube layer along perpendicular to the direction of the thickness of carbon nanotube layer 110
110.In the present embodiment, the carbon nanotube layer 110 is vacantly set by a fixed frame.
In step s 11, the first metal layer 120 is formed by way of plating in the carbon nanotube layer 110
First surface 111.Specifically, the electro-plating method of the first metal layer 120 comprises the following steps：
Step S111, there is provided the solution containing metal ion；
Step S112, the carbon nanotube layer 110 is immersed in the solution, the first table of the carbon nanotube layer 110
Face 111 and second surface 113 are exposed in solution, and and interval setting parallel with the electrode slice in solution；
Step S113, an electrical potential difference is formed between the carbon nanotube layer 110 and the electrode slice, makes metal ion also
Originally it was metal and electroplated the first surface 111 and second surface 113 in the carbon nanotube layer 110, and formed first metal
Layer 120 and second metal layer 130.
In step S111, the forming method of the solution containing metal ion is unlimited, can in the solution as long as ensureing
Form metal ion.The concentration of the metal ion can be according to required the first metal layer 120 and the thickness of second metal layer 130
Degree etc., which is actually needed, to be selected.In the present embodiment, the solution formed by way of copper sulphate is dissolved in the water copper from
Sub- solution.
In step S112, the carbon nanotube layer 110 is arranged at intervals with the electrode slice, and the spacing distance distance is
It can be 0.5 centimetre ~ 3 centimetres, can also be selected according to being actually needed.The electrode slice includes inertia graphite electrode piece, platinum electricity
Pole piece, stainless steel electrode piece and layered carbon nano tubular construction, its area are more than or equal to the area of carbon nano-tube film.The electrode
Piece plays a part of electrode, if good conductivity, and can meet to require with inertia.The carbon nanotube layer 110 is suspended in
In the metal ion solution, specifically, because the carbon nanotube layer 110 is vacantly set by fixed frame, therefore soaked
When entering in metal ion solution, the carbon nanotube layer 110 between fixed frame is suspended in the solution.In the present embodiment,
The electrode slice is copper sheet, and the area of the copper sheet is more than the area of the carbon nanotube layer 110.
In step S113, an electrical potential difference is formed between carbon nanotube layer 110 and electrode slice, and make electrode slice and power supply
Positive pole phase continuous cropping anode, carbon nanotube layer 110 and power cathode phase continuous cropping negative electrode, metal ion is in the CNT as negative electrode
Reduction reaction occurs on layer 110, forms metallic particles and is attached on the tube wall of the CNT.In addition, in the mistake of plating
Cheng Zhong, the surface of CNT forms multiple dangling bonds in the carbon nanotube layer 110 so that the metallic particles passes through described
The dangling bonds of CNT are combined closely with the CNT.Further, the metallic particles is in the carbon nanotube layer 110
Surface link each other, formed a continuous structure so that the first metal layer 120 and second metal layer 130 are one
Continuous structure.In addition, part metals ion reduction is the CNT table that metallic particles is attached to the opening position of micropore 112
Face, and cause the first metal layer 120 mutually to merge to form integrative-structure in the opening position of micropore 112 with second metal layer 130.
The method for forming electrical potential difference between the anode and the cathode includes applying constant current, constant pressure between the anode and the cathode
Or scanning potential etc..In the present embodiment, between positive electrode and negative electrode formed electrical potential difference method for apply constant pressure, anode with
The voltage applied between negative electrode is 0.5 ~ 1.2 volt, and the time is 0.5 hour ~ 4 hours.
Further, in step S112, the first metal layer 120 and second metal layer 130 can also be formed step by step, specifically
, also the second surface 113 of the carbon nanotube layer 110 first can be attached at a substrate（It is not shown）, only make first surface 111
In metal ion solution, first the first metal layer 120 is formed in the plating of first surface 111；Then first will be electroplate with again
The carbon nanotube layer 110 of metal level 120 inverts, and makes the second surface 113 of the carbon nanotube layer 110 molten exposed to metal ion
In liquid, and it is oppositely arranged with the electrode slice, then electroplates the second metal layer 130 in second surface 113.
Further, during second metal layer 130 is electroplated, part second metal layer 130 runs through the micropore 112,
So as to be contacted with the first metal layer 120 and form integrative-structure, the carbon nanotube layer 110 is held on first gold medal
Belong between layer 120 and second metal layer 130.It is appreciated that because the carbon nanotube layer 110 immerses the metal ion solution
In, therefore, the metal ion is electroplated in the first surface 111 and second surface 113 of the carbon nanotube layer 110 simultaneously, i.e.,
The second metal layer 130 can be formed simultaneously with the first metal layer 120.
Further, plating is formed after the second metal layer 130, and it is clear using cleaning solution to can further include one
The step of washing and drying the carbon nanotube layer 110, the first metal layer 120 and second metal layer 130, to remove residual
Other impurities, and the first metal layer 120 and second metal layer 130 is more firmly bonded to the carbon nanotube layer 110
Surface.
In step s 12, the CNT composite bed 11 can by the CNT composite bed 11 it is relative two
Individual surface applies the active force of opposite direction, the CNT composite bed 11 is divided for two parts.Please refer to fig. 5, institute
The disconnection method for stating CNT composite bed 11 comprises the following steps：
Step S121, two surfaces relative to the CNT composite bed 11 apply the directed force F of opposite direction,
F’；
Step S122, it is continuously applied the institute firmly F, F ', make the carbon nanotube layer 110 in the CNT composite bed 11
Separated from centre, be attached at the surface of the first metal layer 120 and second metal layer 130 respectively, form two collectors 10.
In step S121, described two directed force Fs, F ' big I are according to the carbon nanotube layer 110, first gold medal
Category layer 120 and the thickness of second metal layer 130 are selected, so that the carbon nanotube layer 110 can separate.Described two works
Firmly F, F ' put on two relative surfaces of CNT composite bed 11, so as to by CNT composite bed 11 along thickness side
To separating, i.e., carbon nanotube layer 110 is divided into the first essentially identical sub- 114 and second sub- carbon of carbon nanotube layer of two panels area
Nanotube layer 116, the surface for being attached at the first metal layer 120 and second metal layer 130 is corresponded to respectively, so as to form two
The essentially identical collector 10 of area, and the area of the collector 10 is substantially equal to the CNT composite bed before splitting
11 area.That is, the area of the first sub- carbon nanotube layer 114 and the second sub- carbon nanotube layer 116 is substantially equal to
The area of the carbon nanotube layer 110 before segmentation.
The separating method can be selected as needed, for example, using adhesive tape be attached to the first metal layer 120 and
The surface of second metal layer 130, the adhesive tape is then pulled open again.The clamping devices such as tweezers can also be utilized, by the carbon nanometer
Pipe composite bed 11 separates.Further, in the case where the thickness of CNT composite bed 11 meets condition, blade can also be used
The CNT composite bed 11 is separated Deng cutting tool.In the present embodiment, by tearing the CNT composite bed 11
Mode to the CNT composite bed 11 apply directed force F, F '.
It is appreciated that a surface of the CNT composite bed 11 can also be fixed, and it is compound to the CNT
The mode that another surface of layer 11 applies directed force F separates the CNT composite bed 11.
In step S122, during directed force F, F ' is continuously applied, carbon nanotube layer 110 is in directed force F, F '
Effect is lower to be separated, and forms the first sub- 114 and second sub- carbon nanotube layer 116 of carbon nanotube layer, and the first sub- carbon nanometer
Tube layer 114 is attached at the surface of the first metal layer 120, and the dangling bonds by carbon nano tube surface and first metal
Layer 120 combines；The second sub- carbon nanotube layer 116 is attached at the surface of the second metal layer 130, and passes through CNT
The dangling bonds on surface and the surface of the second metal layer 130.During separation, the first sub- carbon nanotube layer 114
It is essentially identical with the thickness of the second sub- carbon nanotube layer 116, and be respectively uniformly distributed in the gold medal of the first metal layer 120 and second
Belong to the surface of layer 130.CNT in the first sub- carbon nanotube layer 114 is basically parallel to the first metal layer 120
Surface, the CNT in the second sub- carbon nanotube layer 114 is basically parallel to the surface of the second metal layer 130.
The preparation method of collector provided in an embodiment of the present invention has advantages below：In the carbon by way of plating
The surface of nanotube layer forms the first metal layer and second metal layer, and the first metal layer and second metal layer can be made firm
The surface for being bonded to the carbon nanotube layer, so as to avoid the drift of CNT in subsequent applications or come off；The carbon is received
Mitron layer can block metal level directly to be contacted with certain corrosive electrolyte, so as to prevent electrolyte and metal level it
Between corrosion reaction, the metal level is not corroded, reduce corrosion product to connecing between collector and electrode material layer
The influence of electric shock resistance；Furthermore because the carbon nanotube layer has good electric conductivity, and the carbon nanotube layer directly with it is described
Electrode material layer is contacted and can preferably combined with the electrode material layer, so as to reduce further the collector and the electricity
Contact resistance between the active material layer of pole；Finally, then the first metal layer and second metal layer are formed again by plating
The mode torn, two collectors can be once prepared, so as to improve the preparation efficiency of the collector.
Also referring to Fig. 6, second embodiment of the invention provides a kind of preparation method of collector 10, including following step
Suddenly：
Step S20 a, there is provided the first metal layer 120；
Step S21, there is provided a carbon nanotube layer 110, the carbon nanotube layer 110 include relative first surface 111 and
Second surface 113, the first surface 111 of the carbon nanotube layer 110 is attached to the surface of the first metal layer 120；
Step S22, a second metal layer 130 is electroplated in the second surface 113 of the carbon nanotube layer 110, forms a carbon
Nanotube composite bed 11；And
Step S23, the CNT composite bed 11 is torn, the carbon nanotube layer 110 is formed one first sub- carbon and receive
Mitron layer 114 is attached at the surface of the first metal layer 120, and one second sub- CNT 116 is attached at described second layer by layer
The surface of metal level 130.
The preparation method and first embodiment for the collector 10 that second embodiment of the invention provides are essentially identical, and its difference exists
In now the first surface 111 of the carbon nanotube layer 110 and the first metal layer 120 being attached, then again in second surface
113 depositing second metal layers 130.
In the step s 21, the first metal layer 120 is combined closely with the carbon nanotube layer 110, first metal
Layer 120 plays a part of the support carbon nanotube layer 110, and the thickness of the first metal layer 120 can be selected as needed
Select, to support the carbon nanotube layer 10.In the present embodiment, the first metal layer 120 can be 10 microns, so that described
Collector 10 has certain mechanical strength.
In step S22, during the deposition of the second metal layer 130, the second gold medal of the corresponding opening position of space 112
Category layer 130 will pass through the space 112 of the carbon nanotube layer 110, and is merged with the first metal layer 120, make institute
Carbon nanotube layer 110 is stated to be firmly fixed between the first metal layer 120 and second metal layer 130.
In addition, those skilled in the art can also do other changes in spirit of the invention, these are according to present invention spirit
The change done, it should all be included in scope of the present invention.
Claims (12)
1. a kind of preparation method of collector, including：
A carbon nanotube layer is provided, the carbon nanotube layer has relative first surface and second surface, the carbon nanotube layer
Including multiple CNTs, at least part CNT is arranged at intervals to form multiple micropores；
A first metal layer is electroplated in the first surface of the carbon nanotube layer, is electroplated in the second surface of the carbon nanotube layer
One second metal layer, form a CNT composite bed；And
The CNT composite bed is torn, the carbon nanotube layer is divided into the first sub- carbon nanotube layer along its thickness direction
And the second sub- carbon nanotube layer, the first sub- carbon nanotube layer are attached at the surface of the first metal layer, second son
Carbon nanotube layer is attached at the surface of the second metal layer.
2. the preparation method of collector as claimed in claim 1, it is characterised in that the carbon nanotube layer is a self-supporting knot
Structure, it is made up of multiple CNTs, thickness direction of the multiple micropore along the carbon nanotube layer runs through the CNT
Layer.
3. the preparation method of collector as claimed in claim 2, it is characterised in that correspond to micro well locations in electroplating process
The first metal layer and second metal layer at place mutually merge to form integrative-structure.
4. the preparation method of collector as claimed in claim 2, it is characterised in that the first metal layer and second metal layer
Electroplating process comprise the following steps：
One solution containing metal ion is provided；
The carbon nanotube layer is immersed in the solution, and and interval setting parallel with the electrode slice in solution, the carbon
The first surface and second surface of nanotube layer are exposed in the metal ion solution；
An electrical potential difference is formed between the carbon nanotube layer and the electrode slice, makes metal ion reducing metal and electroplates in institute
The first surface and second surface of carbon nanotube layer are stated, forms the first metal layer and second metal layer.
5. the preparation method of collector as claimed in claim 4, it is characterised in that the first metal layer is in the carbon nanometer
The first surface of tube layer forms a continuous structure, and the second metal layer forms one in the second surface of the carbon nanotube layer
Continuous structure.
6. the preparation method of collector as claimed in claim 4, it is characterised in that the carbon nanotube layer immerses metal ion
In solution and the setting that suspends, the carbon nanotube layer in fixed frame are vacantly set.
7. the preparation method of collector as claimed in claim 1, it is characterised in that the carbon nanotube layer includes multilayer laminated
And carbon nano-tube film arranged in a crossed manner, combined by Van der Waals force between the multilayer carbon nanotube film, each carbon nano-tube film
It is arranged of preferred orient in the same direction including multiple CNTs, has one between the CNT in adjacent carbon nano-tube film
Intersecting angle α, and the α is more than 0 degree and less than or equal to 90 degree.
8. the preparation method of collector as claimed in claim 1, it is characterised in that described along the CNT composite bed
Thickness direction is torn the CNT composite bed and specifically included：
Two surface directions relative to the CNT composite bed apply the directed force F of opposite direction, F '；
It is continuously applied the institute firmly F, F ', the carbon nanotube layer in the CNT composite bed is separated from centre, paste respectively
The surface of the first metal layer and second metal layer is invested, forms two collectors.
9. the preparation method of collector as claimed in claim 8, it is characterised in that the application direction of the directed force F is vertical
In the first surface, the directed force F ' application direction perpendicular to the second surface.
10. the preparation method of collector as claimed in claim 8, it is characterised in that in the first sub- carbon nanotube layer
Surface of the CNT parallel to the first metal layer；CNT in the second sub- carbon nanotube layer is parallel to described
The surface of second metal layer.
11. a kind of preparation method of collector, including：
One the first metal layer is provided；
A carbon nanotube layer is provided, the carbon nanotube layer includes relative first surface and second surface, by the carbon nanometer
The first surface of tube layer is attached at the surface of the first metal layer；
A second metal layer is electroplated in the second surface of the carbon nanotube layer, forms a CNT composite bed；And
The CNT composite bed is torn, the carbon nanotube layer is formed one first sub- carbon nanotube layer and is attached at described the
The surface of one metal level, one second sub- CNT are attached at the surface of the second metal layer layer by layer, form two collectors.
12. the preparation method of collector as claimed in claim 11, it is characterised in that the mistake of the deposition of the second metal layer
Cheng Zhong, correspond to the second metal layer at clearance position and run through the space of the carbon nanotube layer, and melt with the first metal layer
It is combined.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269132.4A CN105449221B (en) | 2014-06-17 | 2014-06-17 | The preparation method of collector |
| TW103123449A TWI508360B (en) | 2014-06-17 | 2014-07-08 | Method of making current collector |
| US14/738,955 US20150361573A1 (en) | 2014-06-17 | 2015-06-15 | Method of making current collector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410269132.4A CN105449221B (en) | 2014-06-17 | 2014-06-17 | The preparation method of collector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105449221A CN105449221A (en) | 2016-03-30 |
| CN105449221B true CN105449221B (en) | 2018-04-03 |
Family
ID=54835672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410269132.4A Active CN105449221B (en) | 2014-06-17 | 2014-06-17 | The preparation method of collector |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20150361573A1 (en) |
| CN (1) | CN105449221B (en) |
| TW (1) | TWI508360B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019153273A1 (en) * | 2018-02-09 | 2019-08-15 | 深圳前海优容科技有限公司 | Battery, battery cell, and current collector and manufacturing method therefor |
| CN108539153B (en) * | 2018-03-27 | 2022-10-14 | 电子科技大学 | Metal lithium composite negative electrode material and preparation method thereof |
| CN109216703A (en) * | 2018-09-06 | 2019-01-15 | 珠海光宇电池有限公司 | A kind of flexible, porous collector and preparation method thereof |
| CN111048789B (en) * | 2019-12-26 | 2023-01-24 | 珠海冠宇电池股份有限公司 | Current collector and preparation method and application thereof |
| CN111900413B (en) * | 2020-08-11 | 2021-09-28 | 珠海冠宇电池股份有限公司 | Current collector and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315454A (en) * | 2011-08-02 | 2012-01-11 | 大连丽昌新材料有限公司 | A kind of preparation of composite collector and the application in the lithium ion flow battery thereof |
| CN102738469A (en) * | 2012-07-11 | 2012-10-17 | 中国第一汽车股份有限公司 | Soft type polymeric compound lithium battery and preparation method thereof |
| CN103187573A (en) * | 2011-12-28 | 2013-07-03 | 清华大学 | Lithium-ion battery electrode |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2634306A (en) * | 1950-04-26 | 1953-04-07 | Douglas B Cruikshank | Method of battery manufacture |
| CN103545529B (en) * | 2012-07-13 | 2016-01-20 | 清华大学 | Film lithium ion battery |
| CN103545555B (en) * | 2012-07-13 | 2016-01-20 | 清华大学 | The preparation method of lithium ion battery |
-
2014
- 2014-06-17 CN CN201410269132.4A patent/CN105449221B/en active Active
- 2014-07-08 TW TW103123449A patent/TWI508360B/en active
-
2015
- 2015-06-15 US US14/738,955 patent/US20150361573A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102315454A (en) * | 2011-08-02 | 2012-01-11 | 大连丽昌新材料有限公司 | A kind of preparation of composite collector and the application in the lithium ion flow battery thereof |
| CN103187573A (en) * | 2011-12-28 | 2013-07-03 | 清华大学 | Lithium-ion battery electrode |
| CN102738469A (en) * | 2012-07-11 | 2012-10-17 | 中国第一汽车股份有限公司 | Soft type polymeric compound lithium battery and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201601374A (en) | 2016-01-01 |
| TWI508360B (en) | 2015-11-11 |
| CN105449221A (en) | 2016-03-30 |
| US20150361573A1 (en) | 2015-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105449221B (en) | The preparation method of collector | |
| JP4762368B2 (en) | Porous metal foil and method for producing the same | |
| JP4702304B2 (en) | Fuel cell separator, fuel cell separator manufacturing method, and fuel cell | |
| US20130321983A1 (en) | Nano-porous electrode for super capacitor and manufacturing method thereof | |
| RU2006117787A (en) | ELECTRODE FOR USE IN THE SECONDARY BATTERY, METHOD OF ITS PRODUCTION AND SECONDARY BATTERY | |
| KR840003702A (en) | Electrode coated with lead or lead alloy and its preparation | |
| CN103943281A (en) | Preparation method of electric wire and cable with copper-graphene complex phase conductive wire core | |
| CN105023752B (en) | Printed flexible electrolytic capacitor and manufacturing method thereof | |
| CN105189825B (en) | Electrolytic cell for electrolytic etching of metal extraction | |
| JP5458505B2 (en) | Electrode for electric double layer capacitor and method for manufacturing the same | |
| CN108832133A (en) | A kind of flexible current-collecting body battery and its manufacturing method | |
| CN113150723A (en) | Conductive adhesive, and composite current collector, battery and object with conductive adhesive | |
| Kim et al. | Highly conductive, capacitive, flexible and soft electrodes based on a 3D graphene–nanotube–palladium hybrid and conducting polymer | |
| CN105185679B (en) | TEM (transmission electron microscope) micro-grid | |
| CN102501464B (en) | Lead-acid accumulator assembled by pole plate with frame-cast, screened and pasted lead-plastic compound grid | |
| CN210897476U (en) | Lithium ion battery pole piece structure with multilayer diaphragm | |
| CN1958860A (en) | Negative plate of permanent nickel fastener | |
| JP5846409B2 (en) | Conductive structure for polymer electrolyte fuel cell and polymer electrolyte fuel cell | |
| CN202384440U (en) | Lead-acid storage battery assembled by lead-plastic compound grid cast frame screened and paste-coated polar plates | |
| CN116657209A (en) | Polymer fiber substrate composite metal film, preparation method and application | |
| CN105448623B (en) | The preparation method of field emission body | |
| CN203128675U (en) | Cathode plate for electrolytic copper powder | |
| Ma et al. | Preliminary research on Pb-Sn-Al laminated composite electrode materials applied to zinc electrodeposition | |
| US11374133B2 (en) | Metal matrix composites for contacts on solar cells | |
| CN202610345U (en) | Electrolytic tank with double-coating composite electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |