CN105420770A - Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof - Google Patents
Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof Download PDFInfo
- Publication number
- CN105420770A CN105420770A CN201510853444.4A CN201510853444A CN105420770A CN 105420770 A CN105420770 A CN 105420770A CN 201510853444 A CN201510853444 A CN 201510853444A CN 105420770 A CN105420770 A CN 105420770A
- Authority
- CN
- China
- Prior art keywords
- plating
- electroplating
- electroplate liquid
- sodium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses color-change-preventing cyanide-free silver plating electroplating liquid and an electroplating method thereof. The electroplating liquid comprises, by mass volume concentration, 38-50 g/L of silver nitrate, 110-120 g/L of 2-sulpho-5,5-dimethyl hydantoin, 10-30 g/L of succinimide, 40-100 g/L of sodium pyrophosphate, 30-70 g/L of pyrophosphoric acid, 35-55 g/L of methionine, 0.5-2 g/L of polyethylene glycol, 4-10 g/L of benzotriazole, 1-8 g/L of nonylphenol polyoxyethylene laurel ether and 20-150 g/L of sodium sulfite. The pyrophosphoric acid is used for adjusting the pH to range from 3 to 5, and the temperature of the electroplating liquid ranges from 20 DEG to 55 DEG C. According to the color-change-preventing cyanide-free silver plating electroplating liquid and the electroplating method thereof, the combining force between a silver plating layer obtained through the electroplating method and a plating part base material is good, the leveling capability is good, the covering capability is excellent, the color is bright and not likely to become dark, an intermediate layer does not need to be pre-plated on the surface of the base material, the electroplating liquid can be used in a wide current range, and repeatability is good.
Description
Technical field
The invention belongs to alloy plating liquid field, be specifically related to a kind of Anti-tarnishing plate silver plating solution and electro-plating method thereof.
Background technology
Argent, with its excellent performance and lower cost, becomes one of precious metal be most widely used, especially its distinctive silvery white metalluster, is often applied to family high-grade apparatus, artwork and jewellery etc. as ornament layer.Sulfurous gas in air or hydrogen sulfide easily with silvering generation deferred reaction, cause silver coating from coloring dimmed, usually through plating posttreatment, will mainly soak bright, chemical and electrochemical passivation, painting tectum etc.
Cyaniding plant of silver technique because of its bath stability good, current silver plating solution is most based on hydride systems, and serious harm human body and ecotope, just progressively replaced by non-cyanide silver coating.The non-cyanide silver electroplating solution ion and silver ions not containing cyanogen carries out complexing, obtains coating by electrochemical reaction deposition.But the poor stability of current used non-cyanide silver coating system ubiquity plating solution, the stress of silvered film are large, with the problem such as the associativity current density range that is poor, that allow of substrate is narrow, thus non-cyanide silver coating is not widely used in electrosilvering industry.
In order to obtain good bonding force, in cyanide-free silver plating process, adopt first plates one deck nickel at substrate surface more, then electroless plating one deck silver, last electrosilvering, the binding force of cladding material obtained through this method and compactness good.This processing step is complicated, and energy consumption is larger.Developing a kind of can the cyanide-free silver plating process of industrial applications be the target of people's unremitting pursue.
Summary of the invention
Goal of the invention: for overcoming defect of the prior art, the invention provides a kind of Anti-tarnishing plate silver plating solution and electro-plating method thereof, and to solve, existing non-cyanide silver electroplating system bath stability is poor, current density range is narrow and the allochroic technical problem of coating.
Technical scheme: the invention provides a kind of without cyanogen Anti-tarnishing cyanogen-free silver-plating solution, comprise the component of following mass body volume concentrations: Silver Nitrate 38 ~ 50g/L, 2-sulfo--5,5-T10 110 ~ 120g/L, succimide 10 ~ 30g/L, trisodium phosphate 40 ~ 100g/L, tetra-sodium 30 ~ 70g/L, methionine(Met) 35 ~ 55g/L, polyoxyethylene glycol 0.5 ~ 2g/L, benzotriazole 4-10g/L, Nonyl pheno bay ether 1-8g/L and S-WAT 20 ~ 150g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 3 ~ 5, and temperature of electroplating solution is 20 ~ 55 DEG C.
Wherein, as preferably, Anti-tarnishing cyanogen-free silver-plating solution, comprise the component of following mass body volume concentrations: Silver Nitrate 40 ~ 50g/L, 2-sulfo--5,5-T10 110 ~ 120g/L, succimide 25 ~ 30g/L, trisodium phosphate 50 ~ 100g/L, tetra-sodium 30 ~ 60g/L, methionine(Met) 45 ~ 52g/L, polyoxyethylene glycol 0.5 ~ 2g/L, benzotriazole 6-10g/L, Nonyl pheno bay ether 3-8g/L and S-WAT 50 ~ 150g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 4 ~ 5, and temperature of electroplating solution is 20 ~ 55 DEG C.
Particularly, Anti-tarnishing cyanogen-free silver-plating solution, comprise the component of following mass body volume concentrations: Silver Nitrate 43g/L, 2-sulfo--5,5-T10 118g/L, succimide 30g/L, trisodium phosphate 70g/L, tetra-sodium 55g/L, methionine(Met) 52g/L, polyoxyethylene glycol 1g/L, benzotriazole 8g/L, Nonyl pheno bay ether 8g/L and S-WAT 130g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 5, and temperature of electroplating solution is 20 ~ 55 DEG C.
According to above-mentioned plating solution formula, the present invention also provides a kind of electro-plating method, comprises the following steps:
(1) plating piece substrate surface pre-treatment, i.e. Solvent degreasing, alkali solution oil removing, washing post-drying or dry; Wherein alkali solution comprises NaOH8-12g/L, Na
2cO
345g/L, Na
3pO
440 ~ 50g/L, Na
2siO
38g/L.
(2) electrosilvering: place the electroplate liquid described in any one of claims 1 to 3 in plating tank, silver plate or platinized platinum are anode, and plating piece is working electrode, and the distance between anode and working electrode is 8 ~ 20cm.Current density is 0.2 ~ 2A/dm
2, solution pump circulation stirring, electroplate 10 ~ 30min at 35 ~ 70 DEG C and obtain silvering, 25min electroplating time is best;
(3) plating piece being silvering by the surface that step (2) obtains is placed in deionized water and cleans, packaging after dry.
Beneficial effect: compared with prior art, the present invention has the following advantages: this Anti-tarnishing cyanogen-free silver-plating solution environmental protection is easy to get, and adopts multiple coordination agent to carry out coordination, electroplate liquid good stability.Between the silvered film adopting electro-plating method of the present invention to obtain and plating piece base material, bonding force is good, and leveling ability is good, and covering power is excellent, color light, not easily dimmed, and without the need in substrate surface preplating middle layer, electroplate liquid can use in wider range of current, reproducible.
Embodiment
Below technical solution of the present invention is described in detail, but protection scope of the present invention is not limited to described embodiment.
Embodiment 1
First, conveniently pre-treating process pre-treatment plating piece base material, plating piece base material is copper or copper alloy, and pre-treatment comprises Solvent degreasing, alkali solution oil removing, washing post-drying or dries; Wherein alkali solution comprises NaOH10g/L, Na
2cO
345g/L, Na
3pO
440g/L, Na
2siO
38g/L.Pretreated plating piece is put into electroplate liquid as working electrode, the composition of electroplate liquid comprises: Silver Nitrate 38g/L, 2-sulfo--5,5-T10 110g/L, succimide 15g/L, trisodium phosphate 40g/L, tetra-sodium 30g/L, methionine(Met) 35g/L, polyoxyethylene glycol 0.5g/L, benzotriazole 4g/L, Nonyl pheno bay ether 2g/L and S-WAT 50g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 4.7, and temperature of electroplating solution is 30 DEG C.Platinized platinum is anode, and the distance between anode and working electrode is 20cm, and current density is set to 0.5A/dm
2, plating 30min, after electroplate, deionization washing, air-dryly to pack respectively afterwards.Silvered film color that the present embodiment obtains silvery white light, fine and closely woven smooth, cover complete, have strong anti-tarnishing ability, through repeatedly bending, coating do not occur peeling off skin effect phenomenon, and description taken in conjunction power is good.
Embodiment 2
Other operational conditions are with embodiment 1, difference is: electroplate liquid comprises the component of following mass body volume concentrations: Silver Nitrate 50g/L, 2-sulfo--5, 5-T10 120g/L, succimide 30g/L, trisodium phosphate 100g/L, tetra-sodium 60g/L, methionine(Met) 52g/L, polyoxyethylene glycol 2g/L, benzotriazole 10g/L, Nonyl pheno bay ether 8g/L and S-WAT 150g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 5, temperature of electroplating solution is 30 DEG C, anode is silver plate, distance between anode and working electrode is 15cm, current density is set to 2A/dm
2, plating 30min, after electroplate, deionization washing, air-dryly to pack respectively afterwards.Silvered film color that the present embodiment obtains silvery white light, fine and closely woven smooth, have strong anti-tarnishing ability, through repeatedly bending, coating do not occur peeling off skin effect phenomenon, and description taken in conjunction power is good.
Embodiment 3
Other elementary operation conditions are with embodiment 1, difference is: electroplate liquid comprises the component of following mass body volume concentrations: Silver Nitrate 43g/L, 2-sulfo--5, 5-T10 118g/L, succimide 30g/L, trisodium phosphate 70g/L, tetra-sodium 55g/L, methionine(Met) 52g/L, polyoxyethylene glycol 1g/L, benzotriazole 8g/L, Nonyl pheno bay ether 8g/L and S-WAT 130g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 5, temperature of electroplating solution is 25 DEG C, anode is silver plate, distance between anode and working electrode is 8cm, plating 25min, current density is set to 1A/dm
2, after having electroplated, deionization is washed, and air-dryly to pack respectively afterwards.Silvered film color that the present embodiment obtains silvery white light, fine and closely woven smooth, have strong anti-tarnishing ability, through repeatedly bending, coating do not occur peeling off skin effect phenomenon, and description taken in conjunction power is good.
Above embodiment just plays illustrated example effect to technical conceive of the present invention; can not limit the scope of the invention with this; those skilled in the art are not departing from the spirit and scope of technical solution of the present invention; modify and be equal to replacement, all should drop within protection scope of the present invention.
Claims (7)
1. an Anti-tarnishing cyanogen-free silver-plating solution, it is characterized in that, described electroplate liquid comprises the component of following mass body volume concentrations: Silver Nitrate 38 ~ 50g/L, 2-sulfo--5,5-T10 110 ~ 120g/L, succimide 10 ~ 30g/L, trisodium phosphate 40 ~ 100g/L, tetra-sodium 30 ~ 70g/L, methionine(Met) 35 ~ 55g/L, polyoxyethylene glycol 0.5 ~ 2g/L, benzotriazole 4-10g/L, Nonyl pheno bay ether 1-8g/L and S-WAT 20 ~ 150g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 3 ~ 5, and temperature of electroplating solution is 20 ~ 55 DEG C.
2. Anti-tarnishing cyanogen-free silver-plating solution according to claim 1, it is characterized in that, described electroplate liquid comprises the component of following mass body volume concentrations: Silver Nitrate 40 ~ 50g/L, 2-sulfo--5, 5-T10 110 ~ 120g/L, succimide 25 ~ 30g/L, trisodium phosphate 50 ~ 100g/L, tetra-sodium 30 ~ 60g/L, methionine(Met) 45 ~ 52g/L, polyoxyethylene glycol 0.5 ~ 2g/L, benzotriazole 6-10g/L, Nonyl pheno bay ether 3-8g/L and S-WAT 50 ~ 150g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 4 ~ 5, temperature of electroplating solution is 20 ~ 55 DEG C.
3. Anti-tarnishing cyanogen-free silver-plating solution according to claim 1, it is characterized in that, described electroplate liquid comprises the component of following mass body volume concentrations: Silver Nitrate 43g/L, 2-sulfo--5,5-T10 118g/L, succimide 30g/L, trisodium phosphate 70g/L, tetra-sodium 55g/L, methionine(Met) 52g/L, polyoxyethylene glycol 1g/L, benzotriazole 8g/L, Nonyl pheno bay ether 8g/L and S-WAT 130g/L, the pH of electroplate liquid adopts tetra-sodium to be adjusted to 5, and temperature of electroplating solution is 20 ~ 55 DEG C.
4. an electro-plating method for the electroplate liquid according to any one of claims 1 to 3, is characterized in that, comprises the following steps:
(1) plating piece substrate surface pre-treatment, i.e. Solvent degreasing, alkali solution oil removing, washing post-drying or dry;
(2) electrosilvering: place the electroplate liquid described in any one of claims 1 to 3 in plating tank, silver plate or platinized platinum are anode, and plating piece is working electrode, and current density is 0.2 ~ 2A/dm
2, solution pump circulation stirring, electroplates 10 ~ 30min and obtains silvering at 35 ~ 70 DEG C;
(3) plating piece being silvering by the surface that step (2) obtains is placed in deionized water and cleans, packaging after dry.
5. electro-plating method according to claim 4, is characterized in that, the alkali solution described in step (1) comprises the component of following mass body volume concentrations: NaOH8-12g/L, Na
2cO
345g/L, Na
3pO
440 ~ 50g/L, Na
2siO
38g/L.
6. electro-plating method according to claim 4, is characterized in that, the anode described in step (2) and the distance between working electrode are 8 ~ 20cm.
7. electro-plating method according to claim 4, is characterized in that, the preferred 25min of electroplating time in step (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853444.4A CN105420770A (en) | 2015-11-30 | 2015-11-30 | Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510853444.4A CN105420770A (en) | 2015-11-30 | 2015-11-30 | Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105420770A true CN105420770A (en) | 2016-03-23 |
Family
ID=55499297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510853444.4A Pending CN105420770A (en) | 2015-11-30 | 2015-11-30 | Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105420770A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106245074A (en) * | 2016-08-30 | 2016-12-21 | 湖北吉和昌化工科技有限公司 | The electroplate liquid of a kind of Anti-tarnishing electrosilvering and electroplating technology thereof |
| CN107313084A (en) * | 2017-08-10 | 2017-11-03 | 佛山市南博旺环保科技有限公司 | A kind of alkaline non-cyanide plate silver plating solution and silver-coating method |
| CN109504989A (en) * | 2018-12-11 | 2019-03-22 | 湖北工程学院 | A kind of bright brush plating silver plating liquid and its preparation process, application method |
| CN109853014A (en) * | 2019-01-29 | 2019-06-07 | 广州鸿葳科技股份有限公司 | A kind of silver oxidation resistance agent of resistance to potassium sulfide and preparation method thereof |
| CN111118559A (en) * | 2019-12-20 | 2020-05-08 | 常州极太汽车配件有限公司 | Composition for surface treatment of copper flexible connection |
| CN114214679A (en) * | 2022-01-07 | 2022-03-22 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6620304B1 (en) * | 1999-06-19 | 2003-09-16 | Gerhard Hoffacker | Bath system for galvanic deposition of metals |
| CN101031367A (en) * | 2004-07-29 | 2007-09-05 | 恩索恩公司 | Silver plating in electronics manufacture |
| CN101627150A (en) * | 2006-10-09 | 2010-01-13 | 恩索恩公司 | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates |
| CN101665963A (en) * | 2009-09-23 | 2010-03-10 | 福建师范大学 | Environmental non-cyanide plating solution for silver-plating |
| CN102168290A (en) * | 2011-04-08 | 2011-08-31 | 哈尔滨工业大学 | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof |
| CN103397355A (en) * | 2013-07-19 | 2013-11-20 | 哈尔滨工业大学 | Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process |
| CN105002528A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Cyanide-free silver electroplating solution and electroplating method thereof |
-
2015
- 2015-11-30 CN CN201510853444.4A patent/CN105420770A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6620304B1 (en) * | 1999-06-19 | 2003-09-16 | Gerhard Hoffacker | Bath system for galvanic deposition of metals |
| CN101031367A (en) * | 2004-07-29 | 2007-09-05 | 恩索恩公司 | Silver plating in electronics manufacture |
| CN101627150A (en) * | 2006-10-09 | 2010-01-13 | 恩索恩公司 | Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates |
| CN101665963A (en) * | 2009-09-23 | 2010-03-10 | 福建师范大学 | Environmental non-cyanide plating solution for silver-plating |
| CN102168290A (en) * | 2011-04-08 | 2011-08-31 | 哈尔滨工业大学 | Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof |
| CN103397355A (en) * | 2013-07-19 | 2013-11-20 | 哈尔滨工业大学 | Cyanide-free electrosilvering solution applicable to high-speed electroplating and electroplating process |
| CN105002528A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Cyanide-free silver electroplating solution and electroplating method thereof |
Non-Patent Citations (4)
| Title |
|---|
| 张庆等: ""无氰镀银技术发展及研究现状"", 《电镀与精饰》 * |
| 方景礼: "《电镀添加剂理论与应用》", 30 April 2006, 国防工业出版社 * |
| 杜朝军等: ""以蛋氨酸为配位剂的无氰镀银工艺研究"", 《电镀与环保》 * |
| 黄启明等: "《电镀工业节能减排技术》", 31 January 2010, 化学工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106245074A (en) * | 2016-08-30 | 2016-12-21 | 湖北吉和昌化工科技有限公司 | The electroplate liquid of a kind of Anti-tarnishing electrosilvering and electroplating technology thereof |
| CN107313084A (en) * | 2017-08-10 | 2017-11-03 | 佛山市南博旺环保科技有限公司 | A kind of alkaline non-cyanide plate silver plating solution and silver-coating method |
| CN109504989A (en) * | 2018-12-11 | 2019-03-22 | 湖北工程学院 | A kind of bright brush plating silver plating liquid and its preparation process, application method |
| CN109853014A (en) * | 2019-01-29 | 2019-06-07 | 广州鸿葳科技股份有限公司 | A kind of silver oxidation resistance agent of resistance to potassium sulfide and preparation method thereof |
| CN111118559A (en) * | 2019-12-20 | 2020-05-08 | 常州极太汽车配件有限公司 | Composition for surface treatment of copper flexible connection |
| CN114214679A (en) * | 2022-01-07 | 2022-03-22 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105420770A (en) | Color-change-preventing cyanide-free silver plating electroplating liquid and electroplating method thereof | |
| Wu et al. | Progress of electroplating and electroless plating on magnesium alloy | |
| CA2883815C (en) | Plating solution and plating process for multi-layer cyanide-free plating copper-tin alloy coating, and coins made by the process | |
| CN102691081A (en) | Electrosilvering solution and electrosilvering method | |
| CN102560571A (en) | Cyanide-free silver plating stable electroplating solution and preparation method thereof, and silver plating method | |
| CN105463524A (en) | Electroplating method of cyanide-free silver electroplating liquid | |
| CN102605393A (en) | Ni-W-Fe-Co alloy electroplating liquid and electroplating process thereof | |
| KR101270770B1 (en) | Electroplating method for printed circuit board | |
| CN110760904A (en) | Cyanide-free alkaline cuprous copper plating additive | |
| CN106591897B (en) | A kind of no cryanide ion liquid copper plating solution and copper-plating technique | |
| CN105200465A (en) | Thiazine dye system acidic copper electroplating solution and electroplating method | |
| CN107119292A (en) | A kind of nickel plating solution and the method for nickel plating | |
| CN107190288B (en) | Preparation method of HEDP copper-plated pore-free thin layer | |
| CN104342726A (en) | Cyanide-free silver plating method | |
| CN107236977A (en) | A kind of electroplating pretreatment process optimization method | |
| CN110172684A (en) | A kind of ABS Chrome-free coarsening solution and the preparation method and application thereof | |
| CN104264195A (en) | Mercaptoiminazole cyanide-free gold-electroplating solution and electroplating method thereof | |
| CN109280945A (en) | PCB/FPC the dry film pre-treatment anti-oxidation reinforcing agent of Metal Substrate copper face and its processing method | |
| KR100402730B1 (en) | Method process for forming copper and nickel-plated of electrolytic plating in magnesium compound | |
| CN105418166A (en) | Cyanide-free gold-plated electroplating liquid and method for electroplating ceramic surface with dense gold thin film through pulses | |
| CN105401180A (en) | Electroplating liquid of wear-resistant gold-plated film and electroplating method thereof | |
| CN106011954A (en) | Cyanide-free copper electro-plating solution, preparation method and using method thereof | |
| CN104152952A (en) | High-performance cyanide-free silver pre-plating liquid | |
| CN105316718A (en) | Electroplate liquid and electroplate method for cyanide-free gold electroplating of sulfite | |
| CN109652806A (en) | It is a kind of using red copper or brass as the decoating liquid and withdrawal plating of the bright tin auto parts and components of substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160323 |
|
| RJ01 | Rejection of invention patent application after publication |