CN105419723A - Cross-linkable single-component heat-conductive dispensing-able glue - Google Patents
Cross-linkable single-component heat-conductive dispensing-able glue Download PDFInfo
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- CN105419723A CN105419723A CN201510988369.2A CN201510988369A CN105419723A CN 105419723 A CN105419723 A CN 105419723A CN 201510988369 A CN201510988369 A CN 201510988369A CN 105419723 A CN105419723 A CN 105419723A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to cross-linkable single-component heat-conductive dispensing-able glue which is composed of following components, by mass, 5-15% of epoxy-functionalized liquid silica gel being 50-5000 mPa*s in viscosity, 0.5-2% of vinyl-functionalized liquid silica gel being 200-5000 mPa*s in viscosity, 0.5-2% of hydrogen-containing silicone oil, 0.05-0.5% of a catalyst and the balanced being a heat-conductive filling material. The cross-linkable single-component heat-conductive dispensing-able glue includes the epoxy-functionalized liquid silica gel, the vinyl-functionalized liquid silica gel, the hydrogen-containing silicone oil and the heat-conductive filling material and the like, wherein the vinyl-functionalized liquid silica gel can be subjected to an addition reaction with the hydrogen-containing silicone oil, so that by means of adjustment of viscosity and component ratio, a product having a proper flowability can be obtained. The product is not changed in the flowability for a long time at normal temperature, thereby ensuring normal extruding glue dispensing even the product being stored for a long time.
Description
Technical field
The present invention relates to heat-conducting interface material technical field, particularly relate to a kind of crosslinkable single component heat conduction and can put glue.
Background technology
In heat-conducting interface material field, thermally conductive material has can put glue form and solid shim form etc.The thermally conductive material of solid gasket type mostly is sheet form, be pressed in heater members surface and radiating element surperficial between; The thermally conductive material can putting glue form has certain mobility, stores in a reservoir, by manage or syringe is extruded and spreads upon on thermally-conductive interface.The thermally conductive material can putting glue form has plurality of advantages compared with the thermally conductive material of solid shim form, e.g., has certain mobility, can adapt to different shapes and gap, reduces waste of material; And for example, to the infiltration of device surface well, lower interface resistance can be realized; For another example, the production easily be automated, enhances productivity.Thus, the thermally conductive material can putting glue form has to be applied very widely.
But the thermally conductive material can putting glue form also has certain shortcoming, that is, when this kind of thermally conductive material is filled in comparatively between wide arc gap (1.0 ~ 2.0mm or more), easily creep occurs, thermally conductive material cannot hold its shape shape and remain on original position.Gap particularly between heater members and radiating element surface in vertical direction time, more easily there is creep.In addition, variation of ambient temperature and vibration also can having an impact from shape retention to thermally conductive material, thermally conductive material can be made vertically to slide and leave original position, causing its heat conduction disabler, cause heater members temperature to raise, and may finally cause it to damage.
For the problems referred to above, prior art has multiple settling mode, and basic thinking is all make to put glue to have the characteristic of solidifying under certain conditions, and after a glue operation terminates, colloid solidifies under certain condition, thus avoids creep and displacement occur.
As Chinese patent application CN201110414862.5, a kind of high temperature curing monocomponent heat-conduction flame-retardation electronic pouring sealant and preparation method thereof, by catalyzer as in microcapsule-type, under normal temperature, capsule can not discharge catalyzer, and colloid can be preserved at normal temperatures; And at high temperature, the housing of microcapsule can melt and discharge catalyzer, catalysis joint sealant solidifies, the shortcoming of this kind of scheme is: one, because the material of capsule shell can not be dissolved in silica gel,, and the capsule shell material performance of melting under high temperature can change, and affects the performance of heat conductive silica gel.Two, owing to being filled with the ceramics powder of a large amount of high rigidity in heat conductive silica gel, easily cause breaking of capsule, capsules break may occur or catalyzer oozes out in the process of processing or mixing, cause silica gel premature cure, impact is normal produces and uses.Three, by higher for the cost of platinum catalyst micro encapsulation.
And for example, Chinese patent application CN201210575815.3, a kind of single-component is heating and curing liquid silastic and preparation method thereof.Technical scheme of this application is, uses alkynes alcohol-based mixtures as stopper, and the single-component that can store at normal temperatures is heating and curing liquid silastic, treats stopper volatilization and curable after some glue.The shortcoming of this kind of scheme is: one, only after stopper volatilization, silica gel could solidify, be only suitable for being applied to shallow layer, coating thicker (0.5mm and more than) or when being applied in closure means, because stopper is not volatile, causes silica gel to be difficult to solidification.Two, the performance of stopper on electron device of volatilization has impact.Three, too much stopper can cause the color of silica gel and the change of performance.Four, the simple single-component add-on type liquid silica gel using stopper, its stability in storage is also by the impact of stopper stability, and reliability is not good.
For another example, Chinese patent application CN201310398140.4, a kind of single-component heat conductive flame-retarding type RTV silicon rubber and preparation method thereof, gives the technical scheme adopting moisture-curable.The shortcoming of this kind of scheme is: one, have small-molecule substance to discharge during moisture-curable, and the performance of the small-molecule substance discharged on device and silica gel has larger impact, and some materials also can cause metal section in device to corrode.Two, before solidification, silica gel needs to seal preservation completely, if touch moisture, also can solidify and go bad at normal temperatures.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of crosslinkable single component heat conduction can put glue, solves the problem that the existing thermally conductive material putting glue form exists creep.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of crosslinkable single component heat conduction can put glue, comprises the component composition of following mass percent: the liquid silica gel 5 ~ 15% of epoxy-functional, the liquid silica gel 0.5 ~ 2% of vinyl-functional, containing hydrogen silicone oil 0.5 ~ 2%, catalyzer 0.05 ~ 0.5%, all the other are for heat conductive filler; The viscosity of the liquid silica gel of epoxy-functional is 50 ~ 5000mPas, and the viscosity of the liquid silica gel of vinyl-functional is 200 ~ 5000mPas.
Preferably, the mass percent of the liquid silica gel of epoxy-functional is 8 ~ 12%.
Preferably, the particle diameter of heat conductive filler has at least two kinds of particle diameters.
Preferably, the particle diameter of heat conductive filler is 0.1 ~ 300 μm.
Preferably, heat conductive filler is through coupling agent treatment mistake.
Preferably, heat conductive filler is at least one in aluminum oxide, zinc oxide, aluminium nitride and boron nitride.
Preferably, catalyzer is platinum catalyst.
In sum, advantage of the present invention: the crosslinkable single component heat conduction of one provided by the invention can put glue, comprise the liquid silica gel of epoxy-functional, the liquid silica gel of vinyl-functional, the component such as containing hydrogen silicone oil and heat conductive filler, can addition reaction be there is in the liquid silica gel of vinyl-functional and containing hydrogen silicone oil, by adjusting its viscosity and component ratio, the product with Suitable flow rate can be obtained, and can turnover rate be kept for a long time constant at normal temperatures, guarantee that product still can normally extrude a glue after standing storage, after tested, with the glue the put sample that technical solution of the present invention is obtained, making the turnover rate stored after 1 day under rear normal temperature is 29g/min, and still there is the turnover rate of 26.7g/min after storing 30 days under normal temperature, and when temperature is more than 85 DEG C, the liquid silica gel of epoxy-functional solidifies because of its thermoset, and after certain hour, matrix can be cured as the heat-conducting pad without mobility.After tested, with the glue put that technical solution of the present invention is obtained, at 100 DEG C, solidify 2 hours its turnover rates can drop to 4.9g/min, solidify and solidify completely after 2 days, after 1000 temperature cycling tests of-40 ~ 85 DEG C, still can keep complete solid state, in vertical frock, position is unchanged.
Embodiment
A kind of crosslinkable single component heat conduction can put glue, comprises the component composition of following mass percent: the liquid silica gel 5 ~ 15% of epoxy-functional, the liquid silica gel 0.5 ~ 2% of vinyl-functional, containing hydrogen silicone oil 0.5 ~ 2%, platinum catalyst 0.05 ~ 0.5%, all the other are heat conductive filler; The viscosity of the liquid silica gel of epoxy-functional is 50 ~ 5000mPas, and the viscosity of the liquid silica gel of vinyl-functional is 200 ~ 5000mPas.
In the present invention, the liquid silica gel of epoxy-functional has thermoset.The viscosity that whole component comprises 5 ~ 15% is the liquid silica gel of the epoxy-functional of 50 ~ 5000mPas, make the product obtained by the present invention program can keep original viscosity under normal temperature state, thus ensure that there is mobility and the property put, and smear to after on working face being extruded, heat and solidifiable, thus prevent creep, the best in quality per-cent of the liquid silica gel of epoxy-functional is 8 ~ 12%, within the scope of this, product has better thermoset, only need heat 2 hours its turnover rates at 100 DEG C and can be down to about 5g/min, in addition, the liquid silica gel viscosity of epoxy-functional is 50 ~ 5000mPas, can make to be mixed into enough heat conductive fillers in raw material, conveniently mix.
In the present invention, the finished product viscosity of the liquid silica gel of vinyl-functional and the adjustable product obtained by the present invention program of containing hydrogen silicone oil.Can there is addition reaction in the liquid silica gel of vinyl-functional and containing hydrogen silicone oil, what occur to a certain degree between its product component is crosslinked, and degree of crosslinking its viscosity higher is larger, by adjusting its viscosity and component ratio, can obtain the product with Suitable flow rate.Scheme provided by the present invention, the viscosity comprising 0.5 ~ 2% in component be the liquid silica gel of the vinyl-functional of 200m ~ 5000mPas, the containing hydrogen silicone oil of 0.5 ~ 2% and 0.05 ~ 0.5% platinum catalyst, with this understanding, the glue the put product that turnover rate is 10 ~ 40g/min can be obtained after each component being mixed.
In the present invention, be mixed with heat conductive filler in body material, in order to transferring heat, the form of heat conductive filler has spherical and aspherical two kinds of forms, and the particle diameter of heat conductive filler also varies in size two kinds, and aspherical heat conductive filler specific surface area is large, and thermal conduction capability is higher; The heat conductive filler of small particle size can be filled into the space between Large stone heat conductive filler, can obtain higher filling ratio, thus improves thermal conductivity, and in the present invention, preferred median size is the heat conductive filler of 1 ~ 5 μm and 40 ~ 60 μm; One or more in the optional aluminum oxide of heat conductive filler type, zinc oxide, aluminium nitride and boron nitride etc., preferential oxidation aluminium.
Wherein, heat conductive filler can be undressed, also can be through coupling agent treatment mistake, preferably through heat conductive filler that coupling agent treatment is crossed.The heat conductive filler crossed through coupling agent treatment can by more fully coated, and heat conductivility is better.By the product that technical scheme provided by the invention is obtained, thermal conductivity can arrive 2.5 ~ 4W/k.m.
Embodiment one:
A kind of crosslinkable single component heat conduction can put glue, comprises the component composition of following mass percent: the boron nitride particle 2% that the alumina particle 48.7% that the aluminum oxide 29.9% that the zinc oxide 11.9% that the liquid silica gel 5% of epoxy-functional, the liquid silica gel 1% of vinyl-functional, containing hydrogen silicone oil 1%, platinum catalyst 0.5%, particle diameter are 1 μm, particle diameter are 5 μm, particle diameter are 40 μm, particle diameter are 60 μm.
The liquid silica gel of the liquid silica gel of vinyl-functional, containing hydrogen silicone oil, epoxy-functional is joined in planetary mixer together and stirs; To be aluminum oxide, the particle diameter of 5 μm the be aluminum oxide of 40 μm that to add particle diameter be more successively zinc oxide, the particle diameter of 1 μm and particle diameter are the boron nitride mixing of 60 μm, all first should be uniformly mixed, then add lower a kind of filler after often kind of filler adds; Add platinum catalyst fully to mix; Vacuumize process, obtained sample.
Embodiment two:
The crosslinkable single component heat conduction of one as described in embodiment one can put glue, and the present embodiment has following difference: the component composition comprising following mass percent: the boron nitride particle 2% that the alumina particle 44.8% that the aluminum oxide 29.9% that the zinc oxide 11.9% that the liquid silica gel 8.9% of epoxy-functional, the liquid silica gel 1% of vinyl-functional, containing hydrogen silicone oil 1%, platinum catalyst 0.5%, particle diameter are 1 μm, particle diameter are 5 μm, particle diameter are 40 μm, particle diameter are 60 μm.
First the liquid silica gel of the liquid silica gel of vinyl-functional, containing hydrogen silicone oil, epoxy-functional is joined together in planetary mixer and stir 10 minutes; To be aluminum oxide, the particle diameter of 5 μm the be aluminum oxide of 40 μm that to add particle diameter be more successively zinc oxide, the particle diameter of 1 μm and particle diameter are the boron nitride mixing of 60 μm, all first should be uniformly mixed, then add lower a kind of filler after often kind of filler adds; Add platinum catalyst fully to mix; Vacuumize process, obtained sample.
Embodiment three:
The crosslinkable single component heat conduction of one as described in embodiment one, two can put glue, and the present embodiment has following difference: the component composition comprising following mass percent: the boron nitride particle 2% that the alumina particle 38.7% that the aluminum oxide 29.9% that the zinc oxide 11.9% that the liquid silica gel 15% of epoxy-functional, the liquid silica gel 1% of vinyl-functional, containing hydrogen silicone oil 1%, platinum catalyst 0.5%, particle diameter are 1 μm, particle diameter are 5 μm, particle diameter are 40 μm, particle diameter are 60 μm.
First the liquid silica gel of the liquid silica gel of vinyl-functional, containing hydrogen silicone oil, epoxy-functional is joined together in planetary mixer and stir 10 minutes; To be aluminum oxide, the median size of 5 μm the be aluminum oxide of 40 μm that to add median size be more successively zinc oxide, the median size of 1 μm and median size are the boron nitride mixing of 60 μm, all first should be uniformly mixed after often kind of filler adds, then add lower a kind of filler; Add platinum catalyst fully to mix; Vacuumize process, obtained sample.
Comparative example:
A kind of crosslinkable single component heat conduction can put glue, comprise the component composition of following mass percent: the liquid silica gel 2% of epoxy-functional, the liquid silica gel 10% of vinyl-functional, containing hydrogen silicone oil 1%, particle diameter is the zinc oxide 11.9% of 1 μm, and particle diameter is the aluminum oxide 29.9% of 5 μm, and particle diameter is the alumina particle 42.7% of 40 μm, particle diameter is the boron nitride particle 2% of 60 μm, platinum catalyst 0.5%.
First the liquid silica gel of the liquid silica gel of vinyl-functional, containing hydrogen silicone oil, epoxy-functional is joined together in planetary mixer and stir 10 minutes; To be aluminum oxide, the median size of 5 μm the be aluminum oxide of 40 μm that to add median size be more successively zinc oxide, the median size of 1 μm and median size are the boron nitride mixing of 60 μm, all first should be uniformly mixed after often kind of filler adds, then add lower a kind of filler; Add platinum catalyst fully to mix; Vacuumize process, obtained sample.
Thermal conductivity test is carried out to embodiment one, embodiment two, embodiment three, comparative example, place certain hour at different temperatures after carry out turnover rate measurement, measuring result data as shown in Table 1:
Table one
Wherein:
In table one, thermal conductivity is according to standard A STMD-5470, tests gained by LW-9389 boundary material thermal resistance and heat-conduction coefficient measuring equipment;
Turnover rate is to being believed that by promise the colloid that NordsonEFDRelius1100 point gum machine is extruded under 90psi pressure tests gained, length of testing speech 1min;
Temperature cycle range is-40 DEG C ~ 85 DEG C.
In order to more intuitively represent the advantage of technical solution of the present invention, contriver has carried out the creep resistance test in vertical gap to the sample obtained by technical solution of the present invention, and contrasts with the test result of other technologies scheme.Testing method is specifically: tested colloid being applied to surfaceness is between the aluminum substrate surface of Ra3.2 and smooth glass surface, vertically places, and after between-40 DEG C ~ 60 DEG C, temperature cycle changes 1000 times, the position of record colloid keeps situation.
Test result shows, with the sample that technical scheme provided by the present invention is obtained, can preserve for a long time at normal temperatures, and its turnover rate can decline to a great extent after short time high temperature solidification, substantially can solidify completely after the hot setting of long period, and can still keep stable solid state after temperature cycling test.
Therefore, technical scheme provided by the invention can solve existing curable can gluing process is complicated, solidification effect is poor and side effect is larger problem, there is good normal temperature storage stability and solidification effect, industrial production be highly profitable.
Except above preferred embodiment, the present invention also has other embodiment, and those skilled in the art can make various change and distortion according to the present invention, only otherwise depart from spirit of the present invention, all should belong to the scope that claims of the present invention define.
Claims (7)
1. crosslinkable single component heat conduction can put a glue, it is characterized in that: the component composition comprising following mass percent: the liquid silica gel 5 ~ 15% of epoxy-functional, the liquid silica gel 0.5 ~ 2% of vinyl-functional, containing hydrogen silicone oil 0.5 ~ 2%, catalyzer 0.05 ~ 0.5%, all the other are for heat conductive filler; The viscosity of the liquid silica gel of epoxy-functional is 50 ~ 5000mPas, and the viscosity of the liquid silica gel of vinyl-functional is 200 ~ 5000mPas.
2. the crosslinkable single component heat conduction of one according to claim 1 can put glue, it is characterized in that: the mass percent of the liquid silica gel of epoxy-functional is 8 ~ 12%.
3. the crosslinkable single component heat conduction of one according to claim 2 can put glue, it is characterized in that: the particle diameter of heat conductive filler has at least two kinds of particle diameters.
4. the crosslinkable single component heat conduction of one according to claim 3 can put glue, it is characterized in that: the particle diameter of heat conductive filler is 0.1 ~ 300 μm.
5. the crosslinkable single component heat conduction of one according to claim 4 can put glue, it is characterized in that: heat conductive filler is through coupling agent treatment mistake.
6. the crosslinkable single component heat conduction of one according to claim 5 can put glue, it is characterized in that: heat conductive filler is at least one in aluminum oxide, zinc oxide, aluminium nitride and boron nitride.
7. the crosslinkable single component heat conduction of one according to claim 1 can put glue, it is characterized in that: catalyzer is platinum catalyst.
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| CN201510988369.2A CN105419723B (en) | 2015-12-24 | 2015-12-24 | A kind of crosslinkable one pack system heat conduction can dispensing |
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| CN201510988369.2A CN105419723B (en) | 2015-12-24 | 2015-12-24 | A kind of crosslinkable one pack system heat conduction can dispensing |
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| CN105419723B CN105419723B (en) | 2018-04-10 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106633909A (en) * | 2017-01-13 | 2017-05-10 | 深圳市汉华热管理科技有限公司 | Insulating sizing agent and insulating treatment method |
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
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| CN101962528A (en) * | 2010-09-30 | 2011-02-02 | 烟台德邦科技有限公司 | Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref |
| CN102002346A (en) * | 2010-10-15 | 2011-04-06 | 深圳市安品有机硅材料有限公司 | Organic silicon heat conduction composition and organic silicon heat conduction patch |
| CN102898999A (en) * | 2012-11-06 | 2013-01-30 | 江苏科技大学 | Sealant for electrical heating tubes |
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2015
- 2015-12-24 CN CN201510988369.2A patent/CN105419723B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101962528A (en) * | 2010-09-30 | 2011-02-02 | 烟台德邦科技有限公司 | Two-component sealing silica gel with low viscosity and high thermal conductivity and preparation method theref |
| CN102002346A (en) * | 2010-10-15 | 2011-04-06 | 深圳市安品有机硅材料有限公司 | Organic silicon heat conduction composition and organic silicon heat conduction patch |
| CN102898999A (en) * | 2012-11-06 | 2013-01-30 | 江苏科技大学 | Sealant for electrical heating tubes |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753205A (en) * | 2017-01-11 | 2017-05-31 | 湖南博翔新材料有限公司 | A kind of low viscosity, the epoxy modified silicone casting glue of high heat conduction and its application |
| CN106753205B (en) * | 2017-01-11 | 2020-05-22 | 湖南博翔新材料有限公司 | Epoxy modified organic silicon pouring sealant with low viscosity and high heat conductivity and application thereof |
| CN106633909A (en) * | 2017-01-13 | 2017-05-10 | 深圳市汉华热管理科技有限公司 | Insulating sizing agent and insulating treatment method |
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| CN105419723B (en) | 2018-04-10 |
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