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CN105405935B - 一种led芯片透镜的封装方法 - Google Patents

一种led芯片透镜的封装方法 Download PDF

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CN105405935B
CN105405935B CN201510954258.XA CN201510954258A CN105405935B CN 105405935 B CN105405935 B CN 105405935B CN 201510954258 A CN201510954258 A CN 201510954258A CN 105405935 B CN105405935 B CN 105405935B
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led chip
lens
substrate
dispensing
basal layer
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CN105405935A (zh
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高伟
冯世
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Guangdong Shenglan Photoelectric Technology Co.,Ltd.
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HEFEI ESK OPTICAL-ELECTRICAL TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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Abstract

本发明涉及一种LED芯片透镜的封装方法，采用灌封装置进行封装，所述灌封装置包括基板（1）、安装在基板（1）上的LED芯片（3），以及包裹在LED芯片（3）外的透镜，所述透镜包括包裹在LED芯片（3）外的基础层（21）和覆盖在基础层（21）外的堆叠层（22）构成，所述基板（1）上且位于基础层（21）和堆叠层（22）的外边缘分别设有第一环形凹槽（11）和第二环形凹槽（12），所述第一环形凹槽（11）和第二环形凹槽（12）通过排液槽（13）相互连通，且该排液槽（13）的排液口由基板（1）侧壁伸出。本发明无需模具的情况下，可以实现LED的晶圆级封装，不仅技术操作性强，工艺简单，还可降低LED的生产成本。

Description

一种LED芯片透镜的封装方法
技术领域
本发明涉及LED灌封技术领域，具体涉及一种LED芯片透镜的封装方法。
背景技术
由于省电、长寿命、小体积等优点，LED灯已经越来越多地被应用于照明、背光等领域，并有望取代如白炽灯、荧光灯等传统光源。传统的LED器件的封装工艺是器件级工艺，其成本较高，且难以进行高密度封装。现有的LED器件的透镜基本上都是采用一次成型的一体化结构，传统的透镜封装大多采用预制透镜或者模具成型的方法，不适用于晶圆级封装。
基于此，人们希望能采用无模点胶的工艺来对晶圆级LED芯片进行透镜的封装，最简单直观的无模点胶方法就是直接在LED芯片上点胶，利用塑封胶的表面张力形成透镜的形状。但这种方法并不适合于透镜一体成型结构的LED器件，为了使其能够通过很容易通过无模点胶这种简单工艺完成，迫切需要一种新结构的LED器件。
发明内容
本发明的目的在于提供一种LED芯片透镜的封装方法，该装置可以在无模具的情况下采用点胶的方式制作而成，并具有较大高宽比。
为实现上述目的，本发明采用了以下技术方案：一种LED芯片透镜的封装方法，采用灌封装置进行封装，所述灌封装置包括基板、安装在基板上的LED芯片，以及包裹在LED芯片外的透镜，所述透镜包括包裹在LED芯片外的基础层和覆盖在基础层外的堆叠层构成，所述基板上且位于基础层和堆叠层的外边缘分别设有第一环形凹槽和第二环形凹槽，所述第一环形凹槽和第二环形凹槽通过排液槽相互连通，且该排液槽的排液口由基板侧壁伸出；
该封装方法，包括以下步骤：
（A）将LED芯片防止在基板上，然后在LED芯片上方进行第一次点胶，然后冷却到室温使其固化形成基础层，第一次点胶的点胶量至少包裹LED芯片但并不溢出基板边缘；
（B）对LED芯片上方的基础层顶点进行第二次点胶，然后冷却到室温使其固化形成堆叠层；
（C）在堆叠层上方进行再次点胶，然后冷却到室温使其固化，并重复几次该步骤过程，以和基础层共同构成透镜；
（D）将点胶完毕的LED芯片基座置入高温烤箱，对其周侧灌封硅胶、再固化、得到LED封装结构。
由上述技术方案可知，本发明透镜由包裹在LED芯片外的基础层和覆盖在所述基础层外的堆叠层构成，堆叠层由多层封装胶层叠构成，从而使得本发明可以通过多次“点胶-固化-再点胶-再固化”的“堆叠式”的工艺完成整个透镜的封装，在无需模具的情况下，可以实现LED的晶圆级封装，不仅技术操作性强，工艺简单，还可降低LED的生产成本。
附图说明
图1是本发明的结构示意图。
具体实施方式
下面结合附图对本发明做进一步说明：
如图1所示，本实施例的LED芯片透镜的封装方法，采用灌封装置进行封装，灌封装置包括基板1、安装在基板1上的LED芯片3，以及包裹在LED芯片3外的透镜，透镜包括包裹在LED芯片3外的基础层21和覆盖在基础层21外的堆叠层22构成，基板1上且位于基础层21和堆叠层22的外边缘分别设有第一环形凹槽11和第二环形凹槽12，第一环形凹槽11和第二环形凹槽12通过排液槽13相互连通，且该排液槽13的排液口由基板1侧壁伸出；
该封装方法，包括以下步骤：
S1：将LED芯片3防止在基板1上，然后在LED芯片3上方进行第一次点胶，然后冷却到室温使其固化形成基础层21，第一次点胶的点胶量至少包裹LED芯片3但并不溢出基板1边缘；
S2：对LED芯片3上方的基础层21顶点进行第二次点胶，然后冷却到室温使其固化形成堆叠层22；
S3：在堆叠层22上方进行再次点胶，然后冷却到室温使其固化，并重复几次该步骤过程，以和基础层21共同构成透镜；
S4：将点胶完毕的LED芯片3基座置入高温烤箱，对其周侧灌封硅胶、再固化、得到LED封装结构。
以上所述的实施例仅仅是对本发明的优选实施方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案作出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。

Claims (1)

1.一种LED芯片透镜的封装方法，其特征在于：采用灌封装置进行封装，所述灌封装置包括基板（1）、安装在基板（1）上的LED芯片（3），以及包裹在LED芯片（3）外的透镜，所述透镜包括包裹在LED芯片（3）外的基础层（21）和覆盖在基础层（21）外的堆叠层（22）构成，所述基板（1）上且位于基础层（21）和堆叠层（22）的外边缘分别设有第一环形凹槽（11）和第二环形凹槽（12），所述第一环形凹槽（11）和第二环形凹槽（12）通过排液槽（13）相互连通，且该排液槽（13）的排液口由基板（1）侧壁伸出；
LED芯片透镜的封装方法，包括以下步骤：
（A）将LED芯片（3）放置在基板（1）上，然后在LED芯片（3）上方进行第一次点胶，然后冷却到室温使其固化形成基础层（21），第一次点胶的点胶量至少包裹LED芯片（3）但并不溢出基板（1）边缘；
（B）对LED芯片（3）上方的基础层（21）顶点进行第二次点胶，然后冷却到室温使其固化形成堆叠层（22）；
（C）在堆叠层（22）上方进行再次点胶，然后冷却到室温使其固化，并重复几次该步骤（C）过程，以和基础层（21）共同构成透镜；
（D）将点胶完毕的LED芯片（3）基座置入高温烤箱，对其周侧灌封硅胶、再固化、得到LED封装结构。
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