CN105321858B - For the wafer buffer storage in semiconductor equipment - Google Patents
For the wafer buffer storage in semiconductor equipment Download PDFInfo
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- CN105321858B CN105321858B CN201410286996.7A CN201410286996A CN105321858B CN 105321858 B CN105321858 B CN 105321858B CN 201410286996 A CN201410286996 A CN 201410286996A CN 105321858 B CN105321858 B CN 105321858B
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Abstract
The invention belongs to semicon industry wafer-process field, specifically a kind of wafer buffer storage in semiconductor equipment, including the first wafer cassette, second wafer cassette, first cylinder, second cylinder and bottom plate, wherein the first cylinder and the second cylinder are separately mounted on bottom plate, first wafer cassette is connected to the output end of the first cylinder and the second cylinder with the second wafer cassette, and driven respectively by first cylinder and the second cylinder, alternating is moved to the station that the manipulator fetches and delivers wafer, i.e. described first wafer cassette or the second wafer cassette are moved to the station that the manipulator fetches and delivers wafer, second wafer cassette or the first wafer cassette are located at room.The present invention is simple in construction, and easy to use, multiple wafer cassettes pass through line slideway, the same station of manipulator is provided and fetches and delivers the function of wafer, the burden of manipulator can be mitigated, reduce manipulator because station is more and the drawbacks of run duration increase, the time required to shortening technique, operating efficiency is improved.
Description
Technical field
The invention belongs to semicon industry wafer-process field, specifically a kind of wafer in semiconductor equipment
Buffer storage.
Background technology
The processing of wafer need to pass through the even not same equipment of different technique units in semicon industry, and wherein manipulator is held
The task of wafer transmission is carried on a shoulder pole, if the time used in wafer-process is different, point of speed be present, then cannot directly be passed
Send, generally require an intermediate link, to cache and transmit wafer.In the prior art, typically deposited in the device of similar functions
In two wafer cassettes for wafer caching, the position of wafer cassette is fixed, or is fixed on same plane according to the angle of setting
On, or arrangement up and down, which adds the station that manipulator fetches and delivers wafer, the burden of manipulator is not only increased, is also influenceed
Process time.
The content of the invention
The station of wafer is fetched and delivered to reduce manipulator into wafer buffer storage, mitigates the burden of manipulator, reduces machine
Tool hand because station is more and the drawbacks of run duration increase, be used for it is an object of the invention to provide a kind of in semiconductor equipment
Wafer buffer storage.
The purpose of the present invention is achieved through the following technical solutions：
The present invention includes the first wafer cassette, the second wafer cassette, the first cylinder, the second cylinder and bottom plate, wherein the first cylinder
And second cylinder be separately mounted on bottom plate, first wafer cassette and the second wafer cassette are connected to the first cylinder and second
The output end of cylinder, and be moved to the manipulator by first cylinder and the driving of the second cylinder, alternating respectively and fetched and delivered wafer
Station, i.e., described first wafer cassette or the second wafer cassette be moved to the station that the manipulator fetches and delivers wafer, and described second is brilliant
Circle box or the first wafer cassette are located at room.
Wherein：Sensor is installed in the station position that corresponding manipulator fetches and delivers wafer on the bottom plate, described first is brilliant
The lower surface of circle box and the second wafer cassette is separately installed with the sensor scan baffle plate corresponding with the sensor, and described first is brilliant
Circle box replaces cooperation positioning with the sensor by the sensor scan baffle plate of respective lower section respectively with the second wafer cassette
The station of wafer is fetched and delivered in the manipulator；The sensor is correlation photoelectric sensor, is provided with a sensor described in confession
The groove that sensor scan baffle plate passes through, it is photophore above the groove, is light receiving device below；
First cylinder is fetched and delivered wafer direction with manipulator with the second cylinder and is arranged symmetrically, and the first cylinder driving first
It is acute angle that the moving direction of wafer cassette and the second cylinder, which drive the angle between the moving direction of the second wafer cassette,；Along described first
Cylinder drives the moving direction of the first wafer cassette to be provided with the first straight line guide rail being arranged on bottom plate, the output of first cylinder
End is connected by the first connecting plate with the first wafer cassette, and is connected with along the first straight line guide rail and is slided on first connecting plate
The first sliding block；Drive the moving direction of the second wafer cassette to be provided with the second straight line on bottom plate along second cylinder to lead
Rail, the output end of second cylinder is connected by the second connecting plate with the second wafer cassette, and is connected with second connecting plate
The second sliding block slided along the second straight line guide rail；The first straight line guide rail is taken with second straight line guide rail with the manipulator
The direction of wafer is sent to be arranged symmetrically, and the angle between first and second line slideway is acute angle；First sliding block and the second sliding block
The limited block on bottom plate is respectively equipped with the outside of the both ends of movement travel；
The piston rod of first and second cylinder is in retracted mode, i.e., first, and two wafer cassettes are in room, and described
First, what the station of wafer projected on bottom plate fetched and delivered in the center that two wafer cassette vertical directions project on bottom plate to the manipulator
The distance at center is equal；The opening for inputting or exporting for wafer is respectively equipped with first and second wafer cassette, it is brilliant first and second
The slot of the accommodating wafer is respectively equipped with circle box；Opening in first and second wafer cassette opens up along short transverse, described
The width of opening is more than brilliant diameter of a circle.
Advantages of the present invention is with good effect：
1. the present invention is simple in construction, easy to use, multiple wafer cassettes pass through line slideway, there is provided the same station of manipulator takes
Send the function of wafer, can mitigate the burden of manipulator, reduce manipulator because station is more and the drawbacks of run duration increase.
2. the present invention drives the slide block movement on line slideway by cylinder, so as to drive the first wafer cassette and the second wafer
The change of box position, while the first wafer cassette and the second crystalline substance are judged by the interaction of sensor and sensor scan baffle plate
The location of circle box, it is allowed to successively alternately fetch and deliver on the station of wafer in manipulator, reduces the work that manipulator fetches and delivers wafer
Position, the time required to shortening technique, improve operating efficiency.
3. being respectively provided with limited block on the outside of the movement travel of sliding block of the present invention on line slideway, cylinder piston is prevented
Rod end is connected loosening with sliding block or come off, and causes sliding block to exceed predetermined stroke range.
Brief description of the drawings
Fig. 1 is the scheme of installation (top view) of line slideway of the present invention and bottom plate；
Fig. 2 is the scheme of installation (axonometric drawing) of line slideway of the present invention and bottom plate；
Fig. 3 is cylinder of the present invention, air cylinder fixed plate, the scheme of installation (top view) of connecting plate；
Fig. 4 is cylinder of the present invention, air cylinder fixed plate, the scheme of installation (axonometric drawing) of connecting plate；
Fig. 5 is the scheme of installation (top view) of wafer cassette of the present invention and sensor；
Fig. 6 is the scheme of installation (axonometric drawing) of wafer cassette of the present invention and sensor；
Fig. 7 is that (the first wafer cassette is in manipulator and fetched and delivered on the station of wafer, i.e. originally one of structure top view of the present invention
The original state of invention buffer storage)；
Fig. 8 is that (the first wafer cassette is in manipulator and fetched and delivered on the station of wafer, i.e. originally one of structural front view of the present invention
The original state of invention buffer storage)；
Fig. 9 is the partial enlarged drawing at I in Fig. 8；
Figure 10 is that (the first wafer cassette is in manipulator and fetched and delivered on the station of wafer, i.e. one of structure axonometric drawing of the present invention
The original state of buffer storage of the present invention)；
Figure 11 is two (the second wafer cassette is in manipulator and fetched and delivered on the station of wafer) of the structure top view of the present invention
Figure 12 is two (the second wafer cassette is in manipulator and fetched and delivered on the station of wafer) of the structural front view of the present invention；
Figure 13 is the partial enlarged drawing at II in Figure 12；
Figure 14 is two (the second wafer cassette is in manipulator and fetched and delivered on the station of wafer) of the structure axonometric drawing of the present invention；
Wherein：1 is the first wafer cassette, and 2 be the second wafer cassette, and 3 be first straight line guide rail, and 4 be the first sliding block, and 5 be second
Line slideway, 6 be the second sliding block, and 7 be the first cylinder, and 8 be the second cylinder, and 9 be bottom plate, and 10 be the first fixed plate, and 11 be first
Connecting plate, 12 be the second fixed plate, and 13 be the second connecting plate, and 14 be manipulator, and 15 be the first limited block, and 16 be second spacing
Block, 17 be the 3rd limited block, and 18 be the 4th limited block, and 19 be sensor, and 20 be that first sensor scans baffle plate, and 21 be the second biography
Sensor scans baffle plate, and 22 be slot.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in figs. 1 to 6, the present invention includes the first wafer cassette 1, the second wafer cassette 2, first straight line guide rail 3, the first sliding block
4th, second straight line guide rail 5, the second sliding block 6, the first cylinder 7, the second cylinder 8, bottom plate 9, sensor 19, first sensor scanning gear
Plate 20 and second sensor scanning baffle plate 21, its bottom plate 9 is the motion platform of whole wafer buffer storage, can be according to reality
Situation is fixed on the inside of semiconductor equipment.
The cylinder body of first cylinder 7 is fixed on bottom plate 9 by the first fixed plate 10, and the cylinder body of the second cylinder 8 is solid by second
Fixed board 12 is fixed on bottom plate 9, and the first straight line guide rail 3 being fixed on bottom plate 9 is provided with the outbound course of the first cylinder 7,
The outbound course of second cylinder 8 is provided with the second straight line guide rail 5 being fixed on bottom plate 9, and first straight line guide rail 3 and second straight line are led
Rail 5 is fetched and delivered wafer direction (direction of arrow in Fig. 7 and Figure 11) with manipulator 14 and is arranged symmetrically, first and second line slideway 3,5 it
Between angle be acute angle.The tailpiece of the piston rod of first cylinder 7 is connected by the first connecting plate 11 with the first wafer cassette 1, and the first connection
The first sliding block 4 slided along first straight line guide rail 3 is connected with plate 11, by the stretching motion of the piston rod of the first cylinder 7 come band
Dynamic first wafer cassette 1 is moved along first straight line guide rail 3.The tailpiece of the piston rod of second cylinder 8 passes through the second connecting plate 13 and the second wafer
Box 2 is connected, and the second sliding block 6 slided along second straight line guide rail 5 is connected with the second connecting plate 13, is lived by the second cylinder 8
The stretching motion of stopper rod drives the second wafer cassette 2 to be moved along second straight line guide rail 5.Respectively along height in first and second wafer cassette 1,2
Degree direction opens up the opening for inputting or exporting for wafer, and the width of the opening is more than brilliant diameter of a circle.First and second wafer cassette 1,
The slot 22 of accommodating wafer is respectively equipped with 2, first and second wafer cassette 1,2, which carries, prevents that (of the invention carries wafer slide out device
The wafer cassette for preventing wafer slide out device is prior art).When the piston rod of first and second cylinder 7,8 is all in retracting in place
During state, the station that wafer is fetched and delivered at center that first, two wafer cassettes 1,2 vertical directions project on bottom plate 9 to manipulator 14 exists
The distance at the center projected on bottom plate 9 is equal, i.e., the direction that first and second cylinder 7,8 fetches and delivers wafer with manipulator 14 is arranged symmetrically,
Angle between the two is acute angle.
First wafer cassette 1 and the second wafer cassette 2 stretching by the piston rod of the first cylinder 7 and the piston rod of the second cylinder 8 respectively
Contracting motion, the station of wafer is alternately fetched and delivered in manipulator 14.When a wafer cassette is in the station that manipulator 14 fetches and delivers wafer,
Another wafer cassette is in room.The upper surface of bottom plate 9 is provided with sensor in the station position that corresponding manipulator 14 fetches and delivers wafer
19, the first wafer cassette 1 and the lower surface of the second wafer cassette 2 are separately installed with the first sensor scanning gear corresponding with sensor 19
Plate 20, second sensor scanning baffle plate 21, during first and second cylinder 7,8 piston rods do stretching motion, the first wafer cassette
1 or second wafer cassette 2 baffle plate 20 scanned by the first sensor of respective lower section or second sensor scan baffle plate 21 with it is described
Sensor 19 coordinates, and the station of wafer is alternately fetched and delivered in manipulator 14.
Sensor of the invention 19 is arranged on the upper surface of bottom plate 9, and position is located at the first wafer cassette 1 or the second wafer cassette 2
Lower section when manipulator 14 fetches and delivers wafer station.Sensor 19 is correlation photoelectric sensor, and confession is provided with sensor 19
The groove that first and second sensor scan baffle plate 20,21 passes through, it is photophore above the groove, is light receiving device below.When there is thing
Body is kept off between photophore and light receiving device, and light receiving device just acts one switch controlling signal of output, and control system receives signal
Afterwards, instruction will be sent.The first sensor scanning baffle plate 20 of the lower surface of first wafer cassette 1 installation, installation site are located at first
Wafer cassette 1 is in manipulator 14 when fetching and delivering the station of wafer, and first sensor scanning baffle plate 20 can just block sensor 19
Light path；The second sensor scanning baffle plate 21 of the lower surface of second wafer cassette 2 installation, installation site are located at the second wafer cassette 2
When manipulator 14 fetches and delivers the station of wafer, second sensor scanning baffle plate 21 can just block sensor 19 light path.
The upper surface of bottom plate 9 is separately installed with the first limited block 15, the second limited block 16, the 3rd limited block 17 and the 4th limit
Position block 18.First limited block 15 and the second limited block 16 are located at the 5~10mm of outside at the movement travel both ends of the first sliding block 4 respectively,
3rd limited block 17 and the 4th limited block 18 are located at the 5~10mm of outside at the movement travel both ends of the second sliding block 6 respectively, prevent because of the
The connection of one cylinder 7 and the first connecting plate 11 loosens and the connection of the second cylinder 8 and the second connecting plate 13 loosens, and causes the first cunning
The sliding block 6 of block 4 and second exceeds preset range during exercise.By taking the first cylinder 7 as an example, when the piston rod of the first cylinder 7 is being done
When stretching out motion, if the connection of the tailpiece of the piston rod of the first cylinder 7 and the first connecting plate 11 loosens, then may occur
The range of movement of first sliding block 4 transfinites, and causes the motion of the first wafer cassette 1 to go beyond the scope, the work of wafer is not fetched and delivered in manipulator 14
On position, at this moment the piston rod of the first cylinder 7 has stretched out in place, but first sensor scanning baffle plate 20 does not stop sensor
19 light path, after control system receives signal, alarm will be sent, equipment operation stops, so that maintenance personal is repaired.
First and second cylinder 7,8 of the present invention is the cylinder of carrying magnetic switch, and the stroke of piston rod is equal.Magnetic is opened
The effect of pass is to detect the position of cylinder piston rod, electric signal can be sent after detecting, two cylinders are respectively provided with two magnetic
Switch a, position corresponding when in place of being retracted positioned at piston rod, is named as bottom magnetic switch, another is located at herein
Piston rod stretches out position corresponding when in place, is named as top magnetic switch herein.
The present invention operation principle be：
First and second cylinder 7,8 drives first and second sliding block 4,6 to be slided on first and second line slideway 3,5 respectively, so as to
The change of first and second wafer cassette 1,2 positions is driven, while baffle plate 20, second is scanned by sensor 19 and first sensor and passed
The interaction of sensor scanning baffle plate 21 judges the first wafer cassette 1 and second plus the magnetic switch on first and second cylinder 7,8
The location of wafer cassette 2, it is allowed to successively alternately fetch and deliver on the station of wafer in manipulator 14, to carry out the loading of wafer.
Specially：
The original state of the present invention is as shown in Fig. 7~10：The tailpiece of the piston rod of first cylinder 7 is in stretching state, triggering top
Portion's magnetic switch, ON signals are sent to control system, while first sensor scanning baffle plate 20 is on the position of sensor 19, is hindered
The light path of sensor 19 is kept off, sensor 19 sends ON signals, and (control system of the invention, which has, receives sensor to control system
Signal and record wafer cassette in wafer state function, be prior art).Control system sends instruction, and the first wafer cassette 1 is prevented
Only wafer slide out device is in open mode, that is, allow wafer to pass in and out, now the piston rod of the first cylinder 7 and the second cylinder 8
Piston rod is in halted state, and the first wafer cassette 1 is in manipulator 14 and fetched and delivered on the station of wafer, the piston rod of the second cylinder 8
End is in retracted mode, triggering bottom magnetic switch, sends ON signals and informs second to control system, control system feedback signal
Wafer cassette 2 is on room, is sylphon state, and the second wafer cassette 2 prevents wafer slide out device to be closed, that is, prevented
Wafer passes in and out.Wafer is sent into the first wafer cassette 1 caching for carrying out wafer by manipulator 14, while manipulator 14 can also take crystalline substance away
Circle, next technique unit or next device is gone to carry out PROCESS FOR TREATMENT；Control system can record the wafer in the first wafer cassette 1
Existence, when the slot 22 in the first wafer cassette 1 all has wafer, now the top magnetic of 19 and first cylinder of sensor 7 is opened
Instruction will be sent all in ON states, control system by closing, and make the first wafer cassette 1 prevents wafer slide out device from closing, and prevents
First wafer in motion process of wafer box 1 skids off, and the piston rod of the first cylinder 7 carries out retraction movement afterwards.Now first pass
Sensor scanning baffle plate 20 leaves the light path of sensor 19, no longer block sensor 19, while the top magnetic of the first cylinder 7 switch is not
In ON states, both control system no longer received the ON signals from the top magnetic of the first cylinder 7 switch；When the first cylinder 7
Piston rod is fully retracted, and the magnetic switch of the bottom of the first cylinder 7 is triggered, and in ON states, control system receives ON signals
Afterwards, it is known that the first wafer cassette 1 has returned to specified location, and control system sends instruction, starts the tailpiece of the piston rod of the second cylinder 8
Stretching campaign is carried out, when the tailpiece of the piston rod of the second cylinder 8 stretches out in place, triggering top magnetic switch, transmission ON signals are to control
System, while second sensor scanning baffle plate 21 is on the position of sensor 19, the light path of block sensor 19, sensor 19
Send ON signals and send instruction to control system, control system, make the second wafer cassette 2 prevents wafer slide out device is in from opening
State, that is, wafer is allowed to pass in and out, now the piston rod of the first cylinder 7 and the piston rod of the second cylinder 8 are in halted state, the second wafer
Box 2 is in manipulator 14 and fetched and delivered on the station of wafer.The tailpiece of the piston rod of first cylinder 7 is in retracted mode, and triggering bottom magnetic is opened
Close, send ON signals to control system, control system feedback signal informs that the first wafer cassette 1 is on room, is full box-like state.
Wafer is sent into the second wafer cassette 2 caching for carrying out wafer by manipulator 14, while manipulator 14 can also take wafer away, go next
Individual technique unit or next device carry out PROCESS FOR TREATMENT, and control system can record the wafer existence in the second wafer cassette 2,
When the slot 22 in the second wafer cassette 2 all has wafer, i.e. slot 22 in the first wafer cassette 1 and the second wafer cassette 2 is all present
Wafer, then control system can send alarm, prompt operating personnel to be further processed.
There is also another situation, when the second wafer cassette 2 is on the station that manipulator 14 fetches and delivers wafer, the first wafer cassette
1 in full box-like state, i.e. the magnetic switch at the top of 19 and second cylinder of sensor 8 is in ON states, if manipulator 14 to second
The wafer number that wafer cassette 2 is sent into is less than the wafer number taken out, and after setting time, the wafer in the second wafer cassette 2 is whole
Take out, it is impossible to provide wafer again to manipulator 14, now, control system will send signal, do the piston rod of the second cylinder 8 and contract
Backhaul it is dynamic, in place after, the piston rod of the first cylinder 7 does stretching motion, the state shown in Fig. 7 is returned to, into next initial shape
State works on.
Claims (10)
- A kind of 1. wafer buffer storage in semiconductor equipment, it is characterised in that：Including the first wafer cassette (1), the second crystalline substance Circle box (2), the first cylinder (7), the second cylinder (8) and bottom plate (9), wherein the first cylinder (7) and the second cylinder (8) are installed respectively On bottom plate (9), first wafer cassette (1) is connected to the first cylinder (7) and the second cylinder with the second wafer cassette (2) (8) output end, and be moved to manipulator (14) by first cylinder (7) and the second cylinder (8) driving, alternating respectively and fetched and delivered The station of wafer, i.e., described first wafer cassette (1) or the second wafer cassette (2) are moved to the station that manipulator (14) fetches and delivers wafer, Second wafer cassette (2) or the first wafer cassette (1) are located at room.
- 2. the wafer buffer storage being used for as described in claim 1 in semiconductor equipment, it is characterised in that：On the bottom plate (9) Sensor (19), first wafer cassette (1) and the second crystalline substance are installed in the station position that corresponding manipulator (14) fetches and delivers wafer The lower surface of circle box (2) is separately installed with the sensor scan baffle plate corresponding with the sensor (19), first wafer cassette (1) replaced respectively by the sensor scan baffle plate of respective lower section with the sensor (19) with the second wafer cassette (2) and matched somebody with somebody Conjunction is positioned at the station that the manipulator (14) fetches and delivers wafer.
- 3. the wafer buffer storage being used for as described in claim 2 in semiconductor equipment, it is characterised in that：The sensor (19) For correlation photoelectric sensor, the groove passed through for the sensor scan baffle plate, the groove are provided with sensor (19) Above be photophore, be light receiving device below.
- 4. by the wafer buffer storage being used for claim 1 or 2 described in semiconductor equipment, it is characterised in that：First gas Cylinder (7) is fetched and delivered wafer direction with manipulator (14) with the second cylinder (8) and is arranged symmetrically, and the first cylinder (7) drives the first wafer It is acute angle that the moving direction and the second cylinder (8) of box (1), which drive the angle between the moving direction of the second wafer cassette (2),.
- 5. the wafer buffer storage being used for as described in claim 4 in semiconductor equipment, it is characterised in that：Along first cylinder (7) moving direction of the first wafer cassette (1) is driven to be provided with the first straight line guide rail (3) being arranged on bottom plate (9), first gas The output end of cylinder (7) is connected by the first connecting plate (11) with the first wafer cassette (1), and is connected with first connecting plate (11) The first sliding block (4) slided along the first straight line guide rail (3)；The shifting of the second wafer cassette (2) is driven along second cylinder (8) Dynamic direction is provided with the second straight line guide rail (5) being arranged on bottom plate (9), and the output end of second cylinder (8) connects by second Fishplate bar (13) is connected with the second wafer cassette (2), and is connected with second connecting plate (13) sliding along the second straight line guide rail (5) Dynamic the second sliding block (6).
- 6. the wafer buffer storage being used for as described in claim 5 in semiconductor equipment, it is characterised in that：The first straight line is led The direction that rail (3) fetches and delivers wafer with second straight line guide rail (5) with the manipulator (14) is arranged symmetrically, and first and second straight line is led Angle between rail (3,5) is acute angle.
- 7. the wafer buffer storage being used for as described in claim 5 in semiconductor equipment, it is characterised in that：First sliding block (4) and on the outside of the both ends of the second sliding block (6) movement travel it is respectively equipped with the limited block on bottom plate (9).
- 8. by the wafer buffer storage being used for claim 1 or 2 described in semiconductor equipment, it is characterised in that：Described first and second The piston rod of cylinder (7,8) is in retracted mode, i.e., first, and two wafer cassettes (1,2) are in room, first and second wafer The station of wafer is fetched and delivered on bottom plate (9) to the manipulator (14) in the center that box (1,2) vertical direction projects on bottom plate (9) The distance at the center of projection is equal.
- 9. by the wafer buffer storage being used for claim 1 or 2 described in semiconductor equipment, it is characterised in that：Described first and second The opening for inputting or exporting for wafer is respectively equipped with wafer cassette (1,2), appearance is respectively equipped with first and second wafer cassette (1,2) Put the slot (22) of the wafer.
- 10. the wafer buffer storage being used for as described in claim 9 in semiconductor equipment, it is characterised in that：Described first and second is brilliant Opening on circle box (1,2) opens up along short transverse, and the width of the opening is more than brilliant diameter of a circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286996.7A CN105321858B (en) | 2014-06-24 | 2014-06-24 | For the wafer buffer storage in semiconductor equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410286996.7A CN105321858B (en) | 2014-06-24 | 2014-06-24 | For the wafer buffer storage in semiconductor equipment |
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| CN105321858A CN105321858A (en) | 2016-02-10 |
| CN105321858B true CN105321858B (en) | 2017-11-28 |
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| CN107116476A (en) * | 2016-02-24 | 2017-09-01 | 上银科技股份有限公司 | Work system with least two drive paths |
| CN110349895B (en) * | 2019-06-28 | 2021-06-25 | 上海提牛机电设备有限公司 | Mechanism for moving by using air cylinder and wafer transmission system |
| CN112736001B (en) * | 2020-12-31 | 2022-04-08 | 至微半导体(上海)有限公司 | High-efficiency wafer box conveying device of wet cleaning equipment |
| CN112707148B (en) * | 2020-12-31 | 2022-07-08 | 至微半导体(上海)有限公司 | High-speed wafer loading and unloading conveying system |
| CN113270349B (en) * | 2020-12-31 | 2022-04-05 | 至微半导体(上海)有限公司 | High-speed wafer loading and conveying method and unloading and conveying method |
| CN113611646B (en) * | 2021-08-27 | 2024-04-16 | 沈阳芯源微电子设备股份有限公司 | Wafer conveying device and wafer conveying method |
| CN116995025A (en) * | 2023-07-15 | 2023-11-03 | 浙江精瓷半导体有限责任公司 | Slicing equipment and method for semiconductor processing |
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| CN105321858A (en) | 2016-02-10 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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