CN105223779B - Vacuum frame and encapsulating method for EUV lithography equipment - Google Patents
Vacuum frame and encapsulating method for EUV lithography equipment Download PDFInfo
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- CN105223779B CN105223779B CN201410238163.3A CN201410238163A CN105223779B CN 105223779 B CN105223779 B CN 105223779B CN 201410238163 A CN201410238163 A CN 201410238163A CN 105223779 B CN105223779 B CN 105223779B
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- vacuum chamber
- main substrate
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- euv lithography
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Abstract
The present invention discloses a kind of vacuum frame for EUV lithography equipment, it is characterised in that including：One main substrate, the inner space of the vacuum frame is divided into a main vacuum chamber and a work stage vacuum chamber by the main substrate, include the work stage and measuring system of the EUV lithography equipment in object lens and mask platform including the EUV lithography equipment, the work stage vacuum chamber in the main vacuum chamber.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, more particularly to a kind of vacuum for EUV lithography equipment
Sealing device and encapsulating method.
Background technology
EUVL（Extreme ultraviolet lithography）It is the Next Generation Lithography of most application prospect.
Compared with conventional lithography machine, on the one hand, EUVL wavelength is shorter to reach 5 ~ 20nm, it is possible to achieve higher resolution.On the other hand
Also the problem of facing new.EUVL most one of distinguishing features are the extreme ultraviolets for using wavelength for 13.5nm, and any material is to the ripple
Long radiation has strong sink effect, therefore whole Optical Coatings for Photolithography need to work under high vacuum environment, thus be related to
High vacuum is obtained, contamination control and chamber isolation turn into the key technology that EUVL develops.
In the present invention, propose it is a kind of can realize the EUVL litho machine complete machine frame structures of high-vacuum environment, and
The assembling mode of main substrate from bottom to top.The dividing mode of also big vacuum chamber, and main vacuum chamber and work stage vacuum chamber it
Between sealing device.
As described in US6549264 B2, propose it is a kind of set up vacuum-sealed cavity on etching system, its for mask piece,
The different structures such as projection optical system, wafer have different support chambers, and pressure is different.Big vacuum volume is divided by dividing plate
For several small vacuum volumes, vibration isolation is realized in centre by flexibility decoupling.Dust in control etching system is so conducive to pollute
And carbon pollutes, the vibration isolation capability that can improve litho machine is easy to implement a vacuum chamber and seal assembly being used in etching system.
The vacuum equipment being made up of peripheral assembly 32 and inner frame 34 has isolated noise and the vibration of external environment condition, and this vacuum holding has
The different region of three pressure.Seal assembly 75,78 distinguishes connecting trays 40 and inner chamber 34, chamber 34 and peripheral cavity 32, so that
Masked areas 31 is isolated with optical region 33, same method separates optical region with wafer area.The slit that light beam is passed through
Very little is enough to ensure that the pressure of different zones is different.Using pump 97,98,99 to ensure the vacuum of vacuum chamber.But program knot
Structure is excessively complicated, carries out reliability low.
Such as patent US6279601B, provide a kind of fluid applied to EUVL and carry out sealing structure.Patent US6279601B
Disclosed in Fig. 2 in, 105（It is vertical）With 160（Level to）It is to need sealed object for a pair, 105 inner peripheral walls stretch out cantilever 230,
The another circle groove of 160 circumferential perimeters, 230 ends reach deep down into 160 bottom portion of groove and leave certain gap.In 160 groove
Low-pressure fluid 250 is imported, pallet lower regions are divided into two regions with different pressure, the cantilever two when Pw is different from Po
There to be difference in height between the liquid in face；When Pw and Po pressure differences are very big, liquid can be forced out groove in groove.This sealing structure ensures
There are different pressure, the vibration outside 105 not to be transferred to inner tray, ensure that two cavity pressure differences are maintained for two different zones
In scope of design.
The content of the invention
In order to overcome defect present in prior art, the present invention provides a kind of complete machine framework knot for high vacuum environment
Structure and its sealing device and assembly method, it can isolate main vacuum chamber with work stage vacuum chamber, and pass through vavuum pump
Pump drainage realizes dynamic equilibrium.
In order to realize foregoing invention purpose, the present invention discloses a kind of vacuum frame for EUV lithography equipment, and its feature exists
In, including：The inner space of the vacuum frame is divided into a main vacuum chamber and a work stage vacuum by one main substrate, the main substrate
Include the EUV lithography in object lens and mask platform including the EUV lithography equipment, the work stage vacuum chamber in chamber, the main vacuum chamber
The work stage and measuring system of equipment.
Further, the main substrate is connected by an active damper with the basic framework of the vacuum frame.
Further, the gap between the main substrate and the basic framework is less than 3-5mm.
Further, between the main substrate is adjusted between the main substrate and the basic framework by a wedge-shaped adjustment unit
Gap.
Further, the wedge-shaped adjustment unit includes the fixation bottom plate being connected with the basic framework and a guide pad,
The guide pad is connected with a wedge, and a regulating bolt is included on the fixation bottom plate, and the regulating bolt is used to make the wedge edge
The guide pad is moved up and down.
Further, a position sensor is also included on the main substrate.
Further, the basic framework includes U-shaped extended into the work stage vacuum chamber, and the main substrate includes
One foot, the foot is positioned in this U-shaped, and metal sealing liquid is filled between the foot and this U-shaped.
Further, the metal sealing liquid be containing gallium, indium, tin metal or alloy.
Further, the main substrate includes a diaphragm seal with the main vacuum chamber.
Present invention simultaneously discloses a kind of installation method of the vacuum frame of EUV lithography equipment, it is characterised in that：Including following
Step：
Step one, main substrate is attached on the basic framework of work stage vacuum chamber；Step 2, by the basis of main vacuum chamber
Framework is arranged on the basic framework of work stage vacuum chamber；Wherein, step one is further comprising the steps of：Step 1.1, first by main base
Plate, is placed in lifting frock, is pushed into below installation position；Step 1.2, main substrate is held in the palm to work from bottom to top using lifting frock
Installation site in part platform vacuum chamber；Step 1.3, main substrate is fixed in work stage vacuum chamber with bolt；Step 1.4, pass through
Shock absorber mounting hole in work stage vacuum chamber, main substrate cover plate is arranged on main substrate, shock absorber is attached into main substrate
On cover plate, main substrate component is held up, bolt is removed.
Compared with prior art, it is proposed that a kind of complete machine frame structure that can be used in high vacuum environment and its sealing
Device and assembly method, it can isolate main vacuum chamber with work stage vacuum chamber, and be realized by vavuum pump pump drainage dynamic
State is balanced.The guider that the present invention is provided taken up space with adjusting means integrated design it is small, by position sensor come smart
Really adjustment clearance distance, manually operated flexible, will not discharge pollution.The invention provides liquid metal sealing structure, with when
Phase air release property is low, resistance to baking, reusable and good air-tightness the characteristics of.The invention provides a soft sealing film, pass through
Diaphragm seal, big vacuum chamber is separated, and realizes that the dynamic of main vacuum chamber and work stage vacuum chamber is put down by the pump drainage of vavuum pump
Weighing apparatus.
Brief description of the drawings
It can be obtained further by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
Solution.
Fig. 1 is the structural representation of the vacuum frame of EUV lithography equipment involved in the present invention；
Fig. 2 is the sealing device schematic layout pattern of the vacuum frame of EUV lithography equipment involved in the present invention；
Fig. 3 is the vacuum frame three-dimensional layout figure of EUV lithography equipment involved in the present invention；
Fig. 4 is the assembly flow charts of the vacuum frame of EUV lithography equipment involved in the present invention；
Fig. 5 is the first embodiment of the sealing means of the vacuum frame of EUV lithography equipment involved in the present invention；
Fig. 6 is the second embodiment of the sealing means of the vacuum frame of EUV lithography equipment involved in the present invention；
Fig. 7 is the 3rd embodiment of the sealing means of the vacuum frame of EUV lithography equipment involved in the present invention.
Embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
Fig. 1 schematically show the vacuum frame of 1 lithographic equipment according to one embodiment of present invention.Masking part
（Vacuum level requirements are 10-7~10-9mbar）With silicon wafer exposure part（Vacuum level requirements are 10-5~10-7mbar）It is required
Vacuum it is different, so by main substrate be used as interface by vacuum chamber divide be main vacuum chamber（Main Vacuum
Chamber）101 and work stage vacuum chamber（WS Vacuum Chamber）1, high vacuum is realized by the form of pump drainage respectively
Dynamic equilibrium.Also include some sealing surfaces 104 between each vacuum chamber.Wherein main substrate is used as main vacuum chamber 101 and workpiece
Interface 102 between platform vacuum chamber 1.
Vacuum system layout proposed by the present invention is shown in Fig. 2, and structure uses two layers of outer tower structure, main substrate component
Assemble from bottom to top, the anufacturability of main key component is good, Seal Design is preferable, and the consumptive material of main vacuum chamber is few.
The system vacuum frame three-dimensional structure layout is as shown in Figure 3.Wherein, object lens are included in main vacuum chamber 101 and are covered
Work stage (WS) and measuring system are included in die station (RS), work stage vacuum chamber 1, main substrate is arranged on work stage by shock absorber
In vacuum chamber.
The present invention proposes a kind of structure for from bottom to top assembling main substrate, its assemble flow such as Fig. 4.Main substrate component is by leading
Substrate 201 and main substrate cover plate 202 are constituted.First main substrate 201 is placed in lifting frock during installation, is pushed under installation position
Side, in Fig. 4（a）It is shown.Main substrate 201 is held in the palm to installation position in work stage vacuum chamber 1 from bottom to top using frock is lifted
Put, in Fig. 4（b）It is shown.Main substrate 201 is fixed in work stage vacuum chamber 1 with bolt again, in Fig. 4（c）Institute
Show.Again by the shock absorber mounting hole in work stage vacuum chamber 1, main substrate cover plate 202 is arranged on the main substrate of part 201, so
Shock absorber is attached on main substrate cover plate 202 afterwards, main substrate component is held up, bolt is removed, in Fig. 4（d）.Install
Complete vacuum frame, main substrate 201 is arranged on by shock absorber on the basic framework of work stage vacuum chamber 1.The assembling mode can
With influence of the external vibration to main substrate 201 that decay, so as to ensure the precision and stability of exposure；Simultaneously because from bottom to top
Assembling mode ensure that the opening between as small as possible main vacuum chamber 101 and work stage vacuum chamber 1, and smaller opening can ensure
Better seal performance.
Certain gap must be stayed between main substrate 201 and basic framework, active damper could be allowed to play a role, passed through
Calculate when gap is less than 3 ~ 5mm between main substrate 201 and basic framework, disclosure satisfy that by the pump drainage of vavuum pump main true
The dynamic equilibrium of cavity and work stage vacuum chamber.But 3 ~ 5mm gap is unsatisfactory for active damper work requirements.The present invention is carried
Go out a kind of sealing means of adjustable clearance.Its structure is as shown in figure 5, specific implementation method is：Block 403 is directed to first with fixing
Bottom plate 402 is arranged on the basic framework of work stage vacuum chamber 1, and wedge-shaped regulating block 401 is oriented to by guide pad 403, by adjusting
Section bolt 405 can allow wedge-shaped regulating block 401 to be moved up and down by guide pad 403, the position sensing relied on main substrate 201
Device 404 comes accurate measurement position, so as to reach the function of seal clearance between regulation main substrate 201 and work stage vacuum chamber 1.
Fig. 6 is second of embodiment of the present invention.As shown in fig. 6, enclosing U in the inwall milling one of work stage vacuum chamber 601
Type groove, boss is enclosed in milling one on main substrate 603, in assembling process, the vertical lifting of main substrate 603 on basic framework,
Liquid metal 602 is injected in the seal groove formed between U-shaped groove and boss, such as：Gallium, indium, tin, gallium, indium etc. can be used in
The liquid metal sealing fluid of high vacuum.The height of liquid metal 602 is about the 1/2 of total groove depth, passes through main vacuum chamber 101 and workpiece
The vavuum pump pump drainage of platform vacuum chamber 1, reaches dynamic equilibrium, can so fully achieve main vacuum chamber 101 and work stage vacuum chamber 1
Physical isolation.
Fig. 7 is the third embodiment of the present invention.As shown in fig. 7, covering one between main substrate 702 and main vacuum chamber 705
Layer part diaphragm seal 706, after part main substrate 702 is assembled with work stage vacuum chamber 701, diaphragm seal 706 is again by main vacuum thereon
Chamber 705 is arranged on work stage vacuum chamber 701.Because diaphragm seal 706 is flexibility, object lens are not influenceed（POB）Installation, can't
The vibration of part main substrate 702 is delivered to object lens（POB）On, and main vacuum chamber 705 and work stage vacuum chamber can be fully achieved
701 physical isolation.
Compared with prior art, it is proposed that a kind of complete machine frame structure that can be used in high vacuum environment and its sealing
Device and assembly method, it can isolate main vacuum chamber with work stage vacuum chamber, and be realized by vavuum pump pump drainage dynamic
State is balanced.The guider that the present invention is provided taken up space with adjusting means integrated design it is small, by position sensor come smart
Really adjustment clearance distance, manually operated flexible, will not discharge pollution.The invention provides liquid metal sealing structure, with when
Phase air release property is low, resistance to baking, reusable and good air-tightness the characteristics of.The invention provides a soft sealing film, pass through
Diaphragm seal, big vacuum chamber is separated, and realizes that the dynamic of main vacuum chamber and work stage vacuum chamber is put down by the pump drainage of vavuum pump
Weighing apparatus.
The preferred embodiment of the simply present invention described in this specification, above example is only to illustrate the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical scheme of experiment, all should be within the scope of the present invention.
Claims (5)
1. a kind of vacuum frame for EUV lithography equipment, it is characterised in that including：One main substrate, the main substrate is true by this
The inner space of empty frames frame is divided into a main vacuum chamber and a work stage vacuum chamber, the main substrate by an active damper with
The basic framework connection of the vacuum frame, the gap between the main substrate and the basic framework is less than 3-5mm, the master
Substrate adjusts the gap between the main substrate and the basic framework by a wedge-shaped adjustment unit；The wedge-shaped adjustment unit
Including the fixation bottom plate and guide pad being connected with the basic framework, the guide pad is connected with wedge, the fixed bottom plate
Upper to include regulating bolt, the regulating bolt is used to make the wedge move up and down along the guide pad；Wrapped in the main vacuum chamber
Including in the object lens and mask platform of the EUV lithography equipment, the work stage vacuum chamber includes the work stage of the EUV lithography equipment
And measuring system.
2. it is used for the vacuum frame of EUV lithography equipment as claimed in claim 1, it is characterised in that also include on the main substrate
One position sensor.
3. a kind of vacuum frame for EUV lithography equipment, it is characterised in that including：One main substrate, the main substrate is true by this
The inner space of empty frames frame is divided into a main vacuum chamber and a work stage vacuum chamber, the main substrate by an active damper with
Object lens and mask platform including the EUV lithography equipment, institute in the basic framework connection of the vacuum frame, the main vacuum chamber
Stating includes the work stage and measuring system of the EUV lithography equipment in work stage vacuum chamber, the basic framework includes one to institute
State extension in work stage vacuum chamber U-shaped, the main substrate includes a foot, and the foot is positioned in described U-shaped, institute
Metal sealing liquid is filled between stating foot and being described U-shaped.
4. it is used for the vacuum frame of EUV lithography equipment as claimed in claim 3, it is characterised in that the metal sealing liquid is
Containing gallium, indium, tin metal or alloy.
5. the installation method of the vacuum frame for EUV lithography equipment as described in any one of Claims 1-4, its feature exists
In：Comprise the following steps：
Step one, main substrate is attached on the basic framework of work stage vacuum chamber；
On step 2, the basic framework that the basic framework of main vacuum chamber is arranged on to work stage vacuum chamber；
Wherein, step one is further comprising the steps of：
Step 1.1, first by main substrate, it is placed in lifting frock, is pushed into below installation position；
Step 1.2, main substrate is held in the palm to the installation site to work stage vacuum chamber from bottom to top using lifting frock；
Step 1.3, main substrate is fixed in work stage vacuum chamber with another bolt；
Step 1.4, by the shock absorber mounting hole in work stage vacuum chamber, main substrate cover plate is arranged on main substrate, will be subtracted
The device that shakes is attached on main substrate cover plate, holds up main substrate component, another bolt is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410238163.3A CN105223779B (en) | 2014-05-30 | 2014-05-30 | Vacuum frame and encapsulating method for EUV lithography equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410238163.3A CN105223779B (en) | 2014-05-30 | 2014-05-30 | Vacuum frame and encapsulating method for EUV lithography equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105223779A CN105223779A (en) | 2016-01-06 |
| CN105223779B true CN105223779B (en) | 2017-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410238163.3A Active CN105223779B (en) | 2014-05-30 | 2014-05-30 | Vacuum frame and encapsulating method for EUV lithography equipment |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048889A (en) * | 2012-12-18 | 2013-04-17 | 华中科技大学 | Extreme ultraviolet lithography light source generation system based on drive of circular polarization laser |
| CN103268058A (en) * | 2013-05-10 | 2013-08-28 | 中国科学院微电子研究所 | Electronic device used in EUV vacuum environment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333775B1 (en) * | 1999-01-13 | 2001-12-25 | Euv Llc | Extreme-UV lithography vacuum chamber zone seal |
| SG102718A1 (en) * | 2002-07-29 | 2004-03-26 | Asml Holding Nv | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
-
2014
- 2014-05-30 CN CN201410238163.3A patent/CN105223779B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103048889A (en) * | 2012-12-18 | 2013-04-17 | 华中科技大学 | Extreme ultraviolet lithography light source generation system based on drive of circular polarization laser |
| CN103268058A (en) * | 2013-05-10 | 2013-08-28 | 中国科学院微电子研究所 | Electronic device used in EUV vacuum environment |
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|---|---|
| CN105223779A (en) | 2016-01-06 |
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Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525 Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |