CN105202803A - Portable board-assembly refrigeration apparatus - Google Patents
Portable board-assembly refrigeration apparatus Download PDFInfo
- Publication number
- CN105202803A CN105202803A CN201510693500.2A CN201510693500A CN105202803A CN 105202803 A CN105202803 A CN 105202803A CN 201510693500 A CN201510693500 A CN 201510693500A CN 105202803 A CN105202803 A CN 105202803A
- Authority
- CN
- China
- Prior art keywords
- plate
- graphene
- type semiconductor
- semiconductor
- refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of refrigeration, in particular to a portable board-assembly refrigeration apparatus. The refrigeration apparatus includes a refrigeration plate and a storage battery used for providing DC power for the refrigeration plate, wherein the storage battery is electrically connected with the refrigeration plate; the refrigeration plate can be assembled to form a refrigeration space for refrigeration; the refrigeration plate is provided with a semiconductor refrigeration chip; the refrigeration end face of the semiconductor refrigeration chip is close to the inner side of the refrigeration plate; the heating end face of the semiconductor refrigeration chip is close to the outer side of the refrigeration plate; the semiconductor refrigeration plate can be started to work only with 12 V DC power, and heat is absorbed at the refrigeration end for cooling; the portable board-assembly refrigeration apparatus can still work normally in outdoor places without an external power supply.
Description
Technical field
The present invention relates to refrigeration technology field, particularly relate to a kind of portable plate combined refrigerating device.
Background technology
Current refrigerating plant adopts compressor cooling, and volume is large, is inconvenient to carry, needs external power supply just can carry out work.
Summary of the invention
The present invention is directed to the problems referred to above and propose a kind of portable plate combined refrigerating device, it is characterized in that: comprise cold plate and provide the battery of dc source for it, described battery is electrically connected with described cold plate; Described cold plate can assemble the refrigeration space formed for freezing; Described cold plate arranges semiconductor chilling plate, and the cold junction face of described semiconductor chilling plate is inside described cold plate, and the face, hot junction of described semiconductor chilling plate is near the outside of described cold plate.Semiconductor refrigerating plate only needs the direct current of 12V just can open work, absorbs heat lower the temperature at its cold junction.Even if do not have the place of external power supply can normally use in the wild yet.Refrigeration structure is simple, simplifies refrigerating plant volume, is convenient for carrying.For assembling the cold plate of formation refrigeration space when not using, convenient for collecting.The mode of electricity refrigeration, avoids adopting the cold-producing mediums such as freon, reduces the pollution to environment; Also refrigrant leakage need not be worried in carrying process.
Further, the P-type semiconductor of described semiconductor chilling plate arranges graphene layer, or the N-type semiconductor of described semiconductor chilling plate arranges graphene layer, or the N-type semiconductor of the P-type semiconductor of described semiconductor chilling plate and described semiconductor chilling plate all arranges graphene layer.Described graphene layer has high thermal conductivity and is conducive to distributing described semiconductor chilling plate hot junction heat in time, improve the refrigerating capacity of described semiconductor chilling plate, even if the hot junction of described semiconductor chilling plate does not arrange heat abstractor and can normally work yet, simplify the structure of refrigerating plant, improve portability.The electron mobility that graphene layer is high and conductance, can form stable P pole or N pole quickly with less energy consumption, increase the temperature difference of the hot cold junction of described semiconductor chilling plate, improves refrigerating capacity.
As preferably, described P-type semiconductor arranges graphene layer, and described N-type semiconductor has the graphene layer of Graphene purity higher than the Graphene purity of the graphene layer of described P-type semiconductor.Make described semiconductor chilling plate its cold junction temperature in energising 3S drop to-50 DEG C, hot-side temperature rises to 100 DEG C simultaneously, realizes the hot cold junction temperature difference of described semiconductor chilling plate and reaches 150 degrees Celsius.
As preferably, the N-type semiconductor of described semiconductor chilling plate adds Graphene particle, or the P-type semiconductor of described semiconductor chilling plate adds Graphene particle, or the N-type semiconductor of described semiconductor chilling plate and P-type semiconductor all add Graphene particle.Graphene has high thermal conductivity and is conducive to distributing described semiconductor chilling plate hot junction heat in time, improve the refrigerating capacity of described semiconductor chilling plate, even if the hot junction of described semiconductor chilling plate does not arrange heat abstractor and can normally work yet, simplify the structure of refrigerating plant, improve portability.The electron mobility that Graphene is high and conductance, can form stable P pole or N pole quickly with less energy consumption, increase the temperature difference of the hot cold junction of described semiconductor chilling plate, improves refrigerating capacity.
As preferably, described N-type semiconductor adds Graphene particle, and described P-type semiconductor adds Graphene particle, and the Graphene purity of the Graphene particle of described N-type semiconductor is higher than the Graphene purity of the graphite granule of described P-type semiconductor.Make described semiconductor chilling plate its cold junction temperature in energising 3S drop to-50 DEG C, hot-side temperature rises to 100 DEG C simultaneously, realizes the hot cold junction temperature difference of described semiconductor chilling plate and reaches 150 degrees Celsius.
As preferably, described cold plate arranges heat-conducting layer and thermal insulation layer, is connected inside the cold junction face that described heat-conducting layer is arranged on described semiconductor chilling plate with described cold junction face heat conduction; Described thermal insulation layer is arranged on outside the face, hot junction in described semiconductor refrigerating face.Described semiconductor chilling plate siphons away the heat in described refrigeration space in time by described heat-conducting layer.
As preferably, described heat-conducting layer is Graphene heat-conducting layer.Graphene is better than the thermal conductivity of tens times, metal, has utilization to be siphoned away by described cold junction face by the heat in refrigeration space timely, reduces the temperature in refrigeration space.
As preferably, described cold plate edge arranges sealing device.Described sealing device prevents the cold air in described refrigeration space from overflowing.
As preferably, described power supply arranges the current regulation unit of the size of current for regulating described power supply.By regulating the electric current of described power supply, regulate the cryogenic temperature required for described refrigerating plant.
The present invention has following beneficial effect:
1. refrigerating plant is assembled by board-like cooling piece, and structure is simple, convenient for collecting, easy to assembly;
2. adopt storage battery power supply, still can normally work in the environment not having external power supply;
3. refrigeration temperature levels is adjustable, is suitable for various occasion;
4. semiconductor chilling plate has refrigerating capacity fast, even if frequent switch refrigerating plant all can not affect the temperature in its refrigeration space.
5. adopt the mode of electricity refrigeration to freeze, do not need to use freon as cold-producing medium, environmental protection, safer.
6. adopt the mode of electricity refrigeration to freeze, avoid the refrigeration system using compressor-type, reduce refrigeration noise.
7. adopt the mode of electricity refrigeration to freeze, in refrigeration system, mechanical motion, runs more stable.
8. improve refrigerating speed, be more suitable for portable use occasion.
Accompanying drawing explanation
Fig. 1 portable plate combined refrigerating device stereogram;
Fig. 2 portable plate combined refrigerating device assembly drawing;
Fig. 3 cold plate structural representation;
Fig. 4 semiconductor chilling plate structural representation one;
Fig. 5 semiconductor chilling plate structural representation two;
Wherein, 1-cold plate, 2-battery, 211-semiconductor chilling plate, 12-heat-conducting layer, 13-thermal insulation layer, 14-sealing strip, 111-cold junction, 112-hot junction, 113-N type semiconductor, 114-P type semiconductor, 115-metallic conductor, 116-graphene layer, 117-Graphene particle.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the present invention are described in detail.A kind of portable plate combined refrigerating device, comprise cold plate 1 and battery, battery and cold plate 1 electrically connect as it provides direct current.As shown in Figure 1 and Figure 2, refrigerating plant mutually splices assembling by multiple rectangular shaped article cold drawing and forms a cubical refrigeration space.The shape of cold plate and quantity can be arranged arbitrarily, as long as can form the refrigeration space closed.
As shown in Figure 3, for cold plate arranges semiconductor chilling plate 11.The cold junction face of semiconductor chilling plate is inside cold plate, and the face, hot junction of semiconductor chilling plate is near the outside of cold plate.Wherein, refer to the side for the formation of refrigeration space inwall inside cold plate, outside is then the side of relatively aforementioned inner side.For semiconductor chilling plate provides 12v direct current, make the electronics in semiconductor wherein produce migration, the transfer of heat of cold junction discharged to hot junction, the hot-side temperature of semiconductor refrigerating plate is raised, cold junction temperature reduces to freeze to refrigeration space.
Figure 4 shows that a kind of schematic diagram of semiconductor chilling plate 11.Comprise the cold junction 111 for absorbing heat, for dispel the heat hot junction 112, be arranged on N-type semiconductor 113 between cold junction 111 and hot junction 112 and P-type semiconductor 114, the metallic conductor 115 being connected N-type semiconductor 113 and P-type semiconductor 114.Metallic conductor 115 arranges the positive and negative electrode for being electrically connected battery 2.Battery 2 provides dc source for semiconductor chilling plate 11.
Graphene layer 116 is accompanied in N-type semiconductor or P-type semiconductor.Graphene layer in N-type semiconductor 113 is the N-type doped graphene layer that can increase the impurity of Graphene betatopic ability doped with H2 or other; Graphene layer in P-type semiconductor 114 is can increase doped with NO2 or other P type doped graphene layer that Graphene obtains the impurity of electronic capability.Graphene has the high electron mobility of high thermal conductivity and conductance, and P-type semiconductor 114 or N-type semiconductor 113 can be impelled to form stable P pole or N pole quickly with less energy consumption.Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described semiconductor chilling plate and ability.Make cold junction 111 continue to produce cold, hot junction 112 continues to produce heat, improves the temperature difference of the hot cold junction of semiconductor chilling plate.Also it can be protected to burn even if hot junction 112 does not arrange semiconductor chilling plate described in heat abstractor, ensure that it normally works.
In order to make semiconductor refrigerating heating capacity reach best, also graphene layer 116 can be all set in N-type semiconductor 113 and 11P type semiconductor 4.Now, need ensure that N-type semiconductor 113 has the N-type doped graphene layer of Graphene purity higher than the Graphene purity of the P type doped graphene layer of P-type semiconductor 114.The refrigerating capacity of semiconductor chilling plate is promoted further, and its cold junction temperature can reach about-50 DEG C, and its hot-side temperature can reach about 100 DEG C, and the hot cold junction temperature difference of semiconductor chilling plate reaches 150 DEG C.
The another kind of schematic diagram of Fig. 5 semiconductor chilling plate 11
N-type semiconductor 113 or P-type semiconductor 114 add Graphene particle 117.Graphene particle in N-type semiconductor 113 is the N-type doped graphene particle that can increase the impurity of Graphene betatopic ability doped with H2 or other; Graphene particle in P-type semiconductor 4 is can increase doped with NO2 or other P type doped graphene particle that Graphene obtains the impurity of electronic capability.Graphene has the high electron mobility of high thermal conductivity and conductance, and P-type semiconductor 114 or N-type semiconductor 113 can be impelled to form stable P pole or N pole quickly with less energy consumption.Meanwhile, the heat conductivility that Graphene is high can improve transfer of heat speed in described semiconductor chilling plate and ability.Make cold junction 111 continue to produce cold, hot junction 112 continues to produce heat, improves the temperature difference of the hot cold junction of semiconductor chilling plate.Also it can be protected to burn even if hot junction 112 does not arrange semiconductor chilling plate described in heat abstractor, ensure that it normally works.
In order to make semiconductor refrigerating heating capacity reach best, also can all add graphene layer particle in N-type semiconductor 113 and P-type semiconductor 114.Now, the Graphene purity of the Graphene purity of the Graphene particle added in N-type semiconductor 113 higher than the Graphene particle added in P-type semiconductor 114 need be ensured.The refrigerating capacity of semiconductor chilling plate is promoted further, and its cold junction temperature can reach about-50 DEG C, and its hot-side temperature can reach about 100 DEG C, and the hot cold junction temperature difference of semiconductor chilling plate reaches 150 DEG C.
Cold plate 1 arranges heat-conducting layer 12 and thermal insulation layer 13, is connected inside the cold junction face that heat-conducting layer 12 is arranged on semiconductor chilling plate 11 with the heat conduction of cold junction face.Heat in refrigeration space is passed to the cold junction of semiconductor chilling plate 11 by heat-conducting layer 13, then is transferred to hot junction through cold junction and discharges.Thermal insulation layer 13 is arranged on outside the face, hot junction in semiconductor refrigerating face 11, reduces the heat be discharged into outside thermal insulation layer 13.
Heat-conducting layer can adopt the Graphene heat-conducting layer being added with grapheme material, utilizes Graphene higher than the thermal conductivity of tens times, metal, improves the heat transference efficiency of cold junction 111.
In order to improve the insulating power of cold plate, save energy consumption, the edge of cold plate 1 arranges sealing device 14.Sealing device 14 can be sealing strip etc.
Power supply can arrange the current regulation unit of the size of current for regulating power supply, by the cryogenic temperature of adjustment size of current adjustment refrigerating plant.
Although describe embodiments of the present invention by reference to the accompanying drawings, those of ordinary skill in the art can make various distortion or amendment within the scope of the appended claims.
Claims (9)
1. a portable plate combined refrigerating device, is characterized in that: comprise cold plate (1) and provide the battery of dc source for it, described battery is electrically connected with described cold plate (1); Described cold plate (1) can assemble the refrigeration space formed for freezing; Described cold plate (1) arranges semiconductor chilling plate (11), and the cold junction of described semiconductor chilling plate (11) is near described cold plate (1) inner side, and the hot junction of described semiconductor chilling plate (11) is near the outside of described cold plate (1).
2. the portable plate combined refrigerating device of one according to claim 1, it is characterized in that: the P-type semiconductor of described semiconductor chilling plate (11) arranges graphene layer, or the N-type semiconductor of described semiconductor chilling plate arranges graphene layer, or the N-type semiconductor of the P-type semiconductor of described semiconductor chilling plate (11) and described semiconductor chilling plate (11) all arranges graphene layer.
3. the portable plate combined refrigerating device of one according to claim 2, it is characterized in that: described P-type semiconductor arranges graphene layer, described N-type semiconductor has the graphene layer of Graphene purity higher than the Graphene purity of the graphene layer of described P-type semiconductor.
4. the portable plate combined refrigerating device of one according to claim 1, it is characterized in that: the N-type semiconductor of described semiconductor chilling plate (11) adds Graphene particle, or the P-type semiconductor of described semiconductor chilling plate (11) adds Graphene particle, or the N-type semiconductor of described semiconductor chilling plate (11) and P-type semiconductor all add Graphene particle.
5. the portable plate combined refrigerating device of one according to claim 4, it is characterized in that: described N-type semiconductor adds Graphene particle, described P-type semiconductor adds Graphene particle, and the Graphene purity of the Graphene particle of described N-type semiconductor is higher than the Graphene purity of the graphite granule of described P-type semiconductor.
6. the portable plate combined refrigerating device of one according to claim 1 or 2 or 3 or 4 or 5, it is characterized in that: described cold plate (1) arranges heat-conducting layer (12) and thermal insulation layer (13), be connected with described cold junction heat conduction inside the cold junction that described heat-conducting layer (12) is arranged on described semiconductor chilling plate (11); Described thermal insulation layer (13) is arranged on outside the hot junction in described semiconductor refrigerating face.
7. the portable plate combined refrigerating device of one according to claim 6, is characterized in that: described heat-conducting layer (12) is Graphene heat-conducting layer.
8. the portable plate combined refrigerating device of one according to claim 1 or 2 or 3 or 4 or 5, is characterized in that: described cold plate (1) edge arranges sealing device.
9. the portable plate combined refrigerating device of one according to claim 1 or 2 or 3 or 4 or 5, is characterized in that: described power supply arranges the current regulation unit of the size of current for regulating described power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510693500.2A CN105202803A (en) | 2015-10-24 | 2015-10-24 | Portable board-assembly refrigeration apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510693500.2A CN105202803A (en) | 2015-10-24 | 2015-10-24 | Portable board-assembly refrigeration apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105202803A true CN105202803A (en) | 2015-12-30 |
Family
ID=54950622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510693500.2A Pending CN105202803A (en) | 2015-10-24 | 2015-10-24 | Portable board-assembly refrigeration apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105202803A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957952A (en) * | 2016-05-26 | 2016-09-21 | 安徽明辉成美科技发展有限公司 | Semiconductor refrigeration graphene chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201956405U (en) * | 2011-03-22 | 2011-08-31 | 广东富信电子科技有限公司 | Assembly type multifunctional heat preservation cabinet |
| US20110298526A1 (en) * | 2010-06-07 | 2011-12-08 | Skyworks Solutions, Inc. | Apparatus and method for disabling well bias |
| CN102800802A (en) * | 2012-07-20 | 2012-11-28 | 南京航空航天大学 | Environmental energy conversion device |
| CN203731770U (en) * | 2013-10-18 | 2014-07-23 | 浙江理工大学 | Portable medical refrigerator |
| CN204675108U (en) * | 2015-05-02 | 2015-09-30 | 大连华工创新科技股份有限公司 | Portable small-sized or micro constant-temperature case or electric refrigerator |
| CN205208998U (en) * | 2015-10-24 | 2016-05-04 | 唐玉敏 | Portable board combination refrigerating plant |
-
2015
- 2015-10-24 CN CN201510693500.2A patent/CN105202803A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110298526A1 (en) * | 2010-06-07 | 2011-12-08 | Skyworks Solutions, Inc. | Apparatus and method for disabling well bias |
| US20110300898A1 (en) * | 2010-06-07 | 2011-12-08 | Skyworks Solutions, Inc. | High linearity cmos rf switch passing large signal and quiescent power amplifier current |
| CN201956405U (en) * | 2011-03-22 | 2011-08-31 | 广东富信电子科技有限公司 | Assembly type multifunctional heat preservation cabinet |
| CN102800802A (en) * | 2012-07-20 | 2012-11-28 | 南京航空航天大学 | Environmental energy conversion device |
| CN203731770U (en) * | 2013-10-18 | 2014-07-23 | 浙江理工大学 | Portable medical refrigerator |
| CN204675108U (en) * | 2015-05-02 | 2015-09-30 | 大连华工创新科技股份有限公司 | Portable small-sized or micro constant-temperature case or electric refrigerator |
| CN205208998U (en) * | 2015-10-24 | 2016-05-04 | 唐玉敏 | Portable board combination refrigerating plant |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957952A (en) * | 2016-05-26 | 2016-09-21 | 安徽明辉成美科技发展有限公司 | Semiconductor refrigeration graphene chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103199316B (en) | Battery pack and radiator structure thereof | |
| CN105202801A (en) | Refrigerating device | |
| CN106486719A (en) | Power battery thermal management system based on semiconductor refrigeration piece | |
| WO2017197842A1 (en) | Intelligent heat energy recycling apparatus and air-conditioning system | |
| CN206471454U (en) | A kind of batteries of electric automobile heat management system | |
| CN203288718U (en) | Self-heating self-cooling constant-temperature alkaline battery pack | |
| CN105276894A (en) | Semiconductor refrigerating module provided with solid-state fans and refrigerating container comprising semiconductor refrigerating module | |
| CN105202802A (en) | Open type refrigeration device | |
| CN202094248U (en) | Storage battery cooling system | |
| CN105222393A (en) | A kind of refrigerator type water heater cold-hot integrated device | |
| CN105202800A (en) | Semiconductor cooling and heating chip | |
| CN205846173U (en) | The working medium cooling system by contact of capacity cell | |
| CN102967102B (en) | Portable electronic refrigerator | |
| CN205718139U (en) | A kind of portable type solar energy refrigeration case | |
| CN205208998U (en) | Portable board combination refrigerating plant | |
| CN204011608U (en) | A kind of phase-change heat radiating device for circle battery | |
| CN105783366A (en) | Portable solar refrigerating case | |
| CN203323472U (en) | Solar semiconductor refrigeration refrigerator | |
| CN105202803A (en) | Portable board-assembly refrigeration apparatus | |
| CN206322817U (en) | Power battery thermal management system based on semiconductor refrigeration piece | |
| CN205784105U (en) | Semiconductor refrigerating module and the cold closet including this module with solid-state fan | |
| CN105202612A (en) | Semiconductor heating device | |
| CN205102229U (en) | Semiconductor heating installation | |
| CN202261069U (en) | Inverter cooling system based on semiconductor refrigeration | |
| CN205208996U (en) | Cold and hot integrative device of refrigerator water heater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151230 |