CN105171270B - Brazing filler metal for brazing dissimilar component W-Cu alloy, preparation method and brazing method - Google Patents

Abstract

The invention discloses a solder for brazing W-Cu alloy with different components, a preparation method and a brazing method. The components of the solder and the mass percentages of the components are respectively Mn10.0%-16.0%, Co0. 5% to 3.5%, Ni1.0% to 5.0%, Ti1.0% to 4.0%, Si0.2% to 0.6%, B0.1% to 0.3%, and the balance is Cu. The brazing temperature of the copper-based solder of the present invention is 1000°C to 1050°C, the melting temperature of the solder is moderate, and the solder melts evenly. By adding relevant beneficial elements, the solder has good wettability and metallurgical properties for the W-Cu alloy. Compatibility, the obtained brazed joint has high strength and good corrosion resistance, and can be completely applied in complex environments. It is an economical solder with good comprehensive performance; the prepared copper-based solder foil is conducive to promoting brazing connection The diffusion of alloying elements and interfacial reaction during the process improves the wetting and spreading ability of the solder on the surface of the W-Cu alloy, which helps to form a dense brazed joint.

Description

Brazing material for brazing heterogeneous W-Cu alloys, preparation method and brazing method

technical field

The invention relates to brazing filler metal for brazing heterogeneous W-Cu alloys, a preparation method and a brazing method, and belongs to the technical field of heterogeneous material welding.

Background technique

W-Cu alloy combines the excellent properties of tungsten and copper, has good electrical and thermal conductivity and low thermal expansion coefficient, and is often used as a heat sink material in high-power devices. However, with the high heat generation rate caused by the continuous miniaturization, high integration and high power development of microwave semiconductor devices, it is difficult for the existing homogeneous W-Cu alloy to meet the heat dissipation performance requirements of electronic substrates. This problem can be well solved if two W-Cu alloys of different desired compositions are joined. Brazing, a solid-liquid phase joining method, is one of the preferred methods for joining dissimilar materials. The connection of two W-Cu alloys with different compositions can give full play to the advantages of tungsten-copper composite materials by adjusting the content of tungsten-copper. It has a series of excellent comprehensive properties such as matching thermal expansion coefficient and high strength, so exploring the connection method of two different W-Cu alloys is not only of positive practical significance, but also has a good application prospect.

For the connection of two W-Cu alloys with different components, it is the key to realize the connection of two W-Cu alloys with different components to find a filler material with excellent performance and high cost performance and formulate a reasonable welding process. At present, there are no related reports on the brazing of heterogeneous W-Cu alloys.

Contents of the invention

Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a brazing material for brazing heterogeneous W-Cu alloys, a preparation method and a brazing method, the brazing material has good comprehensive properties, and the designed brazing process is simple and reasonable , the combination of the two can finally obtain a brazed joint with superior mechanical properties.

Technical solution: In order to solve the above technical problems, the solder of the present invention for brazing heterogeneous W-Cu alloys, the components of the solder and the mass percentages of the components are respectively Mn10.0% to 16.0%, Co0. 5% to 3.5%, Ni1.0% to 5.0%, Ti1.0% to 4.0%, Si0.2% to 0.6%, B0.1% to 0.3%, and the balance is Cu.

Preferably, the solder is a foil strip with a thickness of 100-200 μm.

Preferably, the components of the solder and the mass percentages of the components are respectively 12.0% to 15.0% of Mn, 1.0% to 3.0% of Co, 1.5% to 4.0% of Ni, and 1.5% to 4% of Ti, Si0.3%～0.6%, B0.15%～0.3%, the balance is Cu.

As preferably, the mass percentages of the components and components of the solder are respectively Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and the rest are Cu.

A kind of preparation method of the above-mentioned solder of brazing heterogeneous W-Cu alloy, comprises the following steps:

1) Weigh high-purity Mn flakes, Co granules, Ni granules, Ti granules, Si granules, B granules and Cu granules by mass percentage to prepare a mixture, put them in a container with acetone, and heat them at a temperature of 15-25°C Ultrasonic cleaning for 15-20 minutes;

2) drying the mixture after ultrasonic cleaning in step 1 at a temperature of 30-50° C. to obtain a dried mixture;

3) The mixture of Mn, Co, Ni, Ti, Si, B and Cu is prepared by vacuum induction melting method to prepare a solder master alloy with uniform composition, and after the prepared master alloy is crushed, it is loaded into a high vacuum single roller belt In the quartz glass tube of the machine;

4) The quartz glass tube is clamped in the electric induction heating ring of the stripping machine, and the distance between the nozzle and the surface of the copper roller is adjusted to 150-250 μm;

5) Close the furnace door, use a mechanical pump to evacuate to 1.5×10-3Pa, then use a molecular pump to evacuate to a high vacuum, the high vacuum degree is not lower than 6×10-5Pa, and then fill the cavity with high-purity Ar gas to 180-200mbar ;

6) Turn on the motor so that the copper roller speed us is in the range of 29-34m/s, then turn on the high-frequency power supply, heat the master alloy in the quartz glass tube by high-frequency induction until it is completely and uniformly melted, and keep the overheated melt for 70s-90s ;

7) Adjust the pressure of Ar gas to P=20-50KPa, and use high-pressure argon to continuously spray the superheated melt in the quartz glass onto the surface of the cooling copper roller rotating at high speed, and the liquid metal is quenched to form a foil strip, thereby obtaining the solder Foil strip with a thickness of 100-200 μm.

Preferably, in the step 3, the nozzle of the quartz tube is in the shape of a rectangle with a length of 8-12 mm and a width of 0.9-1.2 mm.

As a preference, the diameter of the copper roll in the step 6 is 250 mm, and the width of the copper roll is 50 mm.

A brazing method using the brazing material of the above-mentioned brazing heterogeneous W-Cu alloy, comprising the following steps:

(1) Preparation stage: clean the end faces of two W-Cu alloy samples of different components to be brazed, remove surface impurities, oil stains and oxide films, and use W28~W3.5 metallographic sandpaper to grind and smooth, Use No. W3.5 metallographic sandpaper to grind and smooth both sides of the solder foil. After grinding, put two W-Cu alloy samples of different components and the solder foil together in acetone, and use ultrasonic cleaning for 15~ 20min, and carry out drying treatment;

(2) Assembling stage: place the cleaned solder foil between two W-Cu alloy surfaces to be welded with different components, and fit it tightly in a special brazing fixture to ensure the accuracy of the connection. Place a pressure head of rated mass on it to generate a constant vertical pressure of 0.02-0.04MPa;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10-4Pa, first raise the temperature to 300-350°C at a rate of 10-15°C/min, and keep warm 15-20min, then raise the temperature to 700-850℃ at a rate of 5-10℃/min, hold time for 15-20min, then continue to heat up to a brazing temperature of 1000-1050℃ at a rate of 8-12℃/min, hold time 20 to 45 minutes, then cooled to 800 to 850 degrees at a rate of 12 to 16 degrees Celsius/min, holding time for 10 to 15 minutes, and finally cooled to 400 to 450 degrees Celsius at a rate of 5 to 10 degrees Celsius/min, and cooled to room temperature with the furnace. Open the furnace and take out the welded joints.

The copper-based brazing filler metal prepared by the present invention can make the brazing filler metal have good brazing process performance, heat resistance and corrosion resistance performance and processing performance by adding a variety of alloy elements reasonably, and can meet the requirements of different component W-Cu alloy brazing joints in complex environments. performance requirements in . The addition of an appropriate amount of Mn element can improve the performance of the brazing joint through solid solution, and the second is that the addition of Mn can also improve the high temperature resistance of the joint to a certain extent; Formation of new phases can also change the shape of phase components, and the refinement effect on specific phases is obvious; adding an appropriate amount of Ni can improve the heat and corrosion resistance and high temperature strength of the joint; adding an appropriate amount of Ti is beneficial to reduce the melting point of the solder Improve the fluidity of the alloy and refine the grains, improve the strength and plasticity of the solder alloy; adding a small amount of Si and B can improve the oxidation resistance of the solder, reduce the melting temperature of the solder, and improve the wettability; at the same time, a large amount of The Cu element is beneficial to improve the wettability and solid solution ability of the solder to the base metal, improve the plasticity and strength of the alloy solder, promote the solid solution metallurgical reaction of two W-Cu alloys with different components, and improve the comprehensiveness of the brazed joint. performance.

The brazing process provided by the present invention is to put two W-Cu alloys of different components into a special brazing jig in a butt joint manner, and then put the sample and the jig together into a vacuum furnace to complete the brazing. The environment cooperates with reasonable process parameter setting, so that the whole component has no deformation, no defects such as microscopic cracks, pores and inclusions, which is helpful to obtain brazed joints with good mechanical properties.

The copper-based solder provided by the invention exhibits good wettability and metallurgical compatibility to the W-Cu alloy, and the obtained brazed joint has high strength and good corrosion resistance, and is an economical brazing material with good comprehensive performance . The brazing process designed by the invention is simple, convenient and quick to implement, and can well realize the connection of two different-component W-Cu alloys with reasonable process parameter setting.

Beneficial effect: compared with the prior art, the present invention has the following advantages:

(1) The brazing temperature of the copper-based solder provided by the present invention is 1000°C to 1050°C, the melting temperature of the solder is moderate, and the solder melts evenly. By adding relevant beneficial elements, the solder has a good wetting effect on the W-Cu alloy. Moisture and metallurgical compatibility, the obtained brazed joints have high strength and good corrosion resistance, and can be completely applied in complex environments. It is an economical solder with good comprehensive performance; the prepared copper-based solder foil is beneficial to Promote the diffusion and interfacial reaction of alloying elements in the process of brazing connection, improve the wetting and spreading ability of solder on the surface of W-Cu alloy, and help form dense brazing joints;

(2) The brazing process of the heterogeneous W-Cu alloy designed by the present invention is simple and reasonable, adopts the brazing method in the vacuum furnace, does not need to add flux and other protective measures in the brazing process, and the high vacuum environment cooperates with reasonable process parameter setting Stable, so that the whole component has no deformation, no defects such as microscopic cracks, pores and inclusions, which is helpful to obtain brazed joints with good mechanical properties;

(3) The copper-based solder provided by the present invention has excellent abnormal temperature and high temperature performance, and can fully undergo solid solution metallurgical reactions with the base metal, and use the simple and practical brazing process of the present invention to finally obtain a joint with good comprehensive performance. W-Cu alloy provides new application prospects;

(4) The copper-based brazing material developed by the present invention has good overall performance, is very suitable for brazing of W-Cu alloys, and the brazing process of design is implemented conveniently and quickly, and the preparation of brazing material and brazing process can be repeated and reproduced, which is convenient for extensive application promotion and application.

Description of drawings

Fig. 1 is a structural schematic diagram of the brazing structure of the present invention.

Fig. 2 is the scanning electron micrograph of the brazed joint that concrete implementation 1 obtains;

Fig. 3 is the photo of the macroscopic appearance of the bending fracture of the brazed joint obtained in the specific implementation 1;

Fig. 4 is a photograph of the microscopic appearance of the bending fracture of the brazed joint obtained in Embodiment 1.

detailed description

Example 1

W75-Cu1 alloy and W55-Cu2 alloy were selected for butt joint vacuum brazing. Among them, the size of W75-Cu1 alloy and W55-Cu2 alloy samples are both 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm in section.

The composition and mass percentage ratio of the solder are: Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and the balance is Cu. The thickness of the solder is 100 μm.

Above-mentioned a kind of solder preparation method of brazing W75-Cu alloy and W55-Cu alloy comprises the following steps:

1) Take high-purity 130g Mn sheet, 25g Co particle, 30g Ni particle, 30g Ti particle, 5g Si particle, 2g B particle and 778g Cu particle and make mixture by mass percentage, put into the container that adds acetone, Ultrasonic cleaning at a temperature of about 20°C for 15 to 20 minutes;

2) drying the mixture after ultrasonic cleaning in step 1 at a temperature of 30-50° C. to obtain a dried mixture;

3) The mixture of Mn, Co, Ni, Ti, Si, B and Cu is prepared by vacuum induction melting method to prepare a solder master alloy with uniform composition, and after the prepared master alloy is crushed, it is loaded into a high vacuum single roller belt In the quartz glass tube of the machine;

4) The quartz glass tube is clamped in the electric induction heating ring of the stripping machine, and the distance between the nozzle and the surface of the copper roller is adjusted to 150-250 μm;

5) Close the furnace door, use a mechanical pump to evacuate to 1.5×10 ^-3 Pa, then use a molecular pump to evacuate to a high vacuum, the high vacuum degree is not lower than 6×10 ^-5 Pa, and then fill the cavity with high-purity Ar gas to 180 ~200mbar;

6) Turn on the motor so that the rotational speed u _s of the copper roller is in the range of 29-34m/s, then turn on the high-frequency power supply, heat the master alloy in the quartz glass tube by high-frequency induction until it is completely and uniformly melted, and then keep the superheated melt for 70s～ 90s;

7) Adjust the pressure of Ar gas to P=20-50KPa, and use high-pressure argon to continuously spray the superheated melt in the quartz glass onto the surface of the cooling copper roller rotating at high speed, and the liquid metal is quenched to form a foil strip, thereby obtaining the solder Foil strip, 100 μm thick.

The brazing process steps are:

(1) Preparation stage: Clean the end faces of the W75-Cu1 alloy and W55-Cu2 alloy samples to be brazed to remove impurities, oil stains and oxide films on the surface, and use W28~W3.5 metallographic sandpaper to grind and smooth. W3.5 metallographic sandpaper, grind both sides of the copper-based solder 3 foil to smooth, after grinding, put the W75-Cu1 alloy, W55-Cu2 alloy and the solder foil together in acetone, and use ultrasonic cleaning for 15-20min , and carry out drying treatment;

(2) Assembling stage: place the cleaned solder foil between the W75-Cu1 alloy and the W55-Cu2 alloy surface to be welded, and fit it tightly in the special brazing fixture to ensure the accuracy of the connection. Place an indenter of rated mass to produce a constant vertical pressure of 0.04MPa, as shown in Figure 1;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10 ^-4 Pa, first raise the temperature to 300°C at a rate of 12°C/min, keep it warm for 20min, and then Heat up to 800°C at a rate of 8°C/min, hold for 20 minutes, then continue to heat up to a brazing temperature of 1050°C at a rate of 10°C/min, hold for 30 minutes, then cool to 800°C at a rate of 15°C/min, The holding time is 15 minutes, and finally cooled to 450°C at a rate of 8°C/min, cooled to room temperature with the furnace, and then the furnace is opened to take out the welded joints.

Results: The joints of W75-Cu1 alloy and W55-Cu2 alloy obtained by brazing are well formed. Metallographic observation shows that the brazing zone forms a dense interface bond, the alloy components are evenly distributed, and the four-point bending strength at room temperature is 980MPa. The photo is shown in Figure 2, the macroscopic photo of the bending fracture of the brazing joint is shown in Figure 3, and the microscopic photo of the bending fracture of the brazing joint is shown in Figure 4.

Example 2

W80-Cu alloy and W60-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W80-Cu alloy and W60-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

The composition and mass percentage ratio of the solder are: Mn15.0%, Co2.0%, Ni3.0%, Ti3.0%, Si0.3%, B0.15%, and the balance is Cu. The thickness of the solder was 130 μm.

The brazing process steps are:

(1) Preparation stage: Clean the end faces of W80-Cu alloy and W60-Cu alloy samples to be brazed, remove surface impurities, oil stains and oxide films, use W28~W3.5 metallographic sandpaper to grind smooth, use W3.5 metallographic sandpaper to grind both sides of the copper-based solder foil smooth, after grinding, put the W80-Cu alloy, W60-Cu alloy and the solder foil together in acetone, and use ultrasonic cleaning for 15-20 minutes, And carry out drying treatment;

(2) Assembly stage: place the cleaned solder foil between the W80-Cu alloy and the W60-Cu alloy surface to be welded, and fit it tightly in the special brazing fixture to ensure the accuracy of the connection. Place an indenter of rated mass to produce a constant vertical pressure of 0.03MPa;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10 ^-4 Pa, first raise the temperature to 350°C at a rate of 14°C/min, hold it for 20min, and then Heat up to 850°C at a rate of 10°C/min, hold for 20 minutes, then continue to heat up to a brazing temperature of 1040°C at a rate of 9°C/min, hold for 40 minutes, then cool to 850°C at a rate of 13°C/min, The holding time is 15 minutes, and finally cooled to 400°C at a rate of 7°C/min, cooled to room temperature with the furnace, and then the furnace is opened to take out the welded joints.

Results: The joints of W80-Cu alloy and W60-Cu alloy obtained by brazing were well formed. Metallographic observation showed that the brazing zone formed a dense interface bond, the alloy components were evenly distributed, and the four-point bending strength at room temperature was 950MPa.

Example 3

W70-Cu alloy and W50-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W70-Cu alloy and W50-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

The composition and mass percentage ratio of the solder are: Mn12.0%, Co3.0%, Ni4.0%, Ti3.0%, Si0.6%, B0.3%, and the balance is Cu. The thickness of the solder is 150 μm.

The brazing process steps are:

(1) Preparation stage: Clean the end faces of the W70-Cu alloy and W50-Cu alloy samples to be brazed to remove impurities, oil stains and oxide films on the surface, and use W28~W3.5 metallographic sandpaper to grind and smooth. W3.5 metallographic sandpaper to grind the copper-based solder foil on both sides to smooth, after grinding, put W70-Cu alloy, W50-Cu alloy and solder foil together in acetone, and use ultrasonic cleaning for 15-20min, And carry out drying treatment;

(2) Assembly stage: place the cleaned solder foil between the W70-Cu alloy and the surface of the W50-Cu alloy to be welded, and fit it tightly in the special brazing fixture to ensure the accuracy of the connection. Place an indenter of rated mass to produce a constant vertical pressure of 0.02MPa;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10 ^-4 Pa, first raise the temperature to 300°C at a rate of 10°C/min, keep it warm for 20min, and then Heat up to 800°C at a rate of 6°C/min, hold for 20 minutes, then continue to heat up to a brazing temperature of 1030°C at a rate of 8°C/min, hold for 45 minutes, then cool to 800°C at a rate of 12°C/min, The holding time is 15 minutes, and finally cooled to 400°C at a rate of 5°C/min, cooled to room temperature with the furnace, and then the furnace is opened to take out the welded joints.

Results: The joints of W70-Cu alloy and W50-Cu alloy obtained by brazing were well formed. Metallographic observation showed that the brazing zone formed a dense interface bond, the alloy components were evenly distributed, and the four-point bending strength at room temperature was 930MPa.

Example 4

W60-Cu alloy and W50-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W60-Cu alloy and W50-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

The composition and mass percentage ratio of the solder are: Mn10.0%, Co0.5%, Ni1.0%, Ti1.0%, Si0.2%, B0.1%, and the balance is Cu. The thickness of the solder is 200 μm.

The brazing process steps are:

(1) Preparation stage: Clean the end faces of the W60-Cu alloy and W50-Cu alloy samples to be brazed to remove impurities, oil stains and oxide films on the surface, and use W28~W3.5 metallographic sandpaper to grind and smooth. W3.5 metallographic sandpaper to grind both sides of the copper-based solder foil smooth, after grinding, put the W60-Cu alloy, W50-Cu alloy and the solder foil together in acetone, and use ultrasonic cleaning for 15-20 minutes, And carry out drying treatment;

(2) Assembly stage: place the cleaned solder foil between the W60-Cu alloy and the surface of the W50-Cu alloy to be welded, and fit it tightly in the special brazing fixture to ensure the accuracy of the connection. Place an indenter of rated mass to produce a constant vertical pressure of 0.02MPa;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10 ^-4 Pa, first raise the temperature to 300°C at a rate of 10°C/min, keep it warm for 20min, and then Heat up to 800°C at a rate of 6°C/min, hold for 20 minutes, then continue to heat up to a brazing temperature of 1030°C at a rate of 8°C/min, hold for 45 minutes, then cool to 800°C at a rate of 12°C/min, The holding time is 15 minutes, and finally cooled to 400°C at a rate of 5°C/min, cooled to room temperature with the furnace, and then the furnace is opened to take out the welded joints.

Results: The joints of W60-Cu alloy and W50-Cu alloy obtained by brazing were well formed. Metallographic observation showed that the brazing zone formed a dense interface bond, the alloy components were evenly distributed, and the four-point bending strength at room temperature was 940MPa.

Example 5

W80-Cu alloy and W70-Cu alloy were selected for vacuum brazing of butt joints. Among them, the size of W80-Cu alloy and W70-Cu alloy sample is 20mm×20mm×6mm, and the surface to be brazed is 20mm×6mm.

The composition and mass percentage ratio of the solder are: Mn16.0%, Co3.5%, Ni5.0%, Ti4.0%, Si0.5%, B0.3%, and the balance is Cu. The thickness of the solder was 130 μm.

The brazing process steps are:

(1) Preparation stage: Clean the end faces of W80-Cu alloy and W70-Cu alloy samples to be brazed, remove surface impurities, oil stains and oxide films, use W28~W3.5 metallographic sandpaper to grind and smooth, use W3.5 metallographic sandpaper to grind both sides of the copper-based solder foil smooth, after grinding, put the W80-Cu alloy, W60-Cu alloy and the solder foil together in acetone, and use ultrasonic cleaning for 15-20 minutes, And carry out drying treatment;

(2) Assembly stage: place the cleaned solder foil between the W80-Cu alloy and the surface of the W70-Cu alloy to be welded, and fit it tightly in the special brazing fixture to ensure the accuracy of the connection. Place an indenter of rated mass to produce a constant vertical pressure of 0.03MPa;

(3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10 ^-4 Pa, first raise the temperature to 350°C at a rate of 14°C/min, hold it for 20min, and then Heat up to 850°C at a rate of 10°C/min, hold for 20 minutes, then continue to heat up to a brazing temperature of 1040°C at a rate of 9°C/min, hold for 40 minutes, then cool to 850°C at a rate of 13°C/min, The holding time is 15 minutes, and finally cooled to 400°C at a rate of 7°C/min, cooled to room temperature with the furnace, and then the furnace is opened to take out the welded joints.

Results: The joints of W80-Cu alloy and W70-Cu alloy obtained by brazing were well formed. Metallographic observation showed that the brazing zone formed a dense interface bond, the alloy components were evenly distributed, and the four-point bending strength at room temperature was 950MPa.

The above is only a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications are also possible. It should be regarded as the protection scope of the present invention.

Claims (8)

1. A brazing material for brazing heterogeneous W-Cu alloys, characterized in that: each component of the brazing material and the mass percentages of the components are respectively Mn10.0% to 16.0%, Co0.5% to 3.5% %, Ni1.0% to 5.0%, Ti1.0% to 4.0%, Si0.2% to 0.6%, B0.1% to 0.3%, and the balance is Cu. 2. The brazing filler metal for brazing heterogeneous W-Cu alloys according to claim 1, characterized in that the brazing filler metal is a foil strip with a thickness of 100-200 μm. 3. The solder for brazing heterogeneous W-Cu alloys according to claim 1, characterized in that: the components of the solder and the mass percentages of the components are respectively Mn12.0% to 15.0%, Co1. 0% to 3.0%, Ni1.5% to 4.0%, Ti1.5% to 4%, Si0.3% to 0.6%, B0.15% to 0.3%, and the balance is Cu. 4. according to the brazing material of different component W-Cu alloy of brazing according to right 3, it is characterized in that: the mass percentages of each component and component of described solder are respectively Mn13.0%, Co2.5%, Ni3.0%, Ti3.0%, Si0.5%, B0.2%, and the rest is Cu. 5. a preparation method of the solder of brazing different components W-Cu alloy as claimed in claim 1, is characterized in that, comprises the following steps: 1) Weigh high-purity Mn flakes, Co granules, Ni granules, Ti granules, Si granules, B granules and Cu granules by mass percentage to prepare a mixture, put them in a container with acetone, and heat them at a temperature of 15-25°C Ultrasonic cleaning for 15-20 minutes; 2) drying the mixture after ultrasonic cleaning in step 1 at a temperature of 30-50° C. to obtain a dried mixture; 3) The mixture of Mn, Co, Ni, Ti, Si, B and Cu is prepared by vacuum induction melting method to prepare a solder master alloy with uniform composition, and after the prepared master alloy is crushed, it is loaded into a high vacuum single roller belt In the quartz glass tube of the machine; 4) The quartz glass tube is clamped in the electric induction heating ring of the stripping machine, and the distance between the nozzle and the surface of the copper roller is adjusted to 150-250 μm; 5) Close the furnace door, use a mechanical pump to evacuate to 1.5×10-3Pa, then use a molecular pump to evacuate to a high vacuum, the high vacuum degree is not lower than 6×10-5Pa, and then fill the cavity with high-purity Ar gas to 180-200mbar ; 6) Turn on the motor so that the copper roller speed us is in the range of 29-34m/s, then turn on the high-frequency power supply, heat the master alloy in the quartz glass tube by high-frequency induction until it is completely and uniformly melted, and keep the overheated melt for 70s-90s ; 7) Adjust the pressure of Ar gas to P=20-50KPa, and use high-pressure argon to continuously spray the superheated melt in the quartz glass onto the surface of the cooling copper roller rotating at high speed, and the liquid metal is quenched to form a foil strip, thereby obtaining the solder Foil strip with a thickness of 100-200 μm. 6. The preparation method of brazing material for brazing heterogeneous W-Cu alloys according to claim 5, characterized in that: in the step 3, the nozzle of the quartz tube is rectangular, its length is 8-12 mm, and its width is 0.9 mm. ~1.2mm. 7. The method for preparing brazing filler metal for brazing heterogeneous W-Cu alloys according to claim 5, characterized in that: in the step 6, the diameter of the copper roll is 250 mm, and the width of the copper roll is 50 mm. 8. a brazing method using the solder of the brazing heterogeneous W-Cu alloy claimed in claim 1, is characterized in that, comprises the following steps: (1) Preparation stage: clean the end faces of two W-Cu alloy samples of different components to be brazed, remove surface impurities, oil stains and oxide films, and use W28~W3.5 metallographic sandpaper to grind and smooth, Use No. W3.5 metallographic sandpaper to grind and smooth both sides of the solder foil. After grinding, put two W-Cu alloy samples of different components and the solder foil together in acetone, and use ultrasonic cleaning for 15~ 20min, and carry out drying treatment; (2) Assembling stage: place the cleaned solder foil between two W-Cu alloy surfaces to be welded with different components, and fit it tightly in a special brazing fixture to ensure the accuracy of the connection. Place a pressure head of rated mass on top to generate a constant vertical pressure of 0.02-0.04MPa; (3) Brazing connection stage: place the assembled fixture as a whole in a brazing equipment with a vacuum degree of not less than 6×10-4Pa, first raise the temperature to 300-350°C at a rate of 10-15°C/min, and keep warm 15-20min, then raise the temperature to 700-850℃ at a rate of 5-10℃/min, hold time for 15-20min, then continue to heat up to a brazing temperature of 1000-1050℃ at a rate of 8-12℃/min, hold time 20 to 45 minutes, then cooled to 800 to 850 degrees at a rate of 12 to 16 degrees Celsius/min, holding time for 10 to 15 minutes, and finally cooled to 400 to 450 degrees Celsius at a rate of 5 to 10 degrees Celsius/min, and cooled to room temperature with the furnace. Open the furnace and take out the welded joints.