CN105101679B - A kind of circuit board processing method and a kind of multilayer circuit board - Google Patents
A kind of circuit board processing method and a kind of multilayer circuit board Download PDFInfo
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- CN105101679B CN105101679B CN201410219866.1A CN201410219866A CN105101679B CN 105101679 B CN105101679 B CN 105101679B CN 201410219866 A CN201410219866 A CN 201410219866A CN 105101679 B CN105101679 B CN 105101679B
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Abstract
The invention discloses a kind of circuit board processing method and a kind of multilayer circuit board, to solve how to make the technical problem of the high multilayer super thick copper circuit board of arbitrary neighborhood layer interconnection.Method may include：Multi-layer board is provided, the multi-layer board includes 2 layers of outer layer metal layer and 2m layers of internal layer circuit layer, wherein, 1 layer of internal layer circuit layer of 2i and 2i layers of internal layer circuit layer are connected by buried via hole, and m is the integer more than 1, i=1,2 ... ..m；1 metalized blind vias is made respectively on multiple-plate two sides, outer layer metal layer is connected with adjacent internal layer circuit layer by metalized blind vias；1 bridge joint hole of m is made on the multi-layer board, wherein, 2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer are connected by a bridge joint hole, j=1,2 ... ..m 1；Wherein, the spiral shape current path by 1 bridge joint hole of the m buried via hole and m and 2 metalized blind vias is formed.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to a kind of circuit board processing method and a kind of multilayer circuit board.
Background technology
At present, HDI (High Density Interconnect, high density interconnection or random layer interconnection) circuit board adds
Work method generally has two kinds：One kind is filling perforation plating plus folded hole technology, and another kind is that time pressing technology is added in blind hole plating.
Currently, high multilayer super-thick copper circuit board product application field is more and more, its application scenarios is also not quite similar, wherein
There is a kind of high multilayer super thick copper circuit board arbitrary neighborhood layer interconnection of loop technology requirement, and ensure that electric current forms helical annular electricity
Stream.
But hole technology is electroplated plus folded according to filling perforation, for high multilayer super thick copper products, the aperture of via hole is big and thick
Than high, top layer copper is too thick in footpath, possibly can not realize that copper is filled out in plating in hole using filling perforation plating.Time pressure is added according to blind hole plating
Conjunction technology, repeatedly presses for super thick copper products, the problems such as even uneven heating and plate poor heat resistance easily occurs and causes point
Layer, and repeatedly easily there is the problem of contraposition is inaccurate in pressing.
As it can be seen that the prior art cannot effectively produce the high multilayer super thick copper circuit board of arbitrary neighborhood layer interconnection.
The content of the invention
The embodiment of the present invention provides a kind of circuit board processing method and a kind of multilayer circuit board, any to solve how to make
The technical problem of the high multilayer super thick copper circuit board of adjacent layer interconnection.
First aspect present invention provides a kind of circuit board processing method, including：
Multi-layer board is provided, the multi-layer board includes 2 layers of outer layer metal layer and 2m layers of internal layer circuit layer, has in the multi-layer board
There is m buried via hole, wherein, 2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, and m is more than 1
Integer, i=1,2 ... ..m；
1 metalized blind vias is made respectively on multiple-plate two sides, wherein first metalized blind vias in the first face is used
In connecting the first outer layer metal layer and the 1st layer of internal layer circuit layer, second metalized blind vias in the second face is used to connect the second outer layer
Metal layer and 2m layers of internal layer circuit layer；
M-1 plated-through hole is made on the multi-layer board, and it is logical in face of each metallization from multiple-plate two respectively
Hole carries out back drill, forms m-1 bridge joint hole, wherein, 2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer pass through one
Bridge hole connection, j=1,2 ... ..m-1；
Wherein, by design the circuit on the 2m layers of internal layer circuit layer and the m buried via hole and m-1 bridge hole and
The position of 2 metalized blind vias, forms by the m buried via hole and the spiral shape of m-1 bridge joint hole and 2 metalized blind vias
Current path.
Second aspect of the present invention provides a kind of multilayer circuit board, including：
2 layers of outer-layer circuit layer and 2m layers of internal layer circuit layer and m+1 insulating medium layer, m are the integer more than 1；Wherein,
2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, i=1,2 ... ..m；Layer line in 2j layers
Road floor and 2j+1 floor internal layer circuit floor are connected by a bridge joint hole, j=1,2 ... ..m-1；First outer-layer circuit layer and the 1st
Layer internal layer circuit layer is connected by the first metalized blind vias, and the second outer-layer circuit layer and 2m layers of internal layer circuit layer pass through the second gold medal
Categoryization blind hole connects；The buried via hole and bridge joint hole and first metalized blind vias are formed through in the multilayer circuit board
With the spiral shape current path of the second metalized blind vias.
Therefore in technical solution of the embodiment of the present invention, 2i-1 layers of internal layer circuit layer and 2i are connected using buried via hole
Layer internal layer circuit layer, i=1,2 ... ..m；2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer, j are connected using bridge joint hole
=1,2 ... ..m-1；The line layer of outer layer metal layer and adjacent internal layer is connected using metalized blind vias；High multilayer is realized to surpass
Arbitrary neighborhood layer interconnection conducting in heavy copper circuit board, avoids filling perforation plating plus folded hole technology as far as possible and blind hole plating is added
Produced problem in secondary pressing technology；Also, the high multilayer circuit board helix circuit structure of super-thick copper is realized, allows electric current in circuit
Helical annular electric current is formed in plate, so as to meet product performance demand.
Brief description of the drawings
Technical solution in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
Attached drawing to be used is needed to be briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of flow chart of circuit board processing method provided in an embodiment of the present invention；
Fig. 2 is the flow chart of another circuit board processing method provided in an embodiment of the present invention；
Fig. 3 a to 3d are the schematic diagrames in one embodiment of the invention each process segment；
Fig. 4 is the schematic diagram of the spiral shape current path formed in the embodiment of the present invention.
Embodiment
The embodiment of the present invention provides a kind of circuit board processing method and a kind of multilayer circuit board, any to solve how to make
The technical problem of the high multilayer super thick copper circuit board of adjacent layer interconnection.
In order to make those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Attached drawing, is clearly and completely described the technical solution in the embodiment of the present invention, it is clear that described embodiment is only
The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people
Member's all other embodiments obtained without making creative work, should all belong to the model that the present invention protects
Enclose.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Please refer to Fig.1, the embodiment of the present invention provides a kind of circuit board processing method, it may include：
110th, multi-layer board is provided, the multi-layer board includes 2 layers of outer layer metal layer and 2m layers of internal layer circuit layer, the multi-layer board
It is interior that there is m buried via hole, wherein, 2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, and m is big
In 1 integer, i=1,2 ... ..m；
120th, 1 metalized blind vias is made respectively on multiple-plate two sides, wherein first metallization in the first face is blind
Hole is used to connect the first outer layer metal layer and the 1st layer of internal layer circuit layer, and second metalized blind vias in the second face is used to connect second
Outer layer metal layer and 2m layers of internal layer circuit layer；
130th, m-1 plated-through hole is made on the multi-layer board, and faces each metal from multiple-plate two respectively
Change through hole and carry out back drill, form m-1 bridge joint hole, wherein, 2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer pass through
One bridge joint hole connection, j=1,2 ... ..m-1；
140th, wherein, by designing the circuit on the 2m layers of internal layer circuit layer and the m buried via hole and m-1 bridge joint hole
And the position of 2 metalized blind vias, formed by the m buried via hole and the spiral shell of m-1 bridge joint hole and 2 metalized blind vias
Revolve shape current path.
Wherein, there is provided multi-layer board may include：
1101st, m laminate is provided, the laminate includes middle insulating layer and the line layer on two sides, the lamination
There is the plated-through hole of the line layer on connection two sides on plate；
1102nd, the m laminate and 2 outer layer metal layers and m+1 insulating medium layer are subjected to stacking pressing, made
Multi-layer board is obtained, the plated-through hole on the m laminate is become the buried via hole in the multi-layer board.
Optionally, resin can be filled with the plated-through hole processed on the laminate.
Optionally, after step 130, may also include：The outer layer metal layer is processed as outer-layer circuit layer.
The embodiment of the present invention is preferably applied to high multilayer super thick copper circuit board, and described high multilayer super thick copper circuit board is general
Refer to the total number of plies of line layer in 4 layers or more than 4 layers of circuit board.
More than, an embodiment of the present invention provides a kind of circuit board processing method, and layer line in 2i-1 layers is connected using buried via hole
Road floor and 2i floor internal layer circuit floor, i=1,2 ... ..m；Connected using bridge joint hole in 2j layers of internal layer circuit layer and 2j+1 layers
Sandwich circuit layer, j=1,2 ... ..m-1；The line layer of outer layer metal layer and adjacent internal layer is connected using metalized blind vias；Realize
Arbitrary neighborhood layer interconnection conducting in high multilayer super thick copper circuit board, avoids filling perforation plating plus folded hole technology and blind as far as possible
Produced problem in time pressing technology is added in hole plating；Also, the high multilayer circuit board helix circuit structure of super-thick copper is realized, is allowed
Electric current forms helical annular electric current in the circuit board, so as to meet product performance demand.
For ease of being better understood from technical solution provided in an embodiment of the present invention, below by the reality under a concrete scene
Apply and be introduced exemplified by mode.
Please refer to Fig.2, another circuit board processing method of the embodiment of the present invention, it may include：
200th, material prepares.
In the present embodiment, it is assumed that the circuit board for needing to process is 2m+2 layer circuit boards, i.e. including 2 layers of outer layer metal layer and
2m layers of internal layer circuit layer and the 2m+1 layer insulating medium layers more than between each layer.For above layers, prepare material
Material：
2 layers of outer layer metal layer, m double face copper plate, and 2m+1 layers of insulating medium layer.
Described insulating medium layer can be specifically prepreg, and described outer layer metal layer can be with copper foil layer.
210th, laminate of the processing with plated-through hole.
As shown in Figure 3a, in this step, double face copper is processed as laminate, including：
The holes drilled through in double face copper 300, and heavy copper plating is carried out, process plated-through hole 301；Then, can be
Resin is filled in plated-through hole 301, and resin remaining at through hole aperture is evened out；Then, outer graphics making is carried out, will be double
The metal layer on face copper-clad plate two sides is processed as line layer；In the present embodiment, by the double face copper 300 after above-mentioned steps are processed
Referred to as laminate 300.Then, the laminate 300 includes middle insulating layer 310 and the line layer 320 on two sides, the laminate
There is the plated-through hole 301 of the line layer 320 on connection two sides on 300.
220th, multi-layer board is pressed.
As shown in Figure 3b, in this step, by m laminate 300 and 2 outer layer metal layers 330 and m+1 dielectric
Layer 340 carries out stacking pressing, and multi-layer board 30 is made.In obtained multi-layer board 30, the line layer 320 becomes internal layer circuit layer
320, the plated-through hole 301 becomes buried via hole 301.Then so that there is m buried via hole in multi-layer board 30, wherein, in 2i-1 layers
Sandwich circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, and m is integer more than 1, i=1,2 ... ..m.
230th, metalized blind vias and bridge joint hole are processed.
As shown in Figure 3c, 1 blind hole can be made respectively on the two sides of the multi-layer board 30, and make m-1 through hole, and
Heavy copper plating is carried out, obtains 2 metalized blind vias 302 and m-1 plated-through hole 304.
Then, as shown in Figure 3d, back drill can be carried out from multiple-plate two in face of each plated-through hole 304 respectively, retained
The metallization coating of level turned on is needed, the metallization coating of other levels is removed, m-1 bridge joint hole 303 is made.Bridge joint
The aperture in hole confirms according to radius-thickness ratio, general back drill radius-thickness ratio≤8：1, for example thickness of slab is 5mm, then bore dia at least >=
0.7mm, in general, bridges hole aperture >=1mm.
Optionally, can also be by multiple-plate 2 outer layer metal layers after processing metalized blind vias 302 and bridge joint hole 303
330 are processed as 2 layers of outer-layer circuit layer 330, finally obtain required multilayer circuit board 30.
In the present embodiment multilayer circuit board 30, the first metalized blind vias 302a in the first face is used to connect the first outer layer metal
330a and the 1st layer of internal layer circuit layer 320a of layer, the second metalized blind vias 302b in the second face are used to connect the second outer layer metal layer
330b and 2m layers of internal layer circuit layer 320b.2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer pass through a bridge joint hole
Connection, j=1,2 ... ..m-1.Also, 2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole,
M is integer more than 1, i=1,2 ... ..m.
So far, the interconnection of arbitrary neighborhood layer is realized in multi-layer board 30.In Fig. 3 d, the 1st layer is identified with N1-N2m
Internal layer circuit layer identifies the first outer layer metal layer and the second outer layer metal layer to 2m layers of internal layer circuit layer with W1 and W2.
It should be noted that as shown in figure 4, in the embodiment of the present invention, can be by designing on the 2m layers of internal layer circuit layer
Circuit and the m buried via hole and m-1 bridge joint hole and the position of 2 metalized blind vias, formed pass through the m buried via hole with
M-1 bridge joint hole and the spiral shape current path of 2 metalized blind vias.The spiral shape current path may include 2m annular electro
Stream, this 2m ring current are connected to each other by m buried via hole and m-1 bridge joint hole, form spiral shape current path.
The spiral shape current path can be distributed in the edge of multilayer circuit board 30 as far as possible, with as far as possible around whole
Multilayer circuit board.In the spiral shape current path formed, the flow direction of electric current can be the clockwise or inverse time
Pin.According to Ampere's law, spiral shape current path can produce a magnetic field, in magnetic field the direction of the magnetic line of force for straight up or to
Under.
In some embodiments, which can coordinate with other electromagnetic equipments in institute application apparatus, produce one
A upward lift, reduces running equipment and the frictional force on ground, so that lifting means operational efficiency.It is of course also possible to
A downward pressure is produced, running equipment is pressed on bottom surface, to avoid running equipment from being subjected to displacement as far as possible.
Embodiment two,
D is please referred to Fig.3, the embodiment of the present invention provides multilayer circuit board, it may include：
2 layers of outer-layer circuit layer and 2m layers of internal layer circuit layer and m+1 insulating medium layer, m are the integer more than 1；Wherein,
2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, i=1,2 ... ..m；Layer line in 2j layers
Road floor and 2j+1 floor internal layer circuit floor are connected by a bridge joint hole, j=1,2 ... ..m-1；First outer-layer circuit layer and the 1st
Layer internal layer circuit layer is connected by the first metalized blind vias, and the second outer-layer circuit layer and 2m layers of internal layer circuit layer pass through the second gold medal
Categoryization blind hole connects；The buried via hole and bridge joint hole and first metalized blind vias are formed through in the multilayer circuit board
With the spiral shape current path of the second metalized blind vias.
In some embodiments of the invention, resin is filled with the buried via hole.
In some embodiments of the invention, the diameter in the bridge joint hole is greater than or equal to 1 millimeter.
More than, an embodiment of the present invention provides a kind of multilayer circuit board, and 2i-1 layers of internal layer circuit layer are connected using buried via hole
With 2i layers of internal layer circuit layer, i=1,2 ... ..m；Layer line in 2j layers of internal layer circuit layer and 2j+1 layers is connected using bridge joint hole
Road floor, j=1,2 ... ..m-1；The line layer of outer layer metal layer and adjacent internal layer is connected using metalized blind vias；Realize height
Arbitrary neighborhood layer interconnection conducting in multilayer super thick copper circuit board, avoids filling perforation plating plus folded hole technology and blind hole electricity as far as possible
Produced problem in time pressing technology is added in plating；Also, the high multilayer circuit board helix circuit structure of super-thick copper is realized, allows electric current
Helical annular electric current is formed in the circuit board, so as to meet product performance demand.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention and from the limitation of described sequence of movement because according to
According to the present invention, some steps can use other orders or be carried out at the same time.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and not necessarily the present invention must for involved action and module
Must.
A kind of circuit board processing method and a kind of multilayer circuit board provided above the embodiment of the present invention has carried out in detail
It is thin to introduce, but the explanation of above example is only intended to helping to understand method and its core concept of the invention, should not be construed as
Limitation of the present invention.Those skilled in the art, according to the present invention thought, the invention discloses technical scope
Change or replacement that are interior, can readily occurring in, should be covered by the protection scope of the present invention.
Claims (4)
- A kind of 1. circuit board processing method, it is characterised in that including：Multi-layer board is provided, the multi-layer board includes 2 layers of outer layer metal layer and 2m layers of internal layer circuit layer, has m in the multi-layer board A buried via hole, wherein, 2i-1 layers of internal layer circuit layer and 2i layers of internal layer circuit layer are connected by a buried via hole, and m is whole more than 1 Number, i=1,2 ... m；1 metalized blind vias is made respectively on multiple-plate two sides, wherein first metalized blind vias in the first face is used to connect The first outer layer metal layer and the 1st layer of internal layer circuit layer are connect, second metalized blind vias in the second face is used to connect the second outer layer metal Layer and 2m layers of internal layer circuit layer；On the multi-layer board make m-1 plated-through hole, and respectively from multiple-plate two face each plated-through hole into Row back drill, forms m-1 bridge joint hole, wherein, 2j layers of internal layer circuit layer and 2j+1 layers of internal layer circuit layer pass through a bridge joint Hole connects, j=1,2 ... m-1；Wherein, by designing the circuit on the 2m layers of internal layer circuit layer and the m buried via hole and m-1 bridge joint hole and 2 The position of metalized blind vias, forms the spiral shape electricity by the m buried via hole and m-1 bridge joint hole and 2 metalized blind vias Logical circulation road.
- 2. according to the method described in claim 1, it is characterized in that, the offer multi-layer board includes：M laminate is provided, each laminate includes middle insulating layer and the line layer on two sides, each laminate The plated-through hole of the upper line layer with connection two sides；The m laminate and 2 outer layer metal layers and m+1 insulating medium layer are subjected to stacking pressing, multi-layer board is made, The plated-through hole on the m laminate is set to become the buried via hole in the multi-layer board.
- 3. according to the method described in claim 2, it is characterized in that,Resin is filled with the plated-through hole of the laminate.
- 4. according to the method described in claim 1, it is characterized in that, further include：The outer layer metal layer is processed as outer-layer circuit layer.
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| CN201410219866.1A CN105101679B (en) | 2014-05-22 | 2014-05-22 | A kind of circuit board processing method and a kind of multilayer circuit board |
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| CN201410219866.1A CN105101679B (en) | 2014-05-22 | 2014-05-22 | A kind of circuit board processing method and a kind of multilayer circuit board |
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| CN105101679B true CN105101679B (en) | 2018-04-20 |
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| CN111343800B (en) * | 2020-03-18 | 2023-03-24 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988069A (en) * | 2006-11-24 | 2007-06-27 | 南京航空航天大学 | Process for producing inductive coil by printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3212657B2 (en) * | 1991-12-26 | 2001-09-25 | シャープ株式会社 | Printed circuit board |
| US9520222B2 (en) * | 2012-09-28 | 2016-12-13 | Ibiden Co., Ltd. | Wiring board and method for manufacturing wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1988069A (en) * | 2006-11-24 | 2007-06-27 | 南京航空航天大学 | Process for producing inductive coil by printed circuit board |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |