CN105080892B - A kind of cleaning device and cleaning method of wafer holder - Google Patents
A kind of cleaning device and cleaning method of wafer holder Download PDFInfo
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- CN105080892B CN105080892B CN201510460195.2A CN201510460195A CN105080892B CN 105080892 B CN105080892 B CN 105080892B CN 201510460195 A CN201510460195 A CN 201510460195A CN 105080892 B CN105080892 B CN 105080892B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses the cleaning device and cleaning method of a kind of wafer holder, including first group of wafer holder and second group of wafer holder, wherein, first group of wafer holder and second group of wafer holder is used alternatingly, when first group of wafer holder is in stretches out state, then second group of wafer holder is in contraction state, or when first group of wafer holder is in contraction state, then second group of wafer holder is in and stretches out state.The present invention is by being used alternatingly first group of wafer holder and second group of wafer holder, when one group of wafer holder therein supports wafer, another group of wafer holder is then fully contacted with cleanout fluid, wafer holder is made to remain good cleannes, avoid the dirt immune wafer in wafer holder, wafer defect is reduced, the yield of wafer is improve.
Description
Technical field
The invention belongs to semiconductor crystal wafer cleaning field, is related to cleaning device and the cleaning side of a kind of wafer holder
Method.
Background technology
The deep-submicron stage is being entered into integrated circuit feature size, it is required in IC wafers manufacturing process
Crystal column surface cleanliness factor it is more and more harsher, in order to ensure the cleanliness factor on wafer material surface, the manufacturing process of integrated circuit
In there are hundreds of road mattings, matting account for the 20% of whole manufacture process.
Tradition is to crystal column surface cleaning using the higher slot type cleaning equipment of output ratio, the main wash step of cleaning equipment
Chemical liquids cleaning and dipping is first carried out typically, clear water is then carried out and is cleaned operation.Wafer after chemical liquids cleaning and dipping, crystal column surface
Some by-products and chemical liquids can be still remained, so the clean technique of follow-up clear water is particularly important, if do not wash clean clearly to exist
Crystal column surface produces the defect that there is particulate matter etc such as chemical liquids residual or crystal column surface.
In existing slot type cleaning equipment, support member is, for supporting the part of wafer in rinse bath, but to make for a long time
With during, the contact position between support member and wafer often forms cleaning dead angle, as shown in figure 1, Fig. 1 is existing wafer
The structural representation of support member, during wafer 3 is supported by support member 2 while being positioned over the rinse bath 1 for filling cleanout fluid, due to support member
Cleaning dead angle is formed between 2 and wafer 3 often, it will usually some dirts are remained on support member 2, and remains in support member 2
On dirt often recontamination wafer 3, cause wafer defect, cause the reduction of wafer yield.Therefore, people in the art
Member's existing wafer holder urgently to be resolved hurrily there is a problem of cleaning dead angle, improve the cleanliness factor of wafer.
The content of the invention
The technical problem to be solved is to provide a kind of cleaning device and cleaning method of wafer holder, solves
Existing wafer holder there is a problem of cleaning dead angle, improve the cleanliness factor of wafer.
In order to solve above-mentioned technical problem, the invention provides a kind of cleaning device of wafer holder, including for clear
The rinse bath of semiconductor crystal wafer is washed,
First group of wafer holder, in the rinse bath, and can do the flexible of vertical direction in the rinse bath
Motion, in when stretching out state, which is used to support wafer, first group of wafer holder to receive first group of wafer holder
During contracting state, which is fully contacted with the cleanout fluid in the rinse bath, to remove its surface smut；
Second group of wafer holder, in the rinse bath, and can do the flexible of vertical direction in the rinse bath
Motion, in when stretching out state, which is used to support wafer, second group of wafer holder to receive second group of wafer holder
During contracting state, which is fully contacted with the cleanout fluid in the rinse bath, to remove its surface smut；
Wherein, first group of wafer holder and second group of wafer holder are used alternatingly, when first group of wafer holder
In when stretching out state, then second group of wafer holder is in contraction state, or when first group of wafer holder is in contraction-like
During state, then second group of wafer holder is in and stretches out state.
Preferably, first group of wafer holder and second group of wafer holder include multiple for supporting wafer
Support member.
Preferably, the quantity of first group of wafer holder and second group of wafer holder is equal.
Preferably, first group of wafer holder and second group of wafer holder are evenly distributed in the side of wafer
Edge.
Preferably, the spaced side for being distributed wafer of first group of wafer holder and second group of wafer holder
Edge.
Preferably, cleaning sprayer is provided with the rinse bath, the cleaning sprayer is for first group of wafer support
Part or second group of wafer holder jet cleaning liquid.
Preferably, the cleaning sprayer is provided with valve for adjusting the flow of cleanout fluid.
The present invention also provides a kind of cleaning method of wafer holder, comprises the following steps：
S01, in first group of wafer cleaning operation process, wafer is stretched out and supported to first group of wafer holder, second group
Wafer holder is shunk and is fully contacted with cleanout fluid, to remove the dirt in second group of wafer holder；
S02, in second group of wafer cleaning operation process, wafer is stretched out and supported to second group of wafer holder, first group
Wafer holder is shunk and is fully contacted with cleanout fluid, to remove the dirt in first group of wafer holder；
S03, during subsequent wafer washing and cleaning operation, first group of wafer holder and second group of wafer is used alternatingly
Support member, until completing follow-up wafer cleaning operation.
Preferably, after first group of wafer holder and second group of wafer holder are fully contacted with cleanout fluid, and
The cleanout fluid on its surface is removed by ultra-pure water.
Compared with currently existing scheme, the cleaning device and cleaning method of the wafer holder that the present invention is provided, by alternately
Using first group of wafer holder and second group of wafer holder, when one group of wafer holder therein is in support wafer-shaped
During state, another group of wafer holder is then fully contacted with cleanout fluid, makes wafer holder remain good cleannes, it is to avoid
Dirt immune wafer in wafer holder, reduces wafer defect, improves the yield of wafer.
Description of the drawings
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below by to be used needed for embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can be attached to obtain others according to these accompanying drawings
Figure.
Fig. 1 is the structural representation of existing wafer holder；
The structural representation of the use state of Fig. 2 first group of wafer holder of the present invention；
The structural representation of the use state of Fig. 3 second group of wafer holder of the present invention.
In figure, reference is：
1st, rinse bath；2nd, support member；3rd, wafer；4th, first group of wafer holder；5th, second group of wafer holder.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with enforcement of the accompanying drawing to the present invention
Mode is described in further detail.Those skilled in the art can be by disclosed by this specification content understand the present invention easily
Other advantages and effect.The present invention can also be carried out or be applied, this explanation by specific embodiments different in addition
Every details in book can also based on different viewpoints with application, without departing from the spirit of the present invention carry out it is various modification or
Change.
Above and other technical characteristic and beneficial effect, by conjunction with the embodiments and accompanying drawing 2-3 to the present invention wafer support
The cleaning device of part is described in detail.
As Figure 2-3, the invention provides a kind of cleaning device of wafer holder, including for cleaning semiconductor die
Round 1, first group of wafer holder 4 of rinse bath and second group of wafer holder 5.Specifically, first group of wafer holder 4 sets
In the rinse bath 1, and the stretching motion of vertical direction can be done in rinse bath 1, first group of wafer support 4 is in stretching out
During state, which is used to support wafer 3, and during first group of 4 contraction state of wafer holder, which is fully connect with the cleanout fluid in rinse bath
Touch, to remove its surface smut.Likewise, second group of wafer holder 5 is also located in rinse bath 1, and can do in rinse bath 1
The stretching motion of vertical direction, in when stretching out state, which is used to support wafer 3, second group of wafer second group of wafer holder 5
During 5 contraction state of support member, which is fully contacted with the cleanout fluid in rinse bath 1, to remove its surface smut.
The present invention is used alternatingly first group of wafer holder 4 and second group to keep the cleannes of wafer holder
Wafer holder 5, when first group of wafer holder 4 is in stretches out state, then second group of wafer holder 5 is in contraction-like
State, or when first group of wafer holder 4 is in contraction state, then second group of wafer holder 5 is in and stretches out state.
By first group of wafer holder 4 and second group of wafer holder 5 is used alternatingly, when one group of wafer therein
In when supporting 3 state of wafer, another group of wafer holder is then fully contacted support member with cleanout fluid, wafer holder is protected all the time
Hold good cleannes.
Specifically, in the present embodiment, first group of wafer holder 4 and second group of wafer holder 5 include multiple use
In the support member for supporting wafer.In preferred version, the quantity phase of first group of wafer holder 4 and second group of wafer holder 5
Deng while the edge of wafer 3 can be evenly distributed in.
Meanwhile, in order that wafer 3 is more uniformly stressed, first group of wafer holder 4 and second group of wafer holder 5
The edge of spaced distribution wafer 3.
In order to further improve the cleanliness factor of wafer holder, cleaning sprayer can be also provided with rinse bath 1 and (not shown in figure
Go out), cleaning sprayer is for first group of wafer holder 4 or second group of 5 jet cleaning liquid of wafer holder.Additionally, cleaning spray
Head is provided with valve for adjusting the flow of cleanout fluid, adjusts the flow and impulsive force that spray to wafer holder with more preferable.
The present invention also provides a kind of cleaning method of wafer holder, comprises the following steps：
S01, in first group of wafer cleaning operation process, wafer 3 is stretched out and supported to first group of wafer holder 4, second
Group wafer holder 5 is shunk and is fully contacted with cleanout fluid, to remove the dirt in second group of wafer holder 5；
S02, in second group of wafer cleaning operation process, wafer 3 is stretched out and supported to second group of wafer holder 5, first
Group wafer holder 4 is shunk and is fully contacted with cleanout fluid, to remove the dirt in first group of wafer holder 4；
S03, during subsequent wafer washing and cleaning operation, first group of wafer holder 4 and second group of wafer is used alternatingly
Support member 5, until completing wafer cleaning operation.
Cleanout fluid in the present invention includes chemical liquid or ultra-pure water, when first group of wafer holder 4 or second group of wafer
After support member 5 is fully contacted with chemical liquid, then the chemical liquid on its surface is removed by ultra-pure water.
In sum, the cleaning device and cleaning method of the wafer holder that the present invention is provided, by being used alternatingly first
Group wafer holder 4 and second group of wafer holder 5, when one group of wafer holder therein is in support wafer state,
Another group of wafer holder is then fully contacted with cleanout fluid, makes wafer holder remain good cleannes, it is to avoid wafer
Dirt immune wafer on support member, reduces wafer defect, improves the yield of wafer.
Described above illustrates and describes some preferred embodiments of the present invention, but as previously mentioned, it should be understood that the present invention
Be not limited to form disclosed herein, be not to be taken as the exclusion to other embodiment, and can be used for various other combinations,
Modification and environment, and can be in invention contemplated scope described herein, by above-mentioned teaching or the technology or knowledge of association area
It is modified.And change that those skilled in the art are carried out and change be without departing from the spirit and scope of the present invention, then all should be at this
In the protection domain of bright claims.
Claims (9)
1. a kind of cleaning device of wafer holder, including for cleaning the rinse bath of semiconductor crystal wafer, it is characterised in that
First group of wafer holder, in the rinse bath, and can do the stretching motion of vertical direction in the rinse bath,
In when stretching out state, which is used to support wafer first group of wafer holder, and first group of wafer holder is contraction-like
During state, which is fully contacted with the cleanout fluid in the rinse bath, to remove its surface smut；
Second group of wafer holder, in the rinse bath, and can do the stretching motion of vertical direction in the rinse bath,
In when stretching out state, which is used to support wafer second group of wafer holder, and second group of wafer holder is contraction-like
During state, which is fully contacted with the cleanout fluid in the rinse bath, to remove its surface smut；
Wherein, first group of wafer holder and second group of wafer holder are used alternatingly, when first group of wafer holder is in
When stretching out state, then second group of wafer holder is in contraction state, or when first group of wafer holder is in contraction state,
Then second group of wafer holder is in and stretches out state.
2. the cleaning device of wafer holder according to claim 1, it is characterised in that first group of wafer holder
And second group of wafer holder includes multiple support members for supporting wafer.
3. the cleaning device of wafer holder according to claim 2, it is characterised in that first group of wafer holder
And the quantity of second group of wafer holder is equal.
4. the cleaning device of wafer holder according to claim 2, it is characterised in that first group of wafer holder
And second group of wafer holder is evenly distributed in the edge of wafer.
5. the cleaning device of wafer holder according to claim 2, it is characterised in that first group of wafer holder
And the edge for being distributed wafer that second group of wafer holder is spaced.
6. the cleaning device of wafer holder according to claim 1, it is characterised in that cleaning is provided with the rinse bath
Shower nozzle, the cleaning sprayer is for first group of wafer holder or second group of wafer holder jet cleaning liquid.
7. the cleaning device of wafer holder according to claim 6, it is characterised in that the cleaning sprayer is provided with valve
Door is used for the flow for adjusting cleanout fluid.
8. the cleaning method of the cleaning device of the arbitrary described wafer holder of a kind of employing claim 1～7, its feature exist
In comprising the following steps：
S01, in first group of wafer cleaning operation process, wafer, second group of wafer are stretched out and supported to first group of wafer holder
Support member is shunk and is fully contacted with cleanout fluid, to remove the dirt in second group of wafer holder；
S02, in second group of wafer cleaning operation process, wafer, first group of wafer are stretched out and supported to second group of wafer holder
Support member is shunk and is fully contacted with cleanout fluid, to remove the dirt in first group of wafer holder；
S03, during subsequent wafer washing and cleaning operation, first group of wafer holder and second group of wafer support is used alternatingly
Part, until completing follow-up wafer cleaning operation.
9. the cleaning method of the cleaning device of wafer holder according to claim 8, it is characterised in that described first group
After wafer holder and second group of wafer holder are fully contacted with cleanout fluid, and by ultra-pure water by the cleanout fluid on its surface
Remove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510460195.2A CN105080892B (en) | 2015-07-30 | 2015-07-30 | A kind of cleaning device and cleaning method of wafer holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510460195.2A CN105080892B (en) | 2015-07-30 | 2015-07-30 | A kind of cleaning device and cleaning method of wafer holder |
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| Publication Number | Publication Date |
|---|---|
| CN105080892A CN105080892A (en) | 2015-11-25 |
| CN105080892B true CN105080892B (en) | 2017-04-05 |
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| CN201510460195.2A Active CN105080892B (en) | 2015-07-30 | 2015-07-30 | A kind of cleaning device and cleaning method of wafer holder |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326448A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Semiconductor cleaning device |
| CN111081603B (en) * | 2019-11-25 | 2024-02-27 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN113675113B (en) * | 2021-08-20 | 2024-04-05 | 华海清科股份有限公司 | Wafer horizontal cleaning device and cleaning method |
| CN115815198A (en) * | 2022-11-30 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Cleaning device |
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|---|---|---|---|---|
| GB2349742A (en) * | 1999-04-01 | 2000-11-08 | Nec Corp | Method and apparatus for processing a wafer to remove an unnecessary substance therefrom |
| CN1602229A (en) * | 2001-11-13 | 2005-03-30 | Fsi国际公司 | Semiconductor wafer cleaning systems and methods |
| CN203018351U (en) * | 2012-12-31 | 2013-06-26 | 中芯国际集成电路制造(北京)有限公司 | Wafer cleaning brush and wafer cleaning device |
| CN103909072A (en) * | 2013-01-07 | 2014-07-09 | 台湾暹劲股份有限公司 | Electronic element washing device and operation device used by same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090241995A1 (en) * | 2008-03-31 | 2009-10-01 | Tokyo Electron Limited | Substrate cleaning method and apparatus |
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2015
- 2015-07-30 CN CN201510460195.2A patent/CN105080892B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2349742A (en) * | 1999-04-01 | 2000-11-08 | Nec Corp | Method and apparatus for processing a wafer to remove an unnecessary substance therefrom |
| CN1602229A (en) * | 2001-11-13 | 2005-03-30 | Fsi国际公司 | Semiconductor wafer cleaning systems and methods |
| CN203018351U (en) * | 2012-12-31 | 2013-06-26 | 中芯国际集成电路制造(北京)有限公司 | Wafer cleaning brush and wafer cleaning device |
| CN103909072A (en) * | 2013-01-07 | 2014-07-09 | 台湾暹劲股份有限公司 | Electronic element washing device and operation device used by same |
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| CN105080892A (en) | 2015-11-25 |
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