CN105086921B - A kind of low temperature resistant organosilicon sealant and preparation method thereof - Google Patents
A kind of low temperature resistant organosilicon sealant and preparation method thereof Download PDFInfo
- Publication number
- CN105086921B CN105086921B CN201510485817.7A CN201510485817A CN105086921B CN 105086921 B CN105086921 B CN 105086921B CN 201510485817 A CN201510485817 A CN 201510485817A CN 105086921 B CN105086921 B CN 105086921B
- Authority
- CN
- China
- Prior art keywords
- parts
- low temperature
- temperature resistant
- organosilicon sealant
- hollow microsphere
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention provides a kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block 100 parts of dimethyl silicone polymer, 5~10 parts of plasticizer, 15~20 parts of filler, 3~10 parts of crosslinking agent, 1~2 part of catalyst, 0.5~1 part of coupling agent, 1~2 part of stabilizer, 1.5~2 parts of age resistor, 2~6 parts of tackifier, 4~5 parts of solubilizer PE g MAH, 10~12 parts of polysulfones, 14~15 parts of calcium carbonate hollow microsphere.Present invention also offers the preparation method of the organosilicon sealant.The organosilicon sealant that the present invention is provided has preferable resistance to low temperature.
Description
Technical field：
The present invention relates to a kind of fluid sealant, more particularly to a kind of low temperature resistant organosilicon sealant and preparation method thereof.
Background technology：
Organosilicon sealant, building sealant made from the linear organosilicon polymer be alternately made up of silicon and oxygen atom
And adhesive, it can be used within the scope of wider temperature, show excellent resistance to elevated temperatures, resistance to electrical insulating property, elasticity, resistance to old
The property changed, the characteristic such as UV radiation, resistance to ozone, chemically stable, thus can use under numerous conditions, with safe and reliable,
Good weatherability, the advantages of service life is long.Organosilicon sealant is divided to two kinds of one pack system and bi-component, is a kind of energy cold curing
Elastomer, is hydrolyzed by dimethyl siloxane intermediate, is then condensed into polysiloxanes, as Organosilicon Polymers.The beginning of the sixties,
Silicone building sealant is applied to commercial building abroad.The output value of U.S.'s organosilicon sealant in 1992 is 3.25 hundred million beautiful
Member, accounts for the 22.8% of the fluid sealant gross output value；And increased every year with 2%~6% speed.Though Japanese organosilicon sealant development
Evening, but development is very fast, and especially modified organic silicon fluid sealant has increased quickly since being gone into operation from 1978, maximum as Japanese consumption
Fluid sealant, still kept in recent years 10%~20% annual growth.Before the eighties, due to China's organosilicon sealant industry
Metaplasia produces the long-term dependence on import of organosilicon sealant used in slower development, domestic construction；In recent years, with technical merit
The expansion with the market demand is improved, silicone building sealant production fast development, many enterprise investments are founded the factory or expanding production,
Production capacity is generally 1000~5000t/a, and country's total productive capacity forms Jiangsu and Zhejiang Provinces, Guangdong two more than 30kt/a at present
Big silicone building sealant production base.The need for reducing cost and obtaining various performances to meet different occasions,
It is study hotspot in recent years to the modification of organosilicon sealant, these modifications are also damaged while some excellent properties are obtained
Other performances are lost, such as resistance to low temperature has been weakened after modified much, relative to its excellent resistance to elevated temperatures
For seem more general, performed poor in temperature very low occasion, easily brittle cracking.
For example, Publication No. CN102559133B, publication date are 2014.03.19, apply for the artificial scientific and technological share of Chengdu silicon treasured
The Chinese patent of Co., Ltd discloses " addition type single component organosilicon sealant and its manufacture method ", is characterized in ethene
The mass parts of base silicone oil 100, the mass parts of reinforced filling 1~250, the mass parts of antistructurizing agent 0.5~2, α, ω-dimethyl poly- two
The mass parts of methylsiloxane 10~30, in 120~170 DEG C of temperature in vacuum kneader, 0.06~0.099MPa of vacuum takes off
Water is blended 120~240min and obtains base-material；Again by the mass parts of base-material 100, the mass parts of containing hydrogen silicone oil 1~4, the matter of inhibitor 0.5~5
Part is measured, adds and carries in mixer, the reactor of thermometer, 10min is stirred, the mass parts of catalyst 0.2~3, tackifier are added
0.1~1.0 mass parts, stir 10~15min, continue to stir 10~15min in 0.08~0.099MPa of vacuum, add increasing
The mass parts of stick 0.1~0.5,0.08~0.099MPa of vacuum continue stir 10~20min, then vacuum 0.08~
Continue to stir 5~10min under 0.099MPa, obtain one pack system additional organosilicon fluid sealant.The organosilicon sealant to glass,
Aluminium etc. has excellent adhesive property, but it equally exists the dissatisfactory defect of resistance to low temperature.
The content of the invention：
The technical problem to be solved in the present invention is to provide a kind of low temperature resistant organosilicon sealant, it has preferably low temperature resistant
Performance.
In order to solve the above technical problems, the technical scheme is that：
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 5~10 parts of plasticizer, 15~20 parts of filler, 3~10 parts of crosslinking agent, 1~2 part of catalyst, 0.5~1 part of coupling agent, surely
Determine 1~2 part of agent, 1.5~2 parts of age resistor, 2~6 parts of tackifier, 4~5 parts of solubilizer PE-g-MAH, 10~12 parts of polysulfones, carbon
Sour 14~15 parts of calcium hollow microsphere.
Preferably, plasticizer of the present invention is phenyl silicone oil.
Preferably, filler of the present invention is gas-phase silica or silicon powder.
Preferably, crosslinking agent of the present invention is MTMS.
Preferably, catalyst of the present invention is dibutyl tin laurate.
Preferably, coupling agent of the present invention is amino silicane coupling agent.
Preferably, stabilizer of the present invention is calcium chloride.
Preferably, age resistor of the present invention is naphthylamine antioxidant.
Preferably, tackifier of the present invention are toluene di-isocyanate(TDI).
Another technical problem to be solved by the present invention is that providing the preparation method of above-mentioned low temperature resistant organosilicon sealant.
In order to solve the above technical problems, technical scheme is：
A kind of preparation method of low temperature resistant organosilicon sealant, its step is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding coupling agent, stirring reaction is taken out after 1 hour, and 5 are washed with absolute ethyl alcohol
It is placed in vacuum drying chamber at 90 DEG C and dries 9 hours after secondary, obtains modified calcium carbonate hollow microsphere, the weight of wherein coupling agent is
The 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, filler, solubilizer PE-g-MAH, polysulfones and step (1) will be blocked by formula ratio to obtain
To modified calcium carbonate hollow microsphere add vacuum kneader temperature be 140 DEG C, vacuum be to be dehydrated blending under the conditions of 0.08MPa
90 minutes, move to stirring in stirred tank, obtain base-material after cooling；
(3) plasticizer, crosslinking agent, stabilizer, age resistor, tackifier are added into stirred tank by formula ratio, mixing speed is
The base-material obtained under 500rpm with step (2) is mixed 80 minutes, is added after the catalyst of formula ratio and is continued to mix 25 minutes, obtains
Low temperature resistant organosilicon sealant.
Therefore, compared with prior art, the invention has the advantages that：
1) calcium carbonate hollow microsphere is a kind of inorganic particulate with hollow structure, exhausted with preferable mechanical property and heat
Edge performance, but hydrophily is presented due to the presence of hydroxyl in its surface, dispersing uniformity is not in oil loving organic silicon substrate
It is good, thus the present invention by coupling agent to its modification, the part of hydroxyl on calcium carbonate hollow microsphere surface and having for coupling agent
Chain is reacted, and hydrophily has been changed over into hydrophobic oleophilic oil so that modified calcium carbonate hollow microsphere is can be uniformly dispersed
In organic silicon substrate, its special hollow structure can produce iris action, can effectively obstruct the low temperature environment of outside to organic
The destruction that silicone sealant is produced, and formd between modified calcium carbonate hollow microsphere and organic silicon substrate very strong
Water ratio limit, can play good humidification, improve the mechanical property especially low-temperature flexibility of organosilicon sealant, subtract significantly
Few cold cracking, significantly improves the resistance to low temperature of organosilicon sealant；
2) polysulfones is to contain alkyl-SO in molecular backbone2The thermoplastic resin of-alkyl chain link, with good mechanicalness
Can, as little as -100 DEG C of brittle temperature, under solubilizer PE-g-MAH solubilization, polysulfones forms interface with organic silicon substrate
Stronger blending, more submissive strand is introduced in organic silicon substrate, so as to effectively reduce organosilicon sealant
Brittle temperature, further improves its resistance to low temperature.
Embodiment：
Describe the present invention in detail below in conjunction with specific embodiment, herein illustrative examples and explanation of the invention
For explaining the present invention, but it is not as a limitation of the invention.
Embodiment 1
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 5 parts of phenyl silicone oil, 17 parts of gas-phase silica, 8 parts of MTMS, 1.5 parts of dibutyl tin laurate, ammonia
1 part of base silane coupling agent, 1.6 parts of calcium chloride, 1.7 parts of naphthylamine antioxidant, 2.5 parts of toluene di-isocyanate(TDI), solubilizer PE-g-
4.8 parts of MAH, 11.5 parts of polysulfones, 14.7 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, gas-phase silica, solubilizer PE-g-MAH, polysulfones and step will be blocked by formula ratio
Suddenly it is 140 DEG C, under the conditions of vacuum is 0.08MPa that (1) is obtained modified calcium carbonate hollow microsphere, which adds vacuum kneader temperature,
Dehydration blending 90 minutes, moves to stirring in stirred tank, obtains base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
Embodiment 2
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 8 parts of phenyl silicone oil, 19 parts of silicon powder, 9 parts of MTMS, 1.8 parts of dibutyl tin laurate, amino silicone
0.7 part of alkane coupling agent, 1.4 parts of calcium chloride, 1.9 parts of naphthylamine antioxidant, 4 parts of toluene di-isocyanate(TDI), solubilizer PE-g-MAH
4 parts, 12 parts of polysulfones, 14.4 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, silicon powder, solubilizer PE-g-MAH, polysulfones and step (1) will be blocked by formula ratio
Obtained modified calcium carbonate hollow microsphere add vacuum kneader temperature be 140 DEG C, vacuum be to be dehydrated altogether under the conditions of 0.08MPa
It is mixed 90 minutes, move to stirring in stirred tank, obtain base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
Embodiment 3
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 10 parts of phenyl silicone oil, 20 parts of silicon powder, 3 parts of MTMS, 1.4 parts of dibutyl tin laurate, amino
0.9 part of silane coupler, 1 part of calcium chloride, 1.6 parts of naphthylamine antioxidant, 3 parts of toluene di-isocyanate(TDI), solubilizer PE-g-MAH
4.2 parts, 11 parts of polysulfones, 14 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, silicon powder, solubilizer PE-g-MAH, polysulfones and step (1) will be blocked by formula ratio
Obtained modified calcium carbonate hollow microsphere add vacuum kneader temperature be 140 DEG C, vacuum be to be dehydrated altogether under the conditions of 0.08MPa
It is mixed 90 minutes, move to stirring in stirred tank, obtain base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
Embodiment 4
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 9 parts of phenyl silicone oil, 18 parts of gas-phase silica, 5 parts of MTMS, 2 parts of dibutyl tin laurate, amino
0.6 part of silane coupler, 1.2 parts of calcium chloride, 1.5 parts of naphthylamine antioxidant, 2 parts of toluene di-isocyanate(TDI), solubilizer PE-g-
5 parts of MAH, 10.8 parts of polysulfones, 15 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, gas-phase silica, solubilizer PE-g-MAH, polysulfones and step will be blocked by formula ratio
Suddenly it is 140 DEG C, under the conditions of vacuum is 0.08MPa that (1) is obtained modified calcium carbonate hollow microsphere, which adds vacuum kneader temperature,
Dehydration blending 90 minutes, moves to stirring in stirred tank, obtains base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
Embodiment 5
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 7 parts of phenyl silicone oil, 16 parts of silicon powder, 10 parts of MTMS, 1 part of dibutyl tin laurate, amino silicone
0.5 part of alkane coupling agent, 1.8 parts of calcium chloride, 2 parts of naphthylamine antioxidant, 5 parts of toluene di-isocyanate(TDI), solubilizer PE-g-MAH
4.4 parts, 10.5 parts of polysulfones, 14.8 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, silicon powder, solubilizer PE-g-MAH, polysulfones and step (1) will be blocked by formula ratio
Obtained modified calcium carbonate hollow microsphere add vacuum kneader temperature be 140 DEG C, vacuum be to be dehydrated altogether under the conditions of 0.08MPa
It is mixed 90 minutes, move to stirring in stirred tank, obtain base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
Embodiment 6
A kind of low temperature resistant organosilicon sealant, by weight, is made up of following component：Block dimethyl silicone polymer
100 parts, 6 parts of phenyl silicone oil, 15 parts of gas-phase silica, 4 parts of MTMS, 1.2 parts of dibutyl tin laurate, ammonia
0.8 part of base silane coupling agent, 2 parts of calcium chloride, 1.8 parts of naphthylamine antioxidant, 6 parts of toluene di-isocyanate(TDI), solubilizer PE-g-
4.9 parts of MAH, 10 parts of polysulfones, 14.5 parts of calcium carbonate hollow microsphere.
The step of its preparation method, is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C after 40 minutes
95 DEG C are warming up to after stirring 12 minutes, the aqueous solution for adding amino silicane coupling agent, stirring reaction is taken out after 1 hour, with anhydrous
Ethanol is placed in vacuum drying chamber at 90 DEG C after washing 5 times and dried 9 hours, modified calcium carbonate hollow microsphere is obtained, wherein being coupled
The weight of agent is the 16% of calcium carbonate hollow microsphere；
(2) dimethyl silicone polymer, gas-phase silica, solubilizer PE-g-MAH, polysulfones and step will be blocked by formula ratio
Suddenly it is 140 DEG C, under the conditions of vacuum is 0.08MPa that (1) is obtained modified calcium carbonate hollow microsphere, which adds vacuum kneader temperature,
Dehydration blending 90 minutes, moves to stirring in stirred tank, obtains base-material after cooling；
(3) formula ratio is pressed by phenyl silicone oil, MTMS, calcium chloride, naphthylamine antioxidant, toluene diisocyanate
Acid esters adds stirred tank, and mixing speed is mixed 80 minutes for the base-material obtained under 500rpm with step (2), adds the two of formula ratio
Continue to mix 25 minutes after dibutyl tin laurate, obtain low temperature resistant organosilicon sealant.
According to GB/T 5470-2008 testing example 1-6 and the brittle temperature of comparative example, brittle temperature is lower to be proved
Resistance to low temperature is better, and test result is as shown in the table, wherein, comparative example is special for Publication No. CN102559133B China
Profit：
As seen from the above table, 1-6 of embodiment of the present invention brittle temperature is significantly lower than comparative example, and resistance to low temperature is fine.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (7)
1. a kind of low temperature resistant organosilicon sealant, it is characterised in that：By weight, it is made up of following component：Block poly- diformazan
100 parts of radical siloxane, 5~10 parts of plasticizer, 15~20 parts of filler, 3~10 parts of crosslinking agent, 1~2 part of catalyst, coupling agent 0.5
~1 part, 1~2 part of stabilizer, 1.5~2 parts of age resistor, 2~6 parts of tackifier, 4~5 parts of solubilizer PE-g-MAH, polysulfones 10~
12 parts, 14~15 parts of calcium carbonate hollow microsphere；
The plasticizer is phenyl silicone oil；
The filler is gas-phase silica or silicon powder；
The preparation method of low temperature resistant organosilicon sealant, its step is as follows：
(1) dried calcium carbonate hollow microsphere is put into absolute ethyl alcohol, ultrasonic disperse is heated to 85 DEG C of stirrings after 40 minutes
12 minutes, add coupling agent the aqueous solution after be warming up to 95 DEG C, stirring reaction is taken out after 1 hour, is washed with absolute ethyl alcohol after 5 times
It is placed in vacuum drying chamber at 90 DEG C and dries 9 hours, obtains modified calcium carbonate hollow microsphere, the wherein weight of coupling agent is carbonic acid
The 16% of calcium hollow microsphere；
(2) it will block what dimethyl silicone polymer, filler, solubilizer PE-g-MAH, polysulfones and step (1) were obtained by formula ratio
Modified calcium carbonate hollow microsphere add vacuum kneader temperature be 140 DEG C, vacuum be 90 points of dehydration blending under the conditions of 0.08MPa
Clock, moves to stirring in stirred tank, obtains base-material after cooling；
(3) plasticizer, crosslinking agent, stabilizer, age resistor, tackifier are added into stirred tank by formula ratio, mixing speed is
The base-material obtained under 500rpm with step (2) is mixed 80 minutes, is added after the catalyst of formula ratio and is continued to mix 25 minutes, obtains
Low temperature resistant organosilicon sealant.
2. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The crosslinking agent is methyl three
Methoxy silane.
3. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The catalyst is two bays
Sour dibutyl tin.
4. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The coupling agent is amino silicone
Alkane coupling agent.
5. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The stabilizer is chlorination
Calcium.
6. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The age resistor is naphthylamines class
Age resistor.
7. a kind of low temperature resistant organosilicon sealant according to claim 1, it is characterised in that：The tackifier are toluene two
Isocyanates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510485817.7A CN105086921B (en) | 2015-08-10 | 2015-08-10 | A kind of low temperature resistant organosilicon sealant and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510485817.7A CN105086921B (en) | 2015-08-10 | 2015-08-10 | A kind of low temperature resistant organosilicon sealant and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105086921A CN105086921A (en) | 2015-11-25 |
| CN105086921B true CN105086921B (en) | 2017-09-12 |
Family
ID=54568276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510485817.7A Expired - Fee Related CN105086921B (en) | 2015-08-10 | 2015-08-10 | A kind of low temperature resistant organosilicon sealant and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105086921B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108753245A (en) * | 2018-06-29 | 2018-11-06 | 合肥帧讯低温科技有限公司 | Low-temperature-resistant environment-friendly sealant and preparation method thereof |
| CN109988544A (en) * | 2019-04-22 | 2019-07-09 | 昆山市中迪新材料技术有限公司 | A kind of casting glue and preparation method thereof |
| CN111961408A (en) * | 2020-06-24 | 2020-11-20 | 厦门中思诺新材料有限公司 | Bottom sealant special for stone wet pasting and preparation method thereof |
| CN111793458A (en) * | 2020-08-03 | 2020-10-20 | 江阴宝柏包装有限公司 | Repeated sealing packaging film for food and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE399830T1 (en) * | 2003-03-17 | 2008-07-15 | Dow Corning | SOLVENT-FREE PRESSURE-SENSITIVE SILICONE ADHESIVES WITH IMPROVED HIGH-TEMPERATURE COHESION |
| US20070116907A1 (en) * | 2005-11-18 | 2007-05-24 | Landon Shayne J | Insulated glass unit possessing room temperature-cured siloxane sealant composition of reduced gas permeability |
| CN104357004B (en) * | 2014-12-04 | 2016-09-28 | 广州汇纳新材料科技有限公司 | Casting glue that a kind of applicable psychro-environment uses and its preparation method and application |
-
2015
- 2015-08-10 CN CN201510485817.7A patent/CN105086921B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105086921A (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105086921B (en) | A kind of low temperature resistant organosilicon sealant and preparation method thereof | |
| CN102807812B (en) | Latent curing single-component polyurethane water-proof coating and preparation method thereof | |
| CN110305621B (en) | Dealcoholized room-temperature curing organosilicon sealant and preparation method thereof | |
| CN101353563B (en) | Single-component silicone fluid sealant for solar energy cell assembly and manufacturing method thereof | |
| CN102102006B (en) | Preparation method of double-component polyurethane pouring sealant and product thereof | |
| CN107880797B (en) | Special moisture-heat-resistant high-strength silicone structural adhesive for photovoltaic module | |
| CN104710962B (en) | Room temperature vulcanized silicone rubber adhesive and preparation method thereof | |
| CN106832319B (en) | A method of nano silica/hydroxyl-terminated injecting two methyl siloxane hybrid material is prepared in situ | |
| WO2022068512A1 (en) | Method for preparing organosilicon elastomer on basis of crosslinking of polyphenol compound | |
| CN105504294B (en) | A kind of fluorinated silicone modified polyester resin and preparation method thereof | |
| CN101153076B (en) | A kind of preparation method of polysiloxane resin containing alkoxy group in side group | |
| CN113105605B (en) | UV-cured high-transparency POSS modified organic silicon-castor oil polyurethane material and preparation and application thereof | |
| CN105505302A (en) | Ultraviolet-moisture dual-cured modified organosilicon adhesive and preparation method therefor | |
| CN107523259B (en) | Preparation of alpha-570 coupling agent modified organosilicon sealant | |
| CN102898650A (en) | T-chain unit phenyl-containing MTQ silicon resin and preparation method thereof | |
| CN109593228A (en) | A kind of polyimides-organosiloxane aerogel composite and preparation method thereof | |
| CN110423353A (en) | A kind of polysiloxanes, maleopimaric acid modified polyorganosiloxane and maleopimaric acid modified polyorganosiloxane resistance combustion polyurethane foam | |
| CN104151554B (en) | Synthesis method of three-terminal epoxy-modified silicone oil | |
| CN109749453B (en) | Titanate catalytic composition, preparation method and application thereof | |
| CN109735298A (en) | Heatproof, organosilicon sealant of acid and alkali-resistance and preparation method thereof | |
| CN112210341B (en) | Double-vulcanization system building sealant and preparation method thereof | |
| CN109880566A (en) | One kind having high thermal stability electronics new material and preparation method thereof | |
| CN113956840A (en) | A kind of dealcoholized room temperature vulcanized silicone rubber sealant and preparation method thereof | |
| CN113956835A (en) | Organosilicon sealant for U-shaped heating pipe and preparation method thereof | |
| CN115746565B (en) | Room temperature vulcanized silicone rubber and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170912 Termination date: 20180810 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |