CN105062052A - PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof - Google Patents
PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof Download PDFInfo
- Publication number
- CN105062052A CN105062052A CN201510436421.3A CN201510436421A CN105062052A CN 105062052 A CN105062052 A CN 105062052A CN 201510436421 A CN201510436421 A CN 201510436421A CN 105062052 A CN105062052 A CN 105062052A
- Authority
- CN
- China
- Prior art keywords
- parts
- pa10t
- composite heat
- improved
- boron nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 28
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 229920006119 nylon 10T Polymers 0.000 title claims abstract description 19
- 230000005855 radiation Effects 0.000 title abstract description 5
- 238000002360 preparation method Methods 0.000 title description 3
- 229910052582 BN Inorganic materials 0.000 claims abstract description 14
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910017083 AlN Inorganic materials 0.000 claims abstract description 10
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003365 glass fiber Substances 0.000 claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 7
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 7
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 5
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 9
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 7
- 229910052726 zirconium Inorganic materials 0.000 claims description 7
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 6
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 150000001408 amides Chemical class 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000005453 pelletization Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000007605 air drying Methods 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 238000012986 modification Methods 0.000 abstract description 5
- 230000004048 modification Effects 0.000 abstract description 5
- 239000004952 Polyamide Substances 0.000 abstract description 3
- 229920002647 polyamide Polymers 0.000 abstract description 3
- OTJHLDXXJHAZTN-BYPYZUCNSA-N S-(2-boronoethyl)-L-cysteine Chemical compound OC(=O)[C@@H](N)CSCCB(O)O OTJHLDXXJHAZTN-BYPYZUCNSA-N 0.000 abstract description 2
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 abstract 2
- 238000012545 processing Methods 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- -1 corrosion-resistant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a PA10T composite heat radiation material for heatproof LED lamp, and the material is prepared from the following raw materials in part by weight: 40-42 parts of magnesium oxide, 20-22 parts of boron nitride, 2-3 parts of short cut glass fibre, 30-32 parts of polyamide PA10T, 7-8 parts of alumina whisker, 1-2 parts of carbon monofluoride, 2-3 parts of BeC, 1-2 parts of aluminium nitride, 3-4 parts of zirconium silicate powder, 2-2.5 parts of polyvinyl butyral, 5-6 parts of ethanol and 3-4 parts of SEBS. The composite heat radiation material provided by the invention employs boron nitride to modify SEBS, so that the notch impact strength of the material is improved; the material provided by the invention employs short cut glass fibre and whisker for modification, so that the heat conduction coefficient and mechanical properties of the composite material are improved, and the electrical property is maintained at a high level; carbon monofluoride is used, and the thermal diffusivity, the waterproof and oil resistant function are improved; BeC, aluminium nitride and zirconium silicate powder are used, so that the material has an excellent heat conduction performance, and the hear resistance of the material is improved.
Description
Technical field
The present invention relates to LED heat sink material field, particularly relate to a kind of heat-resisting LED PA10T composite heat dissipation material and preparation method thereof.
Background technology
The thermal conductivity of most metallic substance is better, but the erosion resistance of metallic substance is bad, limits the application in the fields such as its heat exchanger, heat pipe, solar water heater and water reservoir water cooler in Chemical Manufacture and wastewater treatment.Compare with metallic substance, the insulation of plastics, corrosion-resistant, chemical resistance good, and light weight, inexpensive, easy processing, shaping energy consumption are low, is widely used, such as, can be used as electronic package material in the field such as electric.
Utilize high heat-conducting ceramic as aluminium nitride, boron nitride etc. for needing the device of insulating radiation more.Because the difficulty of processing of ceramic product is high, easily break, people start to seek the good polymkeric substance of easy processing, impact resistance to prepare insulating heat-conductive matrix material.
Unbound electron and the ion of conduction current and heat energy is generally there is not in polymer molecular chain.The imperfection of polymer crystallization, also limits the conduction of phonon to heat energy, and therefore polymer materials is the poor conductor of heat mostly, even if the high density polyethylene(HDPE) that thermal conductivity is best, its thermal conductivity is also only 0.44W/mK.But polymer materials has, and quality is light, easily processing, high-performance and low price advantage, needing the numerous areas such as the electronics of product " movement " and on-the-spot " construction ", electrical equipment and information technology to have active demand to high-strength, high-ductility, light weight, easily processing and thermal conductive polymer based composites, key to improve polymer bond (completing quick heat radiating) performance.So polymer materials heat conduction functionalization becomes one of advanced subject of polymer science and engineering subject.
The insulating resin based composites that research and development have high thermal conductivity has urgent practical significance.The most convenient efficient manner of current raising macromolecular material heat conductivility carries out composite heat-conducting modification to current material.
Heat resistant polyamide PA10T is a kind of bio-based semiaromatic polyamide composition, there is excellent mechanical property, thermotolerance and processing characteristics, water-intake rate is low, the advantage such as good stability of the dimension and resistance to chemical attack, is mainly used in electric, LED, automobile and other industries.But, the thermal conductivity of heat resistant polyamide PA10T is less, thus limit its application in some fields, as junctor, motor, transformer, solenoid coil, winding around system led illuminating and heat radiating etc., be therefore necessary the modification it being carried out to heat conductivility aspect.In existing method of modifying, filling heat conductive filler and there is the advantages such as cost is low, equipment simple, applicable scale operation, being best suited for the method as improving PA10T heat conductivility.
Boron nitride has atomic crystal form and fine and close structure, and based on phonon thermal conduction, thermal conductivity is very high, and the thermal expansivity of boron nitride is minimum in pottery in addition, and high temperature insulation characteristic is very outstanding, is that good height insulate high heat conductive filler.Although magnesium oxide thermal conductivity is lower, its low price.
Above-mentioned two kinds of fillers are carried out effective compounded combination, the heat conductive insulating matrix material that thermal conductivity is high, cost is low, formability is excellent may be obtained, can be widely used in insulating requirements higher while require again the LED illumination field of radiating of excellent heat conducting performance.Adopt boron nitride microsphere powder and spherical magnesium oxide as composite heat conductive filler, a small amount of short glass fiber is as reinforcing filler, prepare the high temperature resistant PA10T matrix material of heat conductive insulating, excellent radiation performance, but mechanical property is good not, thermal diffusivity can not meet the requirement of some relatively high power equipment, and weather resistance can not be guaranteed, and needs to improve.
Summary of the invention
The object of the present invention is to provide a kind of heat-resisting LED PA10T composite heat dissipation material, the thermal diffusivity of this composite heat dissipation material, waterproof and oilproof better function, and there is good thermotolerance.
Technical scheme of the present invention is as follows:
A kind of heat-resisting LED PA10T composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, fluorographite 1-2, BeC2-3, aluminium nitride 1-2, zirconium English powder 3-4, polyvinyl butyral acetal 2-2.5, ethanol 5-6, SEBS3-4.
The production method of described heat-resisting LED PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add diadust, crystalline graphite powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, aluminium nitride, zirconium English powder, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Beneficial effect of the present invention
Composite heat dissipation material of the present invention employs magnesium oxide, boron nitride, create good composite collaborative radiating effect, by using SEBS, modification is carried out to boron nitride, the notched Izod impact strength of material is improved, by using short glass fiber, alumina whisker, through modification, thermal conductivity and the mechanical property of matrix material are improved, and electrical property remains on higher level; By using fluorographite, improve the thermal diffusivity of material, waterproof and oilproof function; By using BeC, aluminium nitride, zirconium English powder, not only making material have excellent heat conductivility, and the thermotolerance of material can be improved.
Embodiment
A kind of heat-resisting LED PA10T composite heat dissipation material, is made up of the raw material of following weight part (kilogram): magnesium oxide 41, boron nitride 21, short glass fiber 2.5, polymeric amide PA10T31, alumina whisker 7.5, fluorographite 1.5, BeC2.5, aluminium nitride 1.5, zirconium English powder 3.5, polyvinyl butyral acetal 2.3, ethanol 5.5, SEBS3.5.
The production method of described heat-resisting LED PA10T composite heat dissipation material, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80 DEG C, be stirred to resin and all dissolve, add diadust, crystalline graphite powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, aluminium nitride, zirconium English powder, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4h at 130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Experimental data: the normal direction thermal conductivity of this heat sink material is 4.12W/mK.
Claims (2)
1. a heat-resisting LED PA10T composite heat dissipation material, is characterized in that being made up of the raw material of following weight part: magnesium oxide 40-42, boron nitride 20-22, short glass fiber 2-3, polymeric amide PA10T30-32, alumina whisker 7-8, fluorographite 1-2, BeC2-3, aluminium nitride 1-2, zirconium English powder 3-4, polyvinyl butyral acetal 2-2.5, ethanol 5-6, SEBS3-4.
2. the production method of heat-resisting LED PA10T composite heat dissipation material according to claim 1, is characterized in that:
(1) polyvinyl butyral acetal is added in ethanol, be heated to 80-82 DEG C, be stirred to resin and all dissolve, add diadust, crystalline graphite powder again, stir, then add short glass fiber, alumina whisker stirs, dry, pulverize, obtain modified oxidized aluminium whiskers;
(2) boron nitride mixed with SEBS, aluminium nitride, zirconium English powder, send into twin screw extruder, through melt extruding, water-cooled pelletizing, obtains pellet;
(3) polymeric amide PA10T is dry, the pellet obtained with (2) step and other remaining components mix, and enter from the main spout of parallel dual-screw extruding machine, modified oxidized aluminium whiskers enters from side spout, through melt extruding, water-cooled pelletizing obtains pellet; Forcing machine each section of temperature is respectively: 280,320,310,310 DEG C, screw speed is set as 400r/min; Then forced air drying 4-5h at 125-130 DEG C, uses injection moulding machine injection moulding, to obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510436421.3A CN105062052A (en) | 2015-07-23 | 2015-07-23 | PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510436421.3A CN105062052A (en) | 2015-07-23 | 2015-07-23 | PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105062052A true CN105062052A (en) | 2015-11-18 |
Family
ID=54491588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510436421.3A Pending CN105062052A (en) | 2015-07-23 | 2015-07-23 | PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105062052A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019104895A1 (en) * | 2017-11-29 | 2019-06-06 | 南方科技大学 | Nylon composite and preparation method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
-
2015
- 2015-07-23 CN CN201510436421.3A patent/CN105062052A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304284A (en) * | 2011-08-22 | 2012-01-04 | 金发科技股份有限公司 | Heat-conductive resin composition and preparation method thereof |
| CN102719099A (en) * | 2012-06-08 | 2012-10-10 | 金发科技股份有限公司 | Thermal conductive molding compound and preparation method thereof |
| CN103044904A (en) * | 2012-12-27 | 2013-04-17 | 安徽科聚新材料有限公司 | Special heat-conducting and insulating material for LED (light-emitting diode) lamp holder and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019104895A1 (en) * | 2017-11-29 | 2019-06-06 | 南方科技大学 | Nylon composite and preparation method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102286207B (en) | A kind of thermoplastic polymer based thermal conductive composite and preparation method thereof | |
| CN104559149A (en) | Carbon composite high-thermal-conductivity plastic material and preparation method thereof | |
| CN101717579B (en) | Filling-type thermal-conducting electric-insulating polyphenyl thioether and polyamide blended alloy and preparation method thereof | |
| CN105062054A (en) | High-heat-conducting aging-resistant PA10T composite heat radiating material for LED lamp and preparation method therefor | |
| CN108250747B (en) | Thermoplastic polyetherimide insulating and heat-conducting composite material and preparation method thereof | |
| CN104194286B (en) | Carbon fiber strengthens thermoplas tic resin composite and preparation method thereof | |
| CN104559148A (en) | High-thermal-diffusion-coefficient high molecular material and preparation method thereof | |
| CN105985631A (en) | Heat-conducting composite material for LED (Light Emitting Diode) lamps and preparation method for heat-conducting composite material | |
| CN102746623B (en) | Preparation method for insulating heat conduction material | |
| CN109181134A (en) | Polymer-based heat-conducting composite material and preparation method thereof | |
| CN104559150A (en) | Antistatic caprolactam heat-conducting material and preparation method thereof | |
| CN104987713A (en) | Polyamide 10T composite thermal dissipation material with high thermal conductivity for light-emitting diode lamp, and preparation method thereof | |
| KR101247627B1 (en) | Electrically insulated thermal conductive polymer composition | |
| CN105462246A (en) | Graphene/metal powder composite-modification ultrahigh-heat-conductivity nylon and preparing method thereof | |
| CN104610737A (en) | Heat-conduction and insulation plastic material with high-impact resistant and flame retardation | |
| CN103435847A (en) | High-heat conductivity composite material for LED (light-emitting diode) lamp, heat-conducting filler and production equipment | |
| CN104559146A (en) | Whisker reinforced thermally conductive plastic material and preparation method thereof | |
| CN104987711A (en) | PA10T composite heat disspating material for high-power LED lamps and preparation method therefor | |
| CN105131591A (en) | Heat-resistant PA10T composite heat-dissipating material used in LED light and preparation method thereof | |
| CN105038208A (en) | PA10T (polyamide10T) composite heat dispersing material for LED light and preparation method thereof | |
| CN105062057A (en) | High-wear-resisting PA10T composite heat radiating material for LED lamp and preparation method therefor | |
| CN105001633A (en) | High-strength PA10T composite heat dissipation material for LED lamp and preparing method thereof | |
| CN105985623A (en) | PC-PET (polycarbonate and polyethylene terephthalate) based LED radiating material comprising modified tetrapod-like zinc oxide whiskers and preparation method thereof | |
| CN105062052A (en) | PA10T composite heat radiation material for heatproof LED lamp and preparation method thereof | |
| CN105331069A (en) | PC-PET-based LED cooling material comprising modified mesoporous silica-carbon nano tubes and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151118 |