CN104994703B - A kind of dust-proof radiating device and its power supply - Google Patents
A kind of dust-proof radiating device and its power supply Download PDFInfo
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- CN104994703B CN104994703B CN201410353180.1A CN201410353180A CN104994703B CN 104994703 B CN104994703 B CN 104994703B CN 201410353180 A CN201410353180 A CN 201410353180A CN 104994703 B CN104994703 B CN 104994703B
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Abstract
The invention discloses a kind of dust-proof radiating device and its power supplys, wherein dust-proof radiating device, are platy structure, including substrate, mounting surface and radiated rib；Radiated rib is distributed in the substrate at least one side, increases the heat dissipation area of radiator, improves the radiating efficiency of radiator；The mounting surface is located at the substrate top, for installing the fixed PCB or power component for needing to carry out auxiliary heat dissipation so that dust-proof radiating device can carry the weight of PCB, while also have the function of auxiliary heat dissipation；The radiated rib is the helical teeth structure that extension is tilted down from the substrate surface, and the angle of the radiated rib lower surface and substrate is less than 90 °；Dust can slide and be difficult to deposit in the radiated rib upper surface under the effect of gravity, it is easy to which cooled air-flow is blown off so that dust-proof radiating device does not occur fouling phenomenon or greatly reduces dust stratification rate.
Description
Technical Field
The invention relates to a radiator used for an electronic product and power supply equipment using the dustproof radiator.
Background
With the increasing integration level of chips, the increasing power of chips, and the miniaturization of products, the amount of heat generated by power supplies has increased greatly. The effect of temperature on power supply reliability is up to 60%, thus indicating: the temperature is lowered and the reliability and life span of the product are increased. Therefore, it is necessary to increase the heat dissipation speed and effectively control the operating temperature of the product so that it does not exceed a limit range, thereby improving the reliability and life of the product. The heat dissipation of industrial power supply is generally divided into air cooling and water cooling, wherein the air cooling heat dissipation mode generally adopts an aluminum alloy radiator, and the main form is as follows: the heat dissipation is realized by radiating heat exchange fins exposed in the air outwards in the forms of a plug-in radiator, a welded radiator, a profile radiator and the like. The conventional forced air cooling power radiator generally adopts a conventional shape of a vertical fin and is generally arranged above or on the side surface of a PCB (printed circuit board), the radiator can be arranged only after the PCB is arranged, and the PCB needs to bear the weight of the radiator, so that the requirement on the structural stability of the PCB is high. Because the airflow passing through the radiator is very large, the dust resistance of the conventional radiator and the installation mode of the conventional radiator and the PCB is very poor, particularly under the severe working condition of much smoke and dust, the PCB and the radiator with the conventional shape are very easy to deposit dust, the heat radiation performance is poor, the dust-deposition corrosion resistance is also poor, the dust-deposition corrosion is further aggravated by high temperature, and the PCB is easy to generate various severe conditions such as electric leakage and the like due to the dust-deposition corrosion, so that the product fault rate is high, the service life is short, and the reliability is low. Meanwhile, due to the improvement of power density of the power supply and the trend of miniaturization of the size, a special space is difficult to design inside the power supply for dust prevention of the radiator, and the problem of dust accumulation is further aggravated.
Disclosure of Invention
The invention aims to provide a dustproof radiator which has the advantages of simple structure, quick heat dissipation and good dustproof performance, can prevent the dust accumulation of a PCB used in a power supply and can bear the weight of the PCB, aiming at the problem that the dustproof performance of the heat dissipation structure of the power supply PCB is poor.
The invention also aims to provide a power supply applying the dustproof heat radiator.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a dustproof radiator is of a plate-shaped structure and comprises a base plate, a mounting surface and radiating fins;
the mounting surface is positioned on the upper part of the substrate and used for mounting and fixing a PCB or a power component which needs auxiliary heat dissipation, and has the function of auxiliary heat dissipation;
radiating fins are distributed on at least one surface of the base plate, so that the radiating area of the radiator is increased, and the radiating efficiency of the radiator is improved;
the heat dissipation fins are of inclined tooth structures which extend downwards from the surface of the base plate, and the included angle between the lower surfaces of the heat dissipation fins and the base plate is smaller than 90 degrees; due to the action of gravity, the upper surface of the radiating fin is in an unstable state, dust can slide down under the action of self gravity and is difficult to deposit on the upper surface of the radiating fin, and if the inclination angle of the radiating fin is larger, the difficulty of dust deposition on the upper surface of the radiating fin is larger; in addition, even a small amount of dust is deposited on the upper surface of the radiator, the dust is in an unstable state and is easily blown off by cooling air flow, so that the heat dissipation fins have no dust deposition phenomenon or greatly reduce the dust deposition rate.
In the invention, the upper surface of the radiating rib is a smooth inclined surface, so that the dust deposition prevention effect of the radiating rib is good.
In the invention, in order to increase the surface area of the radiating fin, the upper surface and/or the lower surface of the radiating fin is a corrugated surface, so that the contact area of the radiating fin and the outside air is increased, and the radiating efficiency is improved.
In the invention, the radiator is treated by using a nano solution which can enable the surface of the radiator to have water resistance, dust resistance and oxidation resistance.
In the invention, the radiating fins are distributed on one surface of the base plate, and the plurality of continuously distributed radiating grooves for assisting ventilation and radiation are dug on the other surface of the base plate, so that the resistance of forced air-cooled airflow passing through the radiator can be reduced, the speed of cooling airflow is improved, and the radiating efficiency is improved.
In the invention, the radiator is also provided with a plurality of auxiliary radiating fins which are used for auxiliary radiating and fixing and are vertical to the surface of the base plate, and the radiator can be arranged and fixed in the power supply shell through the auxiliary radiating fins.
The invention also provides a power supply applying the dustproof radiator, which comprises a shell, a plurality of dustproof radiators and a PCB; wherein,
the dustproof radiator is fixedly arranged on the shell or a sheet metal part of the shell and comprises a base plate, an installation surface and radiating fins;
the mounting surface is positioned on the upper part of the substrate and is used for mounting and fixing a PCB or a power component which needs auxiliary heat dissipation to form a heat dissipation structure of the PCB mounted on the upper part of the dustproof heat sink, and the mounting surface also has the function of auxiliary heat dissipation;
according to the structure, the PCB is skillfully arranged at the upper end or the vertical side surface of the radiator, and the PCB is directly supported on the radiator, so that the structural stability of the PCB is improved, the cooling airflow is prevented from directly blowing the PCB, the deposition of dust on the PCB is greatly reduced, and the problems of heat dissipation/corrosion and the like caused by dust collection of components or circuit boards due to a conventional installation mode are solved;
radiating fins are distributed on at least one surface of the base plate, so that the radiating area of the radiator is increased, and the radiating efficiency of the radiator is improved;
the radiating fins are helical tooth structures which extend from the surface of the base plate in a downward inclined mode, and the included angle between the lower surfaces of the radiating fins and the base plate is smaller than 90 degrees.
In the invention, the mounting surface for mounting the PCB can be a vertical surface or an inclined surface so as to adapt to different forms of PCB mounting requirements.
In the invention, the inclination angle of the radiating fins is 30-60 degrees, so that the surface area of the radiating fins is increased as much as possible while the dustproof effect is ensured, and the radiating efficiency is improved.
In the invention, the upper surface of the radiating fin is subjected to surface smoothing treatment to enable the upper surface of the radiating fin to be a smooth surface; the lower surfaces of the radiating fins form corrugated surfaces, so that the radiating area is enlarged.
In the invention, the radiating fins are distributed on one surface of the base plate, and the plurality of continuously distributed radiating grooves for assisting ventilation and radiation are dug on the other surface of the base plate, so that the resistance of forced air-cooled airflow passing through the radiator can be reduced, the speed of cooling airflow is improved, and the radiating efficiency is improved.
In the invention, the radiator is also provided with a plurality of auxiliary radiating fins which are used for auxiliary radiating and fixing and are vertical to the surface of the base plate, and the radiator can be arranged and fixed in the power supply shell through the auxiliary radiating fins.
The invention adopts the special structure that the mounting surface is arranged at the upper part of the base plate, the radiating rib with the inclined tooth structure extending downwards from the surface of the base plate is arranged on the surface of the base plate, the upper surface of the radiating rib is subjected to surface smoothing treatment to form a smooth surface, and the lower surface of the radiating rib adopts a corrugated surface, thereby having the following advantages:
1. the design of the heat dissipation fins which are inclined downwards ensures that dust is difficult to accumulate on the upper surfaces of the heat dissipation fins, and the dust is difficult to deposit along with the larger downward inclination angle of the heat dissipation fins, and even if a small amount of dust is attached to the heat dissipation fins, the dust is easily blown off by cooling airflow because the dust is in an unstable state on the upper surfaces of the inclined heat dissipation fins, so that a good dustproof effect is achieved;
2. the upper surface of the heat dissipation rib is subjected to surface smoothing treatment to form a smooth surface, so that the instability of dust adhesion is increased, the possibility of dust deposition on the upper surface of the heat dissipation rib is low, and even a small amount of dust deposition can be easily blown off by cooling air flow, so that an excellent dustproof effect is achieved;
3. the dust accumulation phenomenon cannot occur on the lower surface of the radiating fin, the lower surface of the radiating fin adopts a corrugated surface structure, the dustproof performance of the radiator cannot be influenced, the radiating area of the radiator can be increased to the maximum extent, and compared with a radiator with a common structure, the radiating effect of the radiator disclosed by the invention is very good;
4. compared with a conventional parallel tooth structure, the helical tooth structure of the radiating fins has the advantages that the longer extension length is realized under the same space volume, the radiating area is greatly increased, the radiating effect is better, and the design of higher power density is facilitated;
5. the upper portion of the radiator base plate is provided with a mounting surface for mounting the PCB, the PCB is ingeniously mounted at the upper end of the radiator or a special mounting structure of the vertical side face, the PCB is directly borne on the radiator, the improvement of the structural stability of the PCB is facilitated, the phenomenon that cooling air flow directly blows the PCB is avoided, the deposition of dust on the PCB is greatly reduced, and the problems that the conventional mounting mode causes dust to cause dust collection of components or circuit boards to cause heat dissipation/corrosion and the like do not exist.
Drawings
Fig. 1 is a schematic structural diagram of a dustproof heat sink in a first embodiment of the present invention;
FIG. 2 is a first schematic structural diagram of a heat dissipation fin according to an embodiment of the present invention;
FIG. 3 is a second schematic structural view of a heat dissipation fin according to an embodiment of the present invention;
fig. 4 is a first schematic structural diagram of a dustproof heat sink according to a third embodiment of the present invention;
fig. 5 is a schematic structural diagram of a dustproof heat sink in a third embodiment of the present invention;
fig. 6 is a first schematic structural diagram of a dustproof heat sink according to a fourth embodiment of the present invention;
fig. 7 is a second schematic structural view of a dustproof heat sink in a fourth embodiment of the present invention;
fig. 8 is a first schematic structural view of a dustproof heat sink according to a fifth embodiment of the present invention;
fig. 9 is a second schematic structural view of a dustproof heat sink in the fifth embodiment of the present invention;
fig. 10 is a first schematic diagram illustrating a PCB mounting structure in a power supply according to a sixth embodiment of the present invention;
FIG. 11 is a second schematic view of a PCB mounting structure in a power supply according to a sixth embodiment of the present invention
Fig. 12 is a third schematic diagram of a PCB mounting structure in a power supply according to a sixth embodiment of the present invention;
fig. 13 is a schematic view of a hybrid mounting structure of a dustproof heat sink in a power supply according to a sixth embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the technical solutions of the present invention, the following detailed description of the technical solutions of the present invention is made with reference to the accompanying drawings and the embodiments, and it is obvious that the following descriptions are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other embodiments based on these embodiments without any inventive work.
The conventional heat dissipation method adopted by the conventional power supply is to install a radiator adopting vertical heat dissipation fins on a PCB, the conventional power supply PCB radiator can be installed only after the PCB is installed, and the PCB needs to bear the weight of the radiator, so that the requirement on the structural stability of the PCB is high. Because the airflow passing through the radiator is very large, the dustproof performance of the radiator adopted by the conventional power supply PCB radiating method and the installation mode of the radiator and the PCB is very poor, particularly under the severe working condition of much smoke and dust, the PCB and the radiator in the conventional shape are very easy to deposit dust, so that the radiating performance of the radiator is poor, the dust deposition corrosion resistance is also poor, the dust deposition corrosion is further aggravated by high temperature, and the PCB is easy to generate various severe conditions such as electric leakage and the like due to the dust deposition corrosion, so that the product failure rate is high, the service life is short, and the reliability is low. Therefore, the present embodiment provides a dustproof heat sink for a power PCB, which solves the above problems by changing the structural shape of the heat sink and the installation position relationship between the PCB and the heat sink, and the present embodiment describes a dustproof heat sink for implementing the dustproof heat dissipation method of the power PCB14, which has a plate-shaped structure, referring to fig. 1, including a base plate 10, a mounting surface 11 and heat dissipation fins 12, wherein the base plate 10 and the heat dissipation fins 12 are made of the same material, thereby reducing the cost while ensuring smooth and efficient heat transfer between the two;
the base plate 10 is a flat plate and used as a bearing structure of the whole radiator, all components of the radiator are installed and fixed on the base plate 10, the radiating fins 12 extending outwards from the surface of the base plate 10 are distributed on one surface of the base plate 10, the radiating fins 12 are used as a main radiating structure of the radiator, and the radiating fins 12 increase the radiating area of the radiator by extending the surface area, so that the radiating efficiency of the radiator is improved;
referring to fig. 10, 11 and 12, the heat sink in this embodiment is used for dissipating heat of the power PCB14, and the PCB14 is mounted on the heat sink to bear the weight of the PCB14, and the mounting surface 11 is located on the upper portion of the substrate 10 and is used for mounting and fixing the PCB14 or power components that need auxiliary heat dissipation, and has a certain function of auxiliary heat dissipation;
the heat dissipation fins 12 are of a helical tooth structure extending from the surface of the base plate 10 in a downward inclination manner, and the included angle between the lower surfaces of the heat dissipation fins 12 and the base plate 10 is smaller than 90 degrees; because of the gravity, the upper surface of the heat dissipation fin 12 is in an unstable state, and the dust will slide down under the action of the gravity of itself and is difficult to deposit on the upper surface of the heat dissipation fin 12, and if the inclination angle of the heat dissipation fin 12 is larger, the difficulty of depositing the dust on the upper surface of the heat dissipation fin 12 is larger; in addition, even if a small amount of dust is deposited on the upper surface of the radiator, the dust is in an unstable state and is easily blown off by cooling airflow, so that the heat dissipation fins 12 have no dust deposition phenomenon or greatly reduce the dust deposition rate; preferably, in order to take account of the dustproof effect and the included angle between the lower surface of the heat dissipation fin 12 and the base plate 10 is generally 30 ° to 60 °, wherein 30 °, 45 ° and 60 ° are several angles which are commonly used.
In the present embodiment, since the space inside the power supply is limited, the use of the heat dissipation fins 12 with large inclination can partially improve the dustproof performance of the heat sink, but is not beneficial to the manufacture and installation of the heat sink; therefore, in order to ensure the dustproof performance and the heat dissipation performance of the heat sink without affecting the exterior structure of the heat sink, referring to fig. 2, the upper surface of the heat dissipation fin 12 is subjected to surface smoothing treatment to make the upper surface of the heat dissipation fin 12 become a smooth surface 121, that is, the upper surface of the heat dissipation fin 12 is a smooth inclined surface, so that the adhesion instability of dust on the upper surface of the heat dissipation fin 12 is increased, the dust can fall off by itself or be blown off by cooling airflow more easily, and the dust deposition prevention effect of the heat dissipation fin 12 is good;
meanwhile, in order to increase the surface area of the heat dissipation fin 12, referring to fig. 2, the lower surface of the heat dissipation fin 12 is a corrugated surface 122, and the corrugated surface 122 structure is a planar structure, which can effectively increase the contact area between the heat dissipation fin 12 and the external air, and improve the heat dissipation efficiency, and referring to fig. 3, for increasing the heat dissipation area as much as possible, the upper surface and the lower surface of the heat dissipation fin 12 may be corrugated surfaces 122 at the same time.
The second embodiment is different from the first embodiment in that the radiator is treated by using a nano solution which can enable the surface of the radiator to have waterproof, dustproof and antioxidant functions, the surface quality of the dustproof radiator is changed by adopting different process means, the comprehensive performance of the radiator is further improved, and the radiator can normally work for a long time under severe working conditions.
The third embodiment is different from the above embodiments in that, in order to facilitate installation and arrangement of the dustproof heat sink in the power supply with limited internal space, the heat dissipation fins 12 are distributed on one surface of the substrate 10 of the dustproof heat sink in each embodiment, and the other surface of the substrate 10 on the other surface is a smooth surface, so that when cooling airflow blows through the dustproof heat sink, due to limited internal space of the power supply, the substrate 10 can block the cooling airflow to a certain extent, and the flow rate of the cooling airflow in the power supply is reduced, thereby affecting the heat dissipation efficiency of the dustproof heat sink. In order to solve the problem, referring to fig. 4 and 5, in this embodiment, a plurality of heat dissipation grooves 101 for assisting ventilation and heat dissipation are dug on the smooth surface of the substrate 10 below the mounting surface 11, and the cross-sectional shape of the heat dissipation groove 101 is a "U" shaped structure, so that the heat dissipation area of the dustproof heat sink at the position can be increased by times; and these radiating grooves 101 can be used as the through of cooling air current simultaneously, can reduce the resistance that forces the air-cooled air current to pass through the radiator, improve the speed of cooling air current, promote the radiating efficiency.
In the fourth embodiment, different from the above embodiments, in order to improve the heat dissipation capability of a single dustproof heat sink as much as possible to meet the heat dissipation requirements of the PCB14 with higher integration and larger unit heat generation amount, further research and improvement on the structure of the dustproof heat sink are required, wherein one method for improving the heat dissipation capability of the dustproof heat sink is to increase the heat dissipation area of the dustproof heat sink, referring to fig. 6 and 7, in the present embodiment, heat dissipation fins 12 extending outward from the surface of the base plate 10 are distributed on both sides of the base plate 10 of the dustproof heat sink, and the heat dissipation area of the dustproof heat sink is increased by arranging the heat dissipation fins 12 on both sides of the base plate 10 as the main heat dissipation structure of the dustproof heat sink, thereby increasing the heat dissipation efficiency of the dustproof heat sink by times
The radiating fins 12 on both sides of the base plate 10 are symmetrical structures and are bevel tooth structures extending from the surface of the base plate 10 in a downward inclination manner, preferably, the radiating fins 12 are fully distributed on the side, without the mounting surface 11, of the base plate 10, so that the space volume is fully utilized, and the radiating area of the dustproof radiator is enlarged; the included angle between the lower surface of the radiating rib 12 and the base plate 10 is less than 90 degrees; because of the gravity, the upper surfaces of the heat dissipation fins 12 on both sides of the base plate 10 are in an unstable state, and dust will slip off under the action of its own gravity and is difficult to deposit on the upper surfaces of the heat dissipation fins 12, and if the inclination angle of the heat dissipation fins 12 is larger, the difficulty of dust deposition on the upper surfaces of the heat dissipation fins 12 is larger; in addition, even if a small amount of dust is deposited on the upper surface of the heat dissipation fin 12, the dust is in an unstable state and is easily blown off by cooling airflow, so that the dust deposition phenomenon does not occur on the heat dissipation fin 12 or the dust deposition rate is greatly reduced; preferably, in order to take account of the dustproof effect and the included angle between the lower surface of the heat dissipation fin 12 and the base plate 10 is generally 30 ° to 60 °, wherein 30 °, 45 ° and 60 ° are several angles which are commonly used.
The fifth embodiment is different from the above embodiments in that the dustproof heat sink in the present invention adopts a structure completely different from that of a common heat sink, in which the PCB14 is directly mounted on the mounting surface 11 of the dustproof heat sink, and the dustproof heat sink bears the weight of the PCB 14; the dustproof heat sink is directly fixed on the housing or the power structural component by means of bolt fixing and the like, preferably, referring to fig. 8 and 9, the dustproof heat sink is provided with a plurality of auxiliary heat dissipation fins 13 perpendicular to the surface of the base plate 10 and used for fixing the dustproof heat sink at the lower end of the base plate 10, the dustproof heat sink can be fixed inside the power supply by the auxiliary heat dissipation fins 13, and further the dustproof heat sink bears the PCB14, so that various defects of directly mounting the heat sink on the PCB14 are avoided.
Sixth embodiment, the present embodiment provides a power supply using any one of the dust-proof heat sinks described in first to fifth embodiments, the power supply including a housing, 20, a dust-proof heat sink and a PCB14, the dust-proof heat sink being mounted and fixed on the housing 20 or a sheet metal part of the housing 20, the dust-proof heat sink including a base plate 10, a mounting surface 11 and a heat dissipation fin 12;
the mounting surface 11 is located on the upper portion of the substrate 10, and is used for mounting and fixing a PCB14 or a power component which needs to perform auxiliary heat dissipation, so as to form a heat dissipation structure in which the PCB14 is mounted on the upper portion of the dustproof heat sink, and meanwhile, the heat dissipation structure has an auxiliary heat dissipation function, and preferably, the mounting surface 11 can be a vertical surface or an inclined surface so as to adapt to different forms of PCB14 mounting requirements;
generally, the dustproof heat sink has a large volume, so that the area of the mounting surface 11 on the dustproof heat sink is large, and a plurality of PCBs 14 or other power components needing auxiliary heat dissipation can be simultaneously mounted on one dustproof heat sink according to needs;
above-mentioned structure installs PCB14 ingenious in the upper end or the perpendicular side of radiator, and the direct bearing of PCB14 is on dustproof radiator, is favorable to improving PCB 14's structural stability, and has avoided the cooling air current directly to blow through PCB14, has reduced the deposit of dust on PCB14 to a very big extent, does not exist conventional mounting means and leads to the dust to make components and parts or circuit board collection ash lead to heat dissipation/corruption scheduling problem.
One side of the base plate 10 is distributed with heat dissipation fins 12 of a helical tooth structure extending from the surface of the base plate 10 in a downward inclination manner, so that the heat dissipation area of the heat sink is increased, and the heat dissipation efficiency of the heat sink is improved.
Preferably, in order to take account of the dustproof effect and the included angle between the lower surface of the heat dissipation fin 12 and the base plate 10 is generally 30 ° to 60 °, wherein 30 °, 45 ° and 60 ° are preferred values in common use.
In addition, in order to take account of both the dust-proof function and the heat dissipation area, the upper surface of the heat dissipation fin 12 is subjected to surface smoothing treatment so that the upper surface of the heat dissipation fin becomes a smooth surface 121; the corrugated surface 122 is formed on the lower surface of the heat dissipation fin 12, which greatly increases the heat dissipation area of the dustproof heat sink.
Referring to fig. 4 and 5, in another structure of a dustproof heat sink for a power supply, a heat dissipation fin 12 is disposed on one surface of a base plate 10, which is provided with an installation surface 11, a plurality of heat dissipation grooves 101 which are continuously distributed and used for assisting ventilation and heat dissipation are dug on a smooth surface of the base plate 10 below the installation surface 11, and the cross section of each heat dissipation groove 101 is in a "U" shape, so that the heat dissipation area of the dustproof heat sink at the position can be increased exponentially; the heat dissipation grooves 101 can be used for cooling airflow to pass through, so that the resistance of forced air-cooled airflow passing through the radiator can be reduced, the speed of the cooling airflow is increased, and the heat dissipation efficiency is improved; the dustproof heat sink having such a structure is compact and requires a relatively low space for installation, and in practical applications, the dustproof heat sinks having different structures described in the present embodiment can be used in combination with each other to make the most use of the internal space limited by the power supply, referring to fig. 13.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (7)
1. The utility model provides a dustproof radiator, is platelike structure, its characterized in that: comprises a base plate (10), a mounting surface (11) and a heat dissipation rib (12);
the mounting surface (11) is positioned at the upper part of the substrate (10) and used for mounting and fixing a PCB (14) or a power component which needs auxiliary heat dissipation, and has the function of auxiliary heat dissipation;
radiating fins (12) for increasing the radiating area are distributed on one surface of the base plate (10), and a plurality of continuously distributed radiating grooves (101) for assisting ventilation and radiation are dug on the other surface of the base plate (10);
the radiating fins (12) are of inclined tooth structures which are inclined downwards and extend from the surface of the base plate (10), and the included angle between the lower surfaces of the radiating fins (12) and the base plate (10) is 30-60 degrees;
the dustproof radiator is also provided with a plurality of auxiliary radiating fins (13) which are used for auxiliary radiating and fixing and are vertical to the surface of the base plate (10);
the mounting surface (11) is provided with a plurality of grooves for mounting the PCB.
2. A dustproof heat sink according to claim 1, wherein: the upper surface of the heat dissipation rib (12) is a smooth surface (121).
3. A dustproof heat sink according to claim 1, wherein: the upper surface and/or the lower surface of the radiating rib (12) is a corrugated surface (122).
4. A dustproof heat sink according to claim 1, wherein: the mounting surface (11) is a vertical surface or an inclined surface.
5. A dustproof heat sink according to claim 1, wherein: the upper surface of the heat dissipation rib (12) is a smooth surface (121); the lower surface of the radiating rib (12) is a corrugated surface (122).
6. The dustproof heat sink according to claim 4, wherein: the cross section of the heat dissipation groove (101) is of a U-shaped structure.
7. A power supply, characterized by: comprising a housing (20), a PCB (14) and the dust-tight heat sink of any of claims 1 to 6;
the dustproof radiator is fixedly arranged on the shell (20) or a sheet metal part of the shell (20);
the PCB (14) is fixedly arranged on the mounting surface (11).
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| CN201410353180.1A CN104994703B (en) | 2014-07-23 | 2014-07-23 | A kind of dust-proof radiating device and its power supply |
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| CN104994703B true CN104994703B (en) | 2018-06-19 |
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| CN201336795Y (en) * | 2009-04-08 | 2009-10-28 | 北京航星力源科技有限公司 | Box-type heat dissipating device |
| CN201396725Y (en) * | 2009-06-09 | 2010-02-03 | 陈建胜 | Fin type radiator |
| CN102611013A (en) * | 2012-04-13 | 2012-07-25 | 上海信赖实业有限公司 | Top cover of power distribution cabinet |
| WO2013186587A1 (en) * | 2012-06-12 | 2013-12-19 | Fci | Connector assembly |
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