CN104948953A - All-illuminating high-illumination LED bulb and assembly method thereof - Google Patents
All-illuminating high-illumination LED bulb and assembly method thereof Download PDFInfo
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- CN104948953A CN104948953A CN201510330266.7A CN201510330266A CN104948953A CN 104948953 A CN104948953 A CN 104948953A CN 201510330266 A CN201510330266 A CN 201510330266A CN 104948953 A CN104948953 A CN 104948953A
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
- F21V3/0615—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass the material diffusing light, e.g. translucent glass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
- F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an all-illuminating high-illumination LED bulb and an assembly method thereof, and relates to the technical field of illumination. The main purpose of the all-illuminating high-illumination LED bulb and the assembly method thereof is to overcome the defect that an existing all-illuminating LED lamp glares and the main working face is low in illumination. The all-illuminating high-illumination LED bulb comprises a bulb shell, an LED luminous body and a lamp base. The LED luminous body is an LED extending light source and is produced by binding and sealing a small-power LED chip in a transmitting heat-sink basal plate. The LED luminous body is fixed in the plane, perpendicular to a center shaft of the lamp base, in the bulb shell and is connected with high-illumination light rays which are ejected by an external power source from the bulb shell through the lamp base.
Description
Technical field
The present invention relates to lighting technical field, particularly relate to a kind of full-luminous high illuminance LED bulb and assemble method thereof.
Background technology
At present, all trades and professions all advocate environmental protection, and lighting field is no exception.At lighting field, due to LED long service life, energy consumption is low, economize energy is remarkable, therefore LED substitutes incandescent lamp and energy-saving fluorescent lamp has been widely used in daily life.Along with the raising of people's quality of life, the requirement of people to LED is also more and more higher, the LED silk lamp of particularly 4 π bright dippings, and full-luminous being used in decorative lighting and ambient lighting of its wide-angle is received by the market very much; But the LED silk lamp ubiquity dazzle of present 4 π bright dippings and aperture, hot spot, shadow, these defects that center point light intensity is on the weak side, uneven illumination is even, are not suitable for the requirement of high illumination operating illumination and Healthy Lighting.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of full-luminous high illuminance LED bulb and assemble method thereof, and main purpose overcomes current full-luminous LED to there is dazzle and the low defect of main illumination of working plane.
For achieving the above object, the present invention mainly provides following technical scheme:
On the one hand, the embodiment of the present invention provides a kind of full-luminous high illuminance LED bulb, comprises cell-shell, LED illuminator and lamp holder; Described LED illuminator is a kind of LED expansion light source, and it is made in printing opacity heat sink substrate by the naked brilliant bundled encapsulation of low-power LED chip;
Described LED illuminator is fixed in inner crossing with a lamp holder central axis plane of cell-shell, and penetrates the illuminating ray of high illumination from cell-shell by lamp holder connection external power.
Further, described LED illuminator is LED light engine;
Low-power LED chip, linear constant current chip, the naked crystalline substance of semiconductor devices are bundled in described printing opacity heat sink substrate encapsulates and are made by described LED light engine.
Further, naked for low-power LED chip brilliant bundled encapsulation is specially in printing opacity heat sink substrate: become by low-power LED chip the naked brilliant bundled encapsulation of circular arrangement in printing opacity heat sink substrate.
Further, the described LED illuminator bubble neck that is fixed on LED bulb to LED bulb cell-shell maximum gauge between.
Further, described printing opacity heat sink substrate is the super book high thermal conductivity substrate that Tapes has micro-shape aperture; Or Tapes has the stairstepping high thermal conductivity substrate of micro-shape aperture.
Further, described Tapes has the super book high thermal conductivity substrate of micro-shape aperture to be the super book high thermal conductivity substrate that below 0.5mm Tapes has micro-shape aperture.
Further, described substrate is fluorescence ceramics substrate, fluorescent glass substrate or fluorescent plastic substrate.
Further, described printing opacity heat sink substrate applies the nesa coating of 0.01mm ~ 5mm.
Further, described cell-shell is described cell-shell is frosted, milky or in whitewash glass bulb; Or for scribbling the cell-shell of 1 μm ~ 500 μm optical films or fluorescent powder film layer.
On the other hand, the embodiment of the present invention also provides a kind of method of assembling full-luminous high illuminance LED bulb, and described full-luminous high illuminance LED bulb is the full-luminous high illuminance LED bulb described in above-mentioned any one, and the method comprises:
Carry out the selection of full-luminous high illuminance LED bulb assembly according to making demand, described selection comprises LED illuminator selection, cell-shell is selected and lamp holder is selected; Described LED illuminator select be according to Software for Design distribution curve flux and effectively working region illumination requirement carry out the selection of fuzzy matching;
LED illuminator is fixed on the core column support with exhaust outlet and electric lead-out wire support, and core column horn mouth and cell-shell are sealed; Or directly LED illuminator to be fixed in cell-shell and to seal;
Vacuum seal, is filled with low viscosity high thermal conductivity heat radiation gas.
The full-luminous high illuminance LED bulb of one that the embodiment of the present invention proposes and assemble method thereof, this LED bulb illuminator a kind of to be made in printing opacity heat sink substrate LED expansion light source by the naked brilliant bundled encapsulation of low-power LED chip, there is provided enough light logical output, realize the full-luminous high illumination of LED bulb; And it is fixed in inner crossing with a lamp holder central axis plane of cell-shell, the defect that existing LED lamp silk lamp light-emitting section line source produces direct glare effectively can be overcome; Can overcome in existing LED lamp silk lamp simultaneously, the logical output of light of the lamp holder central axis plane that LED light-emitting section line source lengthwise position in cell-shell causes is low, there is aperture, hot spot, shadow, center point light intensity is on the weak side, uneven illumination is even and these defects.
Accompanying drawing explanation
The structural representation of a kind of full-luminous high illuminance LED bulb that Fig. 1 provides for the embodiment of the present invention;
The full-luminous high illuminance LED bulb structure schematic diagram of a kind of lamp neck position storing LED illuminator that Fig. 2 provides for the embodiment of the present invention;
A kind of full-luminous high illuminance LED bulb structure schematic diagram having reflectance coating that Fig. 3 provides for the embodiment of the present invention;
The distribution curve flux figure of a kind of full-luminous high illuminance LED bulb that Fig. 4 provides for the embodiment of the present invention;
The full-luminous high illuminance LED bulb structure schematic diagram of a kind of stem stem adjustment LED illuminator that Fig. 5 provides for the embodiment of the present invention;
A kind of core column structure schematic diagram with led photo engine that Fig. 6 provides for the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail.
To be supplied in effective working region that high light is logical to be exported at present, the LED bulb obtaining high illumination be encapsulated on a metal heat sink circuit board by LED chip mostly, a configuration metal heat sink with radiating fin or mould alclad radiator, driving power, a light transmission casing and an electric connector form; This metal heat sink LED bulb, the little what of lighting angle 180 degree, unsightly, dangerous, there is many defects, hinder the application of LED illumination; And the full-luminous LED transparent plastic bulb that all-plastic shell and transparency carrier make, the blow-by structure utilizing cross-ventilation to dispel the heat, also cannot make the full-luminous high illuminance LED bulb that high light leads to output.In addition, LED is a kind of spot light, if human eye looks at it straight, strong dazzle can be produced, in the visual field, stay next shadow, have a strong impact on eyesight, the direct glare that the light-emitting section of full-luminous LED silk lamp produces also is a kind of light pollution, and affect health, the shadow that LED silk lamp produces also allows people produce discomfort.
For solving the above problems, the embodiment of the present invention adopts printing opacity heat sink substrate to make illuminator, and is arranged on by the illuminator of making in inner crossing with a lamp holder central axis plane of cell-shell.Concrete, as shown in Figure 1, the embodiment of the present invention provides a kind of full-luminous high illuminance LED bulb, comprises cell-shell 1, LED illuminator 2 and lamp holder 3; Described LED illuminator 2 is a kind of LED expansion light sources, it is made in printing opacity heat sink substrate by the naked brilliant bundled encapsulation of low-power LED chip, this LED expansion light source is the light source that a kind of light-emitting area is larger, lighting angle is greater than 180 degree, it can be planar light source, curved surface light source, any special-shaped exiting surface light source; Described LED expansion light source is fixed in the inner plane intersected vertically with lamp holder central shaft 3a of cell-shell, and connects by lamp holder external power to penetrate high illumination illuminating ray from cell-shell 1.
Wherein, full-luminous high illuminance LED bulb, its illuminator a kind of to be made in printing opacity heat sink substrate LED expansion light source by the naked brilliant bundled encapsulation of low-power LED chip, there is provided enough light logical output, realize the full-luminous high illumination of LED bulb, and it is fixed in the inner plane crossing with lamp holder central axis of cell-shell and effectively can overcomes the defect that existing LED silk lamp light-emitting section line source produces direct glare; Can overcome in existing LED silk lamp, the logical output of light of the lamp holder central axis plane that LED light-emitting section line source lengthwise position in cell-shell causes is low, there is aperture, hot spot, shadow, these defects that center point light intensity is on the weak side, uneven illumination is even simultaneously.
Further, in order to strengthen the full-luminous high illumination of LED bulb, when printing opacity heat sink substrate encapsulates low-power LED chip, can select and become the naked brilliant bundled encapsulation of circular arrangement in printing opacity heat sink substrate low-power LED chip, also other decentralized arrangement can be adopted by naked for low-power LED chip brilliant bundled encapsulation in printing opacity heat sink substrate, concrete, the embodiment of the present invention does not limit this, the preferred circular arrangement of the present invention.
Wherein, it should be noted that, low-power LED chip in the embodiment of the present invention can for the small-power chip worked under 20mm electric current, and the concrete embodiment of the present invention does not also limit this, and other low-power LED chip also can be applied in the embodiment of the present invention according to real needs.
Further, in implementation process, in order to overcome different profile cell-shell LED bulb existing for dazzle, aperture, hot spot, shadow, center point light intensity is on the weak side, uneven illumination is even and these defect problems, described LED expansion light source can but be not limited to the bubble neck 1b that is fixed on LED bulb to LED bulb cell-shell 1 maximum gauge 1a between.Such as, as shown in Figure 2, this illuminator is placed on bubble neck 1b position.
The embodiment of the present invention is in the concrete process implemented, and this printing opacity heat sink substrate can be but be not limited to following substrate, and this substrate is specially the super book high thermal conductivity substrate that Tapes has micro-shape aperture; Or Tapes has the stairstepping high thermal conductivity substrate of micro-shape aperture.Wherein, this Tapes has super book high thermal conductivity substrate preferred below the 0.5mm Tapes of micro-shape aperture to have the super book high thermal conductivity substrate of micro-shape aperture.Above-mentioned two kinds of multi-form substrates can make the substrate of following material, are specially fluorescence ceramics substrate, fluorescent glass substrate or fluorescent plastic substrate.Certainly, in the specific implementation, the present invention does not also limit this, the substrate of the other materials that also can be fine.
The full-luminous high illuminance LED bulb that the embodiment of the present invention provides, except overcome dazzle existing for LED bulb, aperture, hot spot, shadow, center point light intensity is on the weak side, uneven illumination is even these defect problems by the composition of illuminator and setting position except, it also offers following method and overcome the problems referred to above further, be specially: the cell-shell of this full-luminous high illuminance LED bulb is frosted, milky or in whitewash glass bulb; Or become the cell-shell scribbling 1 μm ~ 500 μm optical films or fluorescent powder film layer, specifically as shown in Figure 3, the inner surface 1c of cell-shell 1 is scribbled 1 μm ~ 500 μm optical films or fluorescent powder film layer.By scribbling the cell-shell of 1 μm ~ 500 μm optical films or fluorescent powder film layer, secondary optical design adjustment is carried out to LED bulb, can low cost, effectively overcome direct glare, industrialization realizes free from glare, without the Healthy Lighting of shadow.
Further, in order to decrease the external LED driver of high cost, large degree of convergence reduces the overall cost of full-luminous high illuminance LED bulb, and in the embodiment of the present invention, this LED illuminator can be LED light engine, also can be independent illuminator.Concrete, the embodiment of the present invention does not limit this, when it is independent illuminator, this LED illuminator is the LED expansion light source naked for low-power LED chip brilliant bundled encapsulation be made in printing opacity heat sink substrate, and it needs the drive unit of power supply when being assembled into bulb.When this LED illuminator is LED light engine, this LED illuminator is low-power LED chip, linear constant current chip, the naked crystalline substance of semiconductor devices are bundled in described printing opacity heat sink substrate and encapsulate the LED light engine be made.The embodiment of the present invention preferably uses LED light engine.
Wherein, LED light engine (LED light engine) is for comprising the entire combination of LED (element) or LED array (module), LED driver and other optics, temperature, machinery and electrical equipment.LED light engine is as a standardized product, and different LED light engine according to different application scenarios, can be selected by different LED lamp producers, designs and make different LED lamp.Manufacturer of a lot of family can be had to produce in batches easily with a standardized LED light engine product simultaneously; Through the LED light engine of automatic or semi-automatic mass production, its life-span really can accomplish with luminescence chip the same life-span, makes the application quality of LED lamp give effective guarantee.
Low-power LED chip, linear constant current chip, the naked crystalline substance of semiconductor devices are bundled in described printing opacity heat sink substrate encapsulates and are made by the LED light engine of the embodiment of the present invention.Be specially: by printing opacity heat sink substrate, LED technology and linear constant current technology, optics, calorifics, machinery and electric, electronic component, merge the LED light engine having made full-luminous high illumination bulb.Wherein, naked core semiconductor components and devices comprises LED drive IC, control IC, sensing IC, communication IC naked core device; Low-power LED chip is the small-power chip worked under 20mm electric current.The present invention uses LED light engine to substitute LED light-emitting section and Conventional LED light sources, and without the need to other configuration driven power supply, decrease the external LED driver of high cost, large degree of convergence reduces the overall cost of LED bulb, is conducive to LED bulb popular.And, expansion light source is made photo engine device, directly can obtain distribution curve flux and effective working region illumination of primary optical design like this, then according to the method for designing of fuzzy matching, the design cost of whole lamp assembling secondary optics can be greatly reduced, as long as revised optical parameter by different cell-shell, just can cylinder list, make light easily and consume little high-power full-luminous high illumination bulb, under being applicable to different luminous environment, operating illumination is to the needs of illumination, be conducive to the industrialization realizing full-luminous high illumination bulb, push away the application of expanding LED illumination.
It should be noted that, when making LED expansion light source, the nesa coating of 0.01mm ~ 5mm can be applied in described printing opacity heat sink substrate, realize light path, circuit, the connection of hot road; After painting is covered with nesa coating, thermal capacity due to LED expansion light source micropore printing opacity heat sink substrate is far longer than the thermal capacity of the heat sink substrate of light-emitting section line source, the increase of thermal capacity is conducive to the heat transfer of led chip, owing to substituting original metal material printed circuit with nesa coating circuit.Decrease longitudinal thermal resistance of heat sink substrate, effectively reduce heat sink system thermal resistance, under the convection action of micropore, the expansion light source of specular removal can be worked at a lower temperature and play the advantage of its specular removal, with transparency conducting layer, really achieving optical, electrical, hot linked full-luminous LED light electric heating composite light source becomes industrialization product.
Based on above-mentioned full-luminous high illuminance LED bulb, the embodiment of the present invention also provides a kind of assemble method of full-luminous high illuminance LED bulb, and the method entirety comprises two steps, and first step is that bulb assembly is selected, and second step is the assembling of whole lamp.Concrete comprises following method:
Step 1, selects the building block of full-luminous high illuminance LED bulb, and this assembly comprises that LED illuminator 2 is selected, cell-shell 1 is selected, lamp holder 3 is selected.
It should be noted that, the selection of the building block of this step is the selection carrying out fuzzy matching according to the lamp distribution curve of the optical software setting shown in Fig. 4 and light fixture effective working region illumination requirement.Wherein fuzzy matching refers to by the watt level of LED chip and the adjustment arranging the position of binding, shape and method for packing in printing opacity heat sink substrate, and namely primary optical design carries out the distribution curve flux that is similar to and light fixture effective working region illumination coupling.
Wherein, the LED expansion light source that the naked brilliant bundled encapsulation of LED illuminator 2 selection low-power LED chip is made in printing opacity heat sink substrate, such as LED light engine, this LED light engine can become with the small-power chip worked under 20mm electric current annular array naked crystalline substance in garden to be bundled in described printing opacity heat sink substrate encapsulates and is made.Printing opacity heat sink substrate encapsulates the LED light engine of making, obtains distribution curve flux approximate as shown in Figure 4 and light fixture effective working region illumination; Wherein printing opacity heat sink substrate, as shown in Figure 5 and Figure 6, selection thickness 0.5mm Tapes has the circular of micro-shape aperture 2c to surpass the fluorescence ceramics substrate 2b of book high thermal conductivity; All to be coated with on substrate 2b two sides with film coating techniques and to be covered with transparent conductive film layer, then use semiconducter IC binding technology, naked crystalline substance binding led chip, linear constant current chip, semiconductor devices encapsulate and are made into LED light engine in printing opacity heat sink substrate; Favourable in order to dispel the heat, be bundled in fluorescence ceramics substrate front side with micropore by being arranged in Duo Ma garden annular 20ma small area analysis LED chip 2a; High-voltage linear constant current chip and naked core semiconductor components and devices are bundled in the reverse side (not representing in Fig. 6) of printing opacity heat sink substrate, the circuit made by transparent conductive film layer carries out electricity, heat connects; Heat dispersion is improved by micro-shape aperture 2c.
Wherein, cell-shell 1 is selected, can according to Market Selection by a kind of suitable shape 1 in the cell-shell of existing bulb, as: A-type, G-type, R-type, PAR-type, T-type, candle type or make a kind of suitable shape by oneself.And further can use frosted, milky or in whitewash glass bulb, or be coated with 1 μm ~ 500 μm optical films or fluorescent powder film layer on the cell-shell of bulb, realize the cell-shell of anti-dazzle effect, carry out secondary optical design adjustment.
Wherein, lamp holder 3 can select the E26 lamp holder commonly used; For the one in the electric connector of the existing bulb such as E40, E27, E26, E14, GU, to be adapted to be mounted within different lamp socket or light fixture.
Step 2, whole lamp assembling.
Carry out whole lamp assembling time, can adopt but be not limited to following method and realize, the method comprises:
First method, as shown in Figure 5 and Figure 6, regulates the full-luminous high illuminance LED bulb of LED illuminator with stem stem.Concrete, first by the position of LED illuminator in cell-shell, determine the length of core column support 4a, then LED illuminator is fixed on exhaust outlet and electric lead-out wire 4c, on the stem stem 4 of support 4a, again core column horn mouth 4b and glass cell-shell are sealed, vacuum seal, be filled with low viscosity high thermal conductivity heat radiation gas.The making of the full-luminous high illuminance LED glass bulb of realization gas dissipates heat, completes whole lamp after being welded by electric lead-out wire 4c assemble with lamp holder 3.Assembling is made into the full-luminous high illuminance LED bulb of distribution curve flux and the light fixture effective working region illumination substantially meeting setting.
Second method, as Fig. 2: by plastic containers vacuum processing technology, be directly fixed in transparent plastic cell-shell by LED illuminator particular manufacturing craft, then seal, vacuum seal, is filled with low viscosity high thermal conductivity heat radiation gas; The making of the full-luminous high illuminance LED plastics bulb of realization gas dissipates heat.Other technique is identical with embodiment one, no longer repeats.
Wherein in whole lamp assembling; described lamp holder 3 can also be built-in with electrical quantity adjustment assembly or electrical protection component or Based Intelligent Control assembly as required as electric connector; full-luminous so high illuminance LED bulb not only normally can be worked by the basic LED drive circuit in LED light engine; light modulation can also be added by additional Zu Jian Kuai; Based Intelligent Control; the functions such as wireless telecommunications, further expand application function and the application of full-luminous high illuminance LED bulb.
Through the above description of the embodiments, those skilled in the art can be well understood to the mode that the present invention can add required common hardware by software and realize, and can certainly pass through hardware, but in a lot of situation, the former is better embodiment.Based on such understanding, technical scheme of the present invention can embody with the form of software product the part that prior art contributes in essence in other words, this computer software product is stored in the storage medium that can read, as the floppy disk of computer, hard disk or CD etc., comprise some instructions and perform method described in each embodiment of the present invention in order to make a computer equipment (can be personal computer, server, or the network equipment etc.).
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (10)
1. a full-luminous high illuminance LED bulb, comprises cell-shell, LED illuminator and lamp holder; It is characterized in that, described LED illuminator is a kind of LED expansion light source, and it is made in printing opacity heat sink substrate by the naked brilliant bundled encapsulation of low-power LED chip;
Described LED illuminator is fixed in inner crossing with a lamp holder central axis plane of cell-shell, and penetrates the illuminating ray of high illumination from cell-shell by lamp holder connection external power.
2. full-luminous high illuminance LED bulb according to claim 1, it is characterized in that, described LED illuminator is LED light engine;
Low-power LED chip, linear constant current chip, the naked crystalline substance of semiconductor devices are bundled in described printing opacity heat sink substrate encapsulates and are made by described LED light engine.
3. full-luminous high illuminance LED bulb according to claim 2, it is characterized in that, naked for low-power LED chip brilliant bundled encapsulation is specially in printing opacity heat sink substrate: become by low-power LED chip the naked brilliant bundled encapsulation of circular arrangement in printing opacity heat sink substrate.
4. the full-luminous high illuminance LED bulb according to any one of claim 1-3, is characterized in that, the bubble neck that described LED illuminator is fixed on LED bulb to LED bulb cell-shell maximum gauge between.
5. full-luminous high illuminance LED bulb according to claim 4, is characterized in that, described printing opacity heat sink substrate is the super book high thermal conductivity substrate that Tapes has micro-shape aperture; Or Tapes has the stairstepping high thermal conductivity substrate of micro-shape aperture.
6. full-luminous high illuminance LED bulb according to claim 5, is characterized in that, described Tapes has the super book high thermal conductivity substrate of micro-shape aperture to be the super book high thermal conductivity substrate that below 0.5mm Tapes has micro-shape aperture.
7. full-luminous high illuminance LED bulb according to claim 6, is characterized in that, described substrate is fluorescence ceramics substrate, fluorescent glass substrate or fluorescent plastic substrate.
8. full-luminous high illuminance LED bulb according to claim 7, is characterized in that, described printing opacity heat sink substrate applies the nesa coating of 0.01mm ~ 5mm.
9. full-luminous high illuminance LED bulb according to claim 7, it is characterized in that, described cell-shell is frosted, milky or in whitewash glass bulb; Or for scribbling the cell-shell of 1 μm ~ 500 μm optical films or fluorescent powder film layer.
10. an assemble method for full-luminous high illuminance LED bulb, the full-luminous high illuminance LED bulb of described full-luminous high illuminance LED bulb according to any one of claim 1-9, the method comprises:
Carry out the selection of full-luminous high illuminance LED bulb assembly according to making demand, described selection comprises LED illuminator selection, cell-shell is selected and lamp holder is selected; Described LED illuminator select be according to Software for Design distribution curve flux and effectively working region illumination requirement carry out the selection of fuzzy matching;
LED illuminator is fixed on the core column support with exhaust outlet and electric lead-out wire support, and core column horn mouth and cell-shell are sealed; Or directly LED illuminator to be fixed in cell-shell and to seal;
Vacuum seal, is filled with low viscosity high thermal conductivity heat radiation gas.
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Application publication date: 20150930 |