CN104913217A - LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell - Google Patents
LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell Download PDFInfo
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- CN104913217A CN104913217A CN201510289846.6A CN201510289846A CN104913217A CN 104913217 A CN104913217 A CN 104913217A CN 201510289846 A CN201510289846 A CN 201510289846A CN 104913217 A CN104913217 A CN 104913217A
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- power supply
- substrate
- led
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- ledbulb lamp
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) bulb lamp with a driving power supply integrated in a bulb shell. The LED bulb lamp comprises the bulb shell, a core column, a power supply drive, multiple LED luminous lamp filaments, heat conduction gas and a lamp holder, wherein the power supply drive is fixedly arranged on the core column; the LED luminous lamp filaments are connected with the power supply drive; the bulb shell is filled with the heat conduction gas; the lamp holder is connected with the bulb shell; each LED luminous lamp filament comprises a substrate; the surface of each substrate is provided with a metal circuit and a bottom adhesive layer; two ends of each substrate are provided with metal pins; each substrate is fixedly provided with an LED luminous unit; each LED luminous unit is provided with a sealing adhesive layer. According to the LED bulb lamp disclosed by the invention, the power supply drive is arranged in the bulb shell, an existing manual assembling link is avoided, large-scale automatic production can be realized, and the production cost is substantially reduced; the lamp filaments adopt an optimized chip arranging type, the temperature of each substrate in different positions is nearly uniform, the luminous flux maintenance rate and the long-term reliability of the whole LED bulb lamp are increased, and the service life of the LED bulb lamp is prolonged.
Description
Technical field
The present invention relates to LED illumination device technical field, particularly relate to the LEDbulb lamp that a kind of driving power is integrated in cell-shell inside.
Background technology
The filament of traditional lighting light fixture generally by tungsten filament etc. can be directly luminous wire form, the defects such as this kind of filament ubiquity life-span is short, power consumption is large.LED light source has the features such as energy-conservation, long-lived, environmental protection, solid encapsulation, LED is made to instead of traditional lighting gradually, existing LED is generally provided with light emitting module, comprises square or circular support, is arranged on the LED chip of support side, and be coated on the lens on LED chip surface.And LED lamp bar adopts transparency carrier, do not use lens just can realize 360 ° of full angle luminescences, become three-dimensional light source, bring unprecedented lighting experience.
Application publication number is the Chinese utility model patent of CN103872227A, disclose a kind of manufacture method of LED mercerising source of 360 degree of luminescences, comprise the following steps: 1, weld a conductive pin respectively at transparency carrier two ends, adopt transparent insulation glue or milky white insulating cement to fix some LED luminescence chips in turn on the front of described transparency carrier; 2, at the front surface coated packaging silicon rubber of transparency carrier; 3, at the backside coating packaging silicon rubber of transparency carrier.But this LED mercerising source all will apply packaging silicon rubber at substrate positive and negative, complex procedures, and the cost of raw material is high, and there is the risk that chip blue light overflows in substrate side surfaces.
Application publication number is the Chinese utility model patent of CN103322525A, disclose a kind of manufacture method of LED silk, it adopts blue chip and red light chips hybrid combining, and then in sequential series by plain conductor, pin place, last connection substrate two ends forms connection circuit.But what this LED silk adopted is bipolar electrode red light chips, and its price is the several times of single electrode red light chips, cost intensive, and in addition, the chip chamber of this LED silk all adopts metal wire to weld, and can only form full series circuit, circuit form is single.
Chip in existing LED silk generally adopts equally spaced mode to arrange, but because substrate is elongate strip structure, the heat conduction of middle part is poorer than two sections of outlines, and therefore during filament spot, medium temperature is higher than two ends nearly 30 DEG C.The position that temperature is high, the reliability of filament can reduce, and high temperature too increases the attenuation degree of light simultaneously, and the service life of filament is reduced.
Application publication number is the Chinese invention patent of CN101968181A, disclose a kind of high light efficiency LED lamp preparation method, its adopts method driver being loaded lamp holder, and LED on the market also adopts this method mostly at present.But the finite volume of lamp holder, very difficult realization can to load in lamp holder and to meet the driver design of integration of safety, requirement of light regulation, and the driver size size of functional form often exceeds the volume of lamp holder model, causes loading.Although increase the problem that plastic can alleviate the restriction of lamp holder volume on certain model, the aesthetics of LED declines, and causes cost to increase.
Grant number is the European patent of EP2535640B1; disclose a kind of preparation method of LEDbulb lamp; its adopts hydrogen, helium or hydrogen helium gas mixture as protective gas, but along with people to improving with requiring in LED service life, finds that a kind of better protective gas is also extremely urgent.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide a kind of driving power to be integrated in the LEDbulb lamp of cell-shell inside.
The object of the invention is to be achieved through the following technical solutions: a kind of driving power is integrated in the LEDbulb lamp of cell-shell inside, comprising: the cell-shell of transparent, milky or colour, stem stem, the power supply driver be fixed on stem stem, LED light-emitting filament that multiple and described power supply driver is connected, the lamp holder that is connected with described cell-shell; Described stem stem, power supply driver and multiple LED light-emitting filament are sealed by cell-shell, and blanketing gas in cell-shell; Described stem stem comprises the bottom blast pipe, horn mouth pedestal and the wire that are sintered to one; Described LED light-emitting filament is connected with the output of power supply driver, forms series-parallel closed-loop path; The input of described power supply driver is connected with the wire of stem stem, and the wire of stem stem is connected with external AC or DC power supply by lamp holder.
Further, described power supply driver is fixed on horn mouth pedestal by machinery or gluing mode, and mechanical system is slot, welding, buckle, stubborn line or spiral.
Further, the substrate of described power supply driver is transparent wiring board, comprises glass plate, sapphire plate, ceramic wafer or plastic plate.
Further, reflectance coating is covered at the device surface of power supply driver.
Further, the substrate of described power supply driver is opaque wiring board, comprises pcb board, plastic plate, aluminium base or ceramic wafer.
Further, at the surface coverage reflectance coating of power supply driver.
Further, described gas is the one in hydrogen, helium, or two kinds mix gaseous mixture that is rear and inert gas by any proportioning; The volume ratio that described inert gas accounts for gaseous mixture is 0-30%; Described inert gas by nitrogen, neon, argon gas, Krypton, xenon one or more to mix by any proportioning and form.
Further, described stem stem, power supply driver and multiple LED light-emitting filament are sealed by cell-shell and are specially: before the inflation of envelope bubble, first described gas is carried out freezing processing, and then inflate.
Further, described LED light-emitting filament comprises substrate, and described substrate surface is provided with metallic circuit and primer layer, and two ends are provided with metal pins; Fixed L ED luminescence unit on metallic circuit; Described luminescence unit is communicated with the metal pins of metal wire with substrate two ends by metallic circuit; LED luminescence unit is provided with adhesive layer.
Further, fluorescent material is mixed with in described primer layer; Fluorescent material is mixed with in described adhesive layer; Described fluorescent material is made up of one or several in green emitting phosphor, yellow fluorescent powder, red fluorescence powder, and the mass ratio of encapsulation glue, green emitting phosphor, yellow fluorescent powder and red fluorescence powder is 100:0-30:5-50:0-10.
Further, described LED luminescence unit is made up of some upside-down mounting blue chips, or is made up of some other color chips except blue light, or is made up of some upside-down mounting blue chips and red light chips mixing.
Further, a part of device of described power supply driver is arranged on the metallic circuit of substrate.
Further, described substrate is glass substrate, and the metallization step of described glass substrate is as follows:
A. surface coarsening is carried out to glass substrate: by the method for physics or chemistry, selective process is carried out to described glass baseplate surface, glass baseplate surface is made to need metallized position to become crude, described physical method is processed glass baseplate surface by mechanical polishing, and described chemical method is corroded glass surface by hydrofluoric acid or sodium hydroxide solution;
B. wired foil: metal paste to be fixed on the glass baseplate surface through step a process by the method for serigraphy by described metallic circuit, or carries out circuit metallization by the mode of magnetron sputtering, evaporation.
Further, described LED light-emitting filament comprises substrate, and described substrate surface is provided with primer layer, and two ends are provided with metal pins; Fixed L ED luminescence unit on primer layer; LED luminescence unit is communicated with by the metal pins of metal wire with substrate two ends; LED luminescence unit is provided with adhesive layer.
Further, fluorescent material is mixed with in described primer layer; Fluorescent material is mixed with in described adhesive layer; Described fluorescent material is made up of one or several in green emitting phosphor, yellow fluorescent powder, red fluorescence powder, and the mass ratio of encapsulation glue, green emitting phosphor, yellow fluorescent powder and red fluorescence powder is 100:0-30:5-50:0-10.
Further, described LED luminescence unit is made up of some formal dress blue chips, or is made up of some other color chips except blue light, or is made up of some formal dress blue chips and red light chips mixing.
Further, the chip of described LED luminescence unit is evenly arranged, or dredge with centre, mode that two ends are close arranges.
Compared with prior art, the beneficial effect of technical solution of the present invention is: power supply driver is arranged in cell-shell, eliminates existing man-made assembly link, can realize large-scale automated production, significantly reduce production cost; Filament substrate surface applies to be mixed with the primer layer of fluorescent material, can effectively prevent chip blue light or ruddiness from overflowing, and eliminates the operation at described substrate back gluing again, enhances productivity and reduce material cost; Filament adopts the chip arrangement optimized, and the temperatures approach of substrate diverse location is even, improves whole lamp lux maintenance and long-term reliability, extends the service life of LED.
Accompanying drawing explanation
Fig. 1 is the LED light-emitting filament front view of the first case study on implementation;
Fig. 2 is the LED light-emitting filament side view of the first case study on implementation;
Fig. 3 is the LED light-emitting filament front view of the second case study on implementation;
Fig. 4 is the LED light-emitting filament front view of the 3rd case study on implementation;
Fig. 5 is the LED light-emitting filament front view of the 4th case study on implementation;
Fig. 6 is the LED light-emitting filament front view of the 5th case study on implementation;
Fig. 7 is the LED light-emitting filament front view of the 6th case study on implementation;
Fig. 8 is the structural representation of power supply driver;
Fig. 9 is the LED lamp bulb structure schematic diagram of the 7th embodiment;
Figure 10 is the LED lamp bulb structure schematic diagram of the 8th embodiment;
Figure 11 is the LED lamp bulb structure schematic diagram of the 9th to the 13 embodiment;
In figure, cell-shell 1, stem stem 2, bottom blast pipe 2-1, horn mouth pedestal 2-2, power supply driver 3, wire 4, LED light-emitting filament 5, lamp holder 6, substrate 7, metal pins 8, metallic circuit 9, primer layer 10, LED luminescence unit 11, upside-down mounting blue chip 11-1, formal dress blue chip 11-2, single electrode red light chips 11-3, bipolar electrode red light chips 11-4, metal wire 12, adhesive layer 13, PCB 14, resistance 15, electric capacity 16, inductance 17, diode 18, control chip 19, the output 20 of power supply driver, the input 21 of power supply driver.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but enforcement of the present invention is not limited to following content.
As shown in Figures 1 to 7, a kind of LED light-emitting filament that the embodiment of the present invention provides, comprising: substrate 7, be arranged on the metal pins 8 being positioned at described substrate 7 two ends, the metallic circuit 9 being applied to described substrate 7 surface, the primer layer 10 being applied to described substrate 7 surface, the adhesive layer 13 that is fixed on the LED luminescence unit 11 on described primer layer 10 and is covered on LED luminescence unit 11.A, B, C are three temperature test points of glass substrate.
As shown in Figure 8, a kind of LED power driver that the embodiment of the present invention provides, comprising: the output 20 of PCB 14, resistance 15, electric capacity 16, inductance 17, diode 18, control chip 19, power supply driver and the input 21 of power supply driver.The SM2082C that described control chip 19 can adopt the bright microelectronics in Shenzhen to produce realizes.
As shown in Fig. 9,10,11, a kind of LEDbulb lamp that the embodiment of the present invention provides, comprising: the cell-shell 1 of transparent, milky or colour, stem stem 2, the power supply driver 3 be fixed on stem stem 2, LED light-emitting filament 5 that multiple and described power supply driver 3 is connected, the lamp holder 6 that is connected with described cell-shell 1; Described stem stem 2, power supply driver 3 and multiple LED light-emitting filament 5 are sealed by cell-shell 1, and blanketing gas in cell-shell 1; Described stem stem 2 comprises bottom blast pipe 2-1, the horn mouth pedestal 2-2 and wire 4 that are sintered to one; Described LED light-emitting filament 5 is connected with the output 20 of power supply driver 3, forms series-parallel closed-loop path; The input 21 of described power supply driver 3 is connected with the wire of stem stem 2, and the wire of stem stem 2 is connected with external AC or DC power supply by lamp holder 6.
As shown in Figure 1, before metallic circuit 9 printing of LED light-emitting filament, the process of glass substrate 7 surface free, luminescence unit 11 is evenly arranged by 28 upside-down mounting blue chip 11-1 and is formed.
As shown in Figure 3, before metallic circuit 9 printing of LED light-emitting filament, selective process is carried out through mechanical polishing in glass substrate 7 surface, and luminescence unit 11 is alternately arranged by 28 upside-down mounting blue chip 11-1 and forms, and chip is 10,8,10 along the distributed number on primer layer 10 length direction.
As shown in Figure 4, before metallic circuit 9 printing of LED light-emitting filament, selective process is carried out through mechanical polishing in glass substrate 7 surface, and luminescence unit 11 is alternately arranged by 28 upside-down mounting blue chip 11-1 and forms, and chip is 11,6,11 along the distributed number on primer layer 10 length direction.
As shown in Figure 5, before metallic circuit 9 printing of LED light-emitting filament, selective corrosion is carried out through hydrofluoric acid in glass substrate 7 surface, luminescence unit 11 is alternately arranged by 21 upside-down mounting blue chip 11-1 and 7 single electrode red light chips 11-3 and is formed, and chip is 11,6,11 along the distributed number on primer layer 10 length direction.
As shown in Figure 6, glass substrate 7 surface of LED light-emitting filament is not processed and type metal circuit 9, luminescence unit 11 is alternately arranged by 21 formal dress blue chip 11-2 and 7 bipolar electrode red light chips 11-4 and is formed, and chip is 10,8,10 along the distributed number on primer layer 10 length direction.
As shown in Figure 7, before metallic circuit 9 printing of LED silk, selective corrosion is carried out through NaOH in glass substrate 7 surface, luminescence unit 11 is alternately arranged by 24 upside-down mounting blue chip 11-1 and 4 single electrode red light chips 11-3 and is formed, and chip is 10,8,10 along the distributed number on primer layer 10 length direction.
As shown in Figure 9, LED light-emitting filament, by connection, forms 4 and the LED of 1 serializer circuit.
As shown in Figure 10, LED light-emitting filament, by connection, forms 2 strings 2 and the LED of circuit.
As shown in figure 11, LED light-emitting filament, by connection, forms 4 strings 1 and the LED of circuit.
The correlation performance parameters of LED light-emitting filament is obtained prepared by table 1 embodiment 1-6
From the embodiment that above form provides, by the mix and match of red light chips and blue chip, the colour rendering index of LED is significantly improved; By optimizing the arrangement mode of chip on substrate, filament diverse location can be made to reach temperature close; Use the method for physics or chemistry to carry out selective process to described glass baseplate surface, the adhesion of metallic circuit and glass substrate can be significantly improved.
The correlation performance parameters of LED is obtained prepared by table 2 embodiment 7-13
From the embodiment that above form provides; by adopting the mist of hydrogen helium, nitrogen neon helium, neon helium, argon helium, krypton helium or xenon helium as protective gas; obviously can improve the steady-state light flux of LED, and obtain higher lux maintenance when lighting for a long time.
Above-described embodiment is only used for explaining and the present invention is described, instead of limits the invention, and in the protection domain of spirit of the present invention and claim, any amendment make the present invention and change, all fall into protection scope of the present invention.
Claims (17)
1. a driving power is integrated in the LEDbulb lamp of cell-shell inside, it is characterized in that, comprising: the cell-shell (1) of transparent, milky or colour, stem stem (2), the power supply driver (3) be fixed on stem stem (2), LED light-emitting filament (5) that multiple and described power supply driver (3) is connected, the lamp holder (6) that is connected with described cell-shell (1); Described stem stem (2), power supply driver (3) and multiple LED light-emitting filament (5) are sealed by cell-shell (1), and blanketing gas in cell-shell (1); Described stem stem (2) comprises the bottom blast pipe (2-1), horn mouth pedestal (2-2) and the wire (4) that are sintered to one; Described LED light-emitting filament (5) is connected with the output (20) of power supply driver (3), forms series-parallel closed-loop path; The input (21) of described power supply driver (3) is connected with the wire (4) of stem stem (2), and the wire (4) of stem stem (2) is connected with external AC or DC power supply by lamp holder (6).
2. a kind of LEDbulb lamp according to claim 1, is characterized in that: described power supply driver (3) is fixed on horn mouth pedestal (2-2) by machinery or gluing mode, and mechanical system is slot, welding, buckle, stubborn line or spiral.
3. a kind of LEDbulb lamp according to claim 1, is characterized in that: the substrate of described power supply driver (3) is transparent wiring board, comprises glass plate, sapphire plate, ceramic wafer or plastic plate.
4. a kind of LEDbulb lamp according to claim 3, is characterized in that: cover reflectance coating at the device surface of power supply driver (3).
5. a kind of LEDbulb lamp according to claim 1, is characterized in that: the substrate of described power supply driver (3) is opaque wiring board, comprises pcb board, plastic plate, aluminium base or ceramic wafer.
6. a kind of LEDbulb lamp according to claim 5, is characterized in that: at the surface coverage reflectance coating of power supply driver (3).
7. a kind of LEDbulb lamp according to claim 1, is characterized in that: described gas is the one in hydrogen, helium, or two kinds mix gaseous mixture that is rear and inert gas by any proportioning; The volume ratio that described inert gas accounts for gaseous mixture is 0-30%; Described inert gas by nitrogen, neon, argon gas, Krypton, xenon one or more to mix by any proportioning and form.
8. a kind of LEDbulb lamp according to claim 1, it is characterized in that: described stem stem (2), power supply driver (3) and multiple LED light-emitting filament (5) are sealed by cell-shell (1) and be specially: before the inflation of envelope bubble, first described gas is carried out freezing processing, and then inflate.
9. a kind of LEDbulb lamp according to claim 1, is characterized in that: described LED light-emitting filament (5) comprises substrate (7), and described substrate (7) surface is provided with metallic circuit (9) and primer layer (10), and two ends are provided with metal pins (8); At the upper fixed L ED luminescence unit (11) of metallic circuit (9); Described luminescence unit (11) is communicated with the metal pins (8) at substrate (7) two ends with metal wire (12) by metallic circuit (9); LED luminescence unit (11) is provided with adhesive layer (13).
10. a kind of LEDbulb lamp according to claim 9, is characterized in that: described primer layer is mixed with fluorescent material in (10); Described adhesive layer is mixed with fluorescent material in (13); Described fluorescent material is made up of one or several in green emitting phosphor, yellow fluorescent powder, red fluorescence powder, and the mass ratio of encapsulation glue, green emitting phosphor, yellow fluorescent powder and red fluorescence powder is 100:0-30:5-50:0-10.
11. a kind of LEDbulb lamp according to claim 9, it is characterized in that: described LED luminescence unit (11) is made up of some upside-down mounting blue chips, or be made up of some other color chips except blue light, or be made up of some upside-down mounting blue chips and red light chips mixing.
12. a kind of LEDbulb lamp according to any one of claim 9-11, is characterized in that: a part of device of described power supply driver (3) is arranged on the metallic circuit (9) of substrate (7).
13. a kind of LEDbulb lamp according to claim 9, is characterized in that: described substrate (7) is glass substrate, and the metallization step of described glass substrate is as follows:
A. surface coarsening is carried out to glass substrate: by the method for physics or chemistry, selective process is carried out to described glass baseplate surface, glass baseplate surface is made to need metallized position to become crude, described physical method is processed glass baseplate surface by mechanical polishing, and described chemical method is corroded glass surface by hydrofluoric acid or sodium hydroxide solution;
B. wired foil: metal paste to be fixed on the glass baseplate surface through step a process by the method for serigraphy by described metallic circuit, or carries out circuit metallization by the mode of magnetron sputtering, evaporation.
14. a kind of LEDbulb lamp according to claim 1, is characterized in that: described LED light-emitting filament (5) comprises substrate (7), and described substrate (7) surface is provided with primer layer (10), and two ends are provided with metal pins (8); At the upper fixed L ED luminescence unit (11) of primer layer (10); LED luminescence unit (11) is communicated with the metal pins (8) at substrate (7) two ends by metal wire (12); LED luminescence unit (11) is provided with adhesive layer (13).
15. a kind of LEDbulb lamp according to claim 14, is characterized in that: described primer layer is mixed with fluorescent material in (10); Described adhesive layer is mixed with fluorescent material in (13); Described fluorescent material is made up of one or several in green emitting phosphor, yellow fluorescent powder, red fluorescence powder, and the mass ratio of encapsulation glue, green emitting phosphor, yellow fluorescent powder and red fluorescence powder is 100:0-30:5-50:0-10.
16. a kind of LEDbulb lamp according to claim 14, it is characterized in that: described LED luminescence unit (11) is made up of some formal dress blue chips, or be made up of some other color chips except blue light, or be made up of some formal dress blue chips and red light chips mixing.
17. LEDbulb lamp according to claim 11 or 16, is characterized in that: the chip of described LED luminescence unit (11) is evenly arranged, or dredge with centre, mode that two ends are close arranges.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510289846.6A CN104913217A (en) | 2015-05-29 | 2015-05-29 | LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510289846.6A CN104913217A (en) | 2015-05-29 | 2015-05-29 | LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell |
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