CN104915614B - Magnetic head and card reader - Google Patents
Magnetic head and card reader Download PDFInfo
- Publication number
- CN104915614B CN104915614B CN201410084278.1A CN201410084278A CN104915614B CN 104915614 B CN104915614 B CN 104915614B CN 201410084278 A CN201410084278 A CN 201410084278A CN 104915614 B CN104915614 B CN 104915614B
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- chip
- attachment
- film
- magnetic induction
- magnetic head
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Abstract
The present invention provides a kind of magnetic head, including chip, wiring board and attachment, the chip includes substrate, magnetic induction film and chip bonding pad, the magnetic induction film and the chip bonding pad are set to the surface of the substrate, input/output terminal with the magnetic induction film corresponding electrical connection of the chip bonding pad as the chip；Wiring and circuit pads, circuit pads electrical connection corresponding with the wiring are equipped on the wiring board；The attachment is fixed on the wiring board, and the chip is fixed on the side of the attachment, moreover, the direction of the top surface of the chip and the top surface of the attachment is consistent, the magnetic induction film is set to the side of the chip；The electrical connection corresponding with the attachment pad of the attachment is set to of the input/output terminal of the chip, circuit pads electrical connection corresponding with the attachment pad.The magnetic head high sensitivity, long service life.In addition, the present invention also provides a kind of card reader.
Description
Technical field
The present invention relates to a kind of magnetic head and include the card reader of the magnetic head.
Background technique
Magnetic card, which passes through the magnetic stripe set in the inner, can be used for recording customer information, personal authentication etc., greatly facilitate people
Daily life.At the same time, it is also widely used for reappearing the card reader for the magnetic information being recorded in magnetic card.Magnetic head is
The critical component of card reader, i.e. card reader are the magnetic informations read in magnetic card by magnetic head, and the sensitivity of magnetic head determines reading
The sensitivity of card device.In actual use, the distance between the detection faces of magnetic head and magnetic card are smaller, and the sensitivity of card reader is got over
It is high.
Summary of the invention
The technical problem to be solved in the present invention is to for drawbacks described above present in card reader, provide a kind of magnetic head and reading
Card device, high sensitivity, and also it is easy to make, at low cost.
For this purpose, the present invention provides a kind of magnetic head, comprising:
Chip, the chip include substrate, magnetic induction film and chip bonding pad, and the magnetic induction film and the chip bonding pad are set
In the surface of the substrate, the chip bonding pad corresponding with the magnetic induction film is electrically connected as the input/output terminal of the chip
It connects；
Wiring board is equipped with wiring and circuit pads, the circuit pads and the wiring pair on the wiring board
It should be electrically connected；
It further include attachment, the attachment is fixed on the wiring board, and the chip is fixed on the side of the attachment, and
And the direction of the top surface of the chip and the top surface of the attachment is consistent, the magnetic induction film is set to the side of the chip；Institute
State the input/output terminal electrical connection corresponding with the attachment pad of the attachment is set to of chip, the circuit pads and the attachment
The corresponding electrical connection of pad.
Wherein, the magnetic induction film is arranged against the top surface of the chip.
Wherein, the top surface of the chip is not less than the top surface of the attachment.
Wherein, the chip bonding pad and the magnetic induction film are set to the same face of the chip, the chip bonding pad and institute
Attachment pad is stated to be electrically connected by conductive metal wire.
Wherein, the shortest distance between the magnetic induction film and the top surface of the chip is less than 50 microns.
Wherein, the chip includes 2n magnetic induction film, and every two magnetic induction films form a favour stone half-bridge, conformal
At n favour stone half-bridge；Alternatively, the chip includes magnetic induction film described in 4m item, every four magnetic induction films form a favour
Stone full-bridge forms m favour stone full-bridge altogether；Alternatively, the chip includes L magnetic induction film, every magnetic induction film shape
At a single armed resistance or impedor, L single armed resistance or impedor are formed altogether；Wherein, the integer that n, m, L are >=1.
Wherein, the magnetic induction film includes gmr film, giant magnetic impedance film, Hall effect film, anisotropic magnetoresistive film, tunnel
Effect magnetoresistive film or giant Hall effect film.
It wherein, further include shell, the chip, the wiring board and the attachment are set in the shell.
Wherein, it is additionally provided with window in the detection faces of the shell, the chip in the shell and the window
Position it is opposite.
It wherein, further include encapsulated layer, for encapsulating the chip, the attachment and the supporter.
Wherein, the attachment uses ceramic material.
The present invention also provides a kind of card reader, including magnetic head, the magnetic head uses magnetic head provided by the invention.
The invention has the following advantages:
Magnetic head provided by the invention, including attachment, chip is set to the side of attachment, and magnetic induction film is set to the chip
Side, can make magnetic induction film close to the detection faces of magnetic head in this way, reduce the distance between magnetic induction film and measured medium, from
And improve the sensitivity of magnetic head；Moreover, the welding of chip bonding pad and conductive metal wire is made not influence magnetic induction film and measured medium
The distance between and the pad of avoidable chip bonding pad and conductive metal wire fall off, improve the service life of magnetic head.
Card reader high sensitivity provided by the invention, and long service life.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of magnetic head of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of chip of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another kind of embodiment of the present invention attachment；
Fig. 4 is the structural schematic diagram of another embodiment of the present invention magnetic head.
Specific embodiment
To make those skilled in the art more fully understand technical solution of the present invention, the present invention is mentioned with reference to the accompanying drawing
The magnetic head and card reader of confession are described in detail.
As shown in Figure 1, magnetic head includes chip 1, wiring board 2 and attachment 3, chip 1 is fixed on the side of attachment 3, and attachment 3 is solid
Due to the top surface of wiring board 2.It should be noted that the top surface mentioned by the present embodiment is upper surface shown in Fig. 1, it is such as attached
The top surface of part 3 just refers to the upper surface of attachment 3 shown in FIG. 1；Bottom surface is the face opposite with top surface, i.e. following table shown in Fig. 1
Face refers to the lower surface of attachment 3 shown in FIG. 1 if the bottom surface of attachment 3；Side is the face being clipped between top and bottom.Core
The top surface of piece 1 and the top surface of attachment 3 and the distance between measured medium are minimum.
Chip 1 includes substrate 11, magnetic induction film 12 and chip bonding pad 13, and magnetic induction film 12 and chip bonding pad 13 are set to substrate
11 the same face, and input/output terminal with magnetic induction film 12 corresponding electrical connection of the chip bonding pad 13 as chip.Substrate 11 is adopted
With silicon substrate or Sapphire Substrate or other suitable substrates.
In the present embodiment, as shown in Fig. 2, chip 1 includes two magnetic induction films 12 and three chip bonding pads 13, three cores
The electrical connection corresponding with two magnetic induction films 12 of piece pad 13, to form favour stone half-bridge circuit.When 1 induced magnetic field of chip, favour
Stone half-bridge circuit can output difference voltage signal.In fact, chip 1 may include 2n magnetic induction film 12, every two magnetic strengths
It answers film 12 to form a favour stone half-bridge, forms n favour stone half-bridge altogether；Alternatively, each chip includes 4m magnetic induction film 12, often
Four magnetic induction films 12 form a favour stone full-bridge, form m favour stone full-bridge altogether；Alternatively, chip includes L magnetic induction film
12, every magnetic induction film 12 forms a single armed resistance or impedor, forms L single armed resistance or impedor altogether；Wherein, n,
M, the integer that L is >=1.In other words, chip 1 may include multiple output channels.Magnetic induction film can be gmr film, giant magnetic impedance
Film, Hall effect film, anisotropic magnetoresistive film, tunnel-effect magnetoresistive film or giant Hall effect film.In addition, each magnetic head can wrap
On one or more chips 1 are included, each chip 1 may include one or more output channels.
Attachment 3 uses ceramic material.Attachment pad 31 is equipped in the side of attachment 3.As shown in Figure 1, chip 1 is fixed
In the side of attachment 3, and the face for making chip 1 that magnetic induction film 12 be arranged is located at the side of chip 1.Moreover, chip bonding pad 13 and magnetic
Sense film 12 is set to the same face of substrate 11, the i.e. side that is located at chip 1 of chip bonding pad 13, to reduce the cost of manufacture of chip 1.
It should be noted that, the side of chip 1 is for the top surface of chip 1, and the top surface of chip 1 refers in chip 1 herein
The face nearest apart from measured medium.The top surface of chip 1 and the top surface of attachment 3 are also considered as the detection faces of magnetic head.In attachment 3
On can also be arranged in pairs attachment pad 31, each pair of attachment pad 31 is electrically connected, one and chip in each pair of attachment pad 31
Pad 13 is electrically connected, another is electrically connected with circuit pads.
Attachment pad 31 and chip bonding pad 13 are electrically connected by conductive metal wire (such as gold thread) 6.In welding conductive metal line 6
When with chip bonding pad 13, the top of conductive metal wire 6 is higher by dozens or even hundreds of micron than chip bonding pad 13.If by chip
The face of 1 setting magnetic induction film 12 is set as the face nearest apart from measured medium, then the weldering of conductive metal wire 6 and chip bonding pad 13
Connecing not only will increase the distance between magnetic induction film 12 and measured medium, but also the welding of conductive metal wire 6 and chip bonding pad 13
Point is easy to fall off in use.The present embodiment chip bonding pad 13 is not set in the face nearest apart from measured medium, therefore, core
The electrical connection of piece pad 13 and conductive metal wire 6 does not influence at a distance from magnetic induction film 12 and measured medium；Moreover, because conductive gold
Belong to the pad of line 6 and chip bonding pad 13 not in the detection faces of magnetic head, in use conductive metal wire 6 and chip bonding pad 13
Pad it is not easy to fall off.
Preferably, magnetic induction film 12 is arranged against the top surface of chip 1, i.e., magnetic induction film 12 is set to the side of chip 1 and leans on
Its nearly top surface side, and be to try to close to the top surface of chip 1, to reduce the distance between magnetic induction film 12 and measured medium,
To improve the sensitivity of magnetic head.It is highly preferred that the shortest distance between magnetic induction film 12 and the top surface of chip 1 is micro- less than 50
The sensitivity of magnetic head not only can be improved in this way, but also magnetic induction film 12 can have been avoided impaired during processing magnetic head for rice.
In the present embodiment, the top surface of chip 1 is flushed with the top surface of attachment 3.However, the present invention is not limited thereto.It is real
On border, the top surface of chip 1 can be higher than the top surface of attachment 3, can also be lower than the top surface of attachment 3.When the top surface of chip 1 is lower than attached
When the top surface of part 3, the distance between magnetic induction film 12 and measured medium are larger, and the sensitivity of magnetic head is poor.It is therefore preferable that chip
1 top surface is not less than the top surface of attachment 3.
Attachment pad 31 is set to the side of attachment 3.In fact, as shown in figure 3, attachment pad 31 can also be divided into two
Point, i.e., a part of attachment pad 31 is located at the side of attachment 3, and another part attachment pad 31 is located at the bottom surface of attachment 3.It uses
When, as shown in figure 4, the part that attachment pad 31 is located at 3 side of attachment is electrically connected with chip bonding pad 13 by the way that conductive metal wire 6 is corresponding
It connects, attachment pad 31 is located at the part electrical connection directly corresponding with the circuit pads of wiring board 2 are set to of 3 bottom surface of attachment, that is, will
The part that attachment pad 31 is located at 3 bottom surface of attachment is stacked and welds with circuit pads, can save conductive metal wire in this way, and
And welding is than stronger, when use, is not easily to fall off.
Assist side 2 is equipped with first line plate pad 21a, the second circuit pads 21b and wiring 22, and First Line
Road plate pad 21a and the second circuit pads 21b passes through the corresponding electrical connection of wiring 22.Attachment pad 31 passes through conductive metal wire 6
Electrical connection corresponding with first line plate pad 21a.Second circuit pads 21b is labeling pad or connect with capillary 7, is used for magnetic
Head is electrically connected with other components.
When attachment pad 31 includes two parts, attachment 3 and wiring board 2 are stacked first, and make attachment pad 31 and the
The position of one circuit pads 21a is corresponding；Then by the welding corresponding with first line plate pad 21a of attachment pad 31.It is this to set
The mode of setting is not only contributed to the electrical connection of attachment 3 and wiring board 2, and since the solder joint of attachment 3 and wiring board 2 is located at attachment
Between wiring board 2, the solder joint of attachment 3 and wiring board 2 is stablized, not easily to fall off.
In the present embodiment, magnetic head further includes encapsulated layer (not shown), for encapsulating chip 1, wiring board 2 and attachment
3, encapsulated layer can both protect chip 1, wiring board 2 and attachment 3, improve the service life of magnetic head, and the aesthetics of magnetic head can be improved.
In another embodiment, magnetic head can further include shell, and chip 1, wiring board 2, attachment 3 are set in shell, then use
Packaging plastic is encapsulated fixation.During installation, the top surface of chip 1 and attachment 3 is made to be close to the inner surface of shell detection faces, shell
Detection faces are that shell distance is detected the nearest face of medium.Window through thickness of shell can also be set in the detection faces of shell
Mouthful, when chip 1 is placed in shell, chip 1 is opposite with the position of window.
Due to the limitation of cost of manufacture, the size of chip 1 is smaller.But the function of realizing wiring board 2, as wiring board 2 needs
It to be electrically connected with capillary 7, or even also need that amplifying circuit or filter circuit is arranged, therefore, the size of wiring board 2 is larger.However,
Attachment 3 has a single function, and does not need to be electrically connected with capillary, does not also need setting amplifying circuit or filter circuit, the size of attachment 3
It can arbitrarily enlarged according to the design needs or diminution.The size that magnetic head top can be reduced by attachment 3 will be enlarged by the application of magnetic head
Range.In addition, the chip 1 for being fixed on wiring board 2 is difficult to detect against shell when chip 1 and wiring board 2 to be set in shell
Face causes the distance between chip 1 and measured medium larger.Attachment 3 can reduce the distance between chip 1 and measured medium.
In addition, the pad of chip bonding pad 13 and conductive wire can be made to be set to the side of magnetic head by attachment 3, this is not
It only can reduce the distance between chip 1 and measured medium, and the welding of chip bonding pad 13 Yu conductive wire can be improved
Fastness, improve the service life of magnetic head.
Magnetic head provided by the above embodiment includes attachment, and chip is set to the side of attachment, and magnetic induction film is set on described
The side of chip can make magnetic induction film close to the detection faces of magnetic head in this way, reduce between magnetic induction film and measured medium away from
From to improve the sensitivity of magnetic head；Moreover, making the welding of chip bonding pad and conductive metal wire not influences magnetic induction film and is tested
The pad of the distance between medium and avoidable chip bonding pad and conductive metal wire falls off, and that improves magnetic head uses the longevity
Life.
In addition, the present invention also provides a kind of card reader, including magnetic head and processor, magnetic head is using provided by the above embodiment
Magnetic head, for incuding the magnetic signal of measured medium and output voltage signal.The output end of magnetic head is connect with processor, processor according to
Required information is obtained according to the voltage signal of magnetic head output.The card reader high sensitivity, and long service life.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (11)
1. a kind of magnetic head, comprising:
Chip, the chip include substrate, magnetic induction film and chip bonding pad, and the magnetic induction film and the chip bonding pad are set to institute
State the surface of substrate, input/output terminal with the magnetic induction film corresponding electrical connection of the chip bonding pad as the chip；
Wiring board is equipped with wiring and circuit pads, circuit pads electricity corresponding with the wiring on the wiring board
Connection；
It is characterized in that, further including attachment, the attachment is fixed on the wiring board, and the chip is fixed on the side of the attachment
Face, moreover, the direction of the top surface of the chip and the top surface of the attachment is consistent, the magnetic induction film and the chip bonding pad are set
In the side of the chip, the magnetic induction film is arranged against the top surface of the chip；The chip bonding pad be set to it is described attached
The corresponding electrical connection of the attachment pad of part, circuit pads electrical connection corresponding with the attachment pad, and also chip bonding pad is not
It is set to the face nearest apart from measured medium.
2. magnetic head according to claim 1, which is characterized in that the top surface of the chip is not less than the top surface of the attachment.
3. magnetic head according to claim 1, which is characterized in that the chip bonding pad and the magnetic induction film are set to the core
The same face of piece, the chip bonding pad are electrically connected with the attachment pad by conductive metal wire.
4. magnetic head according to claim 1, which is characterized in that between the magnetic induction film and the top surface of the chip most
Short distance is less than 50 microns.
5. magnetic head according to claim 1, which is characterized in that the chip includes 2n magnetic induction film, described in every two
Magnetic induction film forms a favour stone half-bridge, forms n favour stone half-bridge altogether；Alternatively, the chip includes magnetic induction described in 4m item
Film, every four magnetic induction films form a favour stone full-bridge, form m favour stone full-bridge altogether；Alternatively, the chip includes L
Magnetic induction film, every magnetic induction film form a single armed resistance or impedor, form L single armed resistance or impedance element altogether
Part；Wherein, the integer that n, m, L are >=1.
6. magnetic head according to claim 1, which is characterized in that the magnetic induction film include giant magnetoresistance film, giant magnetic impedance film,
Hall effect film, anisotropic magnetoresistive film, tunnel-effect magnetoresistive film or giant Hall effect film.
7. magnetic head according to claim 1, which is characterized in that it further include shell, the chip, the wiring board and described
Attachment is set in the shell.
8. magnetic head according to claim 7, which is characterized in that be additionally provided with window in the detection faces of the shell, be set to institute
The chip stated in shell is opposite with the position of the window.
9. magnetic head according to claim 1, which is characterized in that further include encapsulated layer, for encapsulating the chip and described
Attachment.
10. magnetic head according to claim 1, which is characterized in that the attachment uses ceramic material.
11. a kind of card reader, including magnetic head, which is characterized in that the magnetic head is magnetic described in claim 1-10 any one
Head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410084278.1A CN104915614B (en) | 2014-03-10 | 2014-03-10 | Magnetic head and card reader |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410084278.1A CN104915614B (en) | 2014-03-10 | 2014-03-10 | Magnetic head and card reader |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104915614A CN104915614A (en) | 2015-09-16 |
| CN104915614B true CN104915614B (en) | 2019-03-19 |
Family
ID=54084673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410084278.1A Expired - Fee Related CN104915614B (en) | 2014-03-10 | 2014-03-10 | Magnetic head and card reader |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104915614B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2379876Y (en) * | 1999-06-04 | 2000-05-24 | 华南师范大学 | Magnetic head made of stibium-indium series semiconductor magnet resistor |
| CN203275621U (en) * | 2013-06-17 | 2013-11-06 | 北京嘉岳同乐极电子有限公司 | Magnetic sensor |
| CN103512588A (en) * | 2012-06-29 | 2014-01-15 | 北京嘉岳同乐极电子有限公司 | Long magnetic sensor and manufacturing method thereof |
| CN103576101A (en) * | 2012-07-31 | 2014-02-12 | 北京嘉岳同乐极电子有限公司 | Multi-channel integrated type magnetic sensor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7753275B2 (en) * | 2007-09-17 | 2010-07-13 | Verifone, Inc. | Magnetic card reader, especially for point of sale terminals |
-
2014
- 2014-03-10 CN CN201410084278.1A patent/CN104915614B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2379876Y (en) * | 1999-06-04 | 2000-05-24 | 华南师范大学 | Magnetic head made of stibium-indium series semiconductor magnet resistor |
| CN103512588A (en) * | 2012-06-29 | 2014-01-15 | 北京嘉岳同乐极电子有限公司 | Long magnetic sensor and manufacturing method thereof |
| CN103576101A (en) * | 2012-07-31 | 2014-02-12 | 北京嘉岳同乐极电子有限公司 | Multi-channel integrated type magnetic sensor |
| CN203275621U (en) * | 2013-06-17 | 2013-11-06 | 北京嘉岳同乐极电子有限公司 | Magnetic sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104915614A (en) | 2015-09-16 |
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Granted publication date: 20190319 Termination date: 20200310 |