CN104915321A - Immersion type phase-change cooling high-density computing system - Google Patents
Immersion type phase-change cooling high-density computing system Download PDFInfo
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- CN104915321A CN104915321A CN201510302395.5A CN201510302395A CN104915321A CN 104915321 A CN104915321 A CN 104915321A CN 201510302395 A CN201510302395 A CN 201510302395A CN 104915321 A CN104915321 A CN 104915321A
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- 238000001816 cooling Methods 0.000 title claims abstract description 31
- 238000007654 immersion Methods 0.000 title claims abstract description 25
- 238000002791 soaking Methods 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 25
- 239000002826 coolant Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005057 refrigeration Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an immersion type phase change cooling high-density computing system, which relates to the field of high-density computing and comprises a sealed cabinet and a plurality of computing nodes arranged in the sealed cabinet, wherein a sealed top cover is additionally arranged at the top of the sealed cabinet, low-boiling-point cooling liquid for soaking the computing nodes to dissipate heat is filled in the sealed cabinet, at least three main boards are arranged in the computing nodes, two double-path CPUs are arranged on each main board, high-density deployment of the CPUs in a limited computing node space is realized, and meanwhile, a condenser is arranged on the inner side of the sealed top cover. The computing system realizes high-density CPU deployment in a limited computing space, and meets the continuously-improved high-density computing requirement of the industry; an immersion type phase change cooling heat dissipation structure is adopted, and the problems of heat dissipation and noise caused by high-density calculation are solved.
Description
Technical field
The present invention relates to high density and calculate field, specifically a kind of immersion Phase cooling high density computing system.
Background technology
Along with the fast development of internet, cloud computing and large data message technology are also arisen at the historic moment thereupon.Especially the mass data of current internet industry is carried out gathering, classifies, analyzes, processes, is stored.Carrying main body-the data center of current network data, its space is occupied by the server of thousands of online, storage rack, along with the continuous increase of Internet service amount, the calculated amount of data center network data is more and more higher, in limited space, obtain larger computing power, improve bulk density and become industry requirement.But the lifting of computing system computing power is large to the increasing pressure of cooling system.
Summary of the invention
The present invention is directed to the weak point that prior art exists, propose a kind of immersion Phase cooling high density computing system, its objective is in limited space, realize highdensity computing power, meet the high density computation requirement that industry constantly promotes.
A kind of immersion Phase cooling high density computing system of the present invention, the technical scheme solving the problems of the technologies described above employing is as follows: described immersion Phase cooling high density computing system, comprise a sealing cabinet and be arranged on the some computing nodes in described sealing cabinet, described sealing cabinet top installs top pressure closure additional, the low boiling liquid coolant of soaking computing node and being dispelled the heat is filled with in described sealing cabinet, at least three mainboards are provided with in described computing node, and each mainboard is provided with two pieces of two-way CPU, realize CPU high-density deployment in limited computing node space, be provided with condenser between described top pressure closure and computing node simultaneously, when top pressure closure fastens, when in rack, computing node runs, the heat conduction that computing node produces is to liquid coolant, and cooling liquid steam is cooled by the condenser of top, the liquid coolant liquefied refluxes in rack, realizes the Phase cooling process of this high density computing system.
Preferably, described top pressure closure is rotatably connected with described sealing cabinet sidewall, and opposing seal rack can Unscrew.
Preferably, described condenser adopts hose connecting structure, along with described top pressure closure rotation direction rotating opening, can not affect computing node plug and safeguard.
Preferably, described sealing cabinet sidewall is provided with some node fixed guides, can be erected by computing node described in node fixed guide and be inserted in rack.
Preferably, described computing node is 1U node, is provided with three mainboards in described computing node, each mainboard is provided with two pieces of two-way CPU.
Preferably, the lower end of described computing node is provided with power supply interface, and the bottom of corresponding described sealing cabinet is provided with power supply copper bar, and computing node connects power supply copper bar by power supply interface and carries out power taking.
Preferably, the data line of described computing node and signal wire are from its Base top contact, and the top pressure closure of corresponding described sealing cabinet starts there is I/O passage, and the data line of all computing nodes and signal wire are pooled in I/O passage.
Preferably, described liquid coolant is boiling point the liquid coolant of 55-65 degree Celsius.
Preferably, described condenser is provided with inlet and leakage fluid dram, condenser adopts machine room cooling circulating water refrigeration.
The beneficial effect that a kind of immersion Phase cooling high density computing system of the present invention compared with prior art has is: this immersion Phase cooling high density computing system realizes CPU high-density deployment in limited computer memory, realize the computing power of system high-density, meet the high density computation requirement that industry constantly promotes; Adopt immersion Phase cooling heat radiating structure simultaneously, solve high density and calculate the heat radiation and noise problem that bring; Further, this computing system is novel in design, be skillfully constructed, to manufacture use cost lower, and operation maintenance is convenient, therefore has good popularizing value.
Accompanying drawing explanation
Accompanying drawing 1: the schematic diagram of the sealing cabinet of described computing system;
Accompanying drawing 2: the schematic diagram of described 1U computing node;
Accompanying drawing 3: the Phase cooling schematic diagram of described computing system;
Description of reference numerals: 1, rack; 2, node fixed guide; 3, computing node; 4, top pressure closure; 5, condenser; 6, inlet; 7, leakage fluid dram; 8, copper bar; 9, mainboard; 10, CPU; 11, hard disk; 12, power supply interface.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, a kind of immersion Phase cooling high density computing system of the present invention is further described.
A kind of immersion Phase cooling high density computing system of the present invention, this computing system comprises a sealing cabinet and the perpendicular some computing nodes be inserted in described sealing cabinet, described sealing cabinet top installs top pressure closure additional, be filled with the liquid coolant for dispelling the heat to computing node in described sealing cabinet, described computing node immersion is arranged in liquid coolant; Be provided with at least three mainboards in described computing node, and each mainboard be provided with two pieces of two-way CPU, realize improving CPU arrangement density at limited node space, realize stable high density computing power.By computing system of the present invention, achieve the mode of computing node immersion Phase cooling, effectively can solve high density and calculate the huge problem of the thermal value brought, and solve the noise problem brought by radiator fan.
Embodiment:
A kind of immersion Phase cooling high density computing system described in the present embodiment, as shown in Figure 1, described computing system comprises a rack 1, and the sidewall of described rack is provided with some node fixed guides 2, can be erected by computing node 3 described in node fixed guide is inserted in rack, be filled with liquid coolant in described rack, described rack is sealing cabinet, can effectively avoid liquid coolant to reveal simultaneously; Described computing node is fully immersed in liquid coolant, described liquid coolant is the nontoxic insulating environment-friendly cooling liquid of low boiling, do not affect the work of interior of equipment cabinet computing node and can not cause environmental pollution, the heat that computing node work produces simultaneously can effectively conduct to liquid coolant rapidly; Further, described sealing cabinet 1 top is provided with top pressure closure 4, and described top pressure closure is rotatably connected with described sealing cabinet sidewall, and opposing seal rack can Unscrew.
As shown in Figure 1, in high density computing system described in the present embodiment, be provided with condenser 5 between the top pressure closure 4 of described sealing cabinet and computing node, described condenser adopts hose connecting structure, with top pressure closure rotation direction rotating opening, can not affect computing node plug and safeguard; Described condenser is provided with inlet 6 and leakage fluid dram 7, condenser adopts machine room cooling circulating water refrigeration, can liquid coolant effectively in condensation rack.In addition, the bottom of described sealing cabinet 1 is provided with copper bar 8, and described computing node carries out power taking by connecting copper bar.
In computing system described in the present embodiment, described sealing cabinet has 42U space, each computing node is 1U node, as shown in Figure 2, in each computing node 3, be provided with three mainboards 9, be provided with a mainboard than original 1U computing node more, and each mainboard 9 is provided with two pieces of two-way CPU10, realize the bulk density of 1U node 6CPU, add the CPU density of setting of computing node, make the high density computing power possessing 252 CPU in whole machine cabinet 42U space.And have three pieces of hard disks 11 at the lower end concentrated setting of each computing node 3, the lower end of each computing node 3 is provided with power supply interface 12 simultaneously, the power supply copper bar connected bottom rack by power supply interface carries out power taking, and this high density computing system unifies power supply by power supply framework to power supply copper bar; The data line of each computing node and signal wire are from its Base top contact, the top pressure closure of corresponding described sealing cabinet starts there is I/O passage, the data line of all computing nodes and signal wire are pooled in I/O passage, top is adopted to concentrate cabling mode, realize concentrating reason line, be convenient to the maintenance management of cable.
Accompanying drawing 3 is described high density computing system Phase cooling schematic diagram, as shown in Figure 3, when computing node in rack runs, because liquid coolant boiling point is lower, the present embodiment liquid coolant boiling point is selected between 55-65 degree Celsius, the heat conduction that computing node produces is to liquid coolant, liquid coolant vaporization when reaching uniform temperature, cooling liquid steam after evaporation runs into the subcooling condenser of top, the heat conduction of liquid coolant gas is to condenser, the liquid coolant liquefied is back in rack, realizes recycling of liquid coolant; Chilled water simultaneously in condenser absorbs the heat heating of cooling liquid steam, is passed back in machine room circulation, and constantly have cryogenic refrigeration water to flow to condenser from inlet by leakage fluid dram.Like this, whole high density computing system is by the phase transition process of liquid coolant by fluid-gas-liquid, and the recirculating cooling water system of condenser takes away the amount of heat that it runs generation, well solves the heat dissipation problem of high density computing system.
Above-mentioned embodiment is only concrete case of the present invention; scope of patent protection of the present invention includes but not limited to above-mentioned embodiment; any claims according to the invention and any person of an ordinary skill in the technical field to its suitable change done or replacement, all should fall into scope of patent protection of the present invention.
Claims (8)
1. an immersion Phase cooling high density computing system, it is characterized in that, described immersion Phase cooling high density computing system, comprise a sealing cabinet and be arranged on the some computing nodes in described sealing cabinet, described sealing cabinet top installs top pressure closure additional, the low boiling liquid coolant of soaking computing node and being dispelled the heat is filled with in described sealing cabinet, at least three mainboards are provided with in described computing node, and each mainboard is provided with two pieces of two-way CPU, realize CPU high-density deployment in limited computing node space, be provided with condenser between described top pressure closure and computing node simultaneously.
2. a kind of immersion Phase cooling high density computing system according to claim 1, it is characterized in that, described top pressure closure is rotatably connected with described sealing cabinet sidewall, and opposing seal rack can Unscrew.
3. a kind of immersion Phase cooling high density computing system according to claim 1, be is characterized in that, described sealing cabinet sidewall is provided with some node fixed guides, can be erected be inserted in rack by computing node described in node fixed guide.
4. a kind of immersion Phase cooling high density computing system according to claim 3, it is characterized in that, described computing node is 1U node, is provided with three mainboards in described computing node, each mainboard is provided with two pieces of two-way CPU.
5. a kind of immersion Phase cooling high density computing system according to claim 4, it is characterized in that, the lower end of described computing node is provided with power supply interface, and the bottom of corresponding described sealing cabinet is provided with power supply copper bar, and computing node connects power supply copper bar by power supply interface and carries out power taking.
6. a kind of immersion Phase cooling high density computing system according to claim 4, it is characterized in that, the data line of described computing node and signal wire are from its Base top contact, the top pressure closure of corresponding described sealing cabinet starts there is I/O passage, and the data line of all computing nodes and signal wire are pooled in I/O passage.
7. a kind of immersion Phase cooling high density computing system according to claim 1, is characterized in that, described liquid coolant is boiling point the liquid coolant of 55-65 degree Celsius.
8. a kind of immersion Phase cooling high density computing system according to claim 1, is characterized in that, described condenser is provided with inlet and leakage fluid dram, and condenser adopts machine room cooling circulating water refrigeration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510302395.5A CN104915321A (en) | 2015-06-04 | 2015-06-04 | Immersion type phase-change cooling high-density computing system |
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| CN201510302395.5A CN104915321A (en) | 2015-06-04 | 2015-06-04 | Immersion type phase-change cooling high-density computing system |
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| CN104915321A true CN104915321A (en) | 2015-09-16 |
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Cited By (5)
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| CN106255387A (en) * | 2016-08-31 | 2016-12-21 | 深圳绿色云图科技有限公司 | Cooling system and data center |
| CN106912186A (en) * | 2017-04-24 | 2017-06-30 | 深圳绿色云图科技有限公司 | Rack and miniature data center |
| CN106959737A (en) * | 2017-03-08 | 2017-07-18 | 曙光节能技术（北京）股份有限公司 | Liquid cooling apparatus and blade server for server |
| CN110132038A (en) * | 2019-05-17 | 2019-08-16 | 比赫电气（太仓）有限公司 | A kind of two-phase immersion liquid cooling apparatus |
| TWI847577B (en) * | 2022-08-11 | 2024-07-01 | 緯穎科技服務股份有限公司 | Immersion liquid cooling equipment and heat dissipation method for electronic device |
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Application publication date: 20150916 |