CN104882524A - SMD type LED support based on aluminum base material, and lamp bead employing the support - Google Patents
SMD type LED support based on aluminum base material, and lamp bead employing the support Download PDFInfo
- Publication number
- CN104882524A CN104882524A CN201510291520.7A CN201510291520A CN104882524A CN 104882524 A CN104882524 A CN 104882524A CN 201510291520 A CN201510291520 A CN 201510291520A CN 104882524 A CN104882524 A CN 104882524A
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- plastic cement
- type led
- smd type
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 116
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 115
- 239000011324 bead Substances 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 title abstract description 16
- 239000004568 cement Substances 0.000 claims abstract description 41
- 239000004411 aluminium Substances 0.000 claims description 105
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 24
- 239000013078 crystal Substances 0.000 claims description 23
- 229910052742 iron Inorganic materials 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 but Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an SMD type LED support based on an aluminum base material, and a lamp bead employing the support. Through holes are arranged in an aluminum substrate, at the same time, embedding portions are formed at a plastic cement seat, and the embedding portions are embedded into the through holes of the aluminum substrate. The embedding portions, on one hand, can realize fixation of the plastic cement seat and the aluminum substrate, and on the other hand, the embedding portions embedded into the aluminum substrate also reinforce the overall strength of the aluminum substrate and prevent the aluminum substrate from bending deformation. Therefore, adoption of a conventional fixation mode of embedding the aluminum substrate into the plastic cement seat is unnecessary, the bottom surface of the lamp bead is basically the bottom surface of the aluminum substrate, the heat dissipation area of the lamp bead is large, the heat dissipation performance of the aluminum substrate is fully utilized, and the overall heat dissipation effect of the lamp bead is improved.
Description
Technical field
The application relates to LED support technology field, particularly a kind of SMD type LED support based on aluminium base and adopt the lamp pearl of this support.
Background technology
In the prior art, LED lamp bead is generally coated plastic cement seat on the substrate be made up of iron material or copper material, make the end face of substrate expose die bond region for die bond simultaneously, region, exposed portion, bottom surface is used for heat radiation, and the pad increasing copper material or iron material on plastic cement seat is to connect the crystal on crystal bonding area.
The strength ratio of copper material and iron material is higher, it is very suitable for using as substrate, and therefore current substrate all adopts the LED frame of copper material or iron material, but, copper material and iron material density high, cost is high, adopts copper material and iron material production that LED lamp bead cost can be caused to increase, what is more important, the radiating effect of copper material and iron material is general, and well-known, for LED lamp bead, radiating effect is the important indicator determining its luminescent properties.For this reason, low, that cost is low and radiating effect the is more superior aluminium of trial employing density is used as LED support in the industry, but, the hardness of aluminium is lower, for this reason, the size of aluminium base is generally smaller, and generally can adopt the form in plastic cement seat of being embedded by aluminium base (namely the bottom surface of lamp pearl is linked up by the bottom surface of the bottom surface of plastic cement seat and aluminium base to form), and which results in the exposed area in aluminium base bottom surface, to account for the ratio of lamp pearl bottom surface entire area less.And the bottom surface of aluminium base is the main path derived by the heat of lamp pearl, therefore, this structure effectively cannot play the high heat dispersion of aluminium base.
Summary of the invention
The object of the application is avoid above-mentioned weak point of the prior art and provide a kind of bulk strength that effectively can improve aluminium base, can give full play to the LED support of the heat dispersion of aluminium base simultaneously.
The object of the application is achieved through the following technical solutions:
Provide a kind of SMD type LED support based on aluminium base, comprise aluminium base, described aluminium base end face is attached with plastic cement seat, described plastic cement seat offers the encapsulation groove that opening deviates from aluminium base, a part for the end face of described aluminium base part is exposed to the bottom land of described encapsulation groove to form crystal bonding area, described aluminium base offers through hole, be provided with the Embedded Division being embedded in described through hole bottom described plastic cement seat, described plastic cement seat is fixed on described aluminium base by Embedded Division.
Wherein, the crystal bonding area plating of described aluminium base is provided with silver layer.
Wherein, described conducting strip is iron plate.
Wherein, described through hole is arranged around equidistant arrangement around crystal bonding area.
Wherein, the quantity of described number of openings is at least 3, and the quantity of corresponding described Embedded Division is at least 3.
Wherein, described Embedded Division on aluminium base during injection mo(u)lding plastic cement seat plastic cement flow into through hole and being formed.
Wherein, described plastic cement seat is also embedded with conducting strip, and described conducting strip partial denudation is to form bonding wire dish in described encapsulation groove, and partial denudation and plastic cement seat outside are to form leg.
Wherein, the aperture of described through hole reduces gradually from the end face of aluminium base to the bottom surface of aluminium base, or first increases, then reduces.
Wherein, the aluminium of the employing of described aluminium base is: the aluminium alloy that the magnesium mixing 3% to 6% by 94% to 97% aluminium synthesizes.
Also provide a kind of and adopt the above-mentioned LED lamp bead made based on the SMD type LED support of aluminium base, it is characterized in that: be provided with LED crystal in described crystal bonding area, described LED crystal is connected with the bonding wire dish of described conduction, is filled with packaging plastic in described auxiliary tank
The beneficial effect of the application: the application have employed and offer through hole on aluminium base, shaping Embedded Division on plastic cement seat simultaneously, Embedded Division is made to be embedded in the through hole of aluminium base, Embedded Division can realize on the one hand fixing of plastic cement seat and aluminium base, on the other hand, the Embedded Division embedded in aluminium base also strengthens the bulk strength of aluminium base, avoid aluminium base flexural deformation, therefore the fixed form without the need to adopting aluminium base to embed plastic cement seat, therefore the basic bottom surface with regard to being all aluminium base, the bottom surface of lamp pearl, lamp pearl area of dissipation is large, take full advantage of the heat dispersion of aluminium base, improve lamp pearl integral heat sink effect.
Accompanying drawing explanation
Utilize accompanying drawing to be described further the application, but the embodiment in accompanying drawing does not form any restriction to the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the decomposition texture schematic diagram of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Fig. 2 is the structural representation of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Fig. 3 is the cross-sectional view of the embodiment of a kind of SMD type LED support based on aluminium base of the application.
Include in Fig. 1 to Fig. 3:
1---aluminium base, 11---crystal bonding area, 12---through hole, 2---plastic cement seat, 21---encapsulation groove, 22---Embedded Division, 3---conducting strip, 31---leg.
Embodiment
With the following Examples the application is further described.
The embodiment of a kind of SMD type LED support based on aluminium base of the application, as shown in Figure 1 to Figure 3, include: comprise aluminium base 1, described aluminium base 1 end face is attached with plastic cement seat 2, described plastic cement seat 2 offers the encapsulation groove 21 that opening deviates from aluminium base 1, a part for the end face of described aluminium base 1 part is exposed to the bottom land of described encapsulation groove 21 to form crystal bonding area 11, described plastic cement seat 2 is also embedded with conducting strip 3, described conducting strip 3 partial denudation in described encapsulation groove 21 to form bonding wire dish, partial denudation and plastic cement seat 2 outside are to form leg 31, described aluminium base 1 offers four through holes 12, these through holes 12 are arranged around crystal bonding area 11 surrounding equidistant arrangement, the Embedded Division 22 being embedded in described through hole 12 is provided with bottom described plastic cement seat 2, described Embedded Division 22 on aluminium base 1 during injection mo(u)lding plastic cement seat 2 plastic cement flow into and formed, process very convenient, and can more effectively make plastic cement seat 2 be fixed on described aluminium base 1 by Embedded Division 22.Concrete, the quantity of through hole 12 can adjust flexibly, but suggestion is not less than three, and such guarantee plastic cement seat 2 is effectively fixedly connected with aluminium base 1.
Compared with prior art, the application adopts Embedded Division 22 to realize the fixing of plastic cement seat 2 and both aluminium bases 1, simultaneously, the Embedded Division 22 embedded in aluminium base 1 also strengthens the bulk strength of aluminium base 1, avoid aluminium base 1 flexural deformation, therefore, it is possible to for the aluminium base 1 of larger area, and (namely plastic cement seat 2 is arranged at above aluminium base 1 completely without the need to adopting aluminium base 1 to embed the fixed form of plastic cement seat 2, cannot be coated with aluminium base 1 week edge), therefore the bottom surface of aluminium base 1 is exactly the bottom surface (bottom surface of traditional lamp pearl is that the bottom surface that the bottom surface of aluminium base 1 adds plastic cement seat 2 is formed) of lamp pearl, lamp pearl area of dissipation is large, take full advantage of the heat dispersion of aluminium base 1, improve lamp pearl integral heat sink effect.
It should be noted that, above supporting structure is for the larger LED lamp bead of size, for the LED lamp bead that size is smaller, also can cancel conducting strip, directly on aluminium base by technique formation bonding wire dish and legs such as plating.
The bottom surface plating of described aluminium base 1 is provided with silver layer.Thus make aluminium base 1 by soldering on heat dissipation metal frame, its radiating effect can be strengthened further.
Crystal bonding area 11 plating of described aluminium base 1 is provided with silver layer.Be the surface strength strengthening crystal bonding area 11 on the one hand, be convenient to bonding wire, also can increase the reflection of the 11 pairs of light in crystal bonding area on the other hand, reduce the absorption to light, both enhanced luminous efficiency, decrease the heat produced because of absorption light.
Described conducting strip 3 is iron plates.The present embodiment adopts iron plate to be because the intensity of iron plate is comparatively strong, is convenient to processing.Certainly, according to actual needs, also other conducting strips 3 such as copper sheet can be selected.
Each through hole 12 be less than 2% of the base area of aluminium base 1 at the area of aluminium base 1 bottom surface.Guaranteeing on the basis that plastic cement seat 2 and aluminium base 1 are effectively fixedly connected with, reducing its area shared by bottom surface as much as possible, increasing radiating effect.Concrete, the aperture of described through hole 12 reduces (through hole 12 is in back taper mesa-shaped) gradually from the upper surface of aluminium base 1 to the lower surface of aluminium base 1, thus the area of through hole 12 in aluminium base 1 bottom surface is reduced while the contact area increasing Embedded Division 22 and aluminium base 1 as far as possible, even, the aperture of through hole 12 can also first increase from the upper surface of aluminium base 1 to the bottom surface of aluminium base 1, reduce again (in shuttle shape), thus while the area of aluminium base 1 bottom surface, reduce the opening of through hole 12 at aluminium base 1 upper surface reducing through hole 12 while increasing the contact area of Embedded Division 22 and aluminium base 1 as far as possible, strengthen making Embedded Division 22 more firmly be fixed in through hole 12, improve fixed effect.
The aluminium of the employing of described aluminium base 1 is: the aluminium alloy that the magnesium mixing 3% to 6% by 94% to 97% aluminium synthesizes.Adopt the aluminium that above ratio mixes, its intensity can have compared to fine aluminium and significantly promotes, and heat dispersion also can not decline substantially simultaneously.
Adopt the above-mentioned SMD type LED support based on aluminium base to make LED lamp bead, only need to be provided with LED crystal in described crystal bonding area 11, LED crystal is connected with the bonding wire dish of described conduction, then in auxiliary tank, is filled with packaging plastic.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the application; but not the restriction to the application's protection range; although done to explain to the application with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the application or equivalent replacement, and not depart from essence and the scope of technical scheme.
Claims (10)
1. the SMD type LED support based on aluminium base, comprise aluminium base, described aluminium base end face is attached with plastic cement seat, described plastic cement seat offers the encapsulation groove that opening deviates from aluminium base, a part for the end face of described aluminium base part is exposed to the bottom land of described encapsulation groove to form crystal bonding area, it is characterized in that: described aluminium base offers through hole, be provided with the Embedded Division being embedded in described through hole bottom described plastic cement seat, described plastic cement seat is fixed on described aluminium base by Embedded Division.
2. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: the crystal bonding area plating of described aluminium base is provided with silver layer.
3. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: described conducting strip is iron plate.
4. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: described through hole is arranged around equidistant arrangement around crystal bonding area.
5. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: the quantity of described number of openings is at least 3, and the quantity of corresponding described Embedded Division is at least 3.
6. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: described Embedded Division on aluminium base during injection mo(u)lding plastic cement seat plastic cement flow into through hole and formed.
7. a kind of SMD type LED support based on aluminium base as claimed in claim 1, it is characterized in that: described plastic cement seat is also embedded with conducting strip, described conducting strip partial denudation is to form bonding wire dish in described encapsulation groove, and partial denudation and plastic cement seat outside are to form leg.
8. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: the aperture of described through hole reduces gradually from the end face of aluminium base to the bottom surface of aluminium base, or first increases, then reduces.
9. a kind of SMD type LED support based on aluminium base as claimed in claim 1, is characterized in that: the aluminium of the employing of described aluminium base is: the aluminium alloy that the magnesium mixing 3% to 6% by 94% to 97% aluminium synthesizes.
10. one kind adopts the LED lamp bead made based on the SMD type LED support of aluminium base described in claim 1-9, it is characterized in that: in described crystal bonding area, be provided with LED crystal, described LED crystal is connected with the bonding wire dish of described conduction, is filled with packaging plastic in described auxiliary tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291520.7A CN104882524A (en) | 2015-06-01 | 2015-06-01 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510291520.7A CN104882524A (en) | 2015-06-01 | 2015-06-01 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104882524A true CN104882524A (en) | 2015-09-02 |
Family
ID=53949936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510291520.7A Pending CN104882524A (en) | 2015-06-01 | 2015-06-01 | SMD type LED support based on aluminum base material, and lamp bead employing the support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104882524A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110431675A (en) * | 2017-03-13 | 2019-11-08 | 欧司朗光电半导体有限公司 | Device with enhancement layer and the method for manufacturing device |
| WO2019214490A1 (en) * | 2018-05-10 | 2019-11-14 | 京东方科技集团股份有限公司 | Light emitting diode and manufacturing method thereof, backlight and display device |
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| KR100851636B1 (en) * | 2006-07-27 | 2008-08-13 | 삼성전기주식회사 | Surface mounting light emitting diode device |
| CN202067833U (en) * | 2011-05-25 | 2011-12-07 | 广东宏磊达光电科技有限公司 | LED (light-emitting diode) support |
| CN203242663U (en) * | 2013-05-07 | 2013-10-16 | 深圳市诚慧光科技有限公司 | LED support and LED integrated light |
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
| CN205428993U (en) * | 2015-06-01 | 2016-08-03 | 木林森股份有限公司 | SMD type LED support and lamp pearl of adopting this support based on aluminium base |
-
2015
- 2015-06-01 CN CN201510291520.7A patent/CN104882524A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100851636B1 (en) * | 2006-07-27 | 2008-08-13 | 삼성전기주식회사 | Surface mounting light emitting diode device |
| CN202067833U (en) * | 2011-05-25 | 2011-12-07 | 广东宏磊达光电科技有限公司 | LED (light-emitting diode) support |
| CN203242663U (en) * | 2013-05-07 | 2013-10-16 | 深圳市诚慧光科技有限公司 | LED support and LED integrated light |
| CN103855286A (en) * | 2014-02-20 | 2014-06-11 | 博罗承创精密工业有限公司 | LED supporting frame, manufacturing method of LED supporting frame and double-material belt LED supporting frame module |
| CN205428993U (en) * | 2015-06-01 | 2016-08-03 | 木林森股份有限公司 | SMD type LED support and lamp pearl of adopting this support based on aluminium base |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110431675A (en) * | 2017-03-13 | 2019-11-08 | 欧司朗光电半导体有限公司 | Device with enhancement layer and the method for manufacturing device |
| WO2019214490A1 (en) * | 2018-05-10 | 2019-11-14 | 京东方科技集团股份有限公司 | Light emitting diode and manufacturing method thereof, backlight and display device |
| US11322671B2 (en) | 2018-05-10 | 2022-05-03 | Boe Optical Science And Technology Co., Ltd. | Light-emitting diode, method for manufacturing the same, backlight source and display device for improving heat dissipation |
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Application publication date: 20150902 |