CN104874916A - Adsorption machining device applied to back type laser internally-caved microchannel - Google Patents
Adsorption machining device applied to back type laser internally-caved microchannel Download PDFInfo
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- CN104874916A CN104874916A CN201510262306.9A CN201510262306A CN104874916A CN 104874916 A CN104874916 A CN 104874916A CN 201510262306 A CN201510262306 A CN 201510262306A CN 104874916 A CN104874916 A CN 104874916A
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- square groove
- microchannel
- pipe
- central tube
- downside
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The invention discloses an adsorption machining device applied to a back type laser internally-caved microchannel. The adsorption machining device comprises a base, an inlet air distributing pipe and a vent pipe connector. A square groove is completely covered with the lower surface of a sample sheet to be machined so that an enclosed space can be formed by the square groove. Compressed air is led to a center pipeline of a lower air inlet pipeline, one part of the compressed air is exhausted along the pipeline, and the other part of the compressed air enters the large square groove. Negative pressure is formed at horizontal air outlets of thin pipelines, uniform downward adsorption force is produced for the sample sheet to be machined, and the sample sheet to be machined is fixed to the upper portion of the large square groove under the action of the adsorption force; gas in a cavity forms a flow field under the action of the negative pressure; as for the back type laser internally-caved microchannel, high-temperature gas and residues produced in the machining process can be adsorbed under the action of the negative pressure and the airflow field, which is significant for forming the microchannel with a smooth inner wall.
Description
Technical field
The present invention relates to laser micro-machining technology field, be related specifically to a kind of sample adsorption processing unit (plant) utilizing laser microchannel at interior quarter.
Background technology
Along with the development of optics, laser is little with its zone of action, high-energy, high efficiency feature, is more and more widely used in the processing of material, and most of decoration corporations on the market have brought into use the various sheet metal of laser cutting at present.After u-TAS (micro total analysis system) and MEMS (MicroElectromechanical System) is suggested to, along with the diversification of application demand, the application of laser not only trends towards macroscopic view processing, causes the concern of researchers in micro-nano processing especially.Under this background, it is comparatively ripe that current use laser technology etches various plane micro-structural at chip surface, researchers have turned to target the solid threedimensional inner microchannel processing that technical requirement is higher, difficulty of processing is larger, certainly have laser only and can reach this target.
But the interior microchannel of carving of laser is only limitted to the experimental stage at present, uses now laser technology directly to process the technology with 3 D complex structure microchannel at chip internal and there has been preliminary progress, but also create some problems.Laser processing of materials is a kind of destructive processes, and energy height is concentrated on a Working position by focusing objective len by laser, produces microchannel by processes such as ablation, material sublimation, microbursts.Microchannel to produce in this case, but along be some residues solidified again after channel surface leaves distillation, surface roughness is very big, in addition the mode that at present great majority can produce microchannel is formula processing mode dorsad, therefore needs a kind of device simultaneously can removing various high-temperature gas that machining area produces and residue in laser processing of materials process.
Summary of the invention
The object of the present invention is to provide a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad, this device has feature that is easy to use, practical function.
To achieve these goals, a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad, this device comprises base (1), air inlet gas-distributing pipe (2), blast pipe connector (3);
Base (1) Shi Yige center has the square column body of large square groove (11), the periphery of large square groove (11) has been arranged with through hole (12), and three parallel through holes (12) form one group and are located at the side of each large square groove (11); The bottom center of this large square groove (11) is also provided with a little square groove (13), and this little square groove (13) center is provided with a manhole (14); The upper surface corner place of base (1) is provided with the cylindricality counter sink (15) of four straight-through lower surfaces, is fixed by base (1) by four cylindricality counter sinks (15); Material to be processed is placed in the upper surface of base (1) and covers large square groove (11);
Air inlet gas-distributing pipe (2) comprises downside admission line, pipe jointer (22), square cynapse (23), tubule (24), spherical cavity (25); Downside admission line comprises central tube (211), extra heavy pipe road (212), thin pipe (213); The central tube (211) of downside admission line is arranged on admission line centre position, downside, central tube (211) and four axis arrange that extra heavy pipe road (212) is connected symmetrically, and each extra heavy pipe road (212) is provided with three thin pipes (213); The central axes of the through hole (12) that thin pipe (213) is circumferential with square groove (11); The corner of thin pipe (213) and central tube top are respectively equipped with pipe jointer (22); Tubule (24) one end is connected with central tube (211) by pipe jointer (22); Symmetric form spherical cavity (25) centered by the other end of tubule (24); (25) have small annular holes to described spherical cavity; Central tube (211) is provided with the square cynapse (23) identical with central tube (211) caliber; Square cynapse (23) matches with little square groove (13).
Blast pipe connector (3) comprises converting interface (31), blow vent (32); Converting interface (31) is provided with three steam vents corresponding with through hole (12); Each steam vent is connected with a blow vent (32); Described steam vent and blow vent (32) junction are conical surface structure; Can effectively prevent by the inwall of this conical surface structure backflow, the resistance phenomenon generation that three enter discharge duct gas simultaneously, effectively facilitate the discharge of gas; Meanwhile, also guarantee is provided for the through hole (12) of base and thin pipe (213) place of downside admission line form stable negative pressure.
Compared with prior art, the present invention has following beneficial effect.
1, when sample strip to be processed covers base groove top edge, after air inlet gas-distributing pipe passes into compressed air, just identical negative pressure can be formed at 4x 3 horizontal gas outlets place of air inlet gas-distributing pipe, in addition this negative pressure is in the side, inside four of base square groove, an even downward absorption affinity can be had, for ensureing that the quality of sample to be processed has extremely important to the sample strip to be processed covering this square groove.
2, the compressed air overflowed from the venthole at center, air inlet gas-distributing pipe top is that the cavity at base center supplements gas, makes the gas in chamber form flow field under the effect of negative pressure; This absorption affinity secures sample strip to be processed, eliminates clamping device, the production easily be automated, processing.
3, carve microchannel dorsad in formula laser under the effect of negative pressure and air velocity distribution, can adsorb to walk the high-temperature gas, the residue that produce in process simultaneously, the microchannel forming inner wall smooth is had very important significance.
Accompanying drawing explanation
Fig. 1 is the normal axomometric drawing being applied to the absorption processing unit (plant) of formula laser microchannel at interior quarter dorsad that the present invention relates to;
Fig. 2 is the base normal axomometric drawing being applied to the absorption processing unit (plant) of formula laser microchannel at interior quarter dorsad that the present invention relates to;
Fig. 3 .1 is the air inlet gas-distributing pipe normal axomometric drawing being applied to the absorption processing unit (plant) of formula laser microchannel at interior quarter dorsad that the present invention relates to;
Fig. 3 .2 is the air inlet gas-distributing pipe top view being applied to the absorption processing unit (plant) of formula laser microchannel at interior quarter dorsad that the present invention relates to;
Fig. 4 is the blast pipe connector normal axomometric drawing being applied to the absorption processing unit (plant) of formula laser microchannel at interior quarter dorsad that the present invention relates to.
Fig. 5 is that the thin pipe being applied to the absorption processing unit (plant) carving microchannel in formula laser dorsad that the present invention relates to and through hole form negative pressure schematic diagram.
In figure: 1, base, 2, air inlet gas-distributing pipe, 3, blast pipe connector, 11, large square groove, 12, through hole, 13, little square groove, 14, manhole, 15, cylindricality counter sink, 211, central tube, 212, extra heavy pipe road, 213, thin pipe, 22, pipe jointer, 23, square cynapse, 24, tubule, 25, spherical cavity, 31, converting interface, 32, blow vent.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, further detailed description is done to the present invention.
As Figure 1-5, a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad, this device comprises base (1), air inlet gas-distributing pipe (2), blast pipe connector (3);
Base (1) Shi Yige center has the square column body of large square groove (11), the periphery of large square groove (11) has been arranged with through hole (12), and three parallel through holes (12) form one group and are located at the side of each large square groove (11); The bottom center of this large square groove (11) is also provided with a little square groove (13), and this little square groove (13) center is provided with a manhole (14); The upper surface corner place of base (1) is provided with the cylindricality counter sink (15) of four straight-through lower surfaces, is fixed by base (1) by four cylindricality counter sinks (15); Material to be processed is placed in the upper surface of base (1) and covers large square groove (11);
Air inlet gas-distributing pipe (2) comprises downside admission line, pipe jointer (22), square cynapse (23), tubule (24), spherical cavity (25); Downside admission line comprises central tube (211), extra heavy pipe road (212), thin pipe (213); The central tube (211) of downside admission line is arranged on admission line centre position, downside, central tube (211) and four axis arrange that extra heavy pipe road (212) is connected symmetrically, and each extra heavy pipe road (212) is provided with three thin pipes (213); The central axes of the through hole (12) that thin pipe (213) is circumferential with square groove (11); The corner of thin pipe (213) and central tube top are respectively equipped with pipe jointer (22); Tubule (24) one end is connected with central tube (211) by pipe jointer (22); Symmetric form spherical cavity (25) centered by the other end of tubule (24); (25) have small annular holes to described spherical cavity; Central tube (211) is provided with the square cynapse (23) identical with central tube (211) caliber; Square cynapse (23) matches with little square groove (13).
Blast pipe connector (3) comprises converting interface (31), blow vent (32); Converting interface (31) is provided with three steam vents corresponding with through hole (12); Each steam vent is connected with a blow vent (32); Described steam vent and blow vent (32) junction are conical surface structure; Can effectively prevent by the inwall of this conical surface structure backflow, the resistance phenomenon generation that three enter discharge duct gas simultaneously, effectively facilitate the discharge of gas; Meanwhile, also guarantee is provided for the through hole (12) of base and thin pipe (213) place of downside admission line form stable negative pressure.
The caliber of described through hole (12) is greater than thin pipe (213) caliber of downside admission line.
Described spherical cavity (25) is spherical structure, is convenient to uniform stream symmetry and discharges.
The ratio of the internal diameter of described pipeline (12) and thin pipe (213) internal diameter of downside admission line is more than or equal to 2:1.
Embodiment
First the lower surface of sample strip to be processed is covered square groove (11) completely, make square groove (11) form a confined space.
Secondly, central tube (211) place of downside admission line passes into compressed air, and a compressed air part is discharged along central tube (211), extra heavy pipe road (212), thin pipe (213), through hole (12), converting interface (31), blow vent (32); Compressed air another part enters large square groove (11) along the small annular holes on central tube (211), tubule (24), spherical cavity (25); Bore of giving vent to anger due to thin pipe (213) is less than the inlet calibre of pipeline (12), therefore forms the air-flow moved along pipeline (12) in both contact positions; Simultaneously, negative pressure is formed at 4x 3 horizontal gas outlets place of thin pipe (213), in addition this negative pressure is in the side, inside four of large square groove (11), an even downward absorption affinity can be produced to the sample strip to be processed covering this large square groove (11), under the effect of absorption affinity, sample strip to be processed is fixed on the top of large square groove (11), and therefore this device eliminates complicated clamping device.
Simultaneously, the compressed air overflowed from the small annular holes of spherical cavity (25) is that the cavity at large square groove (11) place supplements gas, under the effect of negative pressure, make the gas in chamber form flow field, under the effect of negative pressure and air velocity distribution, can adsorb to walk again produce in process high-temperature gas, residue for carving microchannel in formula laser dorsad simultaneously, significant for the microchannel forming inner wall smooth.
Above-describedly be only an embodiment; be not intended to limit scope of the present invention; those skilled in the art can carry out various distortion and improvement according to this example, and these all changes are all in protection scope of the present invention, and the part that the present invention does not describe in detail is routine techniques and structure.
Claims (5)
1. be applied to the interior absorption processing unit (plant) carving microchannel of formula laser dorsad, it is characterized in that: this device comprises base (1), air inlet gas-distributing pipe (2), blast pipe connector (3);
Base (1) Shi Yige center has the square column body of large square groove (11), the periphery of large square groove (11) has been arranged with through hole (12), and three parallel through holes (12) form one group and are located at the side of each large square groove (11); The bottom center of this large square groove (11) is also provided with a little square groove (13), and this little square groove (13) center is provided with a manhole (14); The upper surface corner place of base (1) is provided with the cylindricality counter sink (15) of four straight-through lower surfaces, is fixed by base (1) by four cylindricality counter sinks (15); Material to be processed is placed in the upper surface of base (1) and covers large square groove (11);
Air inlet gas-distributing pipe (2) comprises downside admission line, pipe jointer (22), square cynapse (23), tubule (24), spherical cavity (25); Downside admission line comprises central tube (211), extra heavy pipe road (212), thin pipe (213); The central tube (211) of downside admission line is arranged on admission line centre position, downside, central tube (211) and four axis arrange that extra heavy pipe road (212) is connected symmetrically, and each extra heavy pipe road (212) is provided with three thin pipes (213); The central axes of the through hole (12) that thin pipe (213) is circumferential with square groove (11); The corner of thin pipe (213) and central tube top are respectively equipped with pipe jointer (22); Tubule (24) one end is connected with central tube (211) by pipe jointer (22); Symmetric form spherical cavity (25) centered by the other end of tubule (24); (25) have small annular holes to described spherical cavity; Central tube (211) is provided with the square cynapse (23) identical with central tube (211) caliber; Square cynapse (23) matches with little square groove (13);
Blast pipe connector (3) comprises converting interface (31), blow vent (32); Converting interface (31) is provided with three steam vents corresponding with through hole (12); Each steam vent is connected with a blow vent (32); Described steam vent and blow vent (32) junction are conical surface structure; Can effectively prevent by the inwall of this conical surface structure backflow, the resistance phenomenon generation that three enter discharge duct gas simultaneously, effectively facilitate the discharge of gas; Meanwhile, also guarantee is provided for the through hole (12) of base and thin pipe (213) place of downside admission line form stable negative pressure.
2. a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad according to claim 1, is characterized in that: the caliber of described through hole (12) is greater than thin pipe (213) caliber of downside admission line.
3. a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad according to claim 1, is characterized in that: described spherical cavity (25) is spherical structure, is convenient to uniform stream symmetry and discharges.
4. a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad according to claim 1, is characterized in that: the ratio of the internal diameter of described pipeline (12) and thin pipe (213) internal diameter of downside admission line is more than or equal to 2:1.
5. a kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad according to claim 1, it is characterized in that: first the lower surface of sample strip to be processed is covered square groove (11) completely, make square groove (11) form a confined space;
Secondly, central tube (211) place of downside admission line passes into compressed air, and a compressed air part is discharged along central tube (211), extra heavy pipe road (212), thin pipe (213), through hole (12), converting interface (31), blow vent (32); Compressed air another part enters large square groove (11) along the small annular holes on central tube (211), tubule (24), spherical cavity (25); Bore of giving vent to anger due to thin pipe (213) is less than the inlet calibre of pipeline (12), therefore forms the air-flow moved along pipeline (12) in both contact positions; Simultaneously, negative pressure is formed at 4x3 horizontal gas outlet place of thin pipe (213), in addition this negative pressure is in the side, inside four of large square groove (11), an even downward absorption affinity can be produced to the sample strip to be processed covering this large square groove (11), under the effect of absorption affinity, sample strip to be processed is fixed on the top of large square groove (11), and therefore this device eliminates complicated clamping device;
Simultaneously, the compressed air overflowed from the small annular holes of spherical cavity (25) is that the cavity at large square groove (11) place supplements gas, under the effect of negative pressure, make the gas in chamber form flow field, under the effect of negative pressure and air velocity distribution, can adsorb to walk again produce in process high-temperature gas, residue for carving microchannel in formula laser dorsad simultaneously, significant for the microchannel forming inner wall smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510262306.9A CN104874916B (en) | 2015-05-21 | 2015-05-21 | A kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510262306.9A CN104874916B (en) | 2015-05-21 | 2015-05-21 | A kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad |
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| Publication Number | Publication Date |
|---|---|
| CN104874916A true CN104874916A (en) | 2015-09-02 |
| CN104874916B CN104874916B (en) | 2016-08-24 |
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| CN201510262306.9A Expired - Fee Related CN104874916B (en) | 2015-05-21 | 2015-05-21 | A kind of absorption processing unit (plant) being applied to formula laser microchannel at interior quarter dorsad |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000246480A (en) * | 1999-03-02 | 2000-09-12 | Koike Sanso Kogyo Co Ltd | Leveling plate for cutting |
| CN2691800Y (en) * | 2004-01-18 | 2005-04-13 | 深圳市大族激光科技股份有限公司 | Stripe shaped sudion laser marking working table |
| DE102004019384B3 (en) * | 2004-04-19 | 2006-01-19 | Robot-Technology Gmbh | Turntable and method for setting shielded working positions |
| CN201385305Y (en) * | 2009-05-05 | 2010-01-20 | 上海晨兴希姆通电子科技有限公司 | Absorption platform |
| CN203712656U (en) * | 2014-01-22 | 2014-07-16 | 惠柏新材料科技（上海）有限公司 | Vacuum process equipment operation platform |
-
2015
- 2015-05-21 CN CN201510262306.9A patent/CN104874916B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000246480A (en) * | 1999-03-02 | 2000-09-12 | Koike Sanso Kogyo Co Ltd | Leveling plate for cutting |
| CN2691800Y (en) * | 2004-01-18 | 2005-04-13 | 深圳市大族激光科技股份有限公司 | Stripe shaped sudion laser marking working table |
| DE102004019384B3 (en) * | 2004-04-19 | 2006-01-19 | Robot-Technology Gmbh | Turntable and method for setting shielded working positions |
| CN201385305Y (en) * | 2009-05-05 | 2010-01-20 | 上海晨兴希姆通电子科技有限公司 | Absorption platform |
| CN203712656U (en) * | 2014-01-22 | 2014-07-16 | 惠柏新材料科技（上海）有限公司 | Vacuum process equipment operation platform |
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| CN104874916B (en) | 2016-08-24 |
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