CN104789167A - High-temperature-resistant adhesive tape as well as high-temperature-resistant release film and high-temperature-resistant adhesive used by high-temperature-resistant adhesive tape - Google Patents
High-temperature-resistant adhesive tape as well as high-temperature-resistant release film and high-temperature-resistant adhesive used by high-temperature-resistant adhesive tape Download PDFInfo
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Abstract
The invention relates to a high-temperature-resistant adhesive tape as well as a high-temperature-resistant release film and a high-temperature-resistant adhesive used by the high-temperature-resistant adhesive tape. A raw material formula of the high-temperature-resistant adhesive comprises the following components: 40-80 parts of ethylene glycol dimethacrylate, 20-30 parts of octadecyl acrylate, 5-10 parts of phenyltrimethoxysilane, 5-10 parts of vinyltriisopropenyloxysilane, 2-10 parts of nano-silica, 1-5 parts of aluminium hexafluoroacetylacetonate, 2-6 parts of polyvinyl alcohol, 2-5 parts of an emulsifier, 1-3 parts of an initiator and 200-350 parts of deionized water. A raw material formula of a film spraying material of the high-temperature-resistant release film comprises the following components: 60-80 parts of polyimide, 10-30 parts of 1,3,5-tris(3,3,3-trifluoropropyl)methylcyclotrisiloxane, 5-25 parts of polybutylene terephthalate, 2-10 parts of an ethylene vinyl acetate copolymer, 2-8 parts of vinyl phenyl silicon oil, 1-3 parts of dioctyl sebacate and 1-4 parts of dibutyltin dilaurate. The heat-resistant pressure sensitive adhesive tape prepared by the invention can work at 70-160 DEG C and can resist the high temperature of 600 DEG C or above in a short time.
Description
Technical field
The present invention relates to high temperature resistant release film and the high-temperature resistance adhesive of a kind of High temperature-resistanadhesive adhesive tape and use thereof, belong to adhesive material technical field.
Background technology
Along with the fast development of economy, heat resistant adhesive tape has been used as the insulation high temperature varnish product of resistance to 100 DEG C-200 DEG C, the protective tapes of engine or cabin mechanical organ, metal solder field.Adhesive tape is generally by base material, release film, glue paste.Market has strong demand to having excellent heat resistance adhesive tape.
The release film that Classical adhesive tape is selected, divide by starting material and have Ge Laxin release film, polyethylene film release film (PEK) and kaolin coating release film three major types, wherein polyethylene film release film is because advantages such as its dimensional stabilitys, produce in a large number in China, and at adhesive tape, the industries such as advertisement widely use, but poly fusing point is lower, will soften at about 80 DEG C, thus degraded, and such as polyvinyl chloride, polycarbonate, although polyurethane and nylon also can be applied to different fields, but their total shortcoming is high temperature resistant poor, at high temperature, film all can deform, thus be not allowed in industries very high to dimensional stability requirements such as electronics cross cuttings.
Traditional tackiness agent comprises acrylic acid adhesive, natural rubber adhesive and synthetic rubber tackiness agent, in these three kinds of tackiness agent, the resistance to elevated temperatures of synthetic rubber tackiness agent is the poorest, and acrylic acid adhesive resistance to elevated temperatures is better, but at a higher temperature, acrylic acid adhesive resistance toheat just worse and worse, along with temperature rises to 100 DEG C, the stripping strength of adhesive tape can reduce gradually and confining force also declines obviously.Present stage, modified acroleic acid tackiness agent just caused Many researchers to pay close attention to because of the continuous pursuit to resistance to elevated temperatures.
Summary of the invention
The object of the invention is to provide high temperature resistant release film and the high-temperature resistance adhesive of a kind of High temperature-resistanadhesive adhesive tape and use thereof.
For achieving the above object, the first technical scheme that the present invention adopts is: a kind of high-temperature resistance adhesive, is characterized in that: the composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 40-80 part;
Octadecyl acrylate 20-30 part;
Phenyltrimethoxysila,e 5-10 part;
Vinyltriisopropenyloxysilane 5-10 part;
Nano silicon 2-10 part;
Hexafluoro-2,4-diacetylmethane aluminium 1-5 part;
Polyvinyl alcohol 2-6 part;
Emulsifying agent 2-5 part;
Initiator 1-3 part;
Deionized water 200-350 part.
Preferred technical scheme is: described emulsifying agent is selected from sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium succinate, hexadecyl polyethylene oxide ether.
Preferred technical scheme is: described emulsifying agent is the mixture that sodium lauryl sulphate and hexadecyl polyethylene oxide ether are formed according to the mass ratio of 2:1.
Preferred technical scheme is: described initiator is Potassium Persulphate or ammonium persulphate.
For achieving the above object, the second technical scheme that the present invention adopts is: a kind of high temperature resistant release film, and the composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 60-80 part;
Trifluoro propyl methyl cyclotrisiloxane 10-30 part
Polybutylene terephthalate 5-25 part;
Ethylene-vinyl acetate copolymer 2-10 part;
Vinyl phenyl silicone oil 2-8 part;
Dioctyl sebacate 1-3 part;
Dibutyl tin laurate 1-4 part.
For achieving the above object, the third technical scheme that the present invention adopts is: a kind of High temperature-resistanadhesive adhesive tape, comprises stacked high-temperature resistance adhesive and high temperature resistant release film, and the composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 40-80 part;
Octadecyl acrylate 20-30 part;
Phenyltrimethoxysila,e 5-10 part;
Vinyltriisopropenyloxysilane 5-10 part;
Nano silicon 2-10 part;
Hexafluoro-2,4-diacetylmethane aluminium 1-5 part;
Polyvinyl alcohol 2-6 part;
Emulsifying agent 2-5 part;
Initiator 1-3 part;
Deionized water 200-350 part;
The composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 60-80 part;
Trifluoro propyl methyl cyclotrisiloxane 10-30 part
Polybutylene terephthalate 5-25 part;
Ethylene-vinyl acetate copolymer 2-10 part;
Vinyl phenyl silicone oil 2-8 part;
Dioctyl sebacate 1-3 part;
Dibutyl tin laurate 1-4 part.
Preferred technical scheme is: described emulsifying agent is selected from sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium succinate, hexadecyl polyethylene oxide ether.
Preferred technical scheme is: described emulsifying agent is the mixture that sodium lauryl sulphate and hexadecyl polyethylene oxide ether are formed according to the mass ratio of 2:1.
Preferred technical scheme is: described initiator is Potassium Persulphate or ammonium persulphate.
Related content in technique scheme is explained as follows:
1, in such scheme, polyimide (PI) can carry out work under condition for a long time more than 350 DEG C, short-term job temperature can reach 450 DEG C, be that in current engineering plastics, high thermal resistance is best, its over-all properties is also that other special engineering plastics are incomparable in addition;
2, in such scheme, trifluoro propyl methyl cyclotrisiloxane is the siloxanes of fluoro, main containing Si-O key in siloxane molecule, bond energy is 462KJ/mol, and the bond energy of C-O is 369KJ/mol, the bond energy of Si-O is larger than C-O, so the good heat resistance of siloxanes.In addition, large than C-O key of Si-O bond angle, and Siliciumatom is larger than carbon atom, methyl occupies suitable space when rotating around Si-O key, and intermolecular gravitation is diminished, between siloxane molecule, gravitation is little, illustrates that its internal cohesive energy is little, and resistance to bond and the internal cohesive energy of polymer are closely related.And the material of fluorine silicon generally has superior thermotolerance, weathering resistance, and fluorine-containing compound has waterproof, oil resistant and the advantage such as solvent resistant, low surface energy, and the film of preparation can be made to have good resistance to elevated temperatures.Trifluoro propyl methyl cyclotrisiloxane is from Zhejiang Huan Xinfu Materials Co., Ltd;
3, in such scheme, polybutylene terephthalate (PBT) belongs to polyester series, be formed by 1.4-pbt butyleneglycol (1.4-Butylene glycol) and terephthalic acid (PTA) or terephthalate (DMT) polycondensation, and the oyster white made via mixing program is translucent to opaque, crystalline thermoplastic polyester's resin.Main chain is the saturated linear molecular composition that rigidity phenyl ring and flexible fatty alcohol couple together by each repeating unit, the height geometrical regularity of molecule and rigid element make whole system have high physical strength, outstanding chemical reagent resistance, thermotolerance and excellent electrical property; And there is no side chain in PBT molecule, symmetrical configuration, meet the requirement of closely piling up.In the system of whole release film, PBT provides extraordinary mechanical stability as skeleton.Polyimide and other silicone component can be bonded together very well.Polybutylene terephthalate is from Dupont;
4, in such scheme, described ethylene-vinyl acetate copolymer (EVA) is nontoxic, tasteless, and grease resistance, acid and alkali corrosion have higher elasticity and toughness, low temperature performance excellent, also can play the effect of expanding material.Adding of EVA makes reactive grafting rate greatly improve, and mechanical property is greatly improved.EVA and polyimide, trifluoro propyl methyl cyclotrisiloxane and polybutylene terephthalate have good consistency, obtain a kind of stable structure system, and in addition, EVA also can improve the toughness of material.EVA comes from Korea S's Samsung chemistry;
5, in such scheme, vinyl phenyl silicone oil is linking agent.Dibutyl tin laurate is stablizer, from Shanghai Nuo Tai Chemical Co., Ltd..Dioctyl sebacate is softening agent, from Tongxiang City, Zhejiang Province Chemical Co., Ltd.;
6, in such scheme, the preparation technology of high temperature resistant release film, comprises the following steps:
The first step: according to the composition of raw materials of the membrane coating material of high temperature resistant release film, corresponding weight part polyimide, trifluoro propyl methyl cyclotrisiloxane, polybutylene terephthalate, ethylene-vinyl acetate copolymer are mixed, stir with stirrer;
Second step; Next add vinyl phenyl silicone oil, dibutyl tin laurate, dioctyl sebacate again, 500-1000 rev/min of stirring, is heated to 120-160 DEG C simultaneously and obtains membrane coating material;
Membrane coating material is passed through film machine film coextrusion head on PET paper (also can be paper or other base material), co-extrusion temperature is 230-280 DEG C, back pressure 600pa-1000pa, and co-extrusion speed is 100-150m/min;
7, in such scheme, Ethylene glycol dimethacrylate is high-temperature resistance adhesive main monomer.Ethylene glycol dimethacrylate is from Guangzhou Yuan Chuan Chemical Co., Ltd.;
8, in such scheme, octadecyl acrylate is incorporated in the main chain of acrylate copolymer, and the long alkyl chain due to octadecyl acrylate can improve the consistency of polyolefine and low surface energy substrates, improves the viscosifying action of tackiness agent with this.Octadecyl acrylate is from Guangzhou Cai De Chemical Co., Ltd.;
9, in such scheme, phenyltrimethoxysila,e, vinyltriisopropenyloxysilane is using the organosilicon modifier as acrylate adhesive, because the high-temperature stability of traditional polypropylene glue is poor, be difficult to that at high temperature there is high confining force and stripping performance, also be difficult to be bonded on the low material of surface energy, and organic-silicon-modified acrylate glue has lower surface tension can soak and bind most of base material, and there is excellent water tolerance, weathering resistance, cementability, the advantage such as low temperature flexibility and thermotolerance, and in organic-silicon-modified acrylate glue, introduce phenyl and vinyl simultaneously, resistance to elevated temperatures and the stripping strength of organosilicon sizing agent can be improved further.Phenyltrimethoxysila,e, vinyltriisopropenyloxysilane are from Qufu City Huarong new chemical materials company limited;
10, in such scheme, nano-silica silicon is incorporated into the toughening effect that can improve glued membrane itself in polymkeric substance, improve force of cohesion, this is because nanoparticle has less dimensional effect, surface-interface effect, it applies and can produce very large reactive force with other components in acrylate glue.The introducing of nanoparticle can improve the rheological property of glue-line, under the prerequisite not damaging glue-line bonding force, to a certain degree can reduce the thickness of glue-line and use the consumption of glue, cost-saving.Find in further experiment of the present invention, when with a certain proportion of vinyltriisopropenyloxysilane modified nano-silica silicon, the encapsulation rate of nano silicon is close to 95%, there is the acrylate copolymer molecule more than 60% to be grafted to the surface of silicon-dioxide, which increase the dispersed nano-silica silicon of nano silicon in acrylate copolymer from Beijing Deco Dao Jin Science and Technology Ltd.;
11, in such scheme, hexafluoro-2,4-diacetylmethane aluminium is linking agent, find that hexafluoro-2,4-diacetylmethane aluminium has unique effect to acrylate glue in the present invention, during beginning, viscosity reduces along with the rising of temperature, when temperature rises to after 150 DEG C, viscosity rises along with temperature again.This is that traditional linking agent generally has a softening temperature at 20 DEG C and a DEG C degree left and right to pressure sensitive adhesive, and hexafluoro-2,4-diacetylmethane aluminium makes pressure sensitive adhesive at about 150 DEG C many softening temperatures, and this is the sequestering action because the carboxyl in the ligand exchange of aluminium cross-linked point and main chain occurs.Heat-up time long alkyl group side chain thawing and crystallization can cause the reversible transition of viscosity, the mobility of main chain can strengthen the cooperation exchange interaction at aluminium cross-linked point, this considerably increases the force of cohesion of acrylate glue, improves its resistance toheat.Hexafluoro-2,4-diacetylmethane aluminium is from lark prestige Science and Technology Ltd.;
12, in such scheme, polyvinyl alcohol can use together with emulsifying agent, strengthens their oilness, moisture retention, dispersiveness, cementability;
13, in such scheme, the preparation method of high-temperature resistance adhesive, comprises following concrete steps:
(1) pre-emulsion preparation
According to the composition of raw materials of high-temperature resistance adhesive by Ethylene glycol dimethacrylate, emulsifying agent, initiator, octadecyl acrylate, phenyltrimethoxysila,e, hexafluoro-2, the deionized water mixing of 4-diacetylmethane aluminium, polyvinyl alcohol and 200-300g, obtains pre-emulsion after pre-emulsification;
(2) letex polymerization
By the vinyltriisopropenyloxysilane of the deionized water of 50-150g, respective quality part, nano silicon joins in reactor, 300-500r/min rotating speed is warmed up to 70 DEG C under stirring, then above-mentioned obtained pre-emulsion instillation is added in above-mentioned reactor, within 2-4 hour, drip off, keep thermotonus 1-2 hour, be then warming up to 82-85 DEG C, continue insulation reaction 2 hours, be down to room temperature, discharging, filtration, obtain high-temperature resistance adhesive.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the production process of the high-temperature resistance adhesive of the present invention's use is without the need for machine solvent, and temperature controls easily, and can improve rate of polymerization and molecular weight, environmentally friendly, product and multiple additives have good amalgamation simultaneously;
2, the heat resistant pressure sensitive adhesive band that prepared by the present invention can work at 160 DEG C at 70 DEG C, high temperature resistantly in short-term can be greater than 600 DEG C, and surface compression distortion is little, possesses wear-resisting, shock-resistant, heat-resisting, wear-resisting premium properties.
Embodiment
Below in conjunction with embodiment, the invention will be further described.
Embodiment one: high temperature resistant release film;
The composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 65 parts;
Trifluoro propyl methyl cyclotrisiloxane 15 parts;
Polybutylene terephthalate 10 parts;
Ethylene-vinyl acetate copolymer 4 parts;
Vinyl phenyl silicone oil 4 parts;
Dioctyl sebacate 1 part;
Dibutyl tin laurate 1 part.
The preparation technology of high temperature resistant release film, comprises the following steps:
(1) according to the composition of raw materials of membrane coating material, the polyimide of corresponding weight part, trifluoro propyl methyl cyclotrisiloxane, polybutylene terephthalate, ethylene-vinyl acetate copolymer are mixed, stir with stirrer;
(2) add vinyl phenyl silicone oil, dibutyl tin laurate, dioctyl sebacate again in the mixture obtained in step (1), 600 revs/min of stirrings, are heated to 120 DEG C simultaneously and obtain membrane coating material;
(3) membrane coating material is passed through film machine film coextrusion head on PET paper, co-extrusion temperature is 240 DEG C, back pressure 600pa, and co-extrusion speed is 120m/min.Also can be common paper in other embodiment.
Embodiment two: high temperature resistant release film;
The composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 70 parts;
Trifluoro propyl methyl cyclotrisiloxane 10 parts;
Polybutylene terephthalate 8 parts;
Ethylene-vinyl acetate copolymer 5 parts;
Vinyl phenyl silicone oil 3 parts;
Dioctyl sebacate 2 parts;
Dibutyl tin laurate 2 parts.
The preparation technology of high temperature resistant release film, comprises the following steps:
(1) according to the composition of raw materials of membrane coating material, corresponding weight part polyimide, trifluoro propyl methyl cyclotrisiloxane, polybutylene terephthalate, ethylene-vinyl acetate copolymer are mixed, stir with stirrer;
(2) add vinyl phenyl silicone oil, dibutyl tin laurate, dioctyl sebacate again in the mixture obtained in step (1), 1000 revs/min of stirrings, are heated to 130 DEG C simultaneously and obtain membrane coating material;
(3) passed through by membrane coating material to drench pellicle membrane coextrusion head on PET paper, co-extrusion temperature is 280 DEG C, back pressure 700pa, and co-extrusion speed is 120m/min.
Embodiment three: high temperature resistant release film;
The composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 60 parts;
Trifluoro propyl methyl cyclotrisiloxane 22 parts;
Polybutylene terephthalate 6 parts;
Ethylene-vinyl acetate copolymer 5 parts;
Vinyl phenyl silicone oil 4 parts;
Dioctyl sebacate 1 part;
Dibutyl tin laurate 2 parts.
The preparation technology of high temperature resistant release film, comprises the following steps:
(1) according to the composition of raw materials of membrane coating material, corresponding weight part polyimide, trifluoro propyl methyl cyclotrisiloxane, polybutylene terephthalate, ethylene-vinyl acetate copolymer are mixed, stir with stirrer;
(2) add vinyl phenyl silicone oil, dibutyl tin laurate, dioctyl sebacate again in the mixture obtained in step (1), 800 revs/min of stirrings, are heated to 130 DEG C simultaneously and obtain membrane coating material;
(3) passed through by membrane coating material to drench pellicle membrane coextrusion head on PET paper, co-extrusion temperature is 250 DEG C, back pressure 800pa, and co-extrusion speed is 140m/min.
Embodiment four: high-temperature resistance adhesive;
The composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 80 parts;
Octadecyl acrylate 20 parts;
Phenyltrimethoxysila,e 5 parts;
Vinyltriisopropenyloxysilane 6 parts;
Nano silicon 4 parts;
2 parts, hexafluoro-2,4-diacetylmethane aluminium;
Polyvinyl alcohol 4 parts;
Emulsifying agent 3 parts;
Initiator 2 parts;
Deionized water 300 parts.
The preparation method of high-temperature resistance adhesive, comprises following concrete steps:
(1) pre-emulsion preparation
According to the composition of raw materials of high-temperature resistance adhesive by Ethylene glycol dimethacrylate, emulsifying agent, initiator, octadecyl acrylate, phenyltrimethoxysila,e, hexafluoro-2, the deionized water mixing of 4-diacetylmethane aluminium, polyvinyl alcohol and 200 weight parts, obtains pre-emulsion after pre-emulsification.Preferred technical scheme is: described emulsifying agent is the mixture that sodium lauryl sulphate and hexadecyl polyethylene oxide ether are formed according to the mass ratio of 2:1.Described initiator is ammonium persulphate;
(2) letex polymerization
By the vinyltriisopropenyloxysilane of the deionized water of 100 weight parts, respective quality part, nano silicon joins in reactor, 400r/min rotating speed is warmed up to 70 DEG C under stirring, then above-mentioned obtained pre-emulsion instillation is added in above-mentioned reactor, within 2 hours, drip off, keep thermotonus 1 hour, be then warming up to 82 DEG C, continue insulation reaction 2 hours, be down to room temperature, discharging, filtration, obtain high-temperature resistance adhesive.
Embodiment five: high-temperature resistance adhesive;
The composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 70 parts;
Octadecyl acrylate 25 parts;
Phenyltrimethoxysila,e 6 parts;
Vinyltriisopropenyloxysilane 8 parts;
Nano silicon 6 parts;
4 parts, hexafluoro-2,4-diacetylmethane aluminium;
Polyvinyl alcohol 5 parts;
Emulsifying agent 2 parts;
Initiator 3 parts;
Deionized water 350 parts.
The preparation method of high-temperature resistance adhesive, comprises following concrete steps:
(1) pre-emulsion preparation
According to composition of raw materials Ethylene glycol dimethacrylate, emulsifying agent, initiator, octadecyl acrylate, phenyltrimethoxysila,e, the hexafluoro-2 of high-temperature resistance adhesive, the deionized water mixing of 4-diacetylmethane aluminium, polyvinyl alcohol and 230 weight parts, obtains pre-emulsion after pre-emulsification.Described emulsifying agent is sodium succinate.Described initiator is Potassium Persulphate;
(2) letex polymerization
By the vinyltriisopropenyloxysilane of the deionized water of 120 weight parts, respective quality part, nano silicon joins in reactor, 500r/min rotating speed is warmed up to 70 DEG C under stirring, then above-mentioned obtained pre-emulsion instillation is added in above-mentioned reactor, within 2 hours, drip off, keep thermotonus 1 hour, be then warming up to 85 DEG C, continue insulation reaction 2 hours, be down to room temperature, discharging, filtration, obtain high-temperature resistance adhesive.
Embodiment six: high-temperature resistance adhesive;
The composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 75 parts;
Octadecyl acrylate 25 parts;
Phenyltrimethoxysila,e 7 parts;
Vinyltriisopropenyloxysilane 8 parts;
Nano silicon 5 parts;
4 parts, hexafluoro-2,4-diacetylmethane aluminium;
Polyvinyl alcohol 5 parts;
Emulsifying agent 4 parts;
Initiator 3 parts;
Deionized water 300 parts.
The preparation method of high-temperature resistance adhesive, comprises following concrete steps:
(1) pre-emulsion preparation
According to composition of raw materials Ethylene glycol dimethacrylate, emulsifying agent, initiator, octadecyl acrylate, phenyltrimethoxysila,e, the hexafluoro-2 of high-temperature resistance adhesive, the deionized water mixing of 4-diacetylmethane aluminium, polyvinyl alcohol and 200 weight parts, obtains pre-emulsion after pre-emulsification.Described emulsifying agent is sodium lauryl sulphate.Described initiator is ammonium persulphate;
(2) letex polymerization
By the vinyltriisopropenyloxysilane of the deionized water of 100 weight parts, respective quality part, nano silicon joins in reactor, 500r/min rotating speed is warmed up to 70 DEG C under stirring, then above-mentioned obtained pre-emulsion instillation is added in above-mentioned reactor, within 2 hours, drip off, keep thermotonus 1 hour, be then warming up to 84 DEG C, continue insulation reaction 2 hours, be down to room temperature, discharging, filtration, obtain high-temperature resistance adhesive.
Embodiment seven: High temperature-resistanadhesive adhesive tape;
Embodiment four high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment one, solidification, rolling, cut obtained adhesive tape.
Embodiment eight: High temperature-resistanadhesive adhesive tape;
Embodiment five high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment one, solidification, rolling, cut obtained adhesive tape.
Embodiment nine: High temperature-resistanadhesive adhesive tape;
Embodiment six high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment one, solidification, rolling, cut obtained adhesive tape.
Embodiment ten: High temperature-resistanadhesive adhesive tape;
Embodiment four high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment two, solidification, rolling, cut obtained adhesive tape.
Embodiment 11: High temperature-resistanadhesive adhesive tape;
Embodiment five high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment two, solidification, rolling, cut obtained adhesive tape.
Embodiment 12: High temperature-resistanadhesive adhesive tape;
Embodiment six high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment two, solidification, rolling, cut obtained adhesive tape.
Embodiment 13: High temperature-resistanadhesive adhesive tape;
Embodiment four high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment three, solidification, rolling, cut obtained adhesive tape.
Embodiment 14: High temperature-resistanadhesive adhesive tape;
Embodiment five high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment three, solidification, rolling, cut obtained adhesive tape.
Embodiment 15: High temperature-resistanadhesive adhesive tape;
Embodiment six high-temperature resistance adhesive coated on the obtained high temperature resistant release film of embodiment three, solidification, rolling, cut obtained adhesive tape.
High temperature-resistanadhesive adhesive tape relevant test method is as follows:
(1) initial bonding strength test: select 6032 adhesive tape retention trier (MIDEL KJ-6032, Dongguan City Ke Jian detecting instrument company limited), test according to GB/T4852 ~ 2002, represent initial bonding strength size with ball number;
(2) hold tack: select temperature mode adhesive tape retention trier (MIDEL KJ-6012, Dongguan City Ke Jian detecting instrument company limited), test according to GB/T4851 ~ 1998, calculate hold tack with the time that adhesive tape shear fracture drops;
(3) 180 ° of stripping strengths: select computermatic tension testing machine (MIDEL KJ-1065A, Dongguan City Ke Jian detecting instrument company limited), test according to GB/T2792 ~ 1998;
(4) high temperature hold tack: select temperature mode adhesive tape retention trier (MIDEL KJ-6012, Dongguan City Ke Jian detecting instrument company limited), carry out hold tack test at 100 DEG C, assess the resistance to elevated temperatures of adhesive tape with this.
Test result method is as follows:
| Test event | Initial bonding strength is tested | Hold tack | 180 ° of stripping strengths | High temperature hold tack |
| Embodiment seven | No. 17 | > 3 months | 334.5N/m | 4 hours 26 minutes |
| Embodiment eight | No. 18 | > 3 months | 345.7N/m | 4 hours 54 minutes |
| Embodiment nine | No. 16 | > 3 months | 361.2N/m | 4 hours 29 minutes |
| Embodiment ten | No. 21 | > 3 months | 301.2N/m | 4 hours 15 minutes |
| Embodiment 11 | No. 22 | > 3 months | 347.3N/m | 3 hours 50 minutes |
| Embodiment 12 | No. 16 | > 3 months | 371.2N/m | 3 hours 34 minutes |
| Embodiment 13 | No. 20 | > 3 months | 358.9N/m | 4 hours 31 minutes |
| Embodiment 14 | No. 20 | > 3 months | 361.2N/m | 5 hours 28 minutes |
| Embodiment 15 | No. 21 | > 3 months | 381.8N/m | 6 hours 16 minutes |
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to spirit of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (9)
1. a high-temperature resistance adhesive, is characterized in that: the composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 40-80 part;
Octadecyl acrylate 20-30 part;
Phenyltrimethoxysila,e 5-10 part;
Vinyltriisopropenyloxysilane 5-10 part;
Nano silicon 2-10 part;
Hexafluoro-2,4-diacetylmethane aluminium 1-5 part;
Polyvinyl alcohol 2-6 part;
Emulsifying agent 2-5 part;
Initiator 1-3 part;
Deionized water 200-350 part.
2. high-temperature resistance adhesive according to claim 1, is characterized in that: described emulsifying agent is selected from sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium succinate, hexadecyl polyethylene oxide ether.
3. high-temperature resistance adhesive according to claim 2, is characterized in that: described emulsifying agent is the mixture that sodium lauryl sulphate and hexadecyl polyethylene oxide ether are formed according to the mass ratio of 2:1.
4. high-temperature resistance adhesive according to claim 1, is characterized in that: described initiator is Potassium Persulphate or ammonium persulphate.
5. a high temperature resistant release film, is characterized in that: the composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 60-80 part;
Trifluoro propyl methyl cyclotrisiloxane 10-30 part
Polybutylene terephthalate 5-25 part;
Ethylene-vinyl acetate copolymer 2-10 part;
Vinyl phenyl silicone oil 2-8 part;
Dioctyl sebacate 1-3 part;
Dibutyl tin laurate 1-4 part.
6. a High temperature-resistanadhesive adhesive tape, comprises stacked high-temperature resistance adhesive and high temperature resistant release film, it is characterized in that: the composition of raw materials of described high-temperature resistance adhesive comprises the material of following weight part:
Ethylene glycol dimethacrylate 40-80 part;
Octadecyl acrylate 20-30 part;
Phenyltrimethoxysila,e 5-10 part;
Vinyltriisopropenyloxysilane 5-10 part;
Nano silicon 2-10 part;
Hexafluoro-2,4-diacetylmethane aluminium 1-5 part;
Polyvinyl alcohol 2-6 part;
Emulsifying agent 2-5 part;
Initiator 1-3 part;
Deionized water 200-350 part;
The composition of raw materials of the membrane coating material of described high temperature resistant release film comprises the material of following weight part:
Polyimide 60-80 part;
Trifluoro propyl methyl cyclotrisiloxane 10-30 part
Polybutylene terephthalate 5-25 part;
Ethylene-vinyl acetate copolymer 2-10 part;
Vinyl phenyl silicone oil 2-8 part;
Dioctyl sebacate 1-3 part;
Dibutyl tin laurate 1-4 part.
7. High temperature-resistanadhesive adhesive tape according to claim 6, is characterized in that: described emulsifying agent is selected from sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium succinate, hexadecyl polyethylene oxide ether.
8. High temperature-resistanadhesive adhesive tape according to claim 7, is characterized in that: described emulsifying agent is the mixture that sodium lauryl sulphate and hexadecyl polyethylene oxide ether are formed according to the mass ratio of 2:1.
9. High temperature-resistanadhesive adhesive tape according to claim 6, is characterized in that: described initiator is Potassium Persulphate or ammonium persulphate.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108546386A (en) * | 2018-05-02 | 2018-09-18 | 安徽九牛塑业科技有限公司 | A kind of nano-material modified plastic optical fiber and preparation method thereof |
| CN109554129A (en) * | 2018-11-26 | 2019-04-02 | 常州市白鹭电器有限公司 | Aluminum foil and adhesive tape silicone release agent |
| CN110181893A (en) * | 2019-05-30 | 2019-08-30 | 三峡大学 | A kind of leaching membrane paper and preparation method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011052304A1 (en) * | 2009-10-29 | 2011-05-05 | Kansai Paint Co., Ltd. | Copolymer, aqueous coating composition containing copolymer, and method for forming multilayer coating film |
| CN103694892A (en) * | 2013-12-05 | 2014-04-02 | 深圳市冠恒新材料科技有限公司 | Fluorine-containing polysiloxane release agent and preparation method thereof |
-
2015
- 2015-04-24 CN CN201510200632.7A patent/CN104789167B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011052304A1 (en) * | 2009-10-29 | 2011-05-05 | Kansai Paint Co., Ltd. | Copolymer, aqueous coating composition containing copolymer, and method for forming multilayer coating film |
| CN103694892A (en) * | 2013-12-05 | 2014-04-02 | 深圳市冠恒新材料科技有限公司 | Fluorine-containing polysiloxane release agent and preparation method thereof |
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|---|---|---|---|---|
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| CN108546386A (en) * | 2018-05-02 | 2018-09-18 | 安徽九牛塑业科技有限公司 | A kind of nano-material modified plastic optical fiber and preparation method thereof |
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| CN110181893A (en) * | 2019-05-30 | 2019-08-30 | 三峡大学 | A kind of leaching membrane paper and preparation method thereof |
| CN110379292A (en) * | 2019-07-13 | 2019-10-25 | 广州彩邦印刷有限公司 | High temperature resistant labels |
| CN110379292B (en) * | 2019-07-13 | 2021-06-25 | 广州彩邦印刷有限公司 | High temperature resistant label |
| CN110669278A (en) * | 2019-11-17 | 2020-01-10 | 斯莱达医疗用品（惠州）有限公司 | Pipe for effectively reducing condensate water of breathing pipeline |
| CN110669278B (en) * | 2019-11-17 | 2022-04-26 | 斯莱达医疗用品（惠州）有限公司 | Pipe for effectively reducing condensate water of breathing pipeline |
| CN111019567A (en) * | 2019-12-24 | 2020-04-17 | 李智远 | Water-based environment-friendly acrylic emulsion adhesive and preparation method thereof |
| CN111019567B (en) * | 2019-12-24 | 2021-12-07 | 浙江安益新材料有限公司 | Water-based environment-friendly acrylic emulsion adhesive and preparation method thereof |
| CN115595087A (en) * | 2022-12-15 | 2023-01-13 | 苏州高泰电子技术股份有限公司（Cn） | Latent reactive adhesive film based on polyurethane and preparation method thereof |
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