CN104730110A - Interface defect detection method and interface defect detection device of metal-dielectric medium thin-layer bonding or coating structure - Google Patents
Interface defect detection method and interface defect detection device of metal-dielectric medium thin-layer bonding or coating structure Download PDFInfo
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Abstract
The invention provides an interface defect detection method of a metal-dielectric medium thin-layer bonding or coating structure. The method comprises the following steps: a certain electric field is applied to the two sides of a sample to be tested; parts with defects on the sample to be tested firstly have a partial discharging phenomenon; and whether the sample to be tested has the defects or not by monitoring a discharging signal can be judged, and defect positioning can be carried out. An interface defect detection device of the metal-dielectric medium thin-layer bonding or coating structure comprises a high-voltage electrode with an adjustable high-voltage generator; a metal surface of the sample to be tested is tightly fitted with the high-voltage electrode; a partial discharging monitoring system is electrically connected with the high-voltage electrode and is used for detecting a defect discharging signal from a high-voltage side; and a grounding electrode is tightly fitted with a non-metal surface of the sample to be tested. According to the interface defect detection method and an interface defect detection device of the metal-dielectric medium thin-layer bonding or coating structure, the problem that interface defects of a thin-layer structure are difficult to detect can be solved; and the detection reliability is relatively high, and electric and mechanical performances of the test sample are not influenced or damaged.
Description
Technical field
The present invention relates to field of non destructive testing, the boundary defect detection method of especially a kind of metal-dielectric thin layer of adhesive or coating structure and device.
Background technology
Adhesive structure is that two kinds of different materials or material directly crimp or bond together the solid structure formed.At present, thin layer of adhesive structure is widely used in each fields such as chemical industry, Aeronautics and Astronautics and food.But manufacture at it and usually there will be the defects such as pore, unsticking, delamination damage in use procedure; the existence of these defects not only causes structural strength and rigidity to reduce; and under external force, will there is mechanical property deterioration and may cause structure global failure in structure.
In engineering, the coating material of widespread use refers to that moistening matrix surface, solidifies in adhesive process, adds the coating substances of painting (plating) at substrate surface with holding runny liquid substance.It can improve and improve the performance of original material, also can give matrix new function.Easily exist or the defect such as crack initiation, hole and bubble in the thermal properties of coating and matrix, these boundary defects cause the main cause of coating material dynamic and static destruction in use often.
In metal-dielectric thin layer of adhesive or coating structure, have a kind of material to be the dielectric of insulation, another kind of material is the metal of conduction, and metal is base material normally, thicker, and dielectric is thin layer normally, as the rust protection paint etc. of metal.
Therefore, problem demanding prompt solution in engineer applied to the detection of the interface quality (namely having zero defect) of metal-dielectric thin layer of adhesive or coating structure, but the detection up to the present, for the boundary defect detecting metal-dielectric laminate structure or coating is but not yet successful.Difficulty is: the coating of metal-dielectric and thin layer are all very thin, and conventional echo damages spy method cannot make the ripple signal received be separated in time domain, causes conventional method of detection to be lost efficacy.
Summary of the invention
Technical matters to be solved by this invention is to provide boundary defect detection method and the device of a kind of metal-dielectric thin layer of adhesive or coating structure, the problem of the boundary defect detection difficult of laminate structure or coating can be solved, the reliability detected is higher, and can not affect or damage the electric of test product and mechanical property.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is: the boundary defect detection method of a kind of metal-dielectric thin layer of adhesive or coating structure, the method is: apply certain electric field in test product both sides to be measured, on test product to be measured, defective place will take the lead in occurring partial discharge phenomenon, by monitoring discharge signal, test product to be measured whether existing defects can be judged, and carry out defect location.
Principle of the present invention is: in the interface of metal-dielectric laminate structure or coating, often has a kind of material to be dielectric, therefore, applies certain high voltage, will form certain electric field by test product at electrode two ends in this test product both sides to be measured.
The method comprises the following steps:
1) be positioned over by test product to be measured on the basic platform of fixed electorde formation, traveling electrode can move on test product to be measured;
2) certain electric field is applied by applying certain high-tension mode in test product both sides to be measured to test product both sides to be measured;
3) regulation voltage is to change the size of electric field, makes all cannot detect discharge signal in most of position of test product to be measured;
4) move traveling electrode respectively along the X of test product to be measured, Y-direction, when traveling electrode arrives certain position, monitor local discharge signal, illustrate that traveling electrode place place also exists defect, now should suspend mobile traveling electrode, recording defect position,
Test product to be measured whether existing defects can be judged, and carry out defect location.
Also move traveling electrode by micro-in step 3), from the presence or absence of Partial discharge signal, judge size and the shape of defect; If mobile traveling electrode, until travel through whole test product to be measured, does not have Partial discharge signal, then test product 1 zero defect to be measured is described.
Step 2) in the high voltage range that applies be that 220V ~ 10kV is adjustable, added actual voltage value to be tabled look-up decision according to the thickness of thin layer.
In step 1), when fixed electorde is high-field electrode, traveling electrode is ground-electrode; When fixed electorde is ground-electrode, traveling electrode is high-field electrode.
The boundary defect pick-up unit of a kind of metal-dielectric thin layer of adhesive or coating structure, comprise the high-field electrode being with adjustable high pressure generator, the metal covering of test product to be measured is close to high-field electrode, monitoring system is put in office and high-field electrode is electrically connected, from high-pressure side detecting defects discharge signal, ground-electrode is close to the non-metal surfaces of test product to be measured.
Three freedom degree manipulator and high-field electrode or ground-electrode or test product to be measured match, and promote high-field electrode or ground-electrode or test product to be measured and move.
The fundamental difference of technical solution of the present invention and existing high frequency echo detection technique is: existing echo detecting technology, no matter which kind of method, all utilize detect a flaw the different time of arrival of reflection wave, when structure and coating are very thin time, the echo time cannot telling defect and test product normal segments is poor, is therefore difficult to detect whether have defect.The electric field method of present patent application protection, does not fundamentally adopt the principle of echo, but Real-Time Monitoring applies the local discharge signal after electric field, no matter the size of defect, as long as there is air gap in defect, can monitor discharge signal, the reliability of detection is higher.
The boundary defect detection method of a kind of metal-dielectric thin layer of adhesive provided by the invention or coating structure and device, the problem of the boundary defect detection difficult of laminate structure or coating can be solved, the reliability detected is higher, and can not affect or damage the electric of test product and mechanical property; What detect is gas discharge in defect, gas thinner (air pressure is lower), and defect is less, and the starting potential of electric discharge is lower, and the sensitivity of detection is higher, is very suitable for detecting fine defects.
The invention belongs to nondestructive examination, the high voltage size that conservative control applies, the electric insulation of test product can not be damaged; Due to applying is electric field, can not produce the effect of power, can not affect or damage the mechanical property of test product, be suitable for large application scope.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the structural representation of apparatus of the present invention.
Embodiment
The boundary defect detection method of a kind of metal-dielectric thin layer of adhesive or coating structure, the method is: apply certain electric field in test product 1 both sides to be measured, on test product 1 to be measured, defective place will take the lead in occurring partial discharge phenomenon, by monitoring discharge signal, test product to be measured 1 whether existing defects can be judged, and carry out defect location.
The method comprises the following steps:
1) be positioned over by test product 1 to be measured on the basic platform of fixed electorde formation, traveling electrode can move on test product 1 to be measured;
2) certain electric field is applied by applying certain high-tension mode in test product 1 both sides to be measured to test product 1 both sides to be measured;
3) regulation voltage is to change the size of electric field, makes all cannot detect discharge signal in most of position of test product 1 to be measured;
4) move traveling electrode respectively along the X of test product 1 to be measured, Y-direction, when traveling electrode arrives certain position, monitor local discharge signal, illustrate that traveling electrode place place also exists defect, now should suspend mobile traveling electrode, recording defect position,
Test product to be measured 1 whether existing defects can be judged, and carry out defect location.
Also move traveling electrode by micro-in step 3), from the presence or absence of Partial discharge signal, judge size and the shape of defect; If mobile traveling electrode, until travel through whole test product to be measured 1, does not have Partial discharge signal, then test product 1 zero defect to be measured is described.
Step 2) in the scope that applies be that 220V ~ 10kV is adjustable, added actual voltage value to be tabled look-up decision according to the thickness of thin layer.
In step 1), when fixed electorde is high-field electrode 3, traveling electrode is ground-electrode 2; When fixed electorde is ground-electrode 2, traveling electrode is high-field electrode 3.
The boundary defect pick-up unit of a kind of metal-dielectric thin layer of adhesive or coating structure, comprise the high-field electrode 3 being with adjustable high pressure generator 4, the metal covering of test product 1 to be measured is close to high-field electrode 3, office puts monitoring system 5 and is electrically connected with high-field electrode 3, from high-pressure side detecting defects discharge signal, ground-electrode 2 is close to the non-metal surfaces of test product 1 to be measured.
Three freedom degree manipulator 6 and high-field electrode 3 or ground-electrode 2 or test product to be measured 1 match, and promote high-field electrode 3 or ground-electrode 2 or test product to be measured 1 and move.
The course of work of apparatus of the present invention is as follows:
Test product 1 to be measured is positioned on basic platform that high-field electrode 3 formed; The metal covering of test product 1 to be measured is close to high-field electrode 3, to obtain high voltage; Ground-electrode 2, under the control of three freedom degree manipulator 6, can travel through the surface of test product 1 to be measured along X, Y-direction.
When above ground-electrode 2 moves to test product 1 defect to be measured, due to the existence of gas in defect, office puts monitoring system 5 and will monitor pulsed discharge signal, when electrode 2 removes defect area, office puts monitoring system 5 and will monitor less than pulsed discharge signal, thus test product to be measured 1 whether existing defects can be judged, and carry out defect location.
During concrete enforcement,
1) position of high-field electrode 3 and ground-electrode 2 is interchangeable.I.e. solid ground electrode 2, mobile high-voltage electrode 3, now, test product 1 to be measured is placed on the basic platform of ground-electrode 2 formation.
2) also can solid ground electrode 2 and high-field electrode 3 motionless, and move test product 1 to be measured by three freedom degree manipulator 6 in X, Y-direction.Test product 1 to be measured can also be moved, simultaneously mobile grounding electrode 2 or high-field electrode 3 in the Y direction in X-direction.
3) office puts monitoring system 5 and also can be electrically connected with ground-electrode 2, from side pressure side detecting defects discharge signal.
Claims (7)
1. the boundary defect detection method of a metal-dielectric thin layer of adhesive or coating structure, it is characterized in that the method is: apply certain electric field in test product to be measured (1) both sides, the upper defective place of test product to be measured (1) will take the lead in occurring partial discharge phenomenon, by monitoring discharge signal, test product to be measured (1) whether existing defects can be judged, and carry out defect location.
2. the boundary defect detection method of a kind of metal-dielectric thin layer of adhesive according to claim 1 or coating structure, is characterized in that the method comprises the following steps:
1) be positioned over by test product to be measured (1) on the basic platform of fixed electorde formation, traveling electrode can be upper mobile at test product to be measured (1);
2) certain electric field is applied by applying certain high-tension mode in test product to be measured (1) both sides to test product to be measured (1) both sides;
3) regulation voltage is to change the size of electric field, makes all cannot detect discharge signal in most of position of test product to be measured (1);
4) move traveling electrode respectively along the X of test product to be measured (1), Y-direction, when traveling electrode arrives certain position, monitor local discharge signal, illustrate that traveling electrode place place also exists defect, now should suspend mobile traveling electrode, recording defect position,
Test product to be measured (1) whether existing defects can be judged, and carry out defect location.
3. the boundary defect detection method of a kind of metal-dielectric thin layer of adhesive according to claim 1 or coating structure, is characterized in that: also move traveling electrode by micro-in step 3), from the presence or absence of Partial discharge signal, judges size and the shape of defect; If mobile traveling electrode, until travel through whole test product to be measured (1), does not have Partial discharge signal, then test product to be measured (1) zero defect is described.
4. the boundary defect detection method of a kind of metal-dielectric thin layer of adhesive according to claim 1 or coating structure, is characterized in that: step 2) in apply high voltage be that 220V ~ 10kV is adjustable.
5. the boundary defect detection method of a kind of metal-dielectric thin layer of adhesive according to claim 1 or coating structure, is characterized in that: in step 1), and when fixed electorde is high-field electrode (3), traveling electrode is ground-electrode (2); When fixed electorde is ground-electrode (2), traveling electrode is high-field electrode (3).
6. the boundary defect pick-up unit of a metal-dielectric thin layer of adhesive or coating structure, comprise the high-field electrode (3) of the adjustable high pressure generator of band (4), it is characterized in that: the metal covering of test product to be measured (1) is close to high-field electrode (3), office puts monitoring system (5) and is electrically connected with high-field electrode (3), from high-pressure side detecting defects discharge signal, ground-electrode (2) is close to the non-metal surfaces of test product to be measured (1).
7. the boundary defect pick-up unit of a kind of metal-dielectric thin layer of adhesive according to claim 6 or coating structure, it is characterized in that: three freedom degree manipulator (6) and high-field electrode (3) or ground-electrode (2) or test product to be measured (1) match, and promote high-field electrode (3) or ground-electrode (2) or test product to be measured (1) mobile.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| RU2656292C1 (en) * | 2017-05-10 | 2018-06-04 | Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский Томский политехнический университет" | Method of control of the integrity of the dielectric coating of a metal substrate |
| CN109520924A (en) * | 2018-11-29 | 2019-03-26 | 哈尔滨汽轮机厂有限责任公司 | Metal Substrate workpiece surface sheet metal coating strength detecting method in conjunction with ontology |
| CN111289570A (en) * | 2020-03-30 | 2020-06-16 | 天津大学 | Component coating debonding nondestructive testing device |
| CN112763543A (en) * | 2020-12-29 | 2021-05-07 | 电子科技大学 | Object defect detection method and system based on active electric field |
| CN112946428A (en) * | 2019-11-26 | 2021-06-11 | 杭州通产机械有限公司 | Detection method |
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| CN112763543A (en) * | 2020-12-29 | 2021-05-07 | 电子科技大学 | Object defect detection method and system based on active electric field |
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Application publication date: 20150624 |