CN104729338B - Graded metal loose foam thermal - Google Patents
Graded metal loose foam thermal Download PDFInfo
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- CN104729338B CN104729338B CN201510114972.8A CN201510114972A CN104729338B CN 104729338 B CN104729338 B CN 104729338B CN 201510114972 A CN201510114972 A CN 201510114972A CN 104729338 B CN104729338 B CN 104729338B
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Abstract
A kind of graded metal loose foam thermal, including: coolant circulation passage and airtight evaporation cavity, wherein: the side of coolant circulation passage and the inwall of airtight evaporation cavity are equipped with graded metal foam；The excursion of the hole density of graded metal foam is 3PPI～130PPI, porosity change scope 0.5～0.98, and material is red copper, rustless steel, aluminum, nickel.The construction features of the graded metal foam that the present invention utilizes cleverly, with the form of evaporation cavity additional square duct, bottom wall heat is discharged, greatly improve the coefficient of heat transfer, the wall surface temperature of electronic device can be effectively reduced, improve the runnability of electronic device, extend the service life of electronic device.
Description
Technical field
The present invention relates to the technology in a kind of heat abstractor field, the graded metal loose foam that a kind of heat exchange efficiency is high
Thermal.
Background technology
Eighties of last century eighties, the heat flow density of integrated circuit is about 10W cm‐2, 20 30W are then increased to the nineties
cm‐2, within 2008, have increased to 100W cm‐2, reach as high as 1000W cm future‐2.The height of heat abstractor heat exchange efficiency is direct
Have influence on runnability and the service life of electronic equipment.Therefore, develop efficient electronic device heat transmission equipment be one urgently
Solving of task.Currently, the radiator of most electronic devices is the aluminum fin of casting, although this radiator easily adds
Work, but the coefficient of heat transfer is low, and radiating rate is slow, it is impossible to meet the requirement to heat radiation of the current electron trade.And graded metal foam changes
Ratio of specific heat surface area is big, and there is a passage wriggled of dense metallic framework and gradual change inside, and light weight, in phase-change heat-exchange field
There is the brightest application prospect.
Through the retrieval of prior art is found, Chinese patent literature CN 1878451A open (bulletin) day
2006.12.13, disclose a kind of heat abstractor, including pedestal and the multiple fin from base-plates surface extension, this base interior
Having an evaporation cavity, intracavity is filled with working fluid, wherein, is added with nano-particle in this working fluid.But in evaporation process,
In evaporation cavity in this technology, the nano-particle in working fluid easily deposits, and causes the reduction of effective thermal conductivity, and reducing should
The overall heat exchange efficiency of heat abstractor, is unfavorable for life-time service.
Chinese patent literature CN104266519A, open (bulletin) day 2015.01.07, discloses one and utilizes rigidity
The open-pore metal foam heat pipe with hole density gradual change of thermal conductor technical field, including: heat pipe and foam sintering
In the open-pore metal foam of heat pipe inner wall, wherein: the middle part outer layer of heat pipe is provided with adiabatic section, and two ends are respectively placed in heat exchange environment
Cold end and hot junction；The structure of open-pore metal foam is: interior bone is the structure of dense degree gradual change, i.e. porosity is identical,
Hole density is gradually increased along heat pipe wall vertical direction or reduces；Or hole density is identical, porosity is along heat pipe wall Vertical Square
To being gradually increased or reducing；Or hole density is the most identical with porosity, the material of use presses layer change.This technology increases heat exchange
Specific surface area, the flowing of the fluid beneficially gradually expanded because being heated and heat exchange, enhance capillary force so that this heat pipe is changing
In the case of thermal effect is identical, heat exchange efficiency is higher, and metal consumptive material is less, volume is less.But this technology prepares graded metal foam
Fill the complex process of heat pipe, relatively costly, and also heat pipe is easily damaged, and is unfavorable for reusing.
Chinese patent literature CN103528410A, open (bulletin) day 2014.01.22, discloses a kind of gravity assisted heat pipe
Formula metal foam flat plate heat exchanger, relates to a kind of flat plate heat exchanger.This technology is in order to solve existing heat exchanger dividing plate two effluent
Body temperature difference is big, the problem of heat exchanger effectiveness difference.The top board of this technology, base plate and two side plates enclose formation rectangular frame structure,
Dividing plate is arranged between top board and base plate, and dividing plate, top board and base plate are all horizontally disposed with, and before and after dividing plate, side is connected to two sides
On plate, forming cry-fluid passage between dividing plate and top board, form high temperature fluid passage between dividing plate and base plate, cryogen is led to
In road and high temperature fluid passage, all sintering has metal foam, and dividing plate offers multiple installing hole, and gravity assisted heat pipe is perpendicular to dividing plate
Arranging, the stage casing of gravity assisted heat pipe is welded on installing hole, and the condensation end of gravity assisted heat pipe is positioned at cry-fluid passage, gravity assisted heat pipe
Evaporation ends be positioned at high temperature fluid passage.This technology dividing plate both sides fluid temperature difference is little, and heat exchanger effectiveness is good.But this technology uses
Be common homogeneous metal foam, it is impossible to meeting the trend that heated liquid expands, thus heat exchange property is relatively low.
Summary of the invention
The present invention is directed to deficiencies of the prior art, propose a kind of graded metal loose foam thermal.
The present invention is achieved by the following technical solutions:
The present invention relates to a kind of graded metal loose foam thermal, including: coolant circulation passage and airtight evaporation cavity, its
In: the side of coolant circulation passage and the inwall of airtight evaporation cavity are equipped with graded metal foam.
Described airtight evaporation cavity injects liquid by liquid injection channel, and this liquid is FC 72 or deionized water.
Described liquid injection channel is provided with safety-valve, in case evaporation cavity pressure is too high, it is to avoid evaporation cavity explodes.
The excursion of the hole density of described graded metal foam is 3PPI～130PPI, porosity change scope 0.5
～0.98, material is red copper, rustless steel, aluminum, nickel.
The present invention relates to the preparation method of above-mentioned graded metal loose foam thermal, by the horse under argon shield environment
Not realizing in stove, its concrete steps include:
The first step, place between graded metal foam and copper plate a yellow gold sheet and clamp after sinter, make steaming
Send out the top half in chamber；The most individually repeat this operation and obtain the latter half of evaporation cavity.
Second step, is positioned over the upper and lower two-part side of evaporation cavity some pieces of copper plates, and copper plate steeps with graded metal
Sinter after corresponding yellow gold sheet being set between foam and clamping, make closed evaporating chamber.
3rd step, the upper body outside wall surface in closed evaporating chamber sets gradually yellow gold sheet and graded metal foam also
Sinter after stepping up, make the square duct for cooling.
4th step, arranges one for injecting the pipeline of the band valve of liquid in the side in closed evaporating chamber, making heat radiation dress
Put.
Described sintering refers to: naturally cool to room temperature, by ladder after being warming up to 950 DEG C by Muffle furnace and kept 30 minutes
Degree metal foam and copper plate are sintered together.
Described Muffle furnace is preferably built-in argon shield.
Technique effect
Compared with prior art, the present invention utilizes the geometry feature of the interconnected pore gradual change of graded metal foam, more
Being conducive to the evaporation of liquid, compared with traditional evaporation cavity, the coefficient of heat transfer of the evaporation cavity of the present invention can improve a quantity
Level.The present invention, by means of the heat exchange property of graded metal foam excellence, can require to make according to the area of dissipation of electronic device
The evaporation cavity of corresponding size, is suitable for large-scale application.
Accompanying drawing explanation
Fig. 1 is sectional view of the present invention；
In figure: heating surface copper base 1, graded metal foam 2, red copper wall 3, airtight evaporation cavity 4, graded metal foam 5,
Red copper wall 6, graded metal foam 7, coolant circulation passage 8, red copper wall 9, liquid injection channel 10, safety-valve 11.
Fig. 2 is preparation process schematic diagram of the present invention；
In figure: a, b, c, d are followed successively by four steps.
Detailed description of the invention
Below in conjunction with the accompanying drawings presently preferred embodiments of the present invention is described in detail, so that advantages of the present invention is more easy to by this
Skilled person understands, but protection scope of the present invention is not limited to this embodiment.
Embodiment 1
As it is shown in figure 1, the present embodiment graded metal loose foam thermal, including: the coolant being split to form by metallic plate
Circulation passage 10 and airtight evaporation cavity 4, wherein: the side of coolant circulation passage 10 and the inwall of airtight evaporation cavity 4 are equipped with
Graded metal foam 2,5,7.
Described airtight evaporation cavity 4 injects liquid by liquid injection channel, and this liquid is FC 72 or deionized water.
Described liquid injection channel 10 is provided with safety-valve 11, in case evaporation cavity pressure is too high, it is to avoid evaporation cavity
Blast.
The hole variable density scope of described graded metal foam 2,5,7 is consistent, for 3PPI～130PPI；Porosity change
Scope 0.5～0.98；Material is red copper, rustless steel, aluminum, nickel.
The present embodiment realizes preparing by following steps:
The first step, between graded metal foam and copper plate, place a piece of yellow gold sheet, use rustless steel flexible jig
They are clamped, then they is positioned in the Muffle furnace of argon shield environment.
Second step, turn on the power, Muffle furnace in-furnace temperature is risen to 950 DEG C, keeps 30 minutes.
3rd step, closedown power supply, natural cooling, in-furnace temperature is gradually decrease to room temperature.Thus by graded metal foam
It is sintered together with copper plate, makes the latter half of evaporation cavity, as shown in Figure 2 a.
4th step, repeat above-mentioned first, second and third step, prepare the top half of evaporation cavity.
5th step, is placed on yellow gold sheet between the upper and lower two-part side of evaporation cavity and four pieces of copper plates, with not
Rust steel flexible jig by they clamp, then they are positioned in the Muffle furnace of argon shield environment, repeat second step and
3rd step.It is prepared as the evaporation cavity closed, as shown in Figure 2 b.
6th step, repeats first, second and third step, and graded metal foam and evaporation cavity upper body outside wall surface are sintered in one
Rise, be prepared as the square duct of cooling, as shown in Figure 2 c.
7th step, punches in the side of evaporation cavity, the pipeline of one band valve of soldering, it is simple to inject liquid in evaporation cavity
Body, as shown in Figure 2 d.
The present embodiment by sintering graded metal foam 2 in the latter half of evaporation cavity, it is simple to the evaporation of liquid.In evaporation
The top half sintering in chamber has graded metal foam 5, it is simple to the whereabouts of the liquid that steam condensation is formed.Bottom at square duct
Sintering has graded metal foam 7, it is simple to the heat of evaporation cavity is taken away by cooling liquid.The graded metal that the present invention utilizes cleverly
The construction features of foam, discharges bottom wall heat with the form of the additional square duct of evaporation cavity, greatly improves heat exchange
Coefficient, can effectively reduce the wall surface temperature of electronic device, improves the runnability of electronic device, extends making of electronic device
Use the life-span.
The overall coefficient of heat transfer of the graded metal loose foam hot charging of the present invention compared with without filler metal foam evaporation cavity high 4～
10 times, the foam-filled evaporation cavity of more common homogeneous metal is high 2～5 times.
Claims (5)
1. the preparation method of a graded metal loose foam thermal, it is characterised in that described graded metal loose foam hot charging
Put and include: coolant circulation passage and airtight evaporation cavity, wherein: the side of coolant circulation passage and the inwall of airtight evaporation cavity
It is equipped with graded metal foam；
The excursion of the hole density of described graded metal foam is 3PPI～130PPI, porosity change scope 0.5～
0.98, material is red copper, rustless steel, aluminum, nickel；
Described preparation method concrete steps include:
The first step, sinters after placing a yellow gold sheet and clamping, make evaporation cavity between graded metal foam and copper plate
Top half；The most individually repeat this operation and obtain the latter half of evaporation cavity；
Second step, is positioned over the upper and lower two-part side of evaporation cavity some pieces of copper plates, copper plate and graded metal foam it
Between arrange correspondence yellow gold sheet and clamp after sintering, make airtight evaporation cavity；
3rd step, the upper body outside wall surface at airtight evaporation cavity sets gradually yellow gold sheet and graded metal foam and clamps
Rear sintering, makes the square duct for cooling；
4th step, arranges in the side of airtight evaporation cavity one for injecting the pipeline of the band valve of liquid, makes heat abstractor.
Preparation method the most according to claim 1, is characterized in that, described airtight evaporation cavity passes through liquid injection channel
Injecting liquid, this liquid is FC 72 or deionized water.
Preparation method the most according to claim 2, is characterized in that, described liquid injection channel is provided with relief valve
Door.
Preparation method the most according to claim 1, is characterized in that, described sintering refers to: be warming up to by Muffle furnace
950 DEG C and naturally cool to room temperature after keeping 30 minutes, graded metal foam and copper plate are sintered together.
Preparation method the most according to claim 4, is characterized in that, the built-in argon shield of described Muffle furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510114972.8A CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510114972.8A CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
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| Publication Number | Publication Date |
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| CN104729338A CN104729338A (en) | 2015-06-24 |
| CN104729338B true CN104729338B (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510114972.8A Active CN104729338B (en) | 2015-03-16 | 2015-03-16 | Graded metal loose foam thermal |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716461B (en) * | 2016-02-05 | 2018-04-06 | 江苏科技大学 | A kind of temperature-uniforming plate and manufacture method of the gradient porous capillary wick of in-plane |
| CN107979953A (en) * | 2017-11-22 | 2018-05-01 | 上海交通大学 | Graded metal foam and fin combined radiator |
| CN114688889A (en) * | 2022-03-22 | 2022-07-01 | 东南大学 | Space lattice type foam metal-based intensified condensing device of aerospace thermal control system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201226636Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Liquid cooling radiating device with evaporation cavity |
| US20110284189A1 (en) * | 2010-05-24 | 2011-11-24 | Sumontro Sinha | Reusable high temperature thermal protection system |
| CN103134365A (en) * | 2013-02-17 | 2013-06-05 | 上海交通大学 | Through hole metal foam heat pipe heat exchange device with gradient topographic characteristics |
| CN103528410A (en) * | 2013-10-31 | 2014-01-22 | 中国石油大学(华东) | Gravity heat pipe type metal foam flat plate heat exchanger |
| CN103528406B (en) * | 2013-10-31 | 2015-05-13 | 中国石油大学(华东) | Flat-plate heat exchanger filled with metal foam at partial portion |
| CN104236359B (en) * | 2014-10-09 | 2016-02-03 | 上海交通大学 | A kind of step phase-transition heat-storage heat release integrated apparatus adopting metal foam |
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