CN104661450B - A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN - Google Patents
A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN Download PDFInfo
- Publication number
- CN104661450B CN104661450B CN201510084217.XA CN201510084217A CN104661450B CN 104661450 B CN104661450 B CN 104661450B CN 201510084217 A CN201510084217 A CN 201510084217A CN 104661450 B CN104661450 B CN 104661450B
- Authority
- CN
- China
- Prior art keywords
- hole
- laser
- copper
- gradually
- method based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention discloses and to provide a kind of technique convenient and simple, without consuming a large amount of chemicals and energy conservation and environmental protection, method of the obtained metal layer adhesion property preferably based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN.This method includes：Surface roughening treatment is carried out to copper foil；Using laser drill, and copper foil fusing at the position of hole, which is collapsed, makes it cover hole wall；Pickling, carries out electric plating of whole board behind whole hole, completes the metallization in hole.The advantages of this method is that drilling and the via hole process are combined into a step, and hole wall metal layer switching performance is excellent, reduces process costs, improves production efficiency, and need not consume a large amount of chemicals and energy conservation and environmental protection.
Description
Technical field
The present invention relates to a kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN
Background technology
With the continuous improvement of electronic equipment requirement, the printed circuit board of carrier is realized as electronic equipment electric function
It is evolving, in the market sale proportion reported according to PCB industry state of development, single sided board and dual platen are
Less than 10%, and multi-layer board such as HDI, multi-layer flexible circuit board etc. then account for more than half.
In order to realize the electrical connection of each layer circuit, multilayer circuit board is usually using hole metallization technique.Hole metallization is
Dielectric material between circuit board copper foil such as drills on polyimides, epoxy resin material, and is plated in the hole wall drilled out
One layer of copper, realize two layers or multilayer copper foil circuit between conducting.Hole metallization based on chemical plating process is a kind of relatively biography
The hole metallization technique of system.This technique generally comprises the steps：Drilling → desmearing → washing → roughening → catalysis（It is living
Change）→ washing → electroless copper → washing → electro-coppering → washing → drying.The advantages of this method is that technique is very ripe, but
It is complex, and covers the use of chemical process more, consumes a large amount of medicines and cause environmental pollution.
The content of the invention
The technical problems to be solved by the invention are convenient and simple, the nothings that overcomes the deficiencies of the prior art and provide a kind of technique
A large amount of chemicals need to be consumed and energy conservation and environmental protection, obtained metal layer adhesion property are preferably based on the direct Kong Jin of laser drill
The method of categoryization.
The technical solution adopted in the present invention is：The present invention comprises the following steps：
（1）Brown processing is carried out to copper-clad plate；
（2）Drilled using laser positioning, and it is covered hole wall copper foil fusing at hole；
（3）Pickling, electric plating of whole board, increase hole wall plating copper thickness are carried out behind whole hole.
Further, the method further includes
（4）Whole hole, carries out the whole hole of plasma to the base material after pickling, removes the organic detritus brought during drilling；
（5）Plating, whole plate plating is carried out to the base material behind whole hole, to meet that circuit board is thick to copper thickness and hole wall layers of copper
The requirement of degree.
Further, step is being carried out（1）Before, first the copper-clad plate is etched it is thinned, obtain suitable copper foil thickness
Micro- brown processing is carried out after degree again.
Further, the step（2）In using CO2 laser process equipments.
Further, the step（2）In, it should gradually increase laser power at the position of hole before organic material vaporization, and working as has
Machine material vaporizes, and laser power should be gradually reduced after being formed in drilling hole position.
Further, the step（2）In, laser positioning drills initial pulse energy control in 6-10 mJ, focal height
120-130 mm, laser frequency are controlled in 5000-6000 Hz；When reaching peak power by 15 ms, pulse energy is gradually controlled
System is in 10 mJ, and gradually control is gradually controlled in 5000 Hz focal height in 120 mm, laser frequency；Drilling cycle end, pulse
Gradually control is in 6 mJ for energy, and focal height is gradually controlled in 120 mm, and the gradual control of laser frequency is in 5600 Hz.
Further, the step（3）In using preferable to the oxide removal of copper to elemental copper not damaged
Acids.
The beneficial effects of the invention are as follows：The present invention is carried using substrate organic material and the larger difference of copper foil vapourizing temperature
A kind of new process to metallize while copper-clad plate drills to hole wall is gone out, this technique can be to avoid using chemical plating
Copper, the problem of reducing chemicals cost and environmental pollution, while processing step is shortened, process cost is reduced, and
Obtained metal layer adhesion property is preferable.
Brief description of the drawings
Fig. 1 is that what is do not dealt with cover the structure diagram of copper dual platen；
Fig. 2 is the structure diagram that brown processing is carried out to copper foil；
Fig. 3 is the structure diagram of laser drill；
Fig. 4 is the structure diagram of hole position copper foil fusing；
Fig. 5 is the structure diagram that hole position copper foil sink；
Fig. 6 is the structure diagram of drilling and completion of metallizing；
Fig. 7 is the structure diagram of whole plate plating.
Embodiment
It is described in detail below according to embodiment.Following embodiment is intended merely to the present invention preferably
Technical principle explaination is clear, and not representing the present invention can only limit using the embodiment.
Embodiment one：
The present embodiment be by the use of double-sided copper-clad soft board as base material, and realize blind hole metallize, reach electrical connection
Purpose, specifically include following steps：
A. as shown in Figure 1, the selection common polyimides double face copper of in the market is as base material, and cut into and be adapted to add
The size of work；
B. as shown in Fig. 2, carrying out micro- brown processing to polyimides double-sided copper-clad soft board plate, the condition of brown processing is：
Brown line is gone over the speed of 0.5 m/min so that the thickness of copper foil reaches 6-7M, the thicker copper-clad plate of copper foil need to lose
Brown again after being thinned is carved, the purpose of brown is to allow copper foil to absorb CO2 laser energies；
C. as shown in figure 3, the copper-clad plate after brown is placed in CO2 laser process equipments, drilled using laser positioning, and
Laser drilling parameters are controlled, the copper foil fusing of hole position is sunk, hole position organic media is heated vaporization, and hole wall stays after laser action
There is one layer of thin copper layer.Specifically copper-clad plate is placed in laser process equipment, after equipment input laser operations file, to copper-clad plate
Laser drill is carried out, while automatic control and adjustment laser power exports, initial pulse energy control is in 6-10mJ, focal height control
System is controlled in 5000-6000 Hz in 120-130 mm, laser frequency；When reaching peak power by 15 ms, pulse energy by
Gradually control in 10 mJ, gradually control is gradually controlled in 5000 Hz focal height in 120 mm, laser frequency；Drilling cycle end,
Gradually control is in 6 mJ for pulse energy, and focal height is gradually controlled in 120 mm, and the gradual control of laser frequency is in 5600 Hz；
D. as shown in figure 4, pickling, remove oxide layer that micro- brown leaves in copper foil surface, it is necessary to select to elemental copper without
Damage to the preferable acids of oxide removal of copper, to ensure the reliability of hole wall layers of copper, this example selects dilute hydrochloric acid to make
Mordant；
E. as shown in figure 5, whole hole, since laser action can bring brill dirty, can carry out hole wall using plasma clear
It is clean, plasma treatment time 30min；
F. as shown in fig. 6, whole plate is electroplated, what it is due to selection is the relatively thin copper-clad plate of copper thickness, or have passed through etching
Reduction processing is, it is necessary to integrally electroplate copper-clad plate；The metallization layers of copper of borehole wall is also required to thicken to meet circuit board process
It is required that；
G. as shown in fig. 7, after the completion of plating, washing and drying enters next process.
Embodiment two：
The present embodiment is the double face copper by the use of epoxy resin fiberglass cloth as substrate, and realizes blind hole metal
Change, achieve the purpose that electrical connection, specifically include following steps：
A. as shown in Figure 1, the selection common FR-4 double face coppers of in the market are as base material, and cut into and be adapted to processing
Size；
B. as shown in Fig. 2, carrying out micro- brown processing to covering copper hardboard, the condition of brown processing is：With the speed of 0.5 m/min
Degree goes over brown line so that the thickness of copper foil reaches 6-7M, the thicker copper-clad plate of copper foil need etching brown again after being thinned
Change, the purpose of brown is to allow copper foil to absorb CO2 laser energies；
C. as shown in figure 3, the copper-clad plate after brown is placed in CO2 laser process equipments, drilled using laser positioning, and
Laser drilling parameters are controlled, the copper foil fusing of hole position is sunk, hole position organic media is heated vaporization, and hole wall stays after laser action
There is one layer of thin copper layer, specifically copper-clad plate is placed in laser process equipment, after equipment input laser operations file, to copper-clad plate
Laser drill is carried out, while automatic control and adjustment laser power exports, initial pulse energy control is in 6-10mJ, focal height control
System is controlled in 5000-6000 Hz in 120-130 mm, laser frequency；When reaching peak power by 15 ms, pulse energy by
Gradually control in 10 mJ, gradually control is gradually controlled in 5000 Hz focal height in 120 mm, laser frequency；Drilling cycle end,
Gradually control is in 6 mJ for pulse energy, and focal height is gradually controlled in 120 mm, and the gradual control of laser frequency is in 5600 Hz；
D. as shown in figure 4, pickling, remove oxide layer that micro- brown leaves in copper foil surface, it is necessary to select to elemental copper without
Damage to the preferable acids of oxide removal of copper, to ensure the reliability of hole wall layers of copper, this example selects dilute hydrochloric acid to make
Mordant；
E. as shown in figure 5, whole hole, since laser action can bring brill dirty, can carry out hole wall using plasma clear
It is clean, plasma treatment time 30min；
F. as shown in fig. 6, whole plate is electroplated, what it is due to selection is the relatively thin copper-clad plate of copper thickness, or have passed through etching
Reduction processing is, it is necessary to integrally electroplate copper-clad plate；The metallization layers of copper of borehole wall is also required to thicken to meet circuit board process
It is required that；
G. as shown in fig. 7, after the completion of plating, washing and drying enters next process.
Above-mentioned two example, which can be seen that, can apply the copper-clad plate species of the method for the present invention very much, include but not limited to
Common various soft or hard copper-clad plates.
The present invention is described in detail in above two example, but does not mean that the present invention is limited only to both
Example.In the case where not departing from the technology of the present invention principle, make improvements and deform in the claims in the present invention and technology
Within, it should also belong to protection scope of the present invention.
Claims (6)
- A kind of 1. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN, it is characterised in that：It comprises the following steps：（1）Brown processing is carried out to copper-clad plate；（2）Drilled using laser positioning, and it is covered hole wall copper foil fusing at hole；（3）Pickling, electric plating of whole board, increase hole wall plating copper thickness are carried out behind whole hole；The step（2）In, it should gradually increase laser power at the position of hole before organic material vaporization, and when organic material vaporization, bore Kong Kongwei should be gradually reduced laser power after being formed.
- A kind of 2. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterised in that：The side Method further includes（4）Whole hole, carries out the whole hole of plasma to the base material after pickling, removes the organic detritus brought during drilling；（5）Plating, whole plate plating is carried out to the base material behind whole hole, to meet circuit board to copper thickness and hole wall copper layer thickness It is required that.
- A kind of 3. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterised in that：Carry out Step（1）Before, first the copper-clad plate is etched thinned, micro- brown processing is carried out again after obtaining suitable copper foil thickness.
- A kind of 4. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterised in that：The step Suddenly（2）In using CO2 laser process equipments.
- A kind of 5. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterised in that：The step Suddenly（2）In, laser positioning drills initial pulse energy control in 6-10 mJ, focal height 120-130 mm, laser frequency control In 5000-6000 Hz；When reaching peak power by 15 ms, pulse energy gradually in 10 mJ, focal height gradually control by control System is gradually controlled in 5000 Hz in 120 mm, laser frequency；Drilling cycle end, gradually control is high in 6 mJ, focusing for pulse energy Gradually control is gradually controlled in 5600 Hz degree in 120 mm, laser frequency.
- A kind of 6. method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN according to claim 1, it is characterised in that：The step Suddenly（3）In using to elemental copper not damaged and to the preferable acids of oxide removal of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510084217.XA CN104661450B (en) | 2015-02-16 | 2015-02-16 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510084217.XA CN104661450B (en) | 2015-02-16 | 2015-02-16 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104661450A CN104661450A (en) | 2015-05-27 |
| CN104661450B true CN104661450B (en) | 2018-05-04 |
Family
ID=53252006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510084217.XA Active CN104661450B (en) | 2015-02-16 | 2015-02-16 | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104661450B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517374B (en) * | 2015-12-17 | 2019-02-05 | 深圳崇达多层线路板有限公司 | A kind of production method of thin core plate HDI plate |
| CN107454760A (en) * | 2017-08-24 | 2017-12-08 | 高德（无锡）电子有限公司 | The radium-shine through-hole approaches of carbon dioxide laser |
| CN108156759B (en) * | 2017-12-28 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Reworking method for printed circuit board with smaller laser aperture |
| CN109661126A (en) * | 2018-12-17 | 2019-04-19 | 盐城维信电子有限公司 | A kind of via hole whole plate Electrocoppering method of flexible circuit board |
| CN110278669A (en) * | 2019-07-23 | 2019-09-24 | 信泰电子（西安）有限公司 | The production method of via hole on multi-layer PCB board |
| CN114143970A (en) * | 2021-11-29 | 2022-03-04 | 广东依顿电子科技股份有限公司 | Manufacturing method of single-side copper-based HDI board convenient for heat dissipation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4582938B2 (en) * | 2001-02-28 | 2010-11-17 | 京セラ株式会社 | Insulating sheet manufacturing method and wiring board manufacturing method |
-
2015
- 2015-02-16 CN CN201510084217.XA patent/CN104661450B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562009A (en) * | 1967-02-14 | 1971-02-09 | Western Electric Co | Method of providing electrically conductive substrate through-holes |
| US4341942A (en) * | 1978-10-31 | 1982-07-27 | International Business Machines Corporation | Method of bonding wires to passivated chip microcircuit conductors |
| CN101588679A (en) * | 2009-06-25 | 2009-11-25 | 西安交通大学 | Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104661450A (en) | 2015-05-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104661450B (en) | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN | |
| CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
| CN103079350B (en) | Method for processing patterns in blind slot of printed circuit board | |
| CN101695218B (en) | Method for manufacturing printed circuit board with half-edge hole | |
| CN104160792A (en) | Method for manufacturing printed wiring board and copper foil for laser processing | |
| KR20060114010A (en) | Method of electroplating on aluminum | |
| CN104717845A (en) | Technological method for outer layer circuit board resin hole plugging of multi-layer circuit board | |
| CN106550538A (en) | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit | |
| CN103037640B (en) | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate | |
| CN102438412B (en) | Back drilling method of PCB (Printed Circuit Board) | |
| CN110312380B (en) | Manufacturing and production method of multilayer insulated isolation circuit board with side metallized edges | |
| CN104837304A (en) | Manufacture method of circuit board | |
| CN101699932B (en) | Method for producing high thermal conductivity ceramic circuit board | |
| CN103687342B (en) | A kind of printed circuit board with disconnected hole and preparation method thereof | |
| CN103225094B (en) | The guard method of a kind of blind hole plate plating single-sided current | |
| CN103813652A (en) | Processing method of blind hole | |
| CN101699935B (en) | Method for producing locatable high heat conduction ceramic circuit board | |
| CN104981096B (en) | The processing method and circuit board of hanging golden finger | |
| CN103052267A (en) | Processing method of buried/blind hole circuit board | |
| CN210469874U (en) | Circuit board based on laser drilling carbonization conductive direct metallization hole | |
| CN101699936B (en) | Production method of bright-copper-face high-heat-conductivity ceramic circuit board capable of locating | |
| CN104902677A (en) | External layer super-thick copper circuit board and boring method thereof | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| CN105228346B (en) | The processing method and step groove circuit board of step groove circuit board | |
| CN102413639A (en) | Manufacturing method of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.17, Xianggong Road, Hongwan Industrial Zone, Xiangzhou District, Zhuhai City, Guangdong Province, 519000 Patentee after: Zhuhai Zhongjing Yuansheng Electronic Technology Co.,Ltd. Address before: No. 17, Xianggong Road, Hongwan Industrial Zone, Nanping, Xiangzhou District, Zhuhai City, Guangdong Province, 519060 Patentee before: ZHUHAI TOPSUN ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |