CN104668808A - High-purity indium fiber composited reinforcing solder and preparation method thereof - Google Patents
High-purity indium fiber composited reinforcing solder and preparation method thereof Download PDFInfo
- Publication number
- CN104668808A CN104668808A CN201510044992.2A CN201510044992A CN104668808A CN 104668808 A CN104668808 A CN 104668808A CN 201510044992 A CN201510044992 A CN 201510044992A CN 104668808 A CN104668808 A CN 104668808A
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- Prior art keywords
- solder
- purity indium
- high purity
- indium
- short
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
Disclosed are a high-purity indium fiber composited reinforcing solder and a preparation method therefor. The high-purity indium fiber composited reinforcing solder is formed by distributing short fibers in high-purity indium and the preparation method includes steps of (1) cutting the fibers into short fibers 15-30 micrometers long; (2) mixing high-purity indium powder with the short fibers and uniformly stirring to mixture; (3) pressing the mixture of the high-purity indium powder and the short fibers into preformed bulk solder; (4) rolling the preformed bulk solder into welding sheets. The high-purity indium fiber composited reinforcing solder solves the problems of low packaging strength of high-purity indium, poor fatigue performance and short device life, long-life semiconductor devices with excellent photoelectric parameters can be obtained and product pass rate can be effectively increased.
Description
Technical field
The present invention relates to a kind of high purity indium composite solder for various types of semiconductor devices relieved package, and the preparation method of this solder, belong to solder technology field.
Background technology
Twentieth century seventies, the prelude in photoelectron epoch has been pulled open in the realization of the success that semiconductor laser room temperature is shaken continuously and low loss fiber.Semiconductor laser has that volume is little, lightweight, efficiency is high, the life-span is long, be easy to modulation and the advantage such as cheap, is widely used in industry, medical science and military field.
The temperature tolerance of semiconductor devices is lower, and during encapsulation, the melt temperature of solder will lower than the highest tolerable temperature of semiconductor devices.Therefore semiconductor packages commonly uses the low melting point slicken solders such as indium (In).High purity indium solder has good heat-conductivity conducting performance, can form good Ohmic contact, have superior plastic deformation ability simultaneously with semiconductor chip, effectively can alleviate the residual stress of the material internal formed because of thermal expansion coefficient difference.But, while indium solder brings superior plasticity, yield strength is lower also, after encapsulation semiconductor devices be easy to bend, the distortion such as warpage, package strength is not high, anti-fatigue performance is poor, and simultaneously high purity indium solder encapsulated semiconductor laser instrument exists indium and spreads phenomenon, has had a strong impact on service behaviour and the service life of semiconductor devices.
In view of above shortcoming, the Au-Sn hard solder with high strength waits until that extensive use is studied.But, although Au-Sn hard solder intensity is high, loses the adaptive residual stress caused because of heat and enlarge markedly.For semiconductor laser, there is larger residual stress in chip, easily there is multiplet of doublet phenomenon in encapsulated device, has had a strong impact on the output efficiency of semiconductor laser; And under larger residual stress effect, along with the dislocation in the prolongation semiconductor chip of working time and defect constantly can increase and migration under the acting in conjunction of stress and fuel factor, even form the defects such as micro-crack, thus cause the life-span of semiconductor devices significantly to be reduced.
Chinese patent literature CN102066045B disclosed " Jin-Xi-indium solder that can use with unleaded tin solder compatibility ", it is a kind of Pb-free solder alloy made with gold, tin and indium, the concentration that presents of tin is 17.5% to 20.5%, it is 2.0% to 6.0% that indium presents concentration, and balance mass is gold.The melting range of this alloy is 290 DEG C to 340 DEG C, preferably between 300 DEG C to 340 DEG C.Because the fusing point of this welding alloy is enough high, to allow rear heated sealed; And enough lowly not cause damage to allow sealing semiconductor, be specially adapted to sealed semiconductor device.
Use Precious Metals-Gold in above-mentioned Jin-Xi-indium solder, while raising the cost, do not improve the intensity of solder.
Summary of the invention
For the deficiency that existing semiconductor packages indium solder exists, the invention provides a kind of high purity indium fiber composite and strengthen solder, this solder is under the condition not changing original high purity indium packaging technology, obtain the welding point of high strength, thus effectively improve photoelectric properties and the service life of semiconductor devices.Provide the preparation method of this solder simultaneously.
High purity indium fiber composite of the present invention strengthens solder, is be distributed with short-fibre silk in high purity indium (purity is higher than 99.99%).
Described short-fibre silk adopts carbon fiber, glass fibre, ceramic fibre or other toughness fiber do not reacted with indium.
Described short-fibre silk random dispersion in high purity indium, can not form cellosilk mass.
The volume ratio of described short-fibre silk and high purity indium is 1:20-1:10.
The length of described short-fibre silk 15 μm-30 μm.
Above-mentioned high purity indium fiber composite strengthens the preparation method of solder, comprises the following steps:
(1) filament (carbon fiber, glass fibre or ceramic fibre) is cut into the short-fibre silk that length is 15-30 μm;
(2) by the ratio mixing of high purity indium powder (200-400 order) and short-fibre silk 1:20-1:10 by volume, and stir, make mixture;
(3) mixture of high purity indium powder and short fiber is pressed into block preformed solder;
(4) block preformed solder is rolled into solder thin slice.
The compound indium solder punching obtained is become required form, both can apply.
The filament selected in the present invention and high purity indium, the Gold plated Layer on semiconductor is all reactionless, belongs to desirable physical doping, does not affect the metallurgical reaction in encapsulation process.The plasticity not too large impact added high purity indium of a small amount of fiber, and adding of fiber effectively can hinder material heat expansion, and the fiber implanted is as the reinforcing bar in concrete, serves significant invigoration effect to solder.Therefore, all advantages that fibre-reinforced high purity indium solder almost remains that high purity indium solder melt point is low, plasticity is good etc., again reduce thermal coefficient of expansion simultaneously, improve solder intensity, the combination property of solder is greatly improved.
The present invention has following characteristics:
1. adding of fiber good invigoration effect is served to high purity indium, form the compound interface layer of indium and fiber, semiconductor packages intensity is effectively promoted, improves non-deformability and the fatigue behaviour of encapsulation.
2. because fiber is covered with certain inhibition to high purity indium solder stream, suitably prevent the excessive trickling of high purity indium, thus make tube core lean out heat sink distance to reduce, improve the radiating efficiency of laser instrument.
3. the present invention does not need to change the encapsulation condition under high purity indium technique completely, remains the advantages such as low package temperature, good plasticity, good Ohmic contact and thermal conductivity.
Accompanying drawing explanation
Fig. 1 is the sectional view of high purity indium fiber composite enhancing solder prepared by the present invention.
Wherein: 1, high purity indium, 2, short-fibre silk.
Detailed description of the invention
High purity indium fiber composite of the present invention strengthens solder in the form of sheets, and its cross section as shown in Figure 1, is that random distribution has short-fibre silk 2 in high purity indium 1, and short-fibre silk 2 can not interlock, entanglement is for cellosilk mass.Described short fiber is carbon fiber, glass fibre, ceramic fibre or other toughness fiber do not reacted with indium.
The preparation process that above-mentioned short-fibre silk strengthens high purity indium composite solder is as follows:
1. carbon fiber, glass fibre or ceramic fibre are cut into the short-fibre silk 2 of single bundle or multi beam state, individual staple fibers length is less than 15-30 μm;
2. by the ratio mixing of high purity indium powder (200-400 order) and short-fibre silk 2 1:20-1:10 by volume, and stir, make mixture;
3. the mixture of high purity indium powder and short fiber is pressed into block preformed solder, because indium has good moulding therefore be easy to realize;
4. utilize the ductility that high purity indium is good, block preformed solder is rolled into solder thin slice, and punching becomes required form as required.
Above-mentioned solder is placed between heat sink and chip of laser, welds under pure indium welding procedure.Prevent fibre interferes laser instrument from going out light quality, the edge of solder sheet is concordant with the heat sink edge of light direction or inside contract 0mm-0.05mm.
Claims (6)
1. high purity indium fiber composite strengthens a solder, it is characterized in that, in high purity indium, is distributed with short-fibre silk.
2. short-fibre silk according to claim 1 strengthens high purity indium composite solder, it is characterized in that, described short-fibre silk adopts carbon fiber, glass fibre, ceramic fibre or other toughness fiber do not reacted with indium.
3. high purity indium fiber composite according to claim 1 strengthens solder, and it is characterized in that, described short-fibre silk is randomly dispersed within high purity indium.
4. high purity indium fiber composite according to claim 1 strengthens solder, and it is characterized in that, the volume ratio of described short-fibre silk and high purity indium is 1:20-1:10.
5. high purity indium fiber composite according to claim 1 strengthens solder, it is characterized in that, the length 15-30 μm of described short-fibre silk.
6. high purity indium fiber composite described in claim 1 strengthens a preparation method for solder, it is characterized in that, comprises the following steps:
(1) filament is cut into the short-fibre silk that length is 15-30 μm;
(2) by the ratio mixing of high purity indium powder and short-fibre silk 1:20-1:10 by volume, and stir, make mixture;
(3) mixture of high purity indium powder and short fiber is pressed into block preformed solder;
(4) block preformed solder is rolled into solder thin slice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510044992.2A CN104668808A (en) | 2015-01-29 | 2015-01-29 | High-purity indium fiber composited reinforcing solder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510044992.2A CN104668808A (en) | 2015-01-29 | 2015-01-29 | High-purity indium fiber composited reinforcing solder and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104668808A true CN104668808A (en) | 2015-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510044992.2A Pending CN104668808A (en) | 2015-01-29 | 2015-01-29 | High-purity indium fiber composited reinforcing solder and preparation method thereof |
Country Status (1)
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| CN (1) | CN104668808A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107442924A (en) * | 2016-05-31 | 2017-12-08 | 松下知识产权经营株式会社 | Solder material |
| CN108620765A (en) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | A kind of automobile metal plate work welding material and welding procedure |
| CN108637522A (en) * | 2018-05-25 | 2018-10-12 | 李志平 | A kind of preparation method of creep resistant solder alloy |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225090U (en) * | 1985-07-30 | 1987-02-16 | ||
| JPH09295184A (en) * | 1996-05-09 | 1997-11-18 | Omron Corp | Solder, circuit board on which electronic parts are mounted using the solder, and solder paste |
| CN101088697A (en) * | 2001-05-07 | 2007-12-19 | 霍尼韦尔国际公司 | Interface materials and methods of production and use thereof |
| JP2008036691A (en) * | 2006-08-09 | 2008-02-21 | Toyota Motor Corp | Lead-free solder material, its production method, joined structure and electronic component packaging structure |
| CN101288928A (en) * | 2008-05-09 | 2008-10-22 | 中国科学技术大学 | Ceramic granule reinforced composite material |
| CN102689096A (en) * | 2012-06-07 | 2012-09-26 | 哈尔滨工业大学 | Method for laser-induced self-propagating connection between carbon fiber reinforced aluminum-based composite and metal |
-
2015
- 2015-01-29 CN CN201510044992.2A patent/CN104668808A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225090U (en) * | 1985-07-30 | 1987-02-16 | ||
| JPH09295184A (en) * | 1996-05-09 | 1997-11-18 | Omron Corp | Solder, circuit board on which electronic parts are mounted using the solder, and solder paste |
| CN101088697A (en) * | 2001-05-07 | 2007-12-19 | 霍尼韦尔国际公司 | Interface materials and methods of production and use thereof |
| JP2008036691A (en) * | 2006-08-09 | 2008-02-21 | Toyota Motor Corp | Lead-free solder material, its production method, joined structure and electronic component packaging structure |
| CN101288928A (en) * | 2008-05-09 | 2008-10-22 | 中国科学技术大学 | Ceramic granule reinforced composite material |
| CN102689096A (en) * | 2012-06-07 | 2012-09-26 | 哈尔滨工业大学 | Method for laser-induced self-propagating connection between carbon fiber reinforced aluminum-based composite and metal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107442924A (en) * | 2016-05-31 | 2017-12-08 | 松下知识产权经营株式会社 | Solder material |
| CN108620765A (en) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | A kind of automobile metal plate work welding material and welding procedure |
| CN108637522A (en) * | 2018-05-25 | 2018-10-12 | 李志平 | A kind of preparation method of creep resistant solder alloy |
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Effective date of registration: 20151105 Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant after: Shandong Huaguang Photoelectronic Co., Ltd. Address before: 261061 Weifang high tech Zone, Jin Road, No. 9, No. Applicant before: Shandong Inspur Huaguang Optoelectronics Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150603 |
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| RJ01 | Rejection of invention patent application after publication |