CN104582258A - Thin film circuit board and method for manufacturing thin film circuit board - Google Patents
Thin film circuit board and method for manufacturing thin film circuit board Download PDFInfo
- Publication number
- CN104582258A CN104582258A CN201510009197.XA CN201510009197A CN104582258A CN 104582258 A CN104582258 A CN 104582258A CN 201510009197 A CN201510009197 A CN 201510009197A CN 104582258 A CN104582258 A CN 104582258A
- Authority
- CN
- China
- Prior art keywords
- metal
- circuit board
- film
- conducting layer
- film circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000010409 thin film Substances 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 104
- 239000002184 metal Substances 0.000 claims abstract description 104
- 239000010408 film Substances 0.000 claims abstract description 102
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 30
- 230000004888 barrier function Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 18
- 239000004411 aluminium Substances 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 230000008030 elimination Effects 0.000 claims description 4
- 238000003379 elimination reaction Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052709 silver Inorganic materials 0.000 abstract description 12
- 239000004332 silver Substances 0.000 abstract description 12
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 abstract description 2
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000002002 slurry Substances 0.000 description 11
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention is suitable for the field of circuit boards, and provides a thin film circuit board which comprises an insulating layer, a first metal conducting layer and a second metal conducting layer. The insulating layer comprises a front surface and a back surface, and the first metal conducting layer and the second metal conducting layer are respectively arranged on the front surface and the back surface of the insulating layer. The first metal conductive layer includes a plurality of first lines, and the second metal conductive layer includes a plurality of second lines. The two ends of each first circuit are respectively provided with a conductive hole, and the two ends of each first circuit respectively penetrate through the conductive holes to be electrically connected with one ends of two second circuits. The invention also provides a manufacturing method of the film circuit board. The film circuit board provided by the invention adopts common metal, such as aluminum, to replace the traditional silver paste as a circuit layer, so that the impedance of the film circuit board can be greatly reduced, and the overall performance of electronic equipment is improved. Meanwhile, the manufacturing method of the thin film circuit board provided by the invention has the advantages of simple manufacturing process, easiness in implementation, improvement of the yield of products and reduction of the product cost.
Description
Technical field
The invention belongs to field of circuit boards, particularly relate to the manufacture method of a kind of film circuit board and film circuit board.
Background technology
Point reader is that being become by textual books teaching material can by the Sound teaching material of any sounding of Learning demands by high-tech means such as 10000 electromagnetic induction navigation systems and wireless sensing click technology.Point reader, as a kind of sound unmanned educational aid, is more and more subject to the welcome of the head of a family and student.
The application of film circuit board in point reader widely.Along with electronic product is towards future development that is light, thin, short and smallization, also more and more higher to the performance requirement of the complete machine of point reader.In prior art, the film circuit board of point reader is all adopt silver slurry silk-screen printing technique to make usually.But reduction line impedance will be reached, then the thickness of the silver slurry printed will be correspondingly thickening.Usual silver slurry print thickness is not easily controlled, if deviation appears in the THICKNESS CONTROL of silver slurry printing, then can reduce the production yield of product.The thickness of silver slurry increases simultaneously, will inevitably increase the use amount of silver slurry, thus improve the cost of product.
Summary of the invention
The object of the present invention is to provide a kind of film circuit board, be intended to solve traditional silver slurry printed substrate line impedance large, the problem that product fraction defective is high.
The present invention is achieved in that a kind of film circuit board comprises insulating barrier, the first metal conducting layer and the second metal conducting layer.Described insulating barrier comprises front and the back side, and described first metal conducting layer and described second metal conducting layer are located at front and the back side of described insulating barrier respectively.Described first metal conducting layer comprises multiple first line, and described second metal conducting layer comprises multiple second circuit, and described first line and described second crossing elimination are arranged.The two ends of each described first line are respectively equipped with conductive hole, and the two ends of each described first line are each passed through described conductive hole and are electrically connected with one end of wherein two described second circuits respectively.
Wherein, the material of described first metal conducting layer and described second metal conducting layer is aluminium.
Wherein, described conductive hole is square.
Wherein, the material of described insulating barrier is PC or polyester PET.
Another object of the present invention is to the manufacture method providing a kind of film circuit board, it comprises the steps: at the front of insulating barrier and back side compound first metal conductive film and the second metal conductive film formation metal substrate respectively; Heating cure is carried out to described metal substrate; The first photosurface and the second photosurface is formed respectively at the surface coverage photosensitive material of described first metal conductive film and described second metal conductive film; The line map of the film made is transferred to described first photosurface and described second photosurface; The photosensitive material described first photosurface and described second photosurface not being formed the region of circuit is washed; Exposed described first metal conductive film and described second metal conductive film are carried out etch processes; Remaining photosensitive material is removed form the first exposed metal conducting layer and the second metal conducting layer, wherein, described first metal conducting layer comprises multiple first line, and described second metal conducting layer comprises multiple second circuit, and described first line and described second crossing elimination are arranged; Described metal substrate arranges multiple conductive hole; And the two ends of described first line be each passed through corresponding conductive hole and be connected to form film circuit board with one end of wherein two described second circuits respectively.
Wherein, the two ends of described first line be by riveted joint mode and the second corresponding circuit realize being electrically connected.
Wherein, described photosensitive material is light-sensitive surface, and is sticked on respectively on described first metal conductive film and described second metal conductive film by described light-sensitive surface by the mode of roll extrusion.
Wherein, described photosensitive material is photosensitive-ink, and described photosensitive-ink is printed on respectively on described first metal conductive film and described second metal conductive film by the mode of printing to form photosensitive wet film.
Wherein, before the step line map on the described film being transferred to described first photosurface and described second photosurface, described wiring thin film board fabrication method is further comprising the steps of: the described metal substrate being coated with described photosensitive wet film is carried out drying process.
Wherein, before the step of the surface coverage photosensitive material of described first metal conductive film and described second metal conductive film, the manufacture method of described film circuit board also comprises the described metal substrate of cleaning.
The present invention relative to the technique effect of prior art is:
Film circuit board provided by the invention adopts common metal, such as aluminium, replaces traditional silver slurry as line layer, greatly can reduce the impedance of film circuit board, thus improve the overall performance of electronic equipment.
Simultaneously, the manufacture method of film circuit board provided by the invention, composition metal conducting film on insulating barrier base material, circuit is formed by printing and etch process, and the electric connection of circuit is realized by the technique getting riveted joint ready, the processing procedure of described film circuit board is simple, easily implements, greatly can improve the production yield of product, reduce product cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described to the accompanying drawing used required in the embodiment of the present invention or description of the prior art below, apparently, accompanying drawing described is below only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the cutaway view of the film circuit board that the embodiment of the present invention provides
Fig. 2 is the front schematic view of film circuit board in Fig. 1.
Fig. 3 is the enlarged diagram of circle III part in Fig. 2.
Fig. 4 is the schematic flow sheet of the manufacture method of the film circuit board that the embodiment of the present invention provides.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Referring to Fig. 1, Fig. 2 and Fig. 3, a kind of film circuit board 100 that the specific embodiment of the invention provides comprises insulating barrier 10, first metal conducting layer 11 and the second metal conducting layer 12.Described insulating barrier 10 comprises front and the back side, and described first metal conducting layer 11 and described second metal conducting layer 12 are located at front and the back side of described insulating barrier 10 respectively.
Described first metal conducting layer 11 comprises multiple first line 111, and described second metal conducting layer 12 comprises multiple second circuit 121, and described first line 111 is arranged in a crossed manner with described second circuit 121.The two ends of each described first line 111 are respectively equipped with conductive hole 13, and the two ends of each described first line 111 are each passed through described conductive hole 13 and are electrically connected with one end of wherein two described second circuits 121 respectively.
In other words, film circuit board 100 provided by the invention arranges metal conducting layer respectively the two-sided of insulating barrier 10, and by the mode of getting riveted joint ready, the end of the circuit being positioned at described insulating barrier 10 one side is expressed to the another side of insulating barrier 10, thus described first metal conducting layer 11 is made to realize being electrically connected with described second metal conducting layer 12.
In present embodiment, the material of described first metal conducting layer 11 and described second metal conducting layer 12 is aluminium.Length be the impedance of the aluminum steel of 1m at 2 ohms, and length be 1m conventional silver slurry wiring thin film impedance minimum be 30 ohms.
As can be seen here, film circuit board 100 provided by the invention, adopts common metal, such as aluminium, replace traditional silver slurry as line layer, greatly can reduce the impedance of film circuit board 100, thus provide the overall performance of the electronic equipment using described film circuit board 100.
In other embodiments, described metal conducting layer also can be other metal material such as copper, gold.
In present embodiment, described conductive hole 13 is square.In other embodiments, described conductive hole 13 also can be circular.
In present embodiment, the material of described insulating barrier 10 is PC (Polycarbonate, Merlon) or polyester PET (Polyethylene terephthalate, poly terephthalic acid class).
To specifically introduce the manufacture method of film circuit board 100 provided by the invention below.
Please refer to Fig. 4, the manufacture method of film circuit board 100 provided by the invention, comprises following operation.
In operation S101, cleaning insulating barrier 10 is to remove the spot of insulating barrier 10.In present embodiment, the material of described insulating barrier 10 is PC (Polycarbonate, Merlon) or polyester PET (Polyethyleneterephthalate, poly terephthalic acid class).
In operation S102, at the front of insulating barrier 10 and back side compound first metal conductive film and the second metal conductive film formation metal substrate respectively.In present embodiment, described metal conductive film is aluminium film, and by process for pressing by the described aluminum film compounded front at described insulating barrier 10 and the back side.
In operation S103, heating cure is carried out to described metal substrate.After hot setting, the electrical property of described metal substrate, heat-resisting quantity and corrosion resistance can be strengthened.In present embodiment, the temperature of heating cure is 55 ° ~ 60 °.
In operation S104, clean to described metal substrate the spot removing described metallic substrate surfaces, holding plate face is cleaned.
In operation S105, respectively photosensitive material is set on the surface of described first metal conductive film and described second metal conductive film and forms the first photosurface and the second photosurface.In present embodiment, described photosensitive material is photosensitive-ink, and described photosensitive-ink is printed on respectively on described first metal conductive film and described second metal conductive film by the mode of printing to form photosensitive wet film.
In other embodiments, described photosensitive material is light-sensitive surface, and is sticked on respectively on described first metal conductive film and described second metal conductive film by described light-sensitive surface by the mode of roll extrusion.
In operation S106, the described metal substrate being printed with photosensitive wet film is carried out drying process.
In operation S107, the line map on the film made is transferred to described first photosurface and described second photosurface.In present embodiment, by Automatic continuous exposure machine, automatic aligning exposes, and the line map on the described film is transferred to described first photosurface and described second photosurface.
In operation S108, the photosensitive material described first photosurface and described second photosurface not being formed the region of circuit is washed.That is, in this operation, by not having the region exposed to wash, show the line map covered by remaining photosensitive material, simultaneously by out exposed for the metal conductive film in the region not having line map.
In operation S109, exposed described first metal conductive film and described second metal conductive film are carried out etch processes.In present embodiment, the acid liquid of exposed metal film is etched away.
In operation S110, remaining photosensitive material is removed form the first exposed metal conducting layer 11 and the second metal conducting layer 12.That is, in this operation, the photosensitive material of protection circuit is removed, exposes metallic circuit.Wherein, described first metal conducting layer 11 comprises multiple first line 111, and described second metal conducting layer 12 comprises multiple second circuit 121, and described first line 111 is arranged in a crossed manner with described second circuit 121.
In step S111, described metal substrate arranges multiple conductive hole 13.In present embodiment, form described conductive hole 13 by the mode got ready.And
In step S112, the two ends of described first line 111 are each passed through described conductive hole 13 and are connected to form film circuit board 100 with one end of wherein two described second circuits 121 respectively.In present embodiment, the two ends of described first line 111 to be pressed onto in corresponding conductive hole 13 by the mode of extruding and to be connected with the second corresponding circuit 121.That is, the two ends of described first line 111 be by riveted joint mode and the second corresponding circuit 121 realize being electrically connected.
In step S113, check the circuit characteristic of described film circuit board 100.Finally, film circuit board 100 up to standard for circuit characteristic is received between whole rear loaded cars to be delivered at junction stations use.
As can be seen here, the manufacture method of film circuit board 100 provided by the invention, composite aluminium film on insulating barrier 10 base material, forms circuit by printing and etch process, and realized the electric connection of cross link by the technique getting riveted joint ready, thus make film circuit board 100.Described film circuit board 100, adopts aluminium to replace traditional silver slurry as metal conducting layer, greatly can reduce the impedance of film circuit board 100, thus provide the overall performance of the electronic equipment using described film circuit board 100.Meanwhile, the processing procedure of described film circuit board 100 is simple, easily implements, greatly can improve the production yield of product.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a film circuit board, it is characterized in that, comprise insulating barrier, first metal conducting layer and the second metal conducting layer, described insulating barrier comprises front and the back side, described first metal conducting layer and described second metal conducting layer are located at front and the back side of described insulating barrier respectively, described first metal conducting layer comprises multiple first line, described second metal conducting layer comprises multiple second circuit, described first line and described second crossing elimination are arranged, the two ends of each described first line are respectively equipped with conductive hole, the two ends of each described first line are each passed through described conductive hole and are electrically connected with one end of wherein two described second circuits respectively.
2. film circuit board as claimed in claim 1, it is characterized in that, the material of described first metal conducting layer and described second metal conducting layer is aluminium.
3. film circuit board as claimed in claim 1, it is characterized in that, described conductive hole is square.
4. film circuit board as claimed in claim 1, it is characterized in that, the material of described insulating barrier is PC or polyester PET.
5. a manufacture method for film circuit board, is characterized in that, comprises following operation:
At the front of insulating barrier and back side compound first metal conductive film and the second metal conductive film formation metal substrate respectively;
Heating cure is carried out to described metal substrate;
The first photosurface and the second photosurface is formed respectively at the surface coverage photosensitive material of described first metal conductive film and described second metal conductive film;
The line map of the film made is transferred to described first photosurface and described second photosurface;
The photosensitive material described first photosurface and described second photosurface not being formed the region of circuit is washed;
Exposed described first metal conductive film and described second metal conductive film are carried out etch processes;
Remaining photosensitive material is removed form the first exposed metal conducting layer and the second metal conducting layer, wherein, described first metal conducting layer comprises multiple first line, and described second metal conducting layer comprises multiple second circuit, and described first line and described second crossing elimination are arranged;
Described metal substrate arranges multiple conductive hole; And
The two ends of described first line be each passed through corresponding conductive hole and be connected to form film circuit board with one end of wherein two described second circuits respectively.
6. the manufacture method of film circuit board as claimed in claim 5, is characterized in that, the two ends of described first line realize being electrically connected by the mode of riveted joint and the second corresponding circuit.
7. the manufacture method of film circuit board as claimed in claim 5, it is characterized in that, described photosensitive material is light-sensitive surface, and is sticked on respectively on described first metal conductive film and described second metal conductive film by described light-sensitive surface by the mode of roll extrusion.
8. the manufacture method of film circuit board as claimed in claim 5, it is characterized in that, described photosensitive material is photosensitive-ink, and described photosensitive-ink is printed on respectively on described first metal conductive film and described second metal conductive film by the mode of printing to form photosensitive wet film.
9. the manufacture method of film circuit board as claimed in claim 8, it is characterized in that, before the step line map on the described film being transferred to described first photosurface and described second photosurface, described wiring thin film board fabrication method is further comprising the steps of: the described metal substrate being coated with described photosensitive wet film is carried out drying process.
10. the manufacture method of film circuit board as claimed in claim 5, it is characterized in that, before the step of the surface coverage photosensitive material of described first metal conductive film and described second metal conductive film, the manufacture method of described film circuit board also comprises the described metal substrate of cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510009197.XA CN104582258B (en) | 2015-01-06 | 2015-01-06 | Thin film circuit board and method for manufacturing thin film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510009197.XA CN104582258B (en) | 2015-01-06 | 2015-01-06 | Thin film circuit board and method for manufacturing thin film circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582258A true CN104582258A (en) | 2015-04-29 |
| CN104582258B CN104582258B (en) | 2017-11-14 |
Family
ID=53097154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510009197.XA Expired - Fee Related CN104582258B (en) | 2015-01-06 | 2015-01-06 | Thin film circuit board and method for manufacturing thin film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104582258B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1502977A (en) * | 1975-09-19 | 1978-03-08 | Int Computers Ltd | Multilayer printed circuit boards |
| JP2007035710A (en) * | 2005-07-22 | 2007-02-08 | Toshiba Corp | Multilayer printed wiring board |
| CN101078886A (en) * | 2006-05-24 | 2007-11-28 | 富士胶片株式会社 | Image recording method and image recording apparatus |
| CN202111926U (en) * | 2011-06-22 | 2012-01-11 | 四川深北电路科技有限公司 | Multilayer circuit board |
| CN104064859A (en) * | 2014-06-25 | 2014-09-24 | 周启塔 | Manufacturing process of flexible antenna board |
-
2015
- 2015-01-06 CN CN201510009197.XA patent/CN104582258B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1502977A (en) * | 1975-09-19 | 1978-03-08 | Int Computers Ltd | Multilayer printed circuit boards |
| JP2007035710A (en) * | 2005-07-22 | 2007-02-08 | Toshiba Corp | Multilayer printed wiring board |
| CN101078886A (en) * | 2006-05-24 | 2007-11-28 | 富士胶片株式会社 | Image recording method and image recording apparatus |
| CN202111926U (en) * | 2011-06-22 | 2012-01-11 | 四川深北电路科技有限公司 | Multilayer circuit board |
| CN104064859A (en) * | 2014-06-25 | 2014-09-24 | 周启塔 | Manufacturing process of flexible antenna board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104582258B (en) | 2017-11-14 |
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Granted publication date: 20171114 |