CN104497897B - Method for bonding paperboard material and film-coated material - Google Patents
Method for bonding paperboard material and film-coated material Download PDFInfo
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- CN104497897B CN104497897B CN201410725170.6A CN201410725170A CN104497897B CN 104497897 B CN104497897 B CN 104497897B CN 201410725170 A CN201410725170 A CN 201410725170A CN 104497897 B CN104497897 B CN 104497897B
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- conductive sheet
- paperboard
- film
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- covering material
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- 239000000463 material Substances 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000011087 paperboard Substances 0.000 title claims abstract description 24
- 239000004743 Polypropylene Substances 0.000 claims description 2
- -1 polypropylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 7
- 239000012528 membrane Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 4
- 239000007888 film coating Substances 0.000 abstract description 3
- 238000009501 film coating Methods 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000010030 laminating Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
本发明公开了一种板纸材料与覆膜材料的粘合方法，属于覆膜方法领域，为解决现有方法密封性不好且不环保的问题而设计。一种板纸材料与覆膜材料的粘合方法，所述方法至少包括下述步骤：步骤1、将贴合覆膜材料后的板纸材料放置于第一导电片上，将第二导电片压紧贴合覆膜材料后的所述板纸材料；步骤2、为所述第一导电片和/或所述第二导电片通电预设时间t，所述第一导电片和所述第二导电片之间产生的电流使所述板纸材料和所述覆膜材料内的分子产生共振从而实现互相渗透粘合。该方法粘合效果好且环保。The invention discloses a method for bonding a cardboard material and a film-coating material, belongs to the field of film-covering methods, and is designed to solve the problems of poor sealing performance and environmental protection in the existing methods. A method for bonding a paperboard material and a film-coated material, the method at least includes the following steps: Step 1, placing the paperboard material pasted with the film-coated material on a first conductive sheet, pressing the second conductive sheet The cardboard material closely attached to the film material; step 2, electrifying the first conductive sheet and/or the second conductive sheet for a preset time t, the first conductive sheet and the second conductive sheet The electric current generated between the conductive sheets makes the molecules in the paperboard material and the film coating material resonate so as to achieve mutual penetration and adhesion. This method has good bonding effect and is environmentally friendly.
Description
技术领域technical field
本发明涉及覆膜方法领域，具体涉及一种板纸材料与覆膜材料的粘合方法。The invention relates to the field of film covering methods, in particular to a method for bonding paperboard materials and film covering materials.
背景技术Background technique
板纸材料为了提高其刚性、收缩率、强度、耐热性等参数性能，通常需要在其表面进行覆膜处理，其中，覆膜材料与板纸材料的粘合是关键步骤，决定着覆膜工艺的成败。In order to improve its rigidity, shrinkage, strength, heat resistance and other parameter properties, the cardboard material usually needs to be coated on its surface. Among them, the bonding of the film material and the cardboard material is a key step, which determines the quality of the film coating. The success or failure of craftsmanship.
现有技术中覆膜材料与板纸材料的粘合方法大部分都是通过有机化合物粘合剂将其粘合，该方法不利于环保且粘合效果不理想，也有一些是通过缝合的方法实现粘合，但是不能密封且粘合后达不到较高的使用标准。In the prior art, most of the methods of bonding film-covered materials and cardboard materials are bonded by organic compound adhesives. This method is not conducive to environmental protection and the bonding effect is not ideal, and some methods are realized by sewing. Adhesive, but cannot be sealed and does not meet high standards of use after bonding.
发明内容Contents of the invention
本发明的目的在于提出一种板纸材料与覆膜材料的粘合方法，该方法粘合效果好且环保。The object of the present invention is to propose a method for bonding cardboard materials and film-coated materials, which has good bonding effect and is environmentally friendly.
为达此目的，本发明采用以下技术方案：For reaching this purpose, the present invention adopts following technical scheme:
一种板纸材料与覆膜材料的粘合方法，所述方法至少包括下述步骤：A method for bonding a cardboard material and a film covering material, said method at least comprising the following steps:
步骤1、将贴合覆膜材料后的板纸材料放置于第一导电片上，将第二导电片压紧贴合覆膜材料后的所述板纸材料；Step 1, placing the paperboard material pasted with the coating material on the first conductive sheet, and pressing the second conductive sheet against the paperboard material pasted with the coating material;
步骤2、为所述第一导电片和/或所述第二导电片通电预设时间t，所述第一导电片和所述第二导电片之间产生的电流使所述板纸材料和所述覆膜材料内的分子产生共振从而实现互相渗透粘合。Step 2, energizing the first conductive sheet and/or the second conductive sheet for a preset time t, the current generated between the first conductive sheet and the second conductive sheet makes the paperboard material and Molecules within the coating material resonate to achieve interpenetrating bonding.
进一步的，所述第一导电片和/或所述第二导电片与高频电流机连接，所述高频电流机用于提供电源。Further, the first conductive sheet and/or the second conductive sheet are connected to a high-frequency current machine, and the high-frequency current machine is used to provide power.
进一步的，所述步骤1具体为：Further, the step 1 is specifically:
根据所需粘合的板纸材料厚度设定所述板纸材料的通电时间t，将贴合覆膜材料后的板纸材料放置于第一导电片上，按下压合开关，第二导电片将贴合覆膜材料后的所述板纸材料向下压合；Set the energization time t of the cardboard material according to the thickness of the cardboard material to be bonded, place the cardboard material after laminating the film material on the first conductive sheet, press the pressing switch, and the second conductive sheet Pressing down the cardboard material after laminating the film material;
进一步的，所述步骤2具体为：Further, the step 2 is specifically:
根据所需粘合的板纸材料厚度设定所述板纸材料的通电时间t，为所述第一导电片和/或所述第二导电片通电预设时间tSet the energization time t of the cardboard material according to the thickness of the cardboard material to be bonded, and energize the first conductive sheet and/or the second conductive sheet for a preset time t
进一步的，所述方法还包括：Further, the method also includes:
步骤3、所述步骤2中通电预设时间t结束后，与所述高频电流机连接的导电片自动弹起，移开所述板纸材料，操作完成。Step 3: After the power-on preset time t in the step 2 ends, the conductive sheet connected to the high-frequency current machine automatically pops up, and the cardboard material is removed, and the operation is completed.
进一步的，所述覆膜材料是由聚丙烯制成。Further, the covering material is made of polypropylene.
进一步的，贴合覆膜材料后的所述板纸材料的一端面水平置于所述第一导电片上。Further, one end surface of the cardboard material pasted with the coating material is horizontally placed on the first conductive sheet.
本发明的有益效果为：The beneficial effects of the present invention are:
(1)本发明提供的板纸材料与覆膜材料粘合方法使得粘合后的板纸材料的收缩率、强度、耐热性及化学稳定性等性能得到很大的提高。(1) The bonding method of the cardboard material and the film-coated material provided by the present invention greatly improves the shrinkage rate, strength, heat resistance and chemical stability of the bonded cardboard material.
(2)本发明通过在导电片之间产生高频电流实现板纸材料与覆膜材料的分子共振进而使得板纸材料与覆膜材料互相渗透粘合，避免了现有方法中使用有机化合物粘合剂破坏环境的问题，该方法粘合效果好且环保。(2) The present invention realizes the molecular resonance between the cardboard material and the coating material by generating a high-frequency current between the conductive sheets, thereby making the cardboard material and the coating material interpenetrate and bond, avoiding the use of organic compounds in the existing method to bond The problem that the mixture destroys the environment, this method has a good bonding effect and is environmentally friendly.
具体实施方式Detailed ways
下面通过具体实施方式来进一步说明本发明的技术方案。The technical solutions of the present invention will be further described below through specific embodiments.
一种板纸材料与覆膜材料的粘合方法，所述方法包括下述步骤：A method for bonding a cardboard material and a film covering material, said method comprising the steps of:
步骤1、根据所需粘合的板纸材料厚度设定贴合覆膜材料后的板纸材料的通电时间t，将贴合覆膜材料后的板纸材料放置于第一导电片上，本实施方式中，第一导电片是下导电片，第二导电片是上导电片，其中，板纸材料的一端面水平置于第一导电片即下导电片上且与下导电片置于同一水平面上，按下压合开关，第二导电片即上导电片将贴合覆膜材料后的所述板纸材料向下压合；Step 1. Set the energization time t of the cardboard material after laminating the film material according to the thickness of the cardboard material to be bonded, and place the cardboard material after laminating the film material on the first conductive sheet. This implementation In the method, the first conductive sheet is the lower conductive sheet, and the second conductive sheet is the upper conductive sheet, wherein one end surface of the cardboard material is horizontally placed on the first conductive sheet, that is, the lower conductive sheet, and placed on the same horizontal plane as the lower conductive sheet , press the pressing switch, the second conductive sheet, that is, the upper conductive sheet, presses the cardboard material after laminating the film material downward;
步骤2、上导电片与高频电流机连接，该高频电流机用于提供电源。为上导电片通电预设时间t，上下两导电片之间产生的高频电流使板纸材料和覆膜材料内的分子产生共振从而实现互相渗透粘合。Step 2, the upper conductive sheet is connected with a high-frequency current machine, and the high-frequency current machine is used to provide power. The preset time t is energized for the upper conductive sheet, and the high-frequency current generated between the upper and lower conductive sheets makes the molecules in the cardboard material and the film material resonate to achieve mutual penetration and adhesion.
步骤3、步骤2中通电预设时间t结束后，与高频电流机连接的上导电片自动弹起，移开板纸材料，操作完成。Step 3. After the power-on preset time t in step 2 ends, the upper conductive sheet connected to the high-frequency current machine will automatically pop up, remove the cardboard material, and the operation is completed.
上述方法是对板纸材料的其中一个端面与覆膜材料粘合，如需对板纸材料的另一个端面与覆膜材料粘合，则需要将另一个端面与覆膜材料贴合后，继续进行以下步骤：The above method is to bond one of the end faces of the cardboard material to the film material. If the other end face of the cardboard material is to be bonded to the film material, it is necessary to bond the other end face to the film material, and then continue Do the following steps:
步骤4、将另一端面贴合覆膜材料的板纸材料置于下导电片上并与下导电片置于同一水平面；Step 4, place the cardboard material with the other end surface attached to the film material on the lower conductive sheet and place it on the same horizontal plane as the lower conductive sheet;
步骤5、按下压合开关，上导电片向下压合，上下两导电片的高频电流使板纸材料和覆膜材料内的分子产生共振从而实现互相渗透粘合。Step 5. Press the pressing switch, the upper conductive sheet is pressed downward, and the high-frequency current of the upper and lower conductive sheets makes the molecules in the cardboard material and the film material resonate to achieve mutual penetration and adhesion.
步骤6、在完成粘合后，上导电片自动弹起，另一端面的板纸材料与覆膜材料粘合完成。Step 6. After the bonding is completed, the upper conductive sheet automatically pops up, and the cardboard material on the other end is bonded to the film material.
步骤7、断开电源，完成板纸材料的两个端面的粘合。Step 7, disconnect the power supply, and complete the bonding of the two end surfaces of the cardboard material.
上述方法中也可以同时对板纸材料的两个端面与覆膜材料粘合，在放置于下导电片之前，将板纸材料的两个端面与覆膜材料均贴合好后，采用上述步骤1-3完成操作。In the above method, the two end surfaces of the cardboard material and the coating material can also be bonded at the same time. 1-3 to complete the operation.
上述导电片的数量不限，可以通过采用多个导电片之间放置多个板纸材料进行粘合，从而提高粘合效率；另外，步骤2中必须使用高频电流机，不可以采用其他方式为导电片提供电源。The number of the above-mentioned conductive sheets is not limited, and the bonding efficiency can be improved by placing multiple cardboard materials between multiple conductive sheets; in addition, a high-frequency current machine must be used in step 2, and other methods cannot be used Provides power to the conductive sheet.
以上仅是实现本发明的优选方案而非对其限制，任何对本发明的具体实施方式进行修改或者对部分技术特征进行等同替换，而不脱离本发明技术方案的精神，均应涵盖在本发明请求保护的技术方案范围当中。本发明的保护范围还包括本领域技术人员不付出创造性劳动所能想到的任何替代技术方案。The above is only a preferred solution to realize the present invention and not limit it. Any modification to the specific embodiment of the present invention or equivalent replacement of some technical features without departing from the spirit of the technical solution of the present invention shall be covered in the claims of the present invention. In the scope of technical solutions for protection. The protection scope of the present invention also includes any alternative technical solutions that those skilled in the art can think of without creative efforts.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410725170.6A CN104497897B (en) | 2014-12-03 | 2014-12-03 | Method for bonding paperboard material and film-coated material |
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| CN201410725170.6A CN104497897B (en) | 2014-12-03 | 2014-12-03 | Method for bonding paperboard material and film-coated material |
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| Publication Number | Publication Date |
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| CN104497897A CN104497897A (en) | 2015-04-08 |
| CN104497897B true CN104497897B (en) | 2018-07-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305892A (en) * | 2000-01-17 | 2001-08-01 | 蔡磊 | High-frequency vortex film covering machine |
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN101607607A (en) * | 2009-07-14 | 2009-12-23 | 朱长宝 | Sealing opening of aluminum-plastic paper composite packaging material adhesive bonding method and device thereof |
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- 2014-12-03 CN CN201410725170.6A patent/CN104497897B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1305892A (en) * | 2000-01-17 | 2001-08-01 | 蔡磊 | High-frequency vortex film covering machine |
| CN1759157A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Intrinsically heatable pressure-sensitive adhesive planar structures |
| CN101607607A (en) * | 2009-07-14 | 2009-12-23 | 朱长宝 | Sealing opening of aluminum-plastic paper composite packaging material adhesive bonding method and device thereof |
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| CN104497897A (en) | 2015-04-08 |
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