CN104439753A - Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material - Google Patents
Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material Download PDFInfo
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- CN104439753A CN104439753A CN201410638882.4A CN201410638882A CN104439753A CN 104439753 A CN104439753 A CN 104439753A CN 201410638882 A CN201410638882 A CN 201410638882A CN 104439753 A CN104439753 A CN 104439753A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a multi-element silver soldering material containing indium and tin. The material is characterized by being composed of silver, copper, tin, indium, zinc and traces of mixed metal, the soldering material comprises 41wt.% to 49wt.% of silver, 21wt.% to 29wt.% of copper, 1.5wt.% to 5.5wt.% of tin, 0.3wt.% to 3.0wt.% of indium, 0.001wt.% to 0.1wt.% of traces of mixed metal and the balance zinc, and traces of mixed metal is composed of two or more elements of lanthanum, cerium, praseodymium, neodymium, zirconium, yttrium and silicon. The invention further provides a preparation method for the multi-element silver soldering material. The method includes the following steps that silver, copper, tin, indium, zinc and traces of mixed metal are sequentially added, smelted, cast, sawed, stripped, squeezed, pulled, formed and cleaned. The multi-element silver soldering material is low in silver content, free of cadmium, low in melting temperature and good in soldering process performance.
Description
Technical field
The present invention relates to a kind of new multicomponent silver solder containing the element such as indium, tin and preparation method thereof, be applicable to the soldering of copper and copper alloy, stainless steel and other metal materials, can be widely used in the soldering of refrigeration, machinery, electromechanics, magnetic valve etc., described Polybasic silver solder belongs to a kind of middle temperature brazing material.
Background technology
When carrying out the soldering of the ferrous metal such as copper and stainless steel and alloy thereof, consider the mechanical property that solder is correlated with to the wetability of soldering mother metal and soldered fitting, people mostly select high silver solder.As common BAg56CuZnSn, be widely used in the soldering of brazed copper and parts of stainless steel, have lower fusion temperature, the energy consumption in brazing process is low.But along with rising steadily of the noble metal prices of raw and semifnished materials, cause the producer using high silver solder to carry out soldering to face huge cost pressure, under the market competition of fierceness, largely reducing the competitiveness using the silver solder enterprises such as BAg56CuZnSn.
Some enterprises reduce silver content by the content increasing Cd, Cd adds, considerably reduce the fusion temperature of solder, improve brazing property, reduce silver content preferably, once once by extensive experimentation, but Cd itself is toxic element, is unfavorable for the health of operator and pollution is existed to environment, not meeting RoHS Directive, along with people are to the attention further of environmental protection, gradually replace by other harmless elements.
However, show according to existing result of study, adding of single-element is not enough to compared with cadmium brazing silver alloy, as adding of Sn in Ag-Cu-Zn-Sn solder can effectively improve mobility, wetability, reduce solid, liquid liquidus temperature, reduce melting region, but its machinability is often poor; In Ag-Cu-Zn-In solder, adding of In can reduce solid, liquid liquidus temperature, reduces melting region, improves mobility, but itself at silver, solid solubility in copper is less and price is higher; People start the silver solder of focus development multi-element alloy system for replacing the use containing cadmium brazing silver alloy.
Therefore; research and develop one and both meet RoHS Directive requirement; not containing harmful chemical element Cd in brazing material; there is again good soldering processes performance; fusion temperature is lower; the new multicomponent silver solder that cost performance is higher carrys out the contour silver solder of alternative BAg56CuZnSn, has important economic worth and meets the requirement of environmental protection.
Summary of the invention
The object of the invention is to overcome above shortcomings in prior art, provide a kind of silver content lower, not containing cadmium element, brazing filler metal melts temperature is lower, Polybasic silver solder that soldering processes performance is good and preparation method thereof
.
The present invention's adopted technical scheme that solves the problem comprises: a kind of Polybasic silver solder containing indium and tin, it is made up of Ag, Cu, Sn, In and Zn, the percentage by weight of described each component is respectively: the Ag of 41-49wt.%, the Cu of 21-29wt.%, the In of the Sn of 1.5-5.5wt.%, 0.3-3.0wt.%, surplus is Zn, and with the addition of the minipool metal of 0.001-0.1wt%, by lanthanum, cerium, praseodymium, neodymium, zirconium, yttrium, silicon, two or more forms described minipool metal.
The percentage by weight of each component of the present invention is respectively: the Ag of 43-47wt.%, the Cu of 23-27wt.%, the Sn of 2.0-5.0wt.%, the In of 0.5-2.5wt.%, surplus is Zn, and with the addition of the minipool metal of 0.001-0.03wt.%, described minipool metal is by lanthanum, cerium, praseodymium, neodymium, zirconium, yttrium, silicon two kinds or plant above composition.
The percentage by weight aggregate value of tin of the present invention and indium can be greater than 5 percent, such as, between 5.1-8.5.Now effectively can reduce the fusion temperature of solder further, when making soldering, energy consumption reduces further, does not affect its processing characteristics in the present invention simultaneously.
The percentage by weight of each component of the present invention is respectively: the In of the Sn of the Cu of the Ag of 46wt.%, 26wt.%, 4.2wt.%, 1.0wt.%, and surplus is that the minipool metal of Zn, 0.03wt.% is as technique addition.
The present invention's adopted technical scheme that solves the problem also comprises: a kind of preparation method of the above-mentioned Polybasic silver solder containing indium and tin, the silver of said ratio, copper, tin, indium, zinc and minipool metal is it is characterized in that to add melting successively, then cast, saw stripping, extruding, drawing, shaping, cleaning is prepared from.By rational melting sequence arrangement, reduce the smelting time of tin, indium, zinc and minipool metal, prevent its oxidation loss in fusion process.
Silver of the present invention, copper, tin, indium, zinc adopt 1# silver, No. 1 standard copper, 99.99 tin, 99.993 indiums, 0# calabash zinc respectively, and the brazing filler metal melts temperature range obtained is 620-700 DEG C.
The present invention compared with prior art, has the following advantages and effect: the noble metal silver 1, contained is less, reduces silver percentage composition 11 percentage points, greatly reduce production cost, saved the consumption of noble metal silver than BAg56CuZnSn silver solder; 2, have excellent mechanical performance when brazed copper and stainless steel, after client uses, feed back soldering processes performance excellent, steady quality, process performance index is suitable with BAg56CuZnSn silver solder; 3, the plasticity of this solder is good, can be processed into the welding rod, welding wire, weld-ring, strip, weld tabs etc. of all size, size; 4, the workpiece such as solder brazing stainless steel, its joint tensile strength can reach 300MPa.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention silver, copper, zinc ternary phase diagrams.
Detailed description of the invention
The embodiment of the present invention uses the hybrid metal of 1# silver, No. 1 standard copper, 0# calabash zinc, In99.993, Sn99.99 and trace containing the Polybasic silver solder of indium and tin, by said ratio, conventional mid-frequency melting furnace is adopted to carry out melting, casting, saw stripping, extruding, drawing, shaping, the techniques such as cleaning are prepared from; The order adding each component wherein during melting adds melting successively according to Ag, Cu, Sn, In, Zn, and add minipool metal, then be prepared from by techniques such as casting, saw stripping, extruding, drawing, shaping, cleanings.The brazing filler metal melts temperature range (reference value) obtained is 620-700 DEG C, and plasticity is good, can be processed into the solder such as welding rod, welding wire, weld-ring, strip, weld tabs of all size, size; Coordinate FB102 (QJ102) brazing flux, soldering wetability is on stainless steel good, good fluidity, and the tensile strength of soldered fitting can reach more than 300MPa; There is higher resistance to gentle mechanical performance, can be applicable to the soldering of the industries such as magnetic valve.
The Polybasic silver solder containing indium and tin of the present invention, coordinate FB102 (QJ102) brazing flux, soldering on the ferrous alloys such as stainless steel, suitable with BAg56CuZnSn to the wetability of mother metal, spreadability, soldered fitting tensile strength can reach more than 300MPa, suitable with BAg56CuZnSn soldered fitting tensile strength.Of the present invention not containing harmful Elements C d, effectively protect the physical safety of operator, do not have the pollution to environment, the fusion temperature of solder is lower and soldering mechanical performance index is suitable with BAg56CuZnSn.
Below by embodiment, the present invention is described in further detail, and following examples are explanation of the invention and the present invention is not limited to following examples.
Design parameter in each embodiment is see table 1-table 4, table 1 is the embodiment of the present invention 1 to embodiment 6 data table related, table 2 is the embodiment of the present invention 7 to embodiment 12 data table related, table 3 is the embodiment of the present invention 13 to embodiment 18 data table related, table 4 is the embodiment of the present invention 19 to embodiment 24 data table related, and each table is specific as follows.
Table 1 embodiment 1 to embodiment 6 data table related
| Component and parameter name | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| Ag(wt.%) | 41 | 46 | 49 | 48 | 45 | 43 |
| Cu(wt.%) | 29 | 26 | 21 | 23 | 24 | 25 |
| In(wt.%) | 0.3 | 1.0 | 3.0 | 1.0 | 1.5 | 2.0 |
| Sn(wt.%) | 0.03 | 4.0 | 5.5 | 1.5 | 1.5 | 2.5 |
| Zn(wt.%) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| Hybrid metal (wt.%) | 0.001 | 0.03 | 0.03 | 0.03 | 0.03 | 0.01 |
| Brazing filler metal melts temperature (DEG C) | 635~700 | 627 ~672 | 620~683 | 635~697 | 629~692 | 628~687 |
Table 2 embodiment 7 to embodiment 12 data table related
| Component and parameter name | Embodiment 7 | Embodiment 8 | Embodiment 9 | Embodiment 10 | Embodiment 11 | Embodiment 12 |
| Ag(wt.%) | 41 | 41 | 41 | 41 | 43 | 44 |
| Cu(wt.%) | 27 | 29 | 28 | 28 | 27 | 26 |
| In(wt.%) | 2.5 | 3.0 | 3.0 | 3.0 | 3.0 | 2.5 |
| Sn(wt.%) | 3.0 | 3.5 | 4.0 | 4.5 | 5.0 | 4.5 |
| Zn(wt.%) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| Hybrid metal (wt.%) | 0.01 | 0.05 | 0.03 | 0.05 | 0.03 | 0.01 |
| Brazing filler metal melts temperature (DEG C) | 628~683 | 627~675 | 627~673 | 622~670 | 620~668 | 623~671 |
Table 3 embodiment 13 to embodiment 18 data table related
| Component and parameter name | Embodiment 13 | Embodiment 14 | Embodiment 15 | Embodiment 16 | Embodiment 17 | Embodiment 18 |
| Ag(wt.%) | 45 | 46 | 47 | 48 | 49 | 49 |
| Cu(wt.%) | 25 | 25 | 24 | 23 | 22 | 21 |
| In(wt.%) | 2.0 | 1.5 | 1.0 | 0.5 | 0.3 | 0.5 |
| Sn(wt.%) | 4.0 | 3.5 | 3.0 | 2.5 | 2.0 | 1.5 |
| Zn (wt.%) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| Hybrid metal (wt.%) | 0.01 | 0.03 | 0.07 | 0.03 | 0.04 | 0.02 |
| Brazing filler metal melts temperature (DEG C) | 627~682 | 629~686 | 630~690 | 635~692 | 637~695 | 629~697 |
Table 4 embodiment 19 to embodiment 24 data table related
| Component and parameter name | Embodiment 19 | Embodiment 20 | Embodiment 21 | Embodiment 22 | Embodiment 23 | Embodiment 24 |
| Ag(wt.%) | 43 | 47 | 45 | 44 | 46 | 46 |
| Cu(wt.%) | 23 | 27 | 24 | 26 | 25 | 24 |
| In(wt.%) | 2.5 | 0.5 | 2.0 | 1.5 | 2.0 | 2.5 |
| Sn(wt.%) | 5.0 | 2.0 | 3.0 | 2.5 | 3.5 | 2.0 |
| Zn(wt.%) | Surplus | Surplus | Surplus | Surplus | Surplus | Surplus |
| Hybrid metal (wt.%) | 0.02 | 0.02 | 0.06 | 0.05 | 0.03 | 0.1 |
| Brazing filler metal melts temperature (DEG C) | 632~675 | 629~678 | 627~672 | 629~674 | 625~671 | 628~675 |
Formula Design of the present invention is reasonable, during the metal materials such as production cost is low, and cost performance is high, soldering stainless steel, brazing filler metal melts temperature is suitable, wetability, good fluidity, soldered fitting any surface finish, mechanical strength is high, soldering processes performance is excellent, steady quality, uniformity is good, and every brazing property index is suitable with BAg56CuZnSn.
Add chemical element Sn in the present invention, the wettability of solder can be improved significantly, and reduce the fusion temperature of solder.Add chemical element In in the present invention, the fusion temperature of solder can be reduced and improve wetability and the joint filling of solder.The excessive interpolation of Sn and In will cause solder embrittlement to rise, and by Composition Control and alloying, ensure that processability and the soldering processes performance of solder simultaneously.
Can be obtained by Ag-Cu-Zn ternary phase diagrams, this product composition falls within the scope of the mixed phase of α (Ag-Zn) phase, α (Cu-Zn) phase and β phase, for promoting the processing characteristics of solder further, the minipool metal added can the tissue of refinement brazing filler metal alloy, improve the mechanical property of solder, improve intensity and the toughness of soldered fitting, and the wettability of passing ratio control and regulation solder, suppress the precipitation of impurity simple substance phase in solder.Make Sn and In content total value be greater than more than 5%, it should be noted that hybrid metal content can not be too high, otherwise the brazing property that impurity element destroys solder entirety can be become.
Although the present invention with embodiment openly as above; but it is also not used to limit protection scope of the present invention; any technical staff being familiar with this technology, not departing from the change and retouching done in the spirit and scope of the present invention, all should belong to protection scope of the present invention.
Claims (6)
1. one kind contains the Polybasic silver solder of indium and tin, it is characterized in that being made up of silver, copper, tin, indium, zinc and minipool metal, the percentage by weight of described each component is respectively: the silver of 41-49 percentage by weight, the copper of 21-29 percentage by weight, the tin of 1.5-5.5 percentage by weight, the indium of 0.3-3.0 percentage by weight, the minipool metal of 0.001-0.1 percentage by weight, surplus is zinc, and by lanthanum, cerium, praseodymium, neodymium, zirconium, yttrium, silicon, two or more forms described minipool metal.
2. the Polybasic silver solder containing indium and tin according to claim 1, it is characterized in that: the percentage by weight of described each component is respectively: the silver of 43-47 percentage by weight, the copper of 23-27 percentage by weight, the tin of 2-5 percentage by weight, the indium of 0.5-2.5 percentage by weight, the minipool metal of 0.001-0.03 percentage by weight, surplus is zinc.
3. the Polybasic silver solder containing indium and tin according to claim 2, is characterized in that: the percentage by weight aggregate value of described tin and indium is between 5.1-8.5.
4. the Polybasic silver solder containing indium and tin according to claim 2, it is characterized in that: the percentage by weight of described each component is respectively: the silver of 46 percentage by weights, the copper of 26 percentage by weights, the tin of 4.2 percentage by weights, the indium of 1.0 percentage by weights, the minipool metal of 0.03 percentage by weight, surplus is zinc.
5. contain a preparation method for the Polybasic silver solder of indium and tin described in claim 1-4, it is characterized in that comprising the following steps: silver, copper, tin, indium, zinc and minipool metal are added melting successively, casting, saw stripping, extruding, drawing, shaping, clean.
6. the preparation method containing the Polybasic silver solder of indium and tin according to claim 5, it is characterized in that: described silver, copper, tin, indium, zinc adopt 1# silver, No. 1 standard copper, 99.99 tin, 99.993 indiums, 0# calabash zinc respectively, and the brazing filler metal melts temperature range obtained is 620-700 DEG C.
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| CN201410638882.4A CN104439753A (en) | 2014-11-13 | 2014-11-13 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
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| CN201410638882.4A CN104439753A (en) | 2014-11-13 | 2014-11-13 | Multi-element silver soldering material containing indium and tin and preparation method of multi-element silver soldering material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942474A (en) * | 2015-07-06 | 2015-09-30 | 江苏科技大学 | Cadmium-free silver brazing solder containing Sn, Si, Zn and Pr and preparation method thereof |
| CN117076892A (en) * | 2023-10-13 | 2023-11-17 | 广东美的制冷设备有限公司 | Solder design method, apparatus, and computer-readable storage medium |
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| CN101716702A (en) * | 2009-11-26 | 2010-06-02 | 金华市三环焊接材料有限公司 | Multi-component alloy cadmium-free low-silver solder |
| CN102240870A (en) * | 2011-05-20 | 2011-11-16 | 杭州华光焊接新材料股份有限公司 | Multielement rare-earth silver solder |
| JP2013013933A (en) * | 2011-06-30 | 2013-01-24 | Rohm Co Ltd | Laminated high melting point soldering layer and fabrication method for the same, and semiconductor device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942474A (en) * | 2015-07-06 | 2015-09-30 | 江苏科技大学 | Cadmium-free silver brazing solder containing Sn, Si, Zn and Pr and preparation method thereof |
| CN104942474B (en) * | 2015-07-06 | 2017-04-05 | 江苏科技大学 | A kind of cadmium-free silver brazing alloy of stanniferous, silicon, zinc and praseodymium and preparation method thereof |
| CN117076892A (en) * | 2023-10-13 | 2023-11-17 | 广东美的制冷设备有限公司 | Solder design method, apparatus, and computer-readable storage medium |
| CN117076892B (en) * | 2023-10-13 | 2024-01-23 | 广东美的制冷设备有限公司 | Solder design method, apparatus, and computer-readable storage medium |
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Application publication date: 20150325 |