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CN104426048B - It is a kind of heat sink and there is the heat sink laser - Google Patents

It is a kind of heat sink and there is the heat sink laser Download PDF

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Publication number
CN104426048B
CN104426048B CN201310385260.0A CN201310385260A CN104426048B CN 104426048 B CN104426048 B CN 104426048B CN 201310385260 A CN201310385260 A CN 201310385260A CN 104426048 B CN104426048 B CN 104426048B
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China
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heat sink
thin slice
gain media
slice gain
sorption channel
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CN104426048A (en
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赵建涛
肖磊
杨锦彬
叶超平
李斌
褚志鹏
高云峰
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Han s Laser Technology Industry Group Co Ltd
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Han s Laser Technology Industry Group Co Ltd
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Abstract

The invention belongs to all solid state laser field, more particularly to it is a kind of heat sink and there is the heat sink laser.It is a kind of heat sink, for fixing thin slice gain media, including a matrix, cooling duct has been provided at the center of described matrix;There is the fixed part for adsorbing the thin slice gain media in described matrix;The fixed part includes the gas port for being located at the sorption channel of described matrix end and being connected with the sorption channel.The present invention also provides a kind of containing the heat sink laser.It is heat sink in the present invention, by setting sorption channel and gas port in base end, extract the gas in the sorption channel out by gas port and produce the fixed thin slice gain media of negative pressure of vacuum absorption, reduce residual stress caused by the fixed thin slice gain media, in use, the thin slice gain media is unlikely to deform, of good reliability, ensure that the gain performance of laser in laser.

Description

It is a kind of heat sink and there is the heat sink laser
Technical field
The invention belongs to all solid state laser field, more particularly to it is a kind of heat sink and there is the heat sink laser.
Background technology
All solid state laser(DPSSL, Diode pumped solid state laser)Refer to semiconductor laser (LD)As the solid state laser of pumping source, its gain media, pumping source part are formed by solid matter, therefore have concentrated biography The advantage of system solid state laser and semiconductor laser is.With small volume, in light weight, efficiency high, stable performance, reliable The good, long lifespan of property, it is easy to operate, go slick(It can continuously run, pulse operating), easily it is intelligent, pollution-free the advantages that, be current One of most potential lasing light emitter.
Thin-sheet laser is one kind of all solid state laser, realizes within 1994 that thin slice swashs first from Adolf.Giesen et al. Since light device【With reference to A.Giesen et al.Scalable concept for diode-pumped high-power solid state lasers,Applied Physics B:Lasers and optics58,365-372(1994)】, obtain Develop rapidly.As shown in figure 1, thin slice gain media using thickness very little and the larger lamellar material of lateral dimension as swashing The gain media of light, by thin slice gain media be fixed on high heat conductance red copper it is heat sink on, have on red copper is heat sink coolant micro- logical Road.Because the area of laminated dielectric is very big, thickness very little, therefore the heat on gain media can be passed to fast and effectively Microchannel cooling heat sink, then taken away by coolant.So thin-sheet laser is heat sink in gain media with can efficiently export Product, weaken the advantages that thermal lensing effect of gain media, therefore the laser of high power, high efficiency, high light beam quality can be realized Output.Because thin-sheet laser has above-mentioned advantage, therefore it is widely used to national defense and military, scientific research, industrial production etc. Various aspects.
Because laser caused by thin rounded flakes gain media has circular symmetry, and conventional optical component is typically all Circle, therefore can be good at matching various optical components, and the laser beam with circular symmetry the fields such as industry with Extensive use, so thin-sheet laser gain media is generally circular.
The fixed form of existing thin-sheet laser gain media has:Welding method, clamp method etc..But welding technique Relatively difficult, welding effect is undesirable, and cost is higher.As shown in figure 1, thin slice gain is situated between using welding or clamp method The one side of matter 200 is fixed on the heat sink 100' of red copper, stress can be produced in gain media, in high-power diode laser pump (ing) Under, remaining stress can cause thin slice gain media 200 to deform in thin slice gain media 200 so that high-power diode pumping The Energy distribution of light is uneven to cause on thin slice gain media 200 that temperature distributing disproportionation is even, cause thin slice gain media to expand It is uneven, so as to aggravate the deformation of thin slice gain media, even thin slice gain media can be caused to be broken when serious.So as to influence to swash The stability of light device, laser output power and beam quality is caused to decline,
In addition, as shown in Fig. 2 existing thin-sheet laser is cooled down using microchannel 10'.On the heat sink 100' of red copper, Intensive a plurality of cooling passage 10' arranged in parallel, porch 101' enters coolant from below, occurs in the 10' of microchannel Heat exchange, partial heat is taken away, is then flowed out from top exit 101', after coolant outflow, pass through air-cooled cooling in outside, Then the heat sink 100' of red copper is again flowed into, so constantly circulation, so as to maintain the heat sink 100' of red copper temperature.This type of cooling Result be to reach the cooling dynamics of approaches uniformity in entire surface.And in general thin-sheet laser is using fiber coupling output Diode laser pumped.Diode laser is approximately Gaussian Profile, as shown in Figure 3 after fiber coupling output.Can See, the pump energy for being loaded into thin slice gain media 200 concentrates on center, energy density highest at center, and edge energy is close Degree is weaker.And common microchannel 10' cooling heat sinks as shown in Figure 2 are uniformly cooling, it can so cause gain media center It is bad to locate cooling effect, temperature highest, and edge temperature is relatively low.When thin-sheet laser high power operates, pumping light power Higher, because power density is larger at center, heat is more, causes at center temperature high, thus at center gain media it is swollen It is swollen more serious, cause outwards to expand at gain media center larger, form " bowl-shape " deformation of similar back-off, here it is thin slice to swash The thermal lensing effect of light device.In high power operation, the thermal lensing effect of thin slice gain media 200 can influence the output of laser Power, stability and beam quality.When ability to bear of the dilatancy of thin slice gain media 200 more than material, result even in Thin slice gain media is burst.
The content of the invention
It is an object of the invention to provide a kind of heat sink and have the heat sink laser, it is intended to solves thin in the prior art Piece gain media leaves residual stress after fixing, and is easily deformed, the problem of use reliability difference.
What the present invention was realized in:It is a kind of heat sink, for fixing thin slice gain media, including a matrix, in the base The cooling duct that the thin slice gain media is cooled down for guiding coolant is provided at the center of body;Have in described matrix and use In the fixed part that the thin slice gain media is adsorbed to fixation;The fixed part includes being used to adsorb institute located at described matrix end State the sorption channel of the fringe region of thin slice gain media and connected with the sorption channel for extracting out in the sorption channel Gas formed vacuum gas port.
Further, the sorption channel is provided with multiple, and each sorption channel is correspondingly communicated with a gas port.
Further, each gas port intersects setting with the sorption channel.
Further, center linear array arrangement of each sorption channel along described matrix.
Further, the sorption channel is an arc groove.
Further, the sorption channel is surrounded around the cooling duct.
Further, the cooling duct includes being provided for cooling down the thin slice gain media along described matrix center line The center cooling duct at center and circular described matrix center linear array are arranged for cooling down the thin slice gain media center week The periphery cooling duct on side.
Further, the center cooling duct is the through hole longitudinally through described matrix;The periphery cooling duct is Longitudinally through the groove of described matrix;The cross section of the groove is in sector.
Further, go out in the end that the thin slice gain media is fixed in described matrix, the periphery cooling duct Center line of the spacing along described matrix between mouth face and the thin slice gain media radially outward gradually increases, and more than described Spacing between the exit face of center cooling duct and the thin slice gain media.
Compared with prior art, the present invention in it is heat sink, by base end set sorption channel, and set with it is described The gas port of sorption channel connection is connected with the vacuum equipment of outside, true so as to extract the gas in the sorption channel out generation Empty negative-pressure adsorption fixes the thin slice gain media, so, is fixed the thin slice gain media by the negative pressure of gas, different In existing directly act on thin slice gain media, fixed mode, reduction are fixed residual caused by the thin slice gain media Residue stress, in use, the thin slice gain media is unlikely to deform, it is of good reliability.
In addition, present invention also offers a kind of laser, it includes a thin slice gain media and heat sink, the thin slice gain Medium be fixed on it is described it is heat sink on, wherein, it is described heat sink to be heat sink described in any of the above-described.
A kind of laser provided by the invention, during thin slice gain media described as a result of above-mentioned heat sink fixation, institute It is small to state residual stress caused by thin slice gain media so that the thin slice gain media is unlikely to deform, of good reliability, and then is ensured Power output and beam quality of the laser after the gain media.
Brief description of the drawings
Fig. 1 is that thin slice gain media is installed on the dimensional structure diagram on heat sink in the prior art;
Fig. 2 is dimensional structure diagram heat sink in the prior art;
Fig. 3 is the distribution schematic diagram of the pump energy of thin slice gain media commonly used in the prior art;
Fig. 4 is perspective cross section schematic diagram heat sink in the embodiment of the present invention;
Fig. 5 is side elevational cross-section schematic diagram heat sink in the embodiment of the present invention;
Fig. 6 is elevational schematic view heat sink in the embodiment of the present invention;
Fig. 7 is that thin slice gain media is installed on the schematic diagram on heat sink in the embodiment of the present invention;
Fig. 8 is the schematic diagram of closure in the embodiment of the present invention.
Description of symbols:
100' red coppers are heat sink 21 connecting holes
The periphery inlet opening of 10' microchannels 22
The periphery fluid hole of 101' porch 23
The center inlet opening of 102' exits 24
The center fluid hole of 200 thin slice gain media 25
100 heat sink 102 peripheries cooling duct
The fixed part of 1 matrix 11
The sorption channel of 2 closure 111
The gas port of 201 working region 112
The fixing hole of 202 non-active area 12
The center cooling duct of 10 cooling duct 101
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
It is described in detail below in conjunction with realization of the specific accompanying drawing to the present invention.
As Figure 4-Figure 6, it is one kind heat sink 100 provided in an embodiment of the present invention, for fixing thin slice gain media 200, Thin slice gain media 200 in the present embodiment as shown in Figure 7 is disc-shaped, and its periphery is nonclient area 202, non-in annular shape Working region 202 is solid matrix materials(Generally crystal or glass), without doping active ions(Such as Nd3+、Yb3 +), the center section of the thin slice gain media 200 is working region 201, and working region is solid laser working substance, be by Active ions doped matrix material and form.Working region 201 is connected with non-active area 202 by way of crystal bonding Together, thin slice gain media 200 is formed.Described heat sink 100 include a matrix 1, and cooling is provided with the center of described matrix 1 Passage 10, the cooling duct 10 are longitudinally through;The cooling duct 10 is used to guide coolant cooling thin slice gain Jie Matter 200;There is fixed part 11 at the top perimeter of described matrix 1;The fixed part 11 is used to adsorb the thin slice gain media 200 fringe region, so as to which the thin slice gain media 200 be fixed;The fixed part 11 include sorption channel 111 and with institute State the gas port 112 of the connection of sorption channel 111, the sorption channel 111 from the top surface longitudinal direction of described matrix 1 to lower recess and Into the gas port 112 penetrates the connection sorption channel 111 by the side of described matrix 1.The sorption channel 111 passes through The gas port 112 is connected with the vacuum equipment of outside, by the gas port 112 by the gas in the sorption channel 111 Body is extracted out to form negative pressure of vacuum so as to which the thin slice gain media 200 be fixed.Compared with prior art, it is heat sink in the present invention 100, by setting sorption channel 111 at the top of matrix 1, and the gas port 112 by connect with the sorption channel 111 with outside The vacuum equipment in portion is connected, described thin so as to extract the gas in the sorption channel 111 out generation negative pressure of vacuum absorption fixation Piece gain media 200, so, the thin slice gain media 200 is fixed by the pressure of air, because atmospheric pressure is uniform Act on the thin slice gain media 200, different from the existing fixed form to thin slice gain media 200, reduce solid Residual stress caused by the fixed thin slice gain media 200, in use, the uniformity of thin slice gain media 200 is good, is not easy Deformation, it is of good reliability.
Specifically, described matrix 1 is square, the sorption channel 111 be provided with it is multiple, specifically, the sorption channel 111 be an arc groove, and the sorption channel 111 annular array centered on the center line of described matrix 1 is distributed, each absorption Passage 111 corresponds and is communicated with a gas port 112.So, the sorption channel 111 adsorbs the thin slice gain media 200 When, the 200 circumferential uniform force of thin slice gain media, it ensure that the flatness of the thin slice gain media 200.
Certainly, the sorption channel 111 can be also surrounded around the cooling duct 10.Namely by the suction Attached passage 111 makes the groove that a cross section is annulus, the periphery one of the thin slice gain media 200 can be enclosed and all produce absorption Power, suction-operated area is big and stepless action in the periphery of thin slice gain media 200 everywhere, warpage can be avoided, in this way, fixed It is firm, while ensure that the flatness of the thin slice gain media 200.
In the present embodiment, as shown in figure 4, the gas port 112 intersects setting with the sorption channel 111, it is preferable that institute Gas port 112 and the sorption channel 111 is stated to intersect vertically setting.The gas port 112 penetrates company by the side of described matrix 1 It is connected to the bottom of the sorption channel 111.In this way, convenient arrangement pipeline is used to connect the gas port 112.
Certainly, the gas port 112 and the sorption channel 111 can also be arranged in parallel according to specific requirement, also It is the bottom that the gas port 112 connects the sorption channel 111, is passed by the bottom of described matrix 1.In this way, the air guide The gas circuit that hole 112 connects with the sorption channel 111, without corner, air motion is unobstructed, and air pressure loss is small, further improves The intensity of absorption so that the thin slice gain media 200 fixes reliably.
Specifically, as shown in fig. 6, the cooling duct 10 is including cold along the longitudinally disposed center of the center line of described matrix 1 But the periphery cooling duct 102 of passage 101 and the center linear array arrangement of circular described matrix 1.Use the center cooling duct 101 In the core for cooling down working region 201 on the thin slice gain media 200, the periphery cooling duct 102 is used to cool down The peripheral part of working region 201 on the thin slice gain media 200.Understand as shown in Figure 3, the thin slice gain media 200 The peripheral part of upper working region 201 and the heat distribution of center section are different.By setting the He of center cooling duct 101 The periphery cooling duct 102, the thin slice gain media 200 can be radiated respectively, radiating efficiency is high so that whole thin The temperature of center section and peripheral part tends to be close on piece gain media 200, that is, the temperature and periphery of center section After lease making crosses radiating, both temperature are essentially identical.Avoid producing temperature difference, the thin slice gain media 200 will not also be turned round Qu Qiqiao, and influence the gain performance to laser.
Preferably, in the present embodiment, the center cooling duct 101 is the through hole longitudinally through described matrix 1;The week Side cooling duct 102 is the groove longitudinally through described matrix 1;The cross section of the groove is in sector.In this way, it is easy to integral casting Processing and fabricating is made, reduces the usage amount of raw material, simplifies manufacture craft, and ensure that structural strength.
Further, shown in Fig. 5, in the end that the thin slice gain media 200 is fixed in described matrix 1, that is, institute On the top for stating matrix 1, the spacing edge between the exit face of the periphery cooling duct 102 and the thin slice gain media 200 The center line of described matrix 1 radially outward gradually increases, and the exit face more than the center cooling duct 101 and the thin slice Spacing between gain media 200.It is, the cross section in the exit of the center cooling duct 101 increases with the thin slice Spacing between beneficial medium 200 is minimum, and the section in the exit of the periphery cooling duct 102 is located on same circular conical surface.By It is the distribution schematic diagram of the pump energy of thin slice gain media 200 described in Fig. 3.Workspace on the thin slice gain media 200 The center section heat in domain 201 is higher than the peripheral part of working region 201.So, by the exit face of center cooling duct 101 It is minimum with the center section distance of working region 201 on thin slice gain media 200, in this way, cooling effectiveness highest, similarly, periphery Cooling duct 102 is radially outward to the cooling effectiveness of the peripheral part of working region 201 on the thin slice gain media 200 Successively decrease.It is, in the temperature of the cooling of the center section of working region 201 on the same period, the thin slice gain media 200 Degree difference is maximum, the temperature difference of the cooling of the peripheral part of working region 201 on the thin slice gain media 200, radially outer Successively decrease.In this way it is ensured that on the gain media in the temperature of the center section of working region 201 and working region 201 Peripheral temperature difference is small as far as possible, avoids to generate thermal residual strain, it is ensured that the thin slice gain media 200 it is reliable Property, it ensure that the gain effect to laser.
Further, the other end of described matrix 1 is provided with closure 2, is offered on the closure 2 multiple for described cold But the fluid hole that liquid enters the inlet opening of the cooling duct 10 and matched in the inlet opening.The fluid hole includes center Fluid hole 25 and periphery fluid hole 23.The inlet opening includes center inlet opening 24 and periphery inlet opening 22..The center goes out liquid Hole 25 and the center inlet opening 24 connect with the center cooling duct 101.Each 22 and one week of the inlet opening Side fluid hole 23 corresponds one periphery cooling duct 102. of connection.The inlet opening 22 and the periphery fluid hole 23 are annular It is uniformly distributed in the periphery of the center fluid hole 25, the 23 alternate setting of the inlet opening 22 and the periphery fluid hole.Specifically Ground, four corners of described matrix 1 are provided with the fixing hole 12 for fixing the closure 2, correspondingly, in the sealing Cover and be provided with connecting hole 21.In the present embodiment, the fixing hole 12 is screwed hole, and the connecting hole is counter sink, actual installation When, it is lock onto by fastener through the connecting hole 21 in the screwed hole in described matrix 1, the closure 2 is fixed on In described matrix 1.Coolant respectively enters the center cooling duct 101 by center inlet opening 24 and periphery inlet opening 22. With periphery cooling duct 102, flowed out by center fluid hole 25 and periphery fluid hole 23, form the radiating of multiple coolants Passage, cooling is carried out to each several part of 200 working region of thin slice gain media 201 respectively, radiating efficiency is high, and passes through The flow velocity of the coolant in each heat emission hole is controlled, each several part of 200 working region of thin slice gain media 201 can be adjusted Radiate the temperature difference so that the temperature of each several part of 200 working region of thin slice gain media 201 tends to an identical value all the time, just Avoid the thermal stress as caused by the temperature difference from remaining, while each inlet opening 22 is arranged on same closure 2, on the one hand, just In processing and fabricating, sealing effectiveness on the other hand ensure that.
In addition, present invention also offers a kind of laser, it includes a thin slice gain media 200 and heat sink 100, described thin Piece gain media 200 is fixed on described heat sink 100, wherein, described heat sink 100 be heat sink 100 described in any of the above-described.
Due to a kind of laser of the present invention, employ above-mentioned heat sink 100 and fix the thin slice gain media 200, by It is remaining caused by the thin slice gain media 200 when the above-mentioned heat sink 100 fixation thin slice gain media 200 is employed Stress is small so that the thin slice gain media 200 is unlikely to deform, of good reliability, and then ensure that laser is situated between by the gain Power output and beam quality after matter.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.

Claims (10)

1. it is a kind of heat sink, for fixing thin slice gain media, including a matrix, it is characterised in that at the center of described matrix Provide the cooling duct that the thin slice gain media is cooled down for guiding coolant;In described matrix have be used for will be described thin The fixed fixed part of piece gain media absorption;The fixed part includes being used to adsorb the thin slice gain located at described matrix end The sorption channel of the fringe region of medium and being connected with the sorption channel is formed for extracting the gas in the sorption channel out The gas port of vacuum.
2. one kind according to claim 1 is heat sink, it is characterised in that:The sorption channel is provided with multiple, each absorption Passage is correspondingly communicated with a gas port.
3. one kind according to claim 2 is heat sink, it is characterised in that:Each gas port intersects with the sorption channel to be set Put.
4. one kind according to claim 3 is heat sink, it is characterised in that:Center line of each sorption channel along described matrix Array is arranged.
It is 5. a kind of heat sink according to any one of claim 1-4, it is characterised in that:The sorption channel is a circular arc Groove.
6. one kind according to claim 1 is heat sink, it is characterised in that:The sorption channel is surrounded located at the cooling duct Around.
7. according to a kind of heat sink described in claim 1,2,3,4 or 6, it is characterised in that:It is described heat sink also including around institute State matrix center linear array arrangement and the periphery cooling duct for cooling down the thin slice gain media central peripheral.
8. one kind according to claim 7 is heat sink, it is characterised in that:The cooling duct is longitudinally through described matrix Through hole;The periphery cooling duct is the groove longitudinally through described matrix;The cross section of the groove is in sector.
9. one kind according to claim 8 is heat sink, it is characterised in that:In fixing the thin slice gain media in described matrix End, center line of the spacing along described matrix between the exit face of the periphery cooling duct and the thin slice gain media Radially outward gradually increase, and the spacing being more than between the exit face of the center cooling duct and the thin slice gain media.
10. a kind of laser, including a thin slice gain media and heat sink, the thin slice gain media be fixed on it is described it is heat sink on, It is characterized in that, described heat sink to be a kind of heat sink described in claim any one of 1-9.
CN201310385260.0A 2013-08-29 2013-08-29 It is a kind of heat sink and there is the heat sink laser Active CN104426048B (en)

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CN106253037A (en) * 2016-08-30 2016-12-21 河南仕佳光子科技股份有限公司 Outer lumen type narrow linewidth V groove fiber-grating laser
GB201701173D0 (en) * 2017-01-24 2017-03-08 Element Six Tech Ltd Synthetic diamond plates
CN110247295A (en) * 2018-11-21 2019-09-17 中国科学院理化技术研究所 A kind of heat sink structure and slab laser reducing slab laser wavefront distortion
CN114361916B (en) * 2021-11-30 2023-12-26 中国电子科技集团公司第十一研究所 Heat sink structural part for laser and laser with heat sink structural part

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CN1564404A (en) * 2004-04-13 2005-01-12 西南科技大学 Silicon chip microtunnel cooled large power laser LED array
CN101588708A (en) * 2008-05-23 2009-11-25 中国科学院工程热物理研究所 Microchannel heat sink and measuring device
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