CN104392936B - Full-pressure-welding igbt chip positioner body - Google Patents
Full-pressure-welding igbt chip positioner body Download PDFInfo
- Publication number
- CN104392936B CN104392936B CN201410541585.8A CN201410541585A CN104392936B CN 104392936 B CN104392936 B CN 104392936B CN 201410541585 A CN201410541585 A CN 201410541585A CN 104392936 B CN104392936 B CN 104392936B
- Authority
- CN
- China
- Prior art keywords
- mould
- fixed lower
- fixation
- lower mould
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims abstract description 10
- 238000007493 shaping process Methods 0.000 claims abstract description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- -1 acyl Imines Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connection Of Plates (AREA)
Abstract
The invention belongs to chip mounting technique field,Specifically related to a kind of full-pressure-welding igbt chip positioner body,Fastened by two parts and constituted,Mould under the fixation of mould and lower section in fixation above being respectively,Mould is identical with fixed lower mould face shaping in fixation,6 fastening teeth are machined with fixed lower mould,The centre position of fixed lower mould is engraved structure,It is machined with multiple chip fixing holes,6 buckling grooves are machined with fixation on mould,Fastening tooth in its distribution angle and fixed lower mould matches,Mould is machined with identical chip fixing hole on multiple and fixed lower mould in fixation,The present invention is closed by fixed lower mould and fixed upper die button,Igbt chip is placed in chip fixing hole,Can effectively prevent it from loosening,Come off,Avoid igbt chip eccentric,Displacement,And simple structure of the present invention,Low cost,High temperature resistant,The coefficient of expansion is small after being heated,It is a kind of preferable full-pressure-welding igbt chip positioner body.
Description
Technical field
The invention belongs to chip mounting technique field, and in particular to a kind of full-pressure-welding igbt chip positioner body.
Background technology
Igbt chip as one of important high-power main flow device of power electronics, have been widely used for high voltage converter,
The fields such as communications and transportation, power engineering, regenerative resource and intelligent grid.In terms of commercial Application, such as traffic control, power become
Change, industrial motor, uninterrupted power source, wind-powered electricity generation and solar facilities, and the frequency converter for automatically controlling.
Domestic market demand steeply rises once so that igbt chip market was once expected, but to the core of igbt chip
Technology and industry are controlled by most of American-European IDM semiconductor manufacturers, and it is special that China successfully develops 8 cun of IGBT in June, 2014
Industry chip, breaks international monopoly.
At present, in igbt chip is actually used, full-pressure-welding IGBT power devices its chips has to be fixedly secured
In chip fixture apparatus, but existing igbt chip fixing device is generally monolithic open type, and chip must be buckled in fixed dress
In putting, it is not easy to easily loosened after fixed and fixed, cause chip positioning inaccurate；Furthermore, existing chip fixture apparatus are generally
Monolithic cell structure, the individual chip package time is long and assembling is bothered in use, in some more severe use environments,
Prolonged use is easily caused chip deformed damaged.A kind of novel chip fixing device body how is designed, the above can be avoided
The generation of problem, can effectively, accurately fix igbt chip and easily operate, and can play guarantor well after fixing to chip
Shield is acted on and copes with various adverse circumstances, is industry personnel technical problem urgently to be resolved hurrily.
The content of the invention
To realize above-mentioned technical functionality, technical scheme is as follows：Full-pressure-welding igbt chip positioner body, by
Two parts fasten composition, are respectively moulds under the fixation of mould and lower section in the fixation of top, mould and mould outward appearance shape under fixing fixation in
Shape is identical, is circular configuration, on fixed lower mould, around the edge of fixed lower mould, is machined with 6 fastening teeth, 6 described fastenings
It is distributed on fixed lower mould with 60 ° of angles between tooth is adjacent, the centre position of fixed lower mould is engraved structure, is machined with multiple cores
Piece fixing hole, described multiple chip fixing holes are square and are uniformly distributed, and the chip fixing hole of square distribution should for fixing phase
Conduction on molybdenum sheet, chip and conductive lower molybdenum sheet, the edge of chip fixing hole is each provided with a gate pole control hole, and chip is solid
The gap for determining hole and fixed lower mould edge drills through four mounting holes, four described mounting holes, per in 90 ° between two neighboring
Angular distribution；Between two mounting holes, the gap at fixed lower mould edge drills through 1 location hole, in the location hole diagonal angle
Drill through another location hole；The edge of mould in fixation, it is corresponding with fixed lower mould, 6 buckling grooves are machined with, its angle of distribution
Fastening tooth on degree and fixed lower mould matches, and the centre position of mould is similarly engraved structure fixation in, and be machined with multiple with
Identical chip fixing hole on fixed lower mould, the gap at mould edge equally drills through four mounting holes in fixation, described
Four mounting holes are identical with the size and distribution angle of the mounting hole on fixed lower mould；It is fixed between two mounting holes
The gap at upper mould edge is machined with a locating dowel, then matches with fixed lower mould.
A diameter of 5mm of described mounting hole.
A diameter of 3mm of described location hole.
The shape size of the chip fixing hole on chip fixing hole and fixed upper mould under described fixation on mould and distribution
Angle is identical.
The outside dimension of described locating dowel is standard that smooth can be inserted into location hole.
The material of mould and fixed lower mould is PEI or polyphenylene sulfide in described fixation.
Beneficial effects of the present invention：The present invention is positioned using two-piece type design by the cooperation of location hole and locating dowel,
Fastened by the buckling groove on the fastening tooth and fixed upper mould on fixed lower mould again and fixed lower mould and fixed upper mould are fixed as one
Body formula, molybdenum sheet, igbt chip, conductive lower molybdenum sheet in conduction are placed in chip fixing hole, can effectively prevent igbt chip
Loosen, come off, it is to avoid the hidden danger such as igbt chip bias, displacement, and simple structure of the present invention, low cost, using polyethers acyl
Imines or polyphenylene sulfide material, high temperature resistant, good flame resistance, the coefficient of expansion is small after being heated, it is ensured that chip at high temperature can be steady
Fixed work, is a kind of preferable full-pressure-welding igbt chip positioner body.
Brief description of the drawings
Total 3, the accompanying drawing of the present invention, wherein：
Fig. 1 is schematic perspective view after the present invention is fastened.
Fig. 2 is the fixed lower die structure schematic diagram of the present invention.
Fig. 3 is the fixed upper mould structure schematic diagram of the present invention.
Fig. 4 is igbt chip mounting structure schematic diagram of the present invention.
In accompanying drawing：1st, fixed lower mould, 2, chip fixing hole, 3, fasten tooth, 4, mounting hole, 5, location hole, 6, mould in fixation,
7th, buckling groove, 8, locating dowel, 9, molybdenum sheet in conduction, 10, igbt chip, 11, conductive lower molybdenum sheet, 12, gate pole control pole, 13, door
Pole control hole.
Specific embodiment
The present invention is further described through below in conjunction with the accompanying drawings.As shown in drawings, a kind of full-pressure-welding igbt chip
Positioner body, the face shaping of mould 1 is identical under it is fixed upper mould 6 and fixes, and circular configuration is all, on fixed lower mould 1, around solid
The edge of mould 1 is fixed, is positioned by the cooperation of location hole and pilot pin, then by the fastening tooth 3 on fixed lower mould 1 and fixed
Buckling groove 7 on upper mould 6 fastens and fixed lower mould 1 and fixed upper mould 6 is fixed as one formula.
The centre position of fixed lower mould 1 is engraved structure, is machined with multiple chip fixing holes 2, and described multiple chips are consolidated
Determine hole 2 to be square distribution, each hollow out processes 3 chip fixing holes 2 on four outsides of the distribution that is square, by the He of igbt chip 9
After molybdenum sheet 9 and conductive lower molybdenum sheet 11 are placed into chip fixing hole 2 in conduction, the edge of chip fixing hole 2 is each provided with
One gate pole control control hole 13, gate pole control pole 12 is inserted into gate pole control hole 13, is then fastened to fixed upper mould 6 solid
Fix on mould 1, molybdenum sheet 9 is fixed in chip fixing hole 2 with igbt chip 10 and conductive lower molybdenum sheet 11 in conduction, and chip is fixed
The gap at the outside in hole 2, chip fixing hole 2 and the fixed lower edge of mould 1 drills through four mounting holes 4, four described mounting holes
4, per angular distribution in 90 ° between two neighboring；Between two mounting holes 4, the gap at the fixed lower edge of mould 1 drills through 1
The location hole 5 of a diameter of 3mm, another location hole 5 is drilled through in the diagonal angle of location hole 5.
The edge of mould 6 in fixation, and fixed lower mould 1 is corresponding, is machined with the phase of fastening tooth 3 on 6 and fixed lower mould 1
Coincide buckling groove 7, and the centre position of mould 6 is similarly engraved structure in fixation, and is machined with multiple and fixed lower mould 1 phase completely
Same chip fixing hole 2, the shape size of the chip fixing hole 2 on chip fixing hole 2 and fixed above mould 6 on fixed lower mould 1
It is identical with distribution angle；The gap at the edge of mould 6 equally drills through four mounting holes of a diameter of 5mm 4 in fixation, described
Four mounting holes 4 are identical with the size and distribution angle of the mounting hole 4 on fixed lower mould 1；Between two mounting holes 4,
The gap at mould edge is machined with the locating dowel 8 that two and fixed lower mould 1 match, mould and fixation in described fixation in fixation
The material of lower mould is PEI or polyphenylene sulfide, and good flame resistance, heat distortion temperature, can be at -160-180 DEG C up to 260 DEG C
Operating temperature under make for a long time, its coefficient of expansion is small after being heated, it is to avoid the appearance of the hidden danger such as igbt chip bias, displacement.
Claims (1)
1. full-pressure-welding igbt chip positioner body, is fastened by two parts and constituted, and is respectively mould and lower section in the fixation of top
Fixation under mould, it is characterised in that：Mould is identical with fixed lower mould face shaping in fixation, is circular configuration, on fixed lower mould, encloses
Around the edge of fixed lower mould, 6 fastening teeth are machined with, are distributed on 60 ° of angles between 6 described fastening teeth are adjacent under fixing
On mould, the centre position of fixed lower mould is engraved structure, is machined with multiple chip fixing holes, described multiple chip fixing holes point
Cloth situation is uniformly distributed to be square, then from the outside of overall circumference, chip fixing hole is bored with the gap at fixed lower mould edge
Take four mounting holes, four described mounting holes, per angular distribution in 90 ° between two neighboring；Between two mounting holes, Gu
The gap for fixing mould edge drills through 1 location hole, and the location hole diagonal angle drills through another location hole；Mould in fixation
Edge, it is corresponding with fixed lower mould, 6 buckling grooves are machined with, the fastening tooth in its distribution angle and fixed lower mould matches,
The centre position of mould is similarly engraved structure in fixation, and is machined with identical chip on multiple and fixed lower mould and fixes
Hole, the gap at mould edge equally drills through four mounting holes, the installation on described four mounting holes and fixed lower mould in fixation
The size and distribution angle in hole are identical；Between two mounting holes, the gap at mould edge is machined with one and determines in fixation
Position post, and fixed lower mould matches；A diameter of 5mm of described mounting hole；A diameter of 3mm of described location hole；Described
Chip fixing hole on fixed lower mould is identical with distribution angle with the shape size of the chip fixing hole on fixed upper mould；Institute
The outside dimension of the locating dowel stated is standard that smooth can be inserted into location hole；Mould and fixed lower mould in described fixation
Material is PEI or polyphenylene sulfide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410541585.8A CN104392936B (en) | 2014-10-01 | 2014-10-01 | Full-pressure-welding igbt chip positioner body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410541585.8A CN104392936B (en) | 2014-10-01 | 2014-10-01 | Full-pressure-welding igbt chip positioner body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104392936A CN104392936A (en) | 2015-03-04 |
| CN104392936B true CN104392936B (en) | 2017-07-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410541585.8A Expired - Fee Related CN104392936B (en) | 2014-10-01 | 2014-10-01 | Full-pressure-welding igbt chip positioner body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104392936B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108649022B (en) * | 2018-05-17 | 2020-04-10 | 江苏芯澄半导体有限公司 | High-temperature packaging structure of wide-bandgap semiconductor silicon carbide power module |
| CN108682655B (en) * | 2018-05-17 | 2020-01-17 | 江苏芯澄半导体有限公司 | High-temperature packaging method for wide-bandgap semiconductor silicon carbide power module |
| CN114543682B (en) | 2022-02-24 | 2022-09-27 | 北京工业大学 | Micro-motion displacement measuring device and method in crimping type IGBT power cycle |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5454705A (en) * | 1991-12-20 | 1995-10-03 | Goldstar Electron Co., Ltd. | Semiconductor mold having cavity blocks with cavities on top and bottom surfaces |
| CN2509713Y (en) * | 2001-12-06 | 2002-09-04 | 河北省景县华北整流器件厂 | Positioning ring for electronic power device |
| CN103400831A (en) * | 2013-07-22 | 2013-11-20 | 国家电网公司 | All-crimping type insulated gate bipolar transistor (IGBT) module and assembling method thereof |
| CN103579165A (en) * | 2013-11-04 | 2014-02-12 | 国家电网公司 | Full-pressure-welding power device |
| CN204289396U (en) * | 2014-10-01 | 2015-04-22 | 河北华整实业有限公司 | Full compression joint type igbt chip positioner body |
-
2014
- 2014-10-01 CN CN201410541585.8A patent/CN104392936B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5454705A (en) * | 1991-12-20 | 1995-10-03 | Goldstar Electron Co., Ltd. | Semiconductor mold having cavity blocks with cavities on top and bottom surfaces |
| CN2509713Y (en) * | 2001-12-06 | 2002-09-04 | 河北省景县华北整流器件厂 | Positioning ring for electronic power device |
| CN103400831A (en) * | 2013-07-22 | 2013-11-20 | 国家电网公司 | All-crimping type insulated gate bipolar transistor (IGBT) module and assembling method thereof |
| CN103579165A (en) * | 2013-11-04 | 2014-02-12 | 国家电网公司 | Full-pressure-welding power device |
| CN204289396U (en) * | 2014-10-01 | 2015-04-22 | 河北华整实业有限公司 | Full compression joint type igbt chip positioner body |
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| Publication number | Publication date |
|---|---|
| CN104392936A (en) | 2015-03-04 |
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Granted publication date: 20170707 Termination date: 20211001 |
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| CF01 | Termination of patent right due to non-payment of annual fee |