CN104362077A - Liner and substrate separation process and flexible display device and manufacturing process thereof - Google Patents
Liner and substrate separation process and flexible display device and manufacturing process thereof Download PDFInfo
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- CN104362077A CN104362077A CN201410609084.9A CN201410609084A CN104362077A CN 104362077 A CN104362077 A CN 104362077A CN 201410609084 A CN201410609084 A CN 201410609084A CN 104362077 A CN104362077 A CN 104362077A
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
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- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a liner and a substrate separation process. The liner separation process includes the steps of 1), manufacturing the flexible membrane liner on a substrate, wherein the flexible membrane liner is located on the substrate and wraps the side face of the substrate; 2), manufacturing an electronic element on the flexible membrane liner; 3), vertically cutting from the surface of the flexible membrane liner along the outer periphery of the electronic element and dissolving the flexible membrane liner to obtain a finished flexible display device. The invention further discloses a flexible display device manufacturing process including the liner and the substrate separation process and the flexible display device manufactured by the manufacturing process. The flexible liner can be stably attached to the rigid substrate during subsequent device manufacturing processes, and separation of the liner and the substrate is simple, low in cost, rapid and free of damage to performance of the device.
Description
Technical field
The present invention relates to the technology of preparing of flexible display device, particularly a kind of substrate and substrate separating technology, flexible display device and preparation technology thereof.
Background technology
First on hard substrate, form fexible film substrate time prepared by flexible display device, and then make electronic device on fexible film substrate, finally fexible film substrate and substrate being dissociated obtains removing the finished device of substrate.But, there are some defects in this method of the prior art: flexible substrate and substrate need to bear the harsh experiment condition such as Ions Bombardment, chemical corrosion, ultraviolet irradiation, high-temperature process in the preparation process of subsequent electronics, cause the adhesion between substrate and substrate significantly to improve, so by fexible film substrate from very easily damage in hard substrate dissociates flexible substrate film and on electronic device; On the contrary, if the adhesion of fexible film substrate and hard substrate is excessively weak, in the process of making devices, just there will be the problem that fexible film substrate surprisingly departs from.
In order to overcome above-mentioned difficulty of dissociating, usually between hard substrate and fexible film substrate, inserting specific sacrifice layer, utilizing sacrifice layer to reduce or improving adhesion therebetween.However, the balance still more difficult control of adhesion power, find a kind of be applicable to various experiment, production environment separating technology then more difficult.
Therefore, not enough for prior art, a kind of brand-new substrate and substrate separating technology are provided, convenience, low cost both can allowing, dissociate fast, and it is very necessary not affect device performance.There is provided a kind of simultaneously and can facilitate, low cost, fast realize technique that flexible display device substrate is separated with substrate and the flexible display device that adopts this technique to prepare very necessary to overcome prior art deficiency.
Summary of the invention
In order to the above-mentioned shortcoming overcoming prior art is with not enough, an object of the present invention is the technique providing a kind of substrate to be separated with substrate, can simply, low cost, realize substrate rapidly and be separated with substrate.
Two of object of the present invention is the preparation technology providing a kind of flexible display device.
Three of object of the present invention is the flexible display device providing the preparation technology of above-mentioned flexible display device to prepare.
Object of the present invention is achieved through the following technical solutions:
A kind of substrate and substrate separating technology, comprise the following steps:
(1) on substrate, fexible film substrate is prepared; Described fexible film substrate is positioned on substrate, and the side of coated matrix;
(2) on fexible film substrate, electronic component is prepared;
(3) peripheral along electronic component, cut vertically downward from fexible film substrate surface, then fexible film substrate is dissociated, obtain flexible display device.
Also sacrifice layer is provided with between the described fexible film substrate of step (1) and substrate.
The bottom surface of step (1) described fexible film also coated matrix.
Described sacrifice layer is more than one in carbon simple substance membrane, nitride film.
Described carbon simple substance is amorphous carbon, carbon nano-tube, Graphene, fullerene or diamond like carbon.
Described nitride is silicon nitride, aluminium nitride, gallium nitride or indium nitride.
A preparation technology for flexible display device, comprises above-mentioned substrate and substrate separating technology.
A kind of flexible display device, is prepared from by the preparation technology of above-mentioned flexible display device.
Compared with prior art, the present invention has the following advantages and beneficial effect:
The present invention by increasing the contact area of fexible film substrate and substrate, thus directly increases the adhesion of the two; In addition, flexible substrate adopts solwution method processing, therefore before its film forming, there is good plasticity, utilize this feature can form the coated board structure of flexible substrate part or the complete coated board structure of flexible substrate artificially, these two kinds of structures ensure that flexible substrate in subsequent device preparation process with the stability of substrate attachment.Even if therefore adopt the less fexible film substrate of adhesion also can ensure that fexible film is firmly attached on substrate in the process of making devices.This separating technology is simple, only the technology such as existing spin coating, blade coating, immersion need be used can to realize, without the need to increasing extra functional layer, process mould or process equipment.When dissociating, directly excise unwanted fexible film region and get final product light separate substrate and substrate, can not impact device performance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram before the fexible film substrate of embodiments of the invention 1 dissociates.
Fig. 2 is the schematic diagram of the fexible film substrate of embodiments of the invention 1 when dissociating.
Fig. 3 is the schematic diagram before the fexible film substrate of embodiments of the invention 2 dissociates.
Fig. 4 is the schematic diagram of the fexible film substrate of embodiments of the invention 2 when dissociating.
Fig. 5 is the schematic diagram before the fexible film substrate of embodiments of the invention 3 dissociates.
Fig. 6 is the schematic diagram of the fexible film substrate of embodiments of the invention 3 when dissociating.
Fig. 7 is the schematic diagram before the fexible film substrate of embodiments of the invention 4 dissociates.
Fig. 8 is the schematic diagram of the fexible film substrate of embodiments of the invention 4 when dissociating.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment 1
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, comprise the following steps:
(1) on substrate, prepare fexible film substrate, described fexible film substrate is positioned on substrate, and the side of coated substrate, and the upper surface of namely coated substrate and side, for part is coated;
Substrate is hard material, and thickness is 1-2000 micron, can be glass, metal, plastics and Fiber Materials, also can for having a substrate of resilient coating based on above-mentioned material.
The material of fexible film substrate 200 can be polyimides (Polyimide, PI), PETG (Polyethylene terephthalate, PET), Polyethylene Naphthalate (Polyethylenenaphthalate, PEN), Merlon (Polycarbonate, PC), polyether sulfone (Polyethersulfone, PES), polyacrylate (Polyacrylate, PAR), Polyetherimide (Polyetherimide), polyamide (Polyamide, or polyether-ether-ketone (polyetheretherketone PA), PEEK) etc.
Flexible substrate can adopt coating process (coating) to be formed on substrate, comprises the combination of blade coating, spin coating, spraying, dip-coating, silk screen printing and these methods.
In order to form the structure of forming section inclusion enclave outside fexible film substrate 200 covered substrate frontside edge as shown in Figure 1, in painting membrane process, the film precursor solution that allows that should be suitable overflows from substrate edges.After reaching covered effect, then process is cured to film precursor solution.The concrete film-forming process of fexible film substrate is general knowledge known in this field, does not repeat them here.Because substrate side surfaces roughness is much larger than upper and lower surface, therefore this structure can increase the contact area of fexible film substrate and substrate, increases adhesive force, reduces the probability departed from.After device preparation, can be dissociated by the mode of cutting.
(2) on fexible film substrate, electronic component is prepared;
Electronic component 300 made on fexible film substrate 200 comprises: insulating barrier, resistance, electric capacity, inductance, wire, transistor, diode and combination thereof.The concrete form of electronic component and position, annexation can be selected flexibly according to concrete requirement on devices and arrange, and do not enumerate at this.
(3) as shown in Figure 2, peripheral along electronic component 300, cut vertically downward from fexible film substrate 200 surface, form line of cut 800; Again fexible film substrate is dissociated from substrate and obtain finished product flexible display device.
Cutting mode specifically can select cutting machine cutting, laser cutting, ion etching, plasma bombardment.
Separate mode specifically can select cylinder or manipulator to be dissociated from substrate by fexible film substrate.
Technique of the present invention, has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 2
The substrate that the present embodiment a kind of prepares for flexible display device and substrate separating technology, further feature is identical with embodiment 1, and difference is following characteristics:
When the step (1) of the present embodiment prepares fexible film substrate on substrate, described fexible film substrate is positioned on matrix, and the side of coated substrate and bottom surface, and namely the upper bottom surface of coated substrate and side, namely completely coated; Prepared structure as shown in Figure 3.
This structure under the character of physics and chemistry not changing fexible film substrate, can improve fexible film substrate to the adhesive force of substrate, reduces the probability departed to greatest extent.
After device preparation, can be dissociated by the mode of cutting.
The step (3) of the present embodiment is specific as follows: as shown in Figure 4, peripheral along electronic component 300, cuts vertically downward from fexible film substrate 200 surface, forms line of cut 800; Then fexible film substrate 200 is torn from substrate 100 and obtain the finished product flexible display device after being separated.
The present embodiment is used for the substrate prepared of flexible display device and substrate separating technology, has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 3
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, comprise the following steps:
(1) on substrate, prepare sacrifice layer, then on sacrifice layer, prepare fexible film substrate; The upper surface of fexible film substrate is coated sacrifice layer and side, the side of substrate is the structure that part is coated;
Sacrifice layer can be in carbon pure metals film, nitride material film more than one, can be single layer structure or sandwich construction;
Carbon pure metals is amorphous carbon, carbon nano-tube, Graphene, fullerene or diamond like carbon;
Nitride material is silicon nitride, aluminium nitride, gallium nitride or indium nitride.
Sacrifice layer is prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
(2) on fexible film substrate, prepare electronic component, the structure now obtained as shown in Figure 5, comprises substrate 100, sacrifice layer 400, fexible film substrate 200 and electronic component 300, wherein the coated matrix of fexible film substrate 200 part;
(3) fexible film substrate is dissociated from sacrifice layer obtain finished product flexible display device.This step specifically comprises, as shown in Figure 6:
(3.1) along the periphery of electronic component 300, having fexible film substrate 200, sacrifice layer 400 and substrate 100 three-decker position stacked successively, cutting vertically downward from fexible film substrate 200 surface, forming line of cut 800;
(3.2) fexible film substrate 200 is dissociated from sacrifice layer 400 obtain being separated the finished product flexible display device of substrate 100.
This embodiment introduces sacrifice layer, sacrifice layer can weaken the adhesion of fexible film substrate and substrate.Therefore the present embodiment is more suitable for the higher situation of fexible film substrate adhesion compared to embodiment 1 and 2.The introducing of sacrifice layer, make fexible film substrate be very easy to dissociate from substrate, meanwhile, the structure of part cladding ensures that fexible film substrate can not surprisingly depart from device fabrication processes.In the process of dissociating, only need excise unwanted fexible film.
The present embodiment is used for the substrate prepared of flexible display device and substrate separating technology, has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 4
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, further feature is identical with embodiment 3, and difference is following characteristics:
The present embodiment is when the step (1) of the present embodiment prepares fexible film substrate on substrate, fexible film substrate is the also coated bottom surface of matrix, namely the side of the upper surface of coated sacrifice layer of knowing clearly and side, substrate and bottom surface, be complete clad structure.
Structure before fexible film substrate dissociates as shown in Figure 7, comprises substrate 100, sacrifice layer 400, fexible film substrate 200 and electronic component 300, wherein the complete coated matrix of fexible film substrate 200.
When dissociating, as shown in Figure 8, fexible film substrate 200 is torn the finished product flexible display device after obtaining separation from sacrifice layer 400.
The present embodiment is used for the substrate prepared of flexible display device and substrate separating technology, has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 5
The present embodiment is prepared a kind of flexible TFT and is driven backboard ia, and to verify effect of the present invention, preparation process is as follows:
(1) first, select glass substrate as the substrate of hard, first glass substrate is cleaned.
(2) polyimide film substrate is prepared on the glass substrate.Concrete, apply polyamide acid solution on the glass substrate, adopt the mode of spin coating, allow part solution overflow from glass substrate edge, until glass substrate 100 side is all covered by solution.After spin coating is complete, hard substrate is sent into N
2in the baking oven of atmosphere, film forming is cured to the first body film of polyamic acid, forms the part clad structure as Fig. 1.
(3) then TFT drive circuit is prepared at polyimide film substrate.
(4) along the periphery of TFT drive circuit, with the position of cutting machine in polyimide film substrate and glass substrate overlap, cut vertically downward from polyimide film substrate surface, avoid being cut to glass substrate, can see Fig. 2.
(5) finally polyimide film substrate is directly torn from substrate.
In order to contrast effect, prepare another flexible TFT and drive backboard ib, the different structures being that forming section is not coated that ib and ia is unique, polyimide film is only spin-coated on upper surface of base plate.In the process making drive circuit, can see that there are the phenomenons such as obvious tilting, bubbling at polyimide film edge, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 6
The present embodiment is prepared a kind of flexible TFT and is driven backboard iia to verify effect of the present invention, and preparation process is as follows:
(1) first, select glass substrate as the substrate of hard, first glass substrate is cleaned.
(2) polyimide film substrate is prepared on the glass substrate.Concrete, apply polyamide acid solution on the glass substrate, adopt the mode of dip-coating, allow glass substrate be soaked in completely in polyimide solution, soak after 10 minutes and take out, glass substrate is sent into N
2in the baking oven of atmosphere, film forming is cured to the first body film of polyamic acid, forms the complete cladding structure as Fig. 3.
(3) then on polyimide film substrate, TFT drive circuit is prepared.
(4) along the periphery of TFT drive circuit, with the position of cutting machine at polyimide film substrate 200, glass substrate, polyimide film substrate three ply, cut vertically downward from polyimide film substrate surface, cut, avoid being cut to glass substrate, as shown in Figure 4.
(5) finally polyimide film is directly torn from substrate.
In order to contrast effect, different being of preparing another flexible TFT driving backboard iib, iib and iia unique does not form completely coated structure, and polyimide film is only spin-coated on upper surface of base plate.In the process making drive circuit, can see that there are the phenomenons such as obvious tilting, bubbling at polyimide film edge, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 7
The present embodiment prepares a kind of flexible AMOLED panel iiia, drives backboard and OLED luminescent device, specifically comprise the following steps containing TFT:
(1) solution processing method is utilized, prepare graphene film sacrifice layer concrete, first graphene oxide is prepared as a kind of colloidal solution, be coated in metallic substrate surfaces, the reducing power of metal substrate is utilized to make it change Graphene in situ, to in the evaporation of solvent progress, Graphene generation self assembly forms graphene film.
(2) prepare Polyethylene Naphthalate substrate, make the complete coated sacrifice layer of this Polyethylene Naphthalate substrate, and forming section cladding outside covered substrate edge.Concrete, adopt the mode of spin coating, allow solution cover sacrifice layer completely, and allow part solution overflow from glass substrate edge, until glass substrate side is all covered by solution.After spin coating is complete, send into N
2film forming is cured in the baking oven of atmosphere.Obtain part clad structure as shown in Figure 5.
(3) on Polyethylene Naphthalate substrate, TFT drive circuit and OLED is prepared.
(4) on Polyethylene Naphthalate substrate, cut out the profile of target board, substrate is torn from sacrifice layer.
In order to contrast effect, arrange comparative example iiib, unique different of iiib and iiia are not forming section clad structure, only at sacrifice layer one side preparation Polyethylene Naphthalate substrate.When making components and parts, can see that Polyethylene Naphthalate film edge has the phenomenons such as obvious tilting, bubbling, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 8
The present embodiment prepares a kind of flexible AMOLED panel iiia, and drive backboard and OLED luminescent device containing TFT, concrete preparation process is as follows:
First select metal substrate as hard substrate, before preparing sacrifice layer, first substrate is cleaned.
(1) solution processing method is utilized, prepare graphene film sacrifice layer, concrete, first graphene oxide is prepared as a kind of colloidal solution, be coated in metal substrate, surface, utilize metal substrate, reducing power make it change Graphene in situ, to solvent progress evaporation in, Graphene generation self assembly formed graphene film.
(2) prepare Polyethylene Naphthalate substrate, make the coated sacrifice layer upper surface of this Polyethylene Naphthalate substrate and side, matrix side and bottom surface, formed completely coated.Concrete, substrate is immersed in together with sacrifice layer in Polyethylene Naphthalate solution, takes out after 10 minutes, send into N
2film forming is cured in the baking oven of atmosphere.The Polyethylene Naphthalate substrate obtained has covered whole substrate and sacrifice layer, as shown in Figure 7.
(3) on Polyethylene Naphthalate substrate, TFT drive circuit and OLED is prepared.
(4) on Polyethylene Naphthalate substrate, cut out the profile of target board, substrate is torn from sacrifice layer.
In order to contrast effect, arrange comparative example ivb, unique different being of ivb and iva does not form complete clad structure, only at sacrifice layer 400 one side preparation Polyethylene Naphthalate substrate.When making components and parts, can see that Polyethylene Naphthalate film edge has the phenomenons such as obvious tilting, bubbling, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 9
The flexible display device of the present embodiment, adopts substrate and substrate separating technology that embodiment 1 ~ 4 is identical, the preparation technology identical with embodiment 5 ~ 8.Obtain separating base plate flexible substrate and on electronic component after, can encapsulate device, assemble, assemble, final form complete display device.This partial content is all industry routine techniques means, therefore does not repeat them here.
Above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not limited by the examples; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (8)
1. substrate and a substrate separating technology, is characterized in that, comprise the following steps:
(1) on substrate, fexible film substrate is prepared; Described fexible film substrate is positioned on substrate, and the side of coated matrix;
(2) on fexible film substrate, electronic component is prepared;
(3) peripheral along electronic component, cut vertically downward from fexible film substrate surface, then fexible film substrate is dissociated, obtain flexible display device.
2. substrate according to claim 1 and substrate separating technology, is characterized in that, is also provided with sacrifice layer between the described fexible film substrate of step (1) and substrate.
3. substrate according to claim 1 and 2 and substrate separating technology, is characterized in that, the bottom surface of step (1) described fexible film also coated matrix.
4. substrate according to claim 2 and substrate separating technology, is characterized in that, described sacrifice layer is more than one in carbon simple substance membrane, nitride film.
5. substrate according to claim 4 and substrate separating technology, is characterized in that, described carbon simple substance is amorphous carbon, carbon nano-tube, Graphene, fullerene or diamond like carbon.
6. substrate according to claim 4 and substrate separating technology, is characterized in that, described nitride is silicon nitride, aluminium nitride, gallium nitride or indium nitride.
7. a preparation technology for flexible display device, is characterized in that, comprises the substrate described in any one of claim 1 ~ 6 and substrate separating technology.
8. a flexible display device, is characterized in that, is prepared from by the preparation technology of flexible display device according to claim 7.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464893A (en) * | 2017-07-31 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | Preparation method, flexible display device and the display of flexible display device |
| CN107507916A (en) * | 2017-08-11 | 2017-12-22 | 京东方科技集团股份有限公司 | A kind of PI substrates and preparation method thereof, display device |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
| US10658592B2 (en) | 2017-07-31 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating flexible display device, flexible display device, and display apparatus |
| CN114613919A (en) * | 2022-02-28 | 2022-06-10 | 上海天马微电子有限公司 | Prefabricated substrate, flexible module, manufacturing method of flexible substrate and flexible module, and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101300899A (en) * | 2005-11-01 | 2008-11-05 | Lg化学株式会社 | Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
| CN102456712A (en) * | 2010-10-30 | 2012-05-16 | 乐金显示有限公司 | Method of fabricating flexible display device |
| US20120156457A1 (en) * | 2009-08-27 | 2012-06-21 | Asahi Glass Company, Limited | Multilayer structure with flexible base material and support, panel for use in electronic device provided with support and production method for panel for use in electronic device |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
| CN103456686A (en) * | 2007-02-02 | 2013-12-18 | 株式会社半导体能源研究所 | Method of manufacturing semiconductor device |
-
2014
- 2014-10-31 CN CN201410609084.9A patent/CN104362077A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101300899A (en) * | 2005-11-01 | 2008-11-05 | Lg化学株式会社 | Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
| CN103456686A (en) * | 2007-02-02 | 2013-12-18 | 株式会社半导体能源研究所 | Method of manufacturing semiconductor device |
| US20120156457A1 (en) * | 2009-08-27 | 2012-06-21 | Asahi Glass Company, Limited | Multilayer structure with flexible base material and support, panel for use in electronic device provided with support and production method for panel for use in electronic device |
| CN102456712A (en) * | 2010-10-30 | 2012-05-16 | 乐金显示有限公司 | Method of fabricating flexible display device |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107464893A (en) * | 2017-07-31 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | Preparation method, flexible display device and the display of flexible display device |
| US10658592B2 (en) | 2017-07-31 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating flexible display device, flexible display device, and display apparatus |
| CN107507916A (en) * | 2017-08-11 | 2017-12-22 | 京东方科技集团股份有限公司 | A kind of PI substrates and preparation method thereof, display device |
| US10565903B2 (en) | 2017-08-11 | 2020-02-18 | Boe Technology Group Co., Ltd. | PI substrate, preparation method thereof and display device |
| CN107507916B (en) * | 2017-08-11 | 2020-04-03 | 京东方科技集团股份有限公司 | PI substrate, preparation method thereof and display device |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
| CN114613919A (en) * | 2022-02-28 | 2022-06-10 | 上海天马微电子有限公司 | Prefabricated substrate, flexible module, manufacturing method of flexible substrate and flexible module, and display device |
| CN114613919B (en) * | 2022-02-28 | 2024-07-16 | 上海天马微电子有限公司 | Prefabricated substrate, flexible module, manufacturing methods of prefabricated substrate and flexible module, and display device |
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