CN104253149A - OLED (Organic Light Emitting Diode) display - Google Patents
OLED (Organic Light Emitting Diode) display Download PDFInfo
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- CN104253149A CN104253149A CN201410496406.3A CN201410496406A CN104253149A CN 104253149 A CN104253149 A CN 104253149A CN 201410496406 A CN201410496406 A CN 201410496406A CN 104253149 A CN104253149 A CN 104253149A
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Abstract
The invention provides an OLED (Organic Light Emitting Diode) display. The OLED display comprises a substrate, a cover plate which is arranged relative to the substrate, and an anode, a functional layer and a cathode which are located between the substrate and the cover plate and are sequentially stacked on the substrate, wherein at least one end of the cathode is connected with a lead terminal, a binding position lead is arranged on the substrate, a plurality of conductive leads are arranged on one side, opposite to the substrate, of the cover plate, one end of any conductive lead is arranged corresponding to one lead terminal, the other end of any conductive lead is arranged corresponding to a binding position lead, and the conductive leads are bonded with the lead terminals and the conductive leads are bonded with the binding position leads through conductive adhesive. The OLED display provided by the invention has the advantages that since the conductive leads are arranged on the cover plate, the two ends of the conductive leads respectively correspond to the lead terminals and the binding position leads on the substrate one to one and the leads which are arranged on the frame of the display in the prior art are changed to be arranged on the cover plate, the position of the frame is prevented from being occupied and the narrow frame design of the OLED display is realized.
Description
Technical field
The present invention relates to display technology field, particularly relate to a kind of OLED display.
Background technology
Organic electroluminescent LED (Organic Light-Emitting Diode, OLED) display is a kind of emerging flat-panel monitor, it possesses self-luminous, do not need that backlight, contrast are high, thickness is thin, visual angle is wide, reaction speed is fast, can be used for flexibility panel, serviceability temperature scope is wide, structure and the processing procedure excellent characteristic such as simpler, therefore there is extraordinary development prospect.
Refer to shown in Fig. 1, be existing OLED displayer structure schematic diagram, existing OLED display comprises substrate 101, the cover plate 102 be covered on substrate 101, sealed by packaging plastic 103 between substrate 101 and cover plate 102.The negative electrode 113 that OLED display also comprises the anode 111 be formed on substrate 101, is formed at the organic or inorganic functional layer 112 on anode 111 and is formed in organic or inorganic functional layer 112.As shown in Figure 2, for the lead-in wire distribution schematic diagram of existing OLED display frame, the one or both ends of the negative electrode 113 of OLED display connect COM lead-in wire 121(and frame lead-in wire), COM lead-in wire 121 needs to take one side of OLED display frame 131 or the larger position on both sides, thus increases the frame 131 of OLED display.But narrow frame tries hard to pursue the developing direction asked caused by display industry, and this lead-in wire distribution mode of existing OLED display does not obviously meet the direction that OLED display develops toward narrow frame, is necessary to improve this.
Summary of the invention
The object of the present invention is to provide a kind of OLED display, COM lead-in wire is arranged on bonnet, thus avoid COM lead-in wire to take the position of OLED display frame, and then realize the narrow frame design of OLED display.
For achieving the above object, the invention provides a kind of OLED display, comprise substrate, the cover plate be oppositely arranged with substrate, the anode be cascading between substrate and cover plate and on substrate, functional layer and negative electrode, at least one end of described negative electrode is connected with lead terminal, described substrate is provided with bindings bit lead-in wire, faced by described cover plate, the one side of substrate is provided with several conductive lead wires, the corresponding lead terminal in one end of arbitrary conductive lead wire is arranged, the corresponding bindings bit lead-in wire of the other end is arranged, between described conductive lead wire and lead terminal, be bonded together by conducting resinl between conductive lead wire and bindings bit go between.
Further, sealed fixing between described substrate and cover plate by packaging plastic, this packaging plastic part is covered on lead terminal and bindings bit lead-in wire, described lead terminal and the upper packaging plastic covered of bindings bit lead-in wire are described conducting resinl, and the packaging plastic of remainder is conducting resinl or the packaging plastic without conductivity.
Further, described conducting resinl is anisotropy conductiving glue.
Further, described conducting resinl is made by adding electrically conductive particles in packaging plastic.
Further, described electrically conductive particles is conductive gold spacer.
Further, described conductive lead wire is made up of ITO or metal material.
Further, described conductive lead wire is formed by etch process.
Further, this etch process is acid etching processing procedure or dry ecthing procedure.
Beneficial effect of the present invention: OLED display of the present invention, on the cover board conductive lead wire is set, the two ends of conductive lead wire go between with the lead terminal on substrate and bindings bit one_to_one corresponding respectively, and between conductive lead wire and lead terminal, be bonded together by conducting resinl between conductive lead wire and bindings bit go between, make to form conducting between conductive lead wire and lead terminal, conducting is formed between conductive lead wire and bindings bit go between, namely lead terminal and bindings bit form conducting between going between, and conductive lead wire does not take OLED display bezel locations owing to being arranged on cover plate, therefore the narrow frame design of OLED display can be realized.
Accompanying drawing explanation
Fig. 1 is existing OLED structure schematic diagram;
Fig. 2 is the lead-in wire distribution schematic diagram of existing OLED display frame;
Fig. 3 is the sectional structure schematic diagram of OLED display of the present invention;
Fig. 4 is the structural representation of the cover plate of OLED display of the present invention;
Fig. 5-8 be OLED display of the present invention substrate on conductive glue in the schematic diagram of diverse location.
Embodiment
Mechanism of the present invention and operation principle is described in detail below in conjunction with accompanying drawing.In order to better the present embodiment is described, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product; To those skilled in the art, in accompanying drawing, some known features and explanation thereof may be omitted is understandable.The corresponding same or analogous parts of same or analogous label.
Refer to shown in Fig. 3-5, the invention provides a kind of OLED display, comprise cover plate 2 that substrate 1 and substrate 1 be oppositely arranged, between substrate 1 and cover plate 2 and the anode 3 be cascading on substrate 1, functional layer 4 and negative electrode 5, seal by packaging plastic 6 between described substrate 1 and cover plate 2 and fix.Described substrate 1 and cover plate 2 are made by glass.At least one end of described negative electrode 5 is connected with lead terminal 7, is connected with lead terminal 7 and is described, can find out from Fig. 5-8 in the present embodiment for negative electrode 5 two ends, and lead terminal 7 lays respectively at the two ends, left and right of negative electrode 5.Described substrate 1 is provided with bindings bit lead-in wire 8, as the output of OLED display COM lead-in wire, for binding with PFC or IC in successive process.
Refer to shown in Fig. 4, described cover plate 2 is provided with several conductive lead wires 9 in the face of the one side of substrate 1.Described conductive lead wire 9 is made up of ITO or metal material, has good electric conductivity.Those conductive lead wires 9 and lead terminal 7 one_to_one corresponding, and to go between 8 one_to_one corresponding with bindings bit, namely the corresponding lead terminal 7 in one end of arbitrary conductive lead wire 9 is arranged, the corresponding bindings bit lead-in wire 8 of the other end is arranged, between described conductive lead wire 9 and lead terminal 7, conductive lead wire 9 and bindings bit gone between 8 and be bonded together by conducting resinl 6 ', and conducting resinl 6 ' has conductivity and adhesiveness.Described conducting resinl 6 ' is anisotropy conductiving glue, the horizontal direction of substrate 1 does not have conductivity, and have conductivity on the direction perpendicular to substrate 1.Described conducting resinl 6 ' is made by adding electrically conductive particles (not shown) in packaging plastic 6, electrically conductive particles is preferably conductive gold spacer, silicon powder particle size in its size and packaging plastic 6 rubber powder granule and packaging plastic 6 matches, thus can make the conducting resinl 6 ' with conductivity by not having a packaging plastic 6 of conductivity.Described conductive lead wire 9 is formed by etch process, and this etch process is acid etching processing procedure or dry ecthing procedure.Described conductive lead wire 9 can be straight line, also can be the cabling of other arbitrary shapes, as curve, arranges as required.Described lead terminal 7, conductive lead wire 9 and bindings bit 8 COM forming OLED display that go between go between, wherein, one end that lead terminal goes between as COM, the main part that conductive lead wire 9 goes between as COM, bindings bit lead-in wire is as the other end of COM lead-in wire, namely the main part of COM lead-in wire has been transferred on cover plate 2, saves the large quantity space at OLED display frame place.
When described substrate 1 and described cover plate 2 are fitted, the projection of one end of the conductive lead wire 9 on described cover plate 2 overlaps with the lead terminal 7 on substrate 1, and projection and the bindings bit of the other end of this conductive lead wire 9 go between and 8 to overlap.And between conductive lead wire 9 and lead terminal 7, conductive lead wire 9 and bindings bit are gone between 8 and are bonded together by conducting resinl 6 ', due to the Anisotropically conductive of conducting resinl 6 ', lead terminal 7 forms conducting with the conductive lead wire 9 on cover plate 2, conductive lead wire 9 and bindings bit go between and 8 form conducting, and be connected to form conducting between negative electrode 5 and lead terminal 7, therefore, negative electrode 5 and bindings bit go between 8 and form conducting, therefore the COM of OLED display lead-in wire is transferred on cover plate 2 by frame by the present invention, avoid taking bezel locations, reduce border width, and then realize narrow frame design.
Shown in Fig. 5-8, sealed fixing between described substrate 1 and cover plate 2 by packaging plastic 6, this packaging plastic 6 part is covered on lead terminal 7 and bindings bit lead-in wire 8, wherein, described lead terminal 7 and bindings bit lead-in wire 8 on cover packaging plastic 6 be described conducting resinl 6 ', and the packaging plastic 6 of remainder can be conducting resinl 6 ' also can be the common packaging plastic 6 without conductivity, as UV glue.
Refer to shown in Fig. 5-8, for conductive glue on substrate is in the schematic diagram of diverse location, described packaging plastic (comprise do not have conductivity packaging plastic 6 and there is the conducting resinl 6 ' of conductivity) rectangular mount structure.In Fig. 5, all packaging plastics are conducting resinl 6 '; In Fig. 6, the packaging plastic be covered on lead terminal 7 and bindings bit lead-in wire 8 is conducting resinl 6 ', and remainder packaging plastic is do not have a packaging plastic 6 of conductivity; In Fig. 7, the packaging plastic be covered on lead terminal 7 and bindings bit lead-in wire 8 is conducting resinl 6 ', and the packaging plastic between two bindings bit lead wire set (each bindings bit lead wire set has several bindings bit lead-in wire 8) is conducting resinl 6 ', remainder packaging plastic is do not have a packaging plastic 6 of conductivity; In Fig. 8, the packaging plastic be covered on lead terminal 7 and bindings bit lead-in wire 8 is conducting resinl 6 ', and the packaging plastic between two bindings bit lead wire set and between lead terminal 7 and bindings bit lead wire set is also conducting resinl 6 ', remainder packaging plastic is do not have a packaging plastic 6 of conductivity.Described packaging plastic 6 and conducting resinl 6 ' are coated on substrate 1, lead terminal 7 or bindings bit lead-in wire 8 by modes such as silk-screen, bat printing, spraying, injections.
In processing procedure, when OLED display is encapsulated, conducting resinl 6 ' can be coated on lead terminal 7 and bindings bit on substrate 1 to go between the position of 8 correspondences, also conducting resinl 6 ' can be coated on the position of conductive lead wire 9 correspondence on cover plate 2, select flexibly as required.
In sum, OLED display of the present invention, on the cover board conductive lead wire is set, the two ends of conductive lead wire go between with the lead terminal on substrate and bindings bit one_to_one corresponding respectively, and between conductive lead wire and lead terminal, be bonded together by conducting resinl between conductive lead wire and bindings bit go between, make to form conducting between conductive lead wire and lead terminal, conducting is formed between conductive lead wire and bindings bit go between, namely lead terminal and bindings bit form conducting between going between, and conductive lead wire does not take OLED display bezel locations owing to being arranged on cover plate, therefore the narrow frame design of OLED display can be realized.
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.All any amendments done within the spirit and principles in the present invention, equivalent to replace and improvement etc., within the protection range that all should be included in the claims in the present invention.
Claims (8)
1. an OLED display, comprise substrate, the cover plate be oppositely arranged with substrate, the anode be cascading between substrate and cover plate and on substrate, functional layer and negative electrode, it is characterized in that, at least one end of described negative electrode is connected with lead terminal, described substrate is provided with bindings bit lead-in wire, faced by described cover plate, the one side of substrate is provided with several conductive lead wires, the corresponding lead terminal in one end of arbitrary conductive lead wire is arranged, the corresponding bindings bit lead-in wire of the other end is arranged, between described conductive lead wire and lead terminal, be bonded together by conducting resinl between conductive lead wire and bindings bit go between.
2. OLED display according to claim 1, it is characterized in that, sealed fixing between described substrate and cover plate by packaging plastic, this packaging plastic part is covered on lead terminal and bindings bit lead-in wire, described lead terminal and the upper packaging plastic covered of bindings bit lead-in wire are described conducting resinl, and the packaging plastic of remainder is conducting resinl or the packaging plastic without conductivity.
3. OLED display according to claim 1 and 2, is characterized in that, described conducting resinl is anisotropy conductiving glue.
4. OLED display according to claim 1 and 2, is characterized in that, described conducting resinl is made by adding electrically conductive particles in packaging plastic.
5. OLED display according to claim 4, is characterized in that, described electrically conductive particles is conductive gold spacer.
6. OLED display according to claim 1, is characterized in that, described conductive lead wire is made up of ITO or metal material.
7. OLED display according to claim 1, is characterized in that, described conductive lead wire is formed by etch process.
8. OLED display according to claim 7, is characterized in that, this etch process is acid etching processing procedure or dry ecthing procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410496406.3A CN104253149A (en) | 2014-09-25 | 2014-09-25 | OLED (Organic Light Emitting Diode) display |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410496406.3A CN104253149A (en) | 2014-09-25 | 2014-09-25 | OLED (Organic Light Emitting Diode) display |
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| CN104253149A true CN104253149A (en) | 2014-12-31 |
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| CN201410496406.3A Pending CN104253149A (en) | 2014-09-25 | 2014-09-25 | OLED (Organic Light Emitting Diode) display |
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Cited By (10)
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| CN104867960A (en) * | 2015-04-21 | 2015-08-26 | 京东方科技集团股份有限公司 | Display panel and packaging method thereof, and display apparatus |
| CN104900677A (en) * | 2015-05-14 | 2015-09-09 | 信利半导体有限公司 | Organic electroluminescent device, display device and lighting device |
| CN104916789A (en) * | 2015-06-30 | 2015-09-16 | 京东方科技集团股份有限公司 | OLED encapsulation method and OLED device |
| CN106298864A (en) * | 2016-11-04 | 2017-01-04 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof, method of testing |
| CN106847827A (en) * | 2017-02-08 | 2017-06-13 | 京东方科技集团股份有限公司 | Display base plate, display panel, display device and bonding method |
| CN107275510A (en) * | 2017-04-20 | 2017-10-20 | 固安翌光科技有限公司 | A kind of Organnic electroluminescent device and preparation method thereof |
| CN107765919A (en) * | 2017-10-25 | 2018-03-06 | 武汉天马微电子有限公司 | Touch display panel and display device |
| CN108011051A (en) * | 2017-11-30 | 2018-05-08 | 武汉天马微电子有限公司 | Organic light-emitting display panel and display device thereof |
| CN108491112A (en) * | 2018-06-04 | 2018-09-04 | 信利光电股份有限公司 | A kind of touch screen and its touch control layer |
| CN108807717A (en) * | 2018-08-14 | 2018-11-13 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and binding method |
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| CN104867960B (en) * | 2015-04-21 | 2019-06-04 | 京东方科技集团股份有限公司 | Display panel and its packaging method, display device |
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| WO2017000440A1 (en) * | 2015-06-30 | 2017-01-05 | 京东方科技集团股份有限公司 | Oled encapsulating method and oled device |
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| CN106847827A (en) * | 2017-02-08 | 2017-06-13 | 京东方科技集团股份有限公司 | Display base plate, display panel, display device and bonding method |
| US10871689B2 (en) | 2017-02-08 | 2020-12-22 | Boe Technology Group Co., Ltd. | Display substrate, display panel, display device and bonding method |
| CN107275510A (en) * | 2017-04-20 | 2017-10-20 | 固安翌光科技有限公司 | A kind of Organnic electroluminescent device and preparation method thereof |
| CN107765919A (en) * | 2017-10-25 | 2018-03-06 | 武汉天马微电子有限公司 | Touch display panel and display device |
| CN108011051B (en) * | 2017-11-30 | 2019-08-13 | 武汉天马微电子有限公司 | Organic light-emitting display panel and display device thereof |
| CN108011051A (en) * | 2017-11-30 | 2018-05-08 | 武汉天马微电子有限公司 | Organic light-emitting display panel and display device thereof |
| CN108491112A (en) * | 2018-06-04 | 2018-09-04 | 信利光电股份有限公司 | A kind of touch screen and its touch control layer |
| CN108807717A (en) * | 2018-08-14 | 2018-11-13 | 武汉华星光电半导体显示技术有限公司 | A kind of display panel and binding method |
| WO2020034293A1 (en) * | 2018-08-14 | 2020-02-20 | 武汉华星光电半导体显示技术有限公司 | Display panel and bonding method |
| US11038006B1 (en) | 2018-08-14 | 2021-06-15 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and bonding method of the same |
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Application publication date: 20141231 |
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