CN104244586A - Method for solidifying copper foil and base material of roll-type IC card circuit board - Google Patents
Method for solidifying copper foil and base material of roll-type IC card circuit board Download PDFInfo
- Publication number
- CN104244586A CN104244586A CN201310278590.XA CN201310278590A CN104244586A CN 104244586 A CN104244586 A CN 104244586A CN 201310278590 A CN201310278590 A CN 201310278590A CN 104244586 A CN104244586 A CN 104244586A
- Authority
- CN
- China
- Prior art keywords
- base material
- copper foil
- roll
- substrate
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for solidifying copper foil and a base material of a roll-type IC card circuit board. The method includes the steps that the roll-type base material, bonding glue and the copper foil are bonded together through a roll-to-roll bonding device to form a whole unsolidified roll substrate provided with the copper foil and the glue which are fixed to the base material in advance, and then three-stage type solidifying is adopted for the bonded whole roll substrate. By means of the method for solidifying the copper foil and the base material of the roll-type IC card circuit board, heating solidifying is carried out on the substrate in a three-stage mode, the problem of the complex technology caused by sheet-type delivery is solved, the peel strength of the processed substrate reaches 1.4 N/mm which is larger than the industry index of 1.2 N/mm, and meanwhile the problems of cockling, layered deformation and the like of the solidified substrate in the traditional technology are solved.
Description
Technical field
The present invention relates to a kind of curing, particularly relate to the curing of a kind of rolling IC-card copper foil of circuit board and base material.
Background technology
Traditional wiring board is chip delivery, the combination of its Copper Foil and base material is completed by chip pressing Post RDBMS, but rolling printed board, due to the delivery of needs rolling, the combination of its Copper Foil and base material must be fitted by Reel-to-reel type, complete through high temperature with after certain curing time, just can make it, in conjunction with firm, to reach the peel strength of regulation.And if the direct entire volume of substrate after vacation being pasted is solidified, the coefficient of expansion due to base material, glue and Copper Foil is inconsistent, and the substrate after solidification there will be the phenomenon such as wrinkle, layering distortion, cannot reach the peel strength of regulation, need again to manufacture, cause production cost high.
Summary of the invention
In order to overcome the problems referred to above, the invention provides a kind of make the finished substrate after solidification non-wrinkle, without the rolling IC-card copper foil of circuit board of lamination and the curing of base material.
For achieving the above object, technical scheme provided by the invention is:
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) first by rolling base material, in conjunction with glue, Copper Foil, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil and glue pre-fixes the uncured entire volume substrate on base material;
2) the entire volume substrate after bonding is adopted syllogic solidification, first paragraph adopts 90 DEG C to heat one hour, makes to flow in conjunction with glue inner homogeneous; Adopt 120 DEG C to heat again two hours, make substrate hot setting; Finally adopt 160 DEG C to heat again three hours, make in conjunction with the complete slaking of glue, and naturally cool.
the usefulness of technique scheme is:
The invention provides the curing of a kind of rolling IC-card copper foil of circuit board and base material, syllogic is adopted to solidify base plate heating, solve chip to deliver goods the loaded down with trivial details problem of the technique brought, the peel strength of the substrate after processing reaches 1.4N/mm, is greater than industry index 1.2N/mm; And also solve in conventional art the problem of the phenomenon such as wrinkle, layering distortion of solidifying metacoxal plate and occurring.
Below in conjunction with the drawings and specific embodiments, the present invention is further illustrated.
Accompanying drawing explanation
Fig. 1 is that the present invention bonds metacoxal plate schematic diagram.
Embodiment
embodiment 1
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) as shown in Figure 1, first by rolling base material 1, in conjunction with glue 2, Copper Foil 3, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil 3 and glue 2 pre-fixes the uncured entire volume substrate 4 on base material 1;
2) adopt syllogic to solidify the entire volume substrate 4 after bonding, first paragraph adopts 90 DEG C to heat one hour, makes to flow in conjunction with glue 2 inner homogeneous; Adopt 120 DEG C to heat again two hours, make substrate 4 hot setting; Finally adopt 160 DEG C to heat again three hours, make in conjunction with glue 2 slaking completely, and naturally cool.
Operation principle:
First by rolling base material 1, fit together by laminating apparatus in conjunction with glue 2, Copper Foil 3, then Three-section type heating curing is adopted to be cured the entire volume substrate after bonding, solve chip to deliver goods the loaded down with trivial details problem of the technique brought, the peel strength of the substrate after processing reaches 1.4N/mm, is greater than industry index 1.2N/mm; And also solve in conventional art the problem of the phenomenon such as wrinkle, layering distortion of solidifying metacoxal plate and occurring.
embodiment 2
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) as shown in Figure 1, first by rolling base material 1, in conjunction with glue 2, Copper Foil 3, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil 3 and glue 2 pre-fixes the uncured entire volume substrate 4 on base material 1;
2) adopt syllogic to solidify the entire volume substrate 4 after bonding, first paragraph adopts 98 DEG C to heat one hour, makes to flow in conjunction with glue 2 inner homogeneous; Adopt 110 DEG C to heat again two hours, make substrate 4 hot setting; Finally adopt 164 DEG C to heat again three hours, make in conjunction with glue 2 slaking completely, and naturally cool.
embodiment 3
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) as shown in Figure 1, first by rolling base material 1, in conjunction with glue 2, Copper Foil 3, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil 3 and glue 2 pre-fixes the uncured entire volume substrate 4 on base material 1;
2) adopt syllogic to solidify the entire volume substrate 4 after bonding, first paragraph adopts 87 DEG C to heat one hour, makes to flow in conjunction with glue 2 inner homogeneous; Adopt 126 DEG C to heat again two hours, make substrate 4 hot setting; Finally adopt 152 DEG C to heat again three hours, make in conjunction with glue 2 slaking completely, and naturally cool.
embodiment 4
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) as shown in Figure 1, first by rolling base material 1, in conjunction with glue 2, Copper Foil 3, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil 3 and glue 2 pre-fixes the uncured entire volume substrate 4 on base material 1;
2) adopt syllogic to solidify the entire volume substrate 4 after bonding, first paragraph adopts 85 DEG C to heat one hour, makes to flow in conjunction with glue 2 inner homogeneous; Adopt 131 DEG C to heat again two hours, make substrate 4 hot setting; Finally adopt 148 DEG C to heat again three hours, make in conjunction with glue 2 slaking completely, and naturally cool.
embodiment 5
A curing for rolling IC-card copper foil of circuit board and base material, comprises following two steps:
1) as shown in Figure 1, first by rolling base material 1, in conjunction with glue 2, Copper Foil 3, by volume to volume laminating apparatus, three is bonded together, make it to become a winding Copper Foil 3 and glue 2 pre-fixes the uncured entire volume substrate 4 on base material 1;
2) adopt syllogic to solidify the entire volume substrate 4 after bonding, first paragraph adopts 95 DEG C to heat one hour, makes to flow in conjunction with glue 2 inner homogeneous; Adopt 116 DEG C to heat again two hours, make substrate 4 hot setting; Finally adopt 167 DEG C to heat again three hours, make in conjunction with glue 2 slaking completely, and naturally cool.
test method:
By above-mentioned Method and process parameter, carry out after solidification testing and passing judgment on.
result of the test:
Known by above-mentioned test, first paragraph temperature is within the scope of 85-98 DEG C, second segment temperature is within the scope of 110-131 DEG C, and the peel strength that the 3rd section of temperature all can realize the substrate after processing within the scope of 148-167 DEG C is all greater than industry index 1.2N/mm, and the phenomenons such as non-wrinkle, layering distortion; Wherein first paragraph temperature is 90 DEG C time, second segment temperature 120 DEG C time, the 3rd section of temperature process 160 DEG C time after the peel strength of substrate best.
Claims (2)
1. a curing for rolling IC-card copper foil of circuit board and base material, is characterized in that: comprise following two steps:
1) first by rolling base material, in conjunction with glue, Copper Foil by volume to volume laminating apparatus, three is bonded together, makes it to become a winding Copper Foil and glue pre-fixes the uncured entire volume substrate on base material;
2) the entire volume substrate after bonding is adopted syllogic solidification, first paragraph adopts 85-98 DEG C of heating one hour, makes to flow in conjunction with glue inner homogeneous; Adopt 110-131 DEG C to heat again two hours, make substrate hot setting; Finally adopt 148-167 DEG C to heat again three hours, make in conjunction with the complete slaking of glue, and naturally cool.
2. the curing of a kind of rolling IC-card copper foil of circuit board as claimed in claim 1 and base material, it is characterized in that: in described step 2, first paragraph temperature adopts 90 DEG C, second segment temperature adopts 120 DEG C, and the 3rd section of temperature adopts 160 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310278590.XA CN104244586A (en) | 2013-07-04 | 2013-07-04 | Method for solidifying copper foil and base material of roll-type IC card circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310278590.XA CN104244586A (en) | 2013-07-04 | 2013-07-04 | Method for solidifying copper foil and base material of roll-type IC card circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104244586A true CN104244586A (en) | 2014-12-24 |
Family
ID=52231666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310278590.XA Pending CN104244586A (en) | 2013-07-04 | 2013-07-04 | Method for solidifying copper foil and base material of roll-type IC card circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104244586A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951969A (en) * | 2017-12-21 | 2019-06-28 | 台郡科技股份有限公司 | It is thinned embedded type circuit rolling manufacturing method |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN114449776A (en) * | 2022-01-25 | 2022-05-06 | 铜川光速芯材科技有限公司 | Metal-based circuit board and preparation method thereof |
| CN114516204A (en) * | 2022-01-25 | 2022-05-20 | 铜川光速芯材科技有限公司 | LED transparent circuit board and preparation method thereof |
| CN114516204B (en) * | 2022-01-25 | 2024-11-15 | 铜川光速芯材科技有限公司 | LED transparent circuit board and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0616489A1 (en) * | 1993-03-19 | 1994-09-21 | Mitsui Mining & Smelting Co., Ltd. | Copper-clad laminate and printed wiring board |
| CN1393033A (en) * | 2000-08-25 | 2003-01-22 | 东丽株式会社 | Semiconductor jointing substrate-use tape with adhesive and copper-clad laminate sheet using it |
| CN1900202A (en) * | 2006-03-20 | 2007-01-24 | 刘萍 | Flexible circuit base material adhesive, preparing method and produced base material |
| CN102307924A (en) * | 2008-12-16 | 2012-01-04 | 陶氏环球技术有限责任公司 | Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
| CN202911257U (en) * | 2012-10-31 | 2013-05-01 | 广东生益科技股份有限公司 | Plate compounding device |
-
2013
- 2013-07-04 CN CN201310278590.XA patent/CN104244586A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0616489A1 (en) * | 1993-03-19 | 1994-09-21 | Mitsui Mining & Smelting Co., Ltd. | Copper-clad laminate and printed wiring board |
| CN1393033A (en) * | 2000-08-25 | 2003-01-22 | 东丽株式会社 | Semiconductor jointing substrate-use tape with adhesive and copper-clad laminate sheet using it |
| CN1900202A (en) * | 2006-03-20 | 2007-01-24 | 刘萍 | Flexible circuit base material adhesive, preparing method and produced base material |
| CN102307924A (en) * | 2008-12-16 | 2012-01-04 | 陶氏环球技术有限责任公司 | Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
| CN202911257U (en) * | 2012-10-31 | 2013-05-01 | 广东生益科技股份有限公司 | Plate compounding device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109951969A (en) * | 2017-12-21 | 2019-06-28 | 台郡科技股份有限公司 | It is thinned embedded type circuit rolling manufacturing method |
| CN109951969B (en) * | 2017-12-21 | 2021-06-29 | 台郡科技股份有限公司 | Thin embedded circuit roll type manufacturing method |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
| CN114449776A (en) * | 2022-01-25 | 2022-05-06 | 铜川光速芯材科技有限公司 | Metal-based circuit board and preparation method thereof |
| CN114516204A (en) * | 2022-01-25 | 2022-05-20 | 铜川光速芯材科技有限公司 | LED transparent circuit board and preparation method thereof |
| CN114449776B (en) * | 2022-01-25 | 2024-08-06 | 铜川光速芯材科技有限公司 | Metal-based circuit board and preparation method thereof |
| CN114516204B (en) * | 2022-01-25 | 2024-11-15 | 铜川光速芯材科技有限公司 | LED transparent circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102543899B (en) | Flexible encapsulating substrate and preparation method thereof | |
| CN103153005B (en) | A kind of multilayer printed board laminating method | |
| JP2010245412A5 (en) | ||
| WO2012071759A1 (en) | High density sim card package module and producing method thereof | |
| CN104244586A (en) | Method for solidifying copper foil and base material of roll-type IC card circuit board | |
| WO2014131071A2 (en) | Semi-finished product for the production of a printed circuit board and method for producing the same | |
| CN106211564B (en) | A kind of flexible circuit panel element and ground connection steel disc attachment device and method | |
| CN206775855U (en) | A kind of assisted compression structure and multi-layer PCB board for dissymmetrical structure pcb board | |
| CN102045948A (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN105101658A (en) | Hot ultrasonic low-temperature sintering method and device of nano silver conductive ink | |
| CN107072034A (en) | LED, PCB, consent metal-based copper-clad plate and preparation method thereof | |
| US9288914B2 (en) | Method of manufacturing a printed circuit board with circuit visible | |
| CN105451450A (en) | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN203077767U (en) | Rolling device | |
| TW201429341A (en) | Method and apparatus for reducing stress of printed circuit board | |
| CN103730375B (en) | OSP surface processes base plate for packaging molding milling method | |
| CN203418835U (en) | Electrical heating roll for circuit board compound machine | |
| CN107480753B (en) | Printed antenna label and manufacturing method thereof | |
| CN106845615B (en) | Method for manufacturing visual card | |
| CN103716997B (en) | A kind of manufacture method of circuit board | |
| JP2002109501A (en) | Method and apparatus for manufacturing ic card | |
| TWM466452U (en) | Hot rolling lamination apparatus | |
| EP3059744B1 (en) | Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device | |
| CN204259274U (en) | A kind of Rigid Flex laminar structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141224 |
|
| RJ01 | Rejection of invention patent application after publication |