CN104238823B

CN104238823B - Touch display panel, preparation method thereof and touch display device

Info

Publication number: CN104238823B
Application number: CN201410503507.9A
Authority: CN
Inventors: 周星耀; 杨康; 马骏
Original assignee: Tianma Microelectronics Co Ltd; Shanghai Tianma Microelectronics Co Ltd
Current assignee: Tianma Microelectronics Co Ltd; Shanghai Tianma Microelectronics Co Ltd
Priority date: 2014-09-26
Filing date: 2014-09-26
Publication date: 2017-08-25
Anticipated expiration: 2034-09-26
Also published as: CN104238823A

Abstract

The invention discloses a touch display panel, a preparation method thereof and a touch display device, wherein the preparation method of the touch display panel comprises the following steps: providing a first substrate and a second substrate; coating a conductive first glue material on the first substrate, and coating an insulating second glue material on the second substrate; or, coating an insulating second glue material on the first substrate, and coating a conductive first glue material on the second substrate; the second rubber material is in a frame shape, and the projection of the first rubber material on the first substrate is positioned outside the projection range of the second rubber material on the first substrate; and aligning and attaching the first substrate and the second substrate to form the touch display panel.

Description

Touch display panel, preparation method thereof and touch display device

Technical Field

The invention relates to the technical field of touch display, in particular to a touch display panel, a preparation method of the touch display panel and a touch display device.

Background

At present, touch display devices are increasingly popular, and generally include a touch display panel, however, in actual work, in the process of preparing the touch display panel, it is found that a signal transmission circuit of the whole touch display panel cannot work normally, so that the problems of the touch performance and the display performance of the touch display device are reduced.

Disclosure of Invention

In view of this, embodiments of the present invention provide a touch display panel, a manufacturing method thereof, and a touch display device.

The embodiment of the invention provides a preparation method of a touch display panel, which comprises the following steps:

providing a first substrate and a second substrate;

coating a conductive first glue material on the first substrate, and coating an insulating second glue material on the second substrate; or, coating an insulating second glue material on the first substrate, and coating a conductive first glue material on the second substrate; the second rubber material is in a frame shape, and the projection of the first rubber material on the first substrate is positioned outside the projection range of the second rubber material on the first substrate;

aligning and attaching the first substrate and the second substrate to form a touch display panel; wherein,

the method for preparing the first substrate specifically comprises the following steps: providing a first substrate; forming a plurality of first conductive terminals and a plurality of touch signal lines connected to the first conductive terminals on the first substrate;

the method for preparing the second substrate specifically comprises the following steps: providing a second substrate; forming a plurality of second conductive terminals on the second substrate;

coating a conductive first glue material on the first substrate, specifically comprising: coating a conductive first glue material on the first conductive terminal, wherein the first glue material covers the first conductive terminal, and the first glue material is positioned on one side of the first substrate facing the second substrate;

coating an insulating second adhesive material on the first substrate specifically comprises: coating an insulating second glue material on one side of the first substrate facing the second substrate, wherein the first conductive terminal is positioned outside an area surrounded by the second glue material;

coating a conductive first adhesive material on the second substrate specifically comprises: coating a conductive first glue material on the second conductive terminal, wherein the first glue material covers the second conductive terminal, and the first glue material is positioned on one side of the second substrate facing the first substrate;

coating an insulating second adhesive material on the second substrate specifically comprises: and coating an insulating second glue material on one side of the second substrate facing the first substrate, wherein the second conductive terminal is positioned outside the area surrounded by the second glue material.

Preferably, the first conductive terminals are electrically connected with the touch signal lines in a one-to-one correspondence manner, the first conductive terminals are located on one side of the first substrate facing the second substrate, the touch signal lines are located on one side of the first substrate facing the second substrate, or the touch signal lines are located on one side of the first substrate away from the second substrate;

the plurality of second conductive terminals are positioned on one side of the second substrate facing the first substrate, wherein the second conductive terminals are arranged opposite to the first conductive terminals;

preferably, the method for manufacturing a touch display panel further includes:

forming a planarization layer on one side of the first substrate facing the second substrate;

the projection of the planarization layer on the first substrate is located within the projection range of the second adhesive material on the first substrate.

Preferably, the first conductive adhesive material comprises a first support, the second insulating adhesive material comprises a second support,

the material and the diameter of the first support are respectively the same as those of the second support.

and forming a planarization layer on one side of the first substrate facing the second substrate to cover the whole first substrate, wherein the projection of the second adhesive material on the first substrate is positioned in the projection range of the planarization layer on the first substrate.

Preferably, the first conductive glue material comprises a first support, the second insulating glue materials each comprise a second support, the material of the second support is the same as that of the first support, and the diameter of the second support is: a difference between a diameter of the first support and a thickness of the planarization layer.

Preferably, the second substrate includes a display region and a non-display region, and the method of manufacturing the second substrate further includes:

providing a second substrate;

forming a first grid electrode and a second grid electrode on the second substrate, wherein the first grid electrode is positioned in a display area, and the second grid electrode is positioned in a non-display area;

forming a gate insulating layer on the second substrate and the first and second gates to cover the entire second substrate;

forming a semiconductor layer over the gate insulating layer, the semiconductor layer being located over the first gate and in the display region;

forming a source drain metal layer on the semiconductor layer and the grid electrode insulating layer, patterning the source drain metal layer, and forming a source electrode, a drain electrode and a first electrode, wherein the source electrode and the drain electrode are positioned above the first grid electrode and positioned in the display area, and the first electrode is positioned above the second grid electrode and positioned in the non-display area;

forming a pixel electrode layer on the gate insulating layer, patterning the pixel electrode layer to form a pixel electrode, the pixel electrode being located in a display region, the pixel electrode being connected to the drain electrode;

forming a passivation layer over the pixel electrode, the source electrode and the drain electrode, the passivation layer covering the entire second substrate;

etching the passivation layer to form a first via hole and a second via hole, wherein the first via hole penetrates through the passivation layer to expose the source and drain electrodes, and the second via hole penetrates through the passivation layer and the gate insulating layer to expose the gate;

and forming a transparent conducting layer on the passivation layer, wherein the transparent conducting layer is connected to the source and drain electrodes through the first via hole, the transparent conducting layer is connected to the grid electrode through the second via hole, and the source and drain electrodes are connected to the grid electrode through the transparent conducting layer.

providing a second substrate;

forming a source drain metal layer on the semiconductor layer and the grid electrode insulating layer, patterning the source drain metal layer, and forming a source electrode, a drain electrode, a pixel electrode and a first electrode, wherein the source electrode and the drain electrode are positioned above the first grid electrode and positioned in the display area, the pixel electrode is positioned in the display area, and the first electrode is positioned above the second grid electrode and positioned in the non-display area;

Accordingly, an embodiment of the present invention further provides a touch display panel, including: a first substrate and a second substrate arranged oppositely,

the first substrate includes: the first conductive terminals are positioned on one side, facing the second substrate, of the first substrate; the touch signal lines are positioned on one side of the first substrate, which faces the second substrate, or on one side of the first substrate, which is far away from the second substrate, wherein the first conductive terminals are electrically connected with the touch signal lines in a one-to-one correspondence manner;

the second substrate includes: a touch drive unit; the plurality of second conductive terminals are positioned on one side of the second substrate, which faces the first substrate, and the second conductive terminals are electrically connected to the touch control driving unit; the touch display panel further includes: the first conductive terminal is arranged on the first substrate, and the first conductive terminal is electrically connected with the first conductive terminal; or the first rubber material is positioned on one side of the second substrate facing the first substrate, and the first rubber material covers the second conductive terminals; the second rubber material is in a frame shape, the second rubber material is positioned on one side, facing the second substrate, of the first substrate, and the first conductive terminals are positioned outside an area surrounded by the second rubber material; or the second glue material is positioned on one side of the second substrate facing the first substrate, and the second conductive terminal is positioned outside the area surrounded by the second glue material;

the touch signal line is electrically connected to the touch driving unit through the first conductive terminal, the conductive first adhesive material and the second conductive terminal to receive a touch driving signal.

Correspondingly, the embodiment of the invention also provides a touch display device, which comprises the touch display panel.

The embodiment of the invention at least achieves one of the following beneficial effects:

in an embodiment of the present invention, the touch display panel includes a first substrate and a second substrate, which are oppositely disposed, the first substrate includes a first conductive terminal and a touch signal line connected to the first conductive terminal, the second substrate includes a second conductive terminal, and the touch display panel further includes: the first conductive terminal is arranged on the first substrate and faces the second substrate; or the first rubber material is positioned on one side of the second substrate facing the first substrate, and the first rubber material covers the second conductive terminals; the second rubber material is in a frame shape, the second rubber material is positioned on one side, facing the second substrate, of the first substrate, and the first conductive terminals are positioned outside an area surrounded by the second rubber material; or the second glue material is positioned on one side of the second substrate facing the first substrate, and the second conductive terminal is positioned outside the area surrounded by the second glue material; the touch signal line is electrically connected to the touch driving unit through the first conductive terminal, the conductive first adhesive material and the second conductive terminal to receive a touch driving signal. The preparation method of the touch display panel comprises the following steps: providing a first substrate and a second substrate; coating a conductive first glue material on the first substrate, and coating an insulating second glue material on the second substrate; or, coating an insulating second glue material on the first substrate, and coating a conductive first glue material on the second substrate; the second rubber material is in a frame shape, and the projection of the first rubber material on the first substrate is positioned outside the projection range of the second rubber material on the first substrate; and aligning and attaching the first substrate and the second substrate to form the touch display panel. Therefore, the projection of the first conductive terminal and the second conductive terminal on the first substrate is positioned outside the projection range of the insulated second rubber material on the first substrate, so that the influence of discharge, short circuit and the like of a circuit and a touch electrode of the touch display panel can be avoided, the normal work of a signal transmission circuit (signal transmission wiring) of the whole touch display panel is maintained, the touch performance and the display performance of the touch display panel and the touch display device are at least improved, the preparation steps of the touch display panel are reduced, the process preparation flow is simplified, and one of the benefits of improving the yield and the productivity is achieved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic view of a photomask process flow of FIG. 7;

fig. 2 is a flowchart illustrating steps of a method for manufacturing a touch display panel according to an embodiment of the invention;

fig. 3 is a schematic structural view of a color film substrate on which a plurality of first conductive terminals are formed;

fig. 4(a) is a schematic structural diagram of a color film substrate according to an embodiment of the present invention;

fig. 4(b) is a schematic structural diagram of another color film substrate according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a color film substrate coated with a first adhesive material;

FIG. 6 is a cross-sectional view of an array substrate prepared by a mask (6) process;

fig. 7(a) is a top view structural diagram of the array substrate;

FIG. 7(b) is a schematic structural diagram of the array substrate coated with the second adhesive material;

FIG. 8 is a schematic diagram showing a cross-sectional view of a peripheral circuit of an array substrate prepared by a 6-mask process in comparison with a cross-sectional view of a peripheral circuit of an array substrate prepared by a 7-mask process;

fig. 9(a) to 9(d) are schematic diagrams illustrating a touch display panel formed by attaching a color film substrate to an array substrate;

fig. 10(a) to 10(d) are schematic diagrams illustrating a touch display panel formed by bonding a color film substrate and an array substrate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The touch display panel according to the following embodiments of the present invention may be an in-cell touch display panel, a semi-in-cell touch display panel, or an off-cell touch display panel, and the present invention is not limited thereto. The "upper" and "upper" described in the embodiment of the present invention, for example, "X is located above Y" or "X is located above Y" merely indicate a hierarchical relationship, and do not necessarily indicate direct coverage.

An in-cell (in-cell) touch display panel is different from a traditional touch display panel, and a touch electrode structure is integrated on the inner side of a Color Filter (CF) substrate or the inner side of an array substrate (TFT array substrate) without an external touch screen, so that the requirement of lightness and thinness of a touch display device is met. In the semi-embedded touch display panel, touch sensing electrodes (sensing electrodes) are integrated on the outer side of the display panel, and touch driving electrodes (driving electrodes) are integrated on the inner side of the display panel, or touch sensing electrodes (sensing electrodes) are integrated on the inner side of the display panel, and touch driving electrodes (driving electrodes) are integrated on the outer side of the display panel.

Researchers find that, in the existing embedded touch display panel technology, for example, a touch electrode structure is integrated inside a color film substrate, a driving electrode and a sensing electrode are led out through leads, and a conductive terminal (pad, which may also be referred to as a conductive pad) is connected to the end of each lead; then conducting terminals on the color film substrate and conducting terminals on the opposite array substrate through conducting balls (such as gold balls and silver balls), and leading the conducting terminals on the array substrate to a touch control driving unit through leads on the array substrate, so that the touch control driving unit realizes signal control on a touch control electrode structure, namely: and establishing an electrical connection or signal transmission connection relationship between the touch electrode structure and the touch driving unit on the array substrate.

In order to realize the conduction between the conductive terminals on the color film substrate and the conductive terminals on the array substrate, generally, the conductive terminals on the array substrate are arranged opposite to the conductive terminals on the color film substrate, a glue material doped with conductive balls is coated on a glue material coating area on the inner side of the array substrate, the glue material doped with conductive balls covers the conductive terminals on the array substrate, and the color film substrate is attached to the array substrate, so that the conductive terminals on the array substrate are conducted (electrically connected) with the conductive terminals on the color film substrate by using the glue material doped with conductive balls.

Researchers also find that the productivity of the touch display panel formed by aligning and laminating the array substrate prepared by the 7mask process and the color film substrate is low, mainly due to the complicated process of the 7mask process. In order to improve the productivity of the panel, the 7mask process for preparing the array substrate can be adjusted to be a 6mask process or a 5mask process, so as to achieve the purposes of simplifying the process preparation flow and improving the productivity of the panel. However, if the panel bonding method is adopted, new problems inevitably occur in the 6mask or 5mask process preparation flow: because the peripheral circuit of each panel omits the process of preparing a gate via hole (G-via), the insulating layer via hole (P-via) is designed to be a deep-shallow hole, and the top-most Indium Tin Oxide (ITO) transparent electrode is utilized to conduct the gate and Source Drain (SD) metals, when the array substrate (conductive balls are contacted with the top-most ITO electrode) coated with the adhesive material is attached to the color film substrate, unnecessary discharge or short circuit can be generated on the touch (touch) electrode and the touch (touch) signal transmission circuit on the side of the color film substrate, and the circuit on the whole touch display panel cannot work normally. A schematic flow chart of a process for preparing a Thin Film Transistor (TFT) array substrate by using 7 masks (7 masks) in the prior art is described below with reference to fig. 1, where the process mainly includes the following steps:

step 101: forming a gate by using the first mask.

Step 102: a semiconductor layer is formed using the second mask.

Step 103: and forming a gate through hole by using a third photomask.

Step 104: and forming a source drain electrode by using the fourth photomask.

Step 105: and forming a pixel electrode by using a fifth photomask.

Step 106: and forming an insulating layer through hole by using the sixth photomask.

Step 107: and forming a common electrode by using the seventh photomask.

Therefore, the existing 7-mask process flow is complicated and not beneficial to improving the production capacity.

In the embodiment of the invention, in order to avoid the problem that unnecessary discharge or short circuit is generated in a touch (touch) electrode and a touch (touch) signal transmission circuit on the side of a color film substrate after an array substrate prepared by a 6mask or 5mask process is attached to the color film substrate in the prior art, the invention provides a preparation method of a touch display panel and the touch display panel. The present invention will be described in detail below with reference to specific examples, but the present invention is not limited to the following examples.

It should be noted that, for convenience of description, the first substrate in the embodiment of the present invention is a color film substrate by way of example, but the first substrate is a color film substrate by way of example only, and is not limited to this, and in actual operation, the first substrate may also be a cover plate or an encapsulation cover plate. The embodiment of the invention provides a preparation method of a touch display panel, which comprises the following steps:

providing a first substrate and a second substrate;

the method for preparing the second substrate specifically comprises the following steps: forming a plurality of second conductive terminals on a second substrate;

coating a conductive first glue material on the first substrate specifically includes: coating a conductive first glue material on the first conductive terminal, wherein the first glue material covers the first conductive terminal, and the first glue material is positioned on one side of the first substrate facing the second substrate;

Specifically, as shown in fig. 2 and fig. 3, a method for manufacturing a touch display panel according to an embodiment of the present invention mainly includes the following steps:

in this embodiment, the first substrate is, for example, a color film substrate 3, and the method for manufacturing the color film substrate 3 includes:

step 201: a first substrate 300 is provided, a metal layer is formed on the first substrate 300, and the metal layer is patterned to form a plurality of first conductive terminals 301 for connecting touch signal lines.

The material of the first substrate includes, but is not limited to, glass or quartz. In this step 201, a metal layer may be formed on the first substrate by physical vapor deposition, metal organic chemical vapor deposition, or chemical vapor deposition.

Further, on the first substrate 300, a metal layer is patterned by using a photolithography process to form a plurality of first conductive terminals 301 for connecting with the touch signal lines, wherein the photolithography process is used for transferring the pattern on the mask plate to the surface of the substrate to form a desired pattern. The method specifically comprises gluing, pattern exposure and development. Wherein, the coating refers to coating a layer of photoresist on the surface of the substrate, and for small substrates, a spin coating method is generally used; for large substrates, a slot coating method may be used. The glued substrate can be subjected to pattern exposure after drying and prebaking. After pattern exposure, the pattern on the mask plate is transferred to the substrate and is recorded by the photoresist in a latent image mode, and then the latent image is exposed through the developing solution. If the used photoresist is a positive photoresist, the photoresist irradiated by ultraviolet rays is dissolved in the developing process after exposure, and the part which is not irradiated is left; and the negative photoresist is the opposite. After photolithography, the unwanted metal layer is etched away using a dry or wet etch process to form the desired first conductive terminal 301. For example, the first conductive terminals 301 are arranged in a row and distributed in a concentrated manner, and are arranged in order, and the first conductive terminals 301 are isolated from each other; the first conductive terminal 301 is made of a transparent conductive material, which may be a transparent conductive metal oxide, such as ITO (indium tin oxide), IGZO (indium gallium zinc oxide), or the like.

Step 202: a planarization layer is formed on the first substrate 300 and exposes the plurality of first conductive terminals.

In step 202, a planarization layer 302 is formed on the color filter substrate 3 by using a deposition process on the first substrate 300 on which the first conductive terminals 301 are formed by etching, and the planarization layer 302 is etched by using a photolithography process to expose the plurality of first conductive terminals 301.

Wherein the planarization layer is formed of a photosensitive material such as: photosensitive color resist materials, photosensitive organic films, and the like. The thickness of the planarization layer is generally

The second adhesive material related to the present invention is generally frame-shaped, for example, may be circular frame-shaped or rectangular frame-shaped, but the present invention does not limit this, and in the specific implementation process, the pattern of the second adhesive material may be designed adaptively according to the actual requirement without affecting the technical solution claimed by implementing the present invention.

Step 203: coating the first glue material.

As shown in fig. 5, since the plurality of first conductive terminals 301 need to be electrically connected to second conductive terminals disposed on the opposite side, a conductive first adhesive material 304 needs to be coated on the first conductive terminals 301, and a projection of the first adhesive material 304 on the color filter substrate 3 is located outside a projection 303 of the second adhesive material on the color filter substrate 3. The first glue material 304 includes conductive balls made of any one or more of gold, silver, copper, and aluminum, and the conductive balls may be spheres plated with gold, silver, copper, and aluminum, and the first glue material 304 is conductive.

Preferably, in step 202, the planarization layer can be disposed in the following two different ways, respectively.

The first method is as follows: as shown in fig. 4(a) and 5, first, a planarization layer is formed over the first substrate 300 using a physical or chemical deposition process.

Then, the planarization layer is etched by using a photolithography process to form a planarization layer 302 so as to expose the plurality of first conductive terminals 301.

The second method comprises the following steps: as shown in fig. 4(b) and 5, first, a planarization layer 302 is formed over the first substrate 300 using a deposition process. Then, the planarization layer is etched by using a photolithography process to form a planarization layer 302 and expose the plurality of first conductive terminals 301.

Preferably, the first glue material 304 further includes a first support and a glue, and the first support may be made of a transparent insulating material with certain strength; preferably, the material of the first support is silicon or silicide. The colloid can be made of materials with strong water resistance, small polarity and low ion content, such as: epoxy glue, and the like.

The conductive first adhesive material according to the embodiment of the present invention may be gold balls doped with a conductive material, or may be an ACF (anisotropic conductive) adhesive.

Considering that the compressibility of the conductive balls may be different from that of the first support due to different materials, in order to enable the first conductive terminals on the color filter substrate to be in conduction with the second conductive terminals on the array substrate, for example, a ratio of a diameter of the conductive balls to a diameter of the first support may be set to 1.1: 1.

step 204: and forming a transparent conductive layer on the second substrate, and etching to form a plurality of second conductive terminals.

The plurality of second conductive terminals are used for connecting the touch signal lines and are arranged opposite to the plurality of first conductive terminals.

Preferably, the array substrate according to the embodiment of the present invention is prepared by using a 5mask or 6mask process, which is different from the 7mask process in the prior art. Specifically, the preparation process is briefly described in conjunction with the preparation flow chart of the array substrate shown in fig. 6, taking a 6mask process as an example, where part a in fig. 6 is a preparation flow process of a TFT device in a display area, and part B in fig. 6 is a preparation flow of signal traces (including but not limited to signal traces such as display signal traces or touch signal traces) in a non-display area:

providing a second substrate 401, and forming a first gate 402 and a second gate 402 'on the second substrate 401 by using a first mask, wherein the first gate 402 is located in a display region (portion a in fig. 6), and the second gate 402' is located in a non-display region (portion B in fig. 6); forming a gate insulating layer 403 over the second substrate 401 and the first and second gates 402 and 402', covering the entire second substrate 401; forming a semiconductor layer 404 over the gate insulating layer 403 with a second mask, wherein the semiconductor layer 404 is located above the first gate 402 and in the display region; forming a source/drain metal layer on the semiconductor layer 404 and the gate insulating layer 403 by using a third photomask, patterning the source/drain metal layer, and forming a source/drain 405 and a first electrode 405 ', wherein the source/drain 405 is located above the first gate 402 and in the display region, and the first electrode 405' is located above the second gate 402 and in the non-display region; forming a pixel electrode layer over the gate insulating layer 403, patterning the pixel electrode layer to form a pixel electrode 406, where the pixel electrode 406 is located in a display region and the pixel electrode is connected to the drain electrode 405; forming a passivation layer 407 over the pixel electrode 406, the source electrode and the drain electrode 405, the passivation layer 407 covering the second substrate 401; and etching the passivation layer 407 by using a fifth photomask to form a first via hole 408 and a second via hole 409, wherein the first via hole 408 penetrates through the passivation layer 407 to expose the first electrode 405 ', the second via hole 409 penetrates through the gate insulating layer 403 and the passivation layer 407 to expose the gate 402', and the first via hole 408 and the second via hole 409 are formed by using the same photomask (i.e., the fifth photomask) process. A transparent conductive layer is formed on the passivation layer 407, covers the entire second substrate 401, and is patterned by a sixth mask to form a common electrode 410, and the gate electrode 402 is connected to the first electrode 405' through the first via hole 408, the second via hole 409, and the common electrode 410. Thus, a second substrate is preliminarily formed.

Further, with reference to fig. 6 and 7(a), a transparent conductive layer is formed on the array substrate 4 by a deposition process, and the transparent conductive layer is etched by a photolithography process (i.e., a sixth mask) to form the common electrode 410 and the plurality of second conductive terminals 411, since the structure of the display area is not improved in the present invention, and the film layer of the display area does not affect the implementation of the embodiment of the present invention, the specific structure of the display area is not shown in fig. 7 (a).

Further, the array substrate 4 is similar to the array substrate 6 in a 5mask process, and the same parts are not described again, and the difference between the array substrate 5 and the array substrate 6 lies in:

forming a source drain metal layer on the semiconductor layer and the grid electrode insulating layer, patterning the source drain metal layer, and simultaneously forming a source electrode, a drain electrode, a pixel electrode and a first electrode in a mask, wherein the source electrode and the drain electrode are positioned above the first grid electrode and positioned in a display area, the pixel electrode is positioned in the display area, and the first electrode is positioned above the second grid electrode and positioned in a non-display area.

Further, as shown in fig. 5 and fig. 7(a), the number of the second conductive terminals 411 is equal to the number of the first conductive terminals 301, and the positions of the second conductive terminals 411 on the array substrate 4 are relatively matched with the positions of the first conductive terminals 301 on the color film substrate 3 (first substrate), so as to ensure that when the color film substrate 3 and the array substrate 4 are aligned and attached to each other, and a touch display panel is formed by packaging, the first conductive terminals 301 are opposite to the second conductive terminals 411. In other words: the first conductive terminals 301 are electrically connected with the touch signal lines in a one-to-one correspondence manner, the first conductive terminals 301 are located on one side of the color film substrate 3 facing the array substrate 4, the touch signal lines are located on one side of the color film substrate 3 facing the array substrate 4, or the touch signal lines are located on one side of the color film substrate 3 away from the array substrate 4; further, when the second adhesive 413 is coated on the color filter substrate 3 (the first substrate), the first conductive terminal 301 is located outside the area surrounded by the second adhesive 413.

The plurality of second conductive terminals 411 are located on one side of the array substrate 4 facing the color film substrate 3, wherein the second conductive terminals 411 are arranged opposite to the first conductive terminals 301;

each second conductive terminal 411 is further connected to one end of a connection line (not shown), and is electrically connected to a touch control circuit through a pin connected to the other end of the connection line, where the touch control circuit is used to scan and detect a touch signal.

It should be noted that, in order to simplify the preparation flow of the array substrate, in the embodiment of the present invention, a 5mask or 6mask process is selected, so that a gate via hole is prevented from being formed in a peripheral circuit of the array substrate by using an additional photomask, but in the present invention, two deep and shallow holes are formed in an insulating layer by using only one photomask, so as to achieve the purpose of connecting a gate and a source/drain. However, due to the simplification of the above process, the common electrode remains at the uppermost layer of the peripheral circuit region of the array substrate, as shown in fig. 8, a schematic diagram comparing a cross-sectional view of a peripheral circuit of an array substrate prepared by a 6mask process with a cross-sectional view of a peripheral circuit of an array substrate prepared by a 7mask process is shown, the left diagram shows the array substrate prepared by the 6mask process, the uppermost layer (the layer closest to the color filter substrate 3) of the array substrate 4 is a common electrode 410 (in the preparation of 5mask or 6mask process, the uppermost layer of the array substrate 4 is the common electrode 410), if the coating is performed in a technical manner (i.e., only one circle of the conductive adhesive 55 is coated), once the conductive adhesive 55 is coated, the conductive adhesive 55 and the common electrode 410 are short-circuited, therefore, the touch performance of the touch display panel is affected, that is, the existing glue material coating method cannot be applied to the 6mask or 5mask process preparation. The right figure shows the array substrate prepared by the 7mask process, and the uppermost layer of the array substrate 4' is the insulating layer 501, so that the existing glue material coating method can not cause line short circuit, and therefore the existing glue material coating method can only be applied to the preparation of the 7mask process, but in this way, the preparation process adopting the 7mask process is complicated, and the yield is also reduced.

Step 205: and coating a second glue material.

The projection of the second conductive terminal on the array substrate is positioned outside the projection range of the second rubber material on the array substrate.

Referring to fig. 8, if a bonding process in the prior art is used, that is, a first adhesive material containing conductive balls is coated on an array substrate, the conductive balls in the first adhesive material are in contact with the uppermost common electrode, which may cause unnecessary discharge or short circuit of the touch capacitor on the color film substrate side, and affect the normal operation of the whole circuit. Considering the above factors together, the present invention improves the coating operation in the array substrate in order to reduce the number of manufacturing processes of the array substrate: as shown in fig. 7(b), a frame-shaped second adhesive 413 is coated on the array substrate, a projection of the planarization layer 302 on the color filter substrate 3 is located within a range of a projection 303 of the second adhesive 413 on the color filter substrate 3, and the second conductive terminals 411 are located outside a range surrounded by the second adhesive 413, where the second adhesive 413 includes a second support, an adhesive, and the like, but does not include conductive balls, and the second adhesive 413 is insulating. Therefore, the second adhesive material is used for supporting in the embodiment of the present invention, so as to ensure the surface pressure of the touch display panel formed by alignment and lamination, and is not easy to cause phenomena such as screen explosion.

Step 206: and aligning and attaching the color film substrate coated with the first adhesive material and the array substrate coated with the second adhesive material to form the touch display panel.

And packaging the color film substrate and the array substrate into the touch display panel by using an alignment and lamination process in the prior art. In step 205, the array substrate is not coated with the conductive first adhesive (including the conductive balls), only the array substrate is coated with the insulating second adhesive (not including the conductive balls), and only the conductive first adhesive is coated on the first conductive terminals on one side of the color filter substrate, the conductive first adhesive is not coated on other areas of the color filter substrate, and the projections of the second conductive terminals 411 and the first conductive terminals on the color filter substrate 3 are both located outside the projection range of the insulating second adhesive on the color filter substrate 3, so that after the alignment bonding, unnecessary discharge or short circuit of the color filter substrate side circuit or the touch trace is not caused, that is, the purpose of simplifying the manufacturing process is achieved by using the 6mask or 5mask process, and meanwhile, the influence of unnecessary discharge, short circuit and the like is avoided, thereby ensuring the normal and stable operation of the touch trace or the touch trace, the touch performance of the touch display panel is improved.

It should be noted that, in the above embodiments, the detailed description is given by taking an example in which the conductive first adhesive material is coated only on the color film substrate and the insulating second adhesive material is coated only on the array substrate, in other embodiments, the insulating second adhesive material may be coated only on the color film substrate and the conductive first adhesive material may be coated only on the array substrate, or both the insulating second adhesive material and the conductive first adhesive material may be coated on the color film substrate, or both the insulating second adhesive material and the conductive first adhesive material may be coated on the array substrate, and only the following conditions need to be satisfied: the projections of the first conductive terminal and the second conductive terminal on the first substrate (color film substrate) are both located outside the projection range of the insulated second adhesive material on the first substrate, at least one of the first conductive terminal and the second conductive terminal is covered by the conductive first adhesive material, and the positions of the first conductive terminal and the second conductive terminal are matched.

In the above-described flow of manufacturing a touch display panel, the steps on the color filter substrate side (step 201 to step 203) and the steps on the array substrate side (step 204 and step 205) may be performed in sequence, i.e., the coating operation on the array substrate side may be performed first, and then the coating operation on the color filter substrate side may be performed, or if the conditions allow, the coating operation may be performed in parallel, and then the alignment bonding may be performed. Moreover, considering that the manufacturing process of the method is put into production in a process flow manner, similar improvements (simultaneous processing of multiple substrates, parallel processing of a color film substrate and an array substrate, etc.) for improving the productivity should be included in the scope of the present invention.

For the sake of easy understanding, the following describes the structures of two planarization layers for the above manufacturing schemes, taking the color filter substrate C2 and the array substrate T as an example for bonding.

Example 1:

considering the complexity of the 7mask process preparation flow of the array substrate, in order to simplify the process flow, the invention adopts the 5mask process or the 6mask process, however, since the 5mask process or the 6mask process can cause the uppermost layer of the peripheral circuit of the array substrate to be the common electrode, if the existing coating mode is still used, the situation of unnecessary discharging or short circuit of the color film substrate side can be caused if the adhesive sealing frame containing the conductive balls is coated on the array substrate in one stroke. Therefore, in order to avoid affecting the normal operation of the peripheral circuit, ensure the normal conduction of the first conductive terminal and the second conductive terminal, and simultaneously, not affect the production capacity, the invention sets the projection of the first conductive terminal and the second conductive terminal on the first substrate (color film substrate) to be outside the projection range of the insulated second adhesive material on the first substrate (color film substrate), or the projection of the first conductive terminal and the second conductive terminal on the second substrate (array substrate) to be outside the projection range of the insulated second adhesive material on the second substrate (array substrate).

As shown in fig. 9(a) to 9(d), which are simplified schematic diagrams illustrating the color filter substrate C1 being bonded to the array substrate T, in fig. 9(a), the color filter substrate C1 includes: the touch screen comprises a first substrate 300 and a plurality of first conductive terminals 301, wherein the plurality of first conductive terminals 301 are used for connecting touch signal lines; a planarization layer 302; the first conductive adhesive 304 covers the plurality of first conductive terminals 301. In fig. 9(b), the array substrate T includes: a second substrate 401, a plurality of second conductive terminals 411, wherein the plurality of second conductive terminals 411 are disposed opposite to the plurality of first conductive terminals 301, and usually, the plurality of second conductive terminals 411 are formed by etching a transparent conductive layer; and a second adhesive 413, wherein a projection of the second conductive terminal 411 on the array substrate T is located outside an area surrounded by a projection of the second adhesive 413 on the array substrate T. As can be seen, in this example 1, the first adhesive material 304 is coated only on the position where the first conductive terminal of the color film substrate C1 is located, and the first adhesive material 304 includes the conductive balls; coating a second adhesive material 413 on the array substrate T, wherein the second adhesive material 413 does not include a conductive ball, and a projection of the first adhesive material 304 on the color filter substrate C1 is located outside a projection 303 range of the second adhesive material on the color filter substrate C1. Therefore, after the color filter substrate C1 and the array substrate T are aligned and bonded, a touch display panel P1 shown in fig. 9(C) is formed. As can be seen from the cross-sectional view C shown in fig. 9(d), the distance between the color filter substrate C1 and the array substrate T at the position of the first adhesive 304 is equal to the distance between the color filter substrate C1 and the array substrate T at the position of the second adhesive 413. In other words, as shown in fig. 9(D), the material and diameter of the second support included in the second adhesive 413 are the same as those of the first support in the first adhesive 304, that is, the diameter of the first support 3041 in the first adhesive 304 is D, and the diameter of the conductive ball 3042 is 1.1D; the diameter of the second support 4131 in the second glue 413 is also D. The most critical is that: the second adhesive 413 does not contain a conductive ball, so that unnecessary discharge or short circuit of the touch circuit or the touch line on the color film substrate C1 side is not caused, and normal operation of the peripheral circuit is ensured. In addition, when the above method is used for mass production, only a few additional coating strokes are added to the peripheral area to ensure the surface pressure, and although the coating is performed on the two substrates respectively, the coating time is not increased much more than that of the previous coating method, and the coating time is very short compared with that of a photomask, and the improvement of the productivity is not affected.

Example 2:

in view of the feasibility and the better technical effect of the scheme of the example 1, the embodiment of the invention is improved based on the scheme of the example 1, and the specific improvement is as follows.

In consideration of the fact that the peripheral wiring of the touch capacitor is likely to be damaged in the etching process of the planarization layer of the color film substrate, in order to ensure normal circuit operation, the peripheral wiring of the touch capacitor on the color film substrate side can be protected in a manner that the peripheral wiring region of the touch capacitor is not etched.

As shown in fig. 10(a) to 10(d), which are simplified schematic diagrams illustrating the color filter substrate C2 being bonded to the array substrate T, in fig. 10(a), the color filter substrate C2 includes: a first substrate 300 ', a plurality of first conductive terminals 301 ', wherein the plurality of first conductive terminals 301 ' are used for connecting with a touch signal line; because the peripheral circuit region is not etched, the projection of the planarization layer 302' on the color film substrate covers the projection of the second adhesive on the color film substrate, and the structural design protects the peripheral wiring of the touch capacitor on the color film substrate side, thereby ensuring normal circuit operation; a first rubber material 304 ', wherein the first rubber material 304 ' covers the plurality of first conductive terminals 301 '. In fig. 10(b), the array substrate T includes: a second substrate 401', a plurality of second conductive terminals 411' located on the second substrate 401', wherein the plurality of second conductive terminals 411' are disposed opposite to the plurality of first conductive terminals 301 ', and the plurality of second conductive terminals 411' are formed by etching a transparent conductive layer; and a second adhesive 413 ', wherein a projection of the second conductive terminal 411 ' on the array substrate T is located outside an area surrounded by a projection of the second adhesive 413 ' on the array substrate. As can be seen, in this example 2, the first adhesive 304 'is coated only on the position of the first conductive terminal of the color film substrate C2, and the first adhesive 304' includes conductive balls; the coating of the second glue 413 'is performed on the array substrate T, and the second glue 413' does not include conductive balls. Therefore, after the color filter substrate C2 and the array substrate T are aligned and bonded, a touch display panel P2 shown in fig. 10(C) is formed. As can be seen from the sectional view taken along a-a 'of fig. 10(d), in this example 2, since the planarization layer is present in the peripheral circuit region of the color filter substrate C2 and has a thickness d, the distance between the upper and lower panels at the position of the first adhesive 304 is greater than the distance between the upper and lower panels at the position of the second adhesive 413'. In the present example 2, the material of the second support included in the second glue 413 'is the same as the material of the first support in the first glue 304'; the diameter of the second support included in the second rubber material 413' is: the difference between the diameter of the first support contained in the first glue 304' and the thickness of the planarization layer. As shown in fig. 10(D), the diameter of the first support 3041 ' of the first rubber 304 ' is D, and the diameter of the conductive ball 3042 ' is 1.1D; the diameter of the second support 4131 'in the second rubber 413' is D-D. This example 2 can realize all the technical effects of example 1, and simultaneously, the size of the photosensitive planarization layer is increased to the peripheral of the touch capacitor of the color filter substrate side of protecting and further protecting the circuit or the line, improved touch performance.

In an embodiment of the present invention, a method for manufacturing a touch display panel includes: providing a first substrate and a second substrate; coating a conductive first glue material on the first substrate, and coating an insulating second glue material on the second substrate; or, coating an insulating second glue material on the first substrate, and coating a conductive first glue material on the second substrate; the second rubber material is in a frame shape, and the projection of the first rubber material on the first substrate is positioned outside the projection range of the second rubber material on the first substrate; and aligning and attaching the first substrate and the second substrate to form the touch display panel. Therefore, the projection of the first conductive terminal and the second conductive terminal on the first substrate is located outside the projection range of the insulated second rubber material on the first substrate, so that the influence of discharge, short circuit and the like of a circuit and a touch electrode of the touch display panel can be avoided, the normal work of a signal transmission circuit (signal transmission wiring, touch wiring, display wiring and other wiring circuits) of the whole touch display panel is maintained, the touch performance and the display performance of the touch display panel are improved, in addition, the TFT array substrate is prepared by adopting a 5mask or 6mask process, the preparation steps are reduced, the process preparation flow is simplified, and the yield and the productivity are improved.

Based on the same inventive concept as the preparation method of the touch display panel provided by the embodiment of the invention, the embodiment of the invention also provides the touch display panel.

As shown in fig. 9(a) to 9(d), in an embodiment of the present invention, the touch display panel P1 includes a first substrate and a second substrate that are disposed opposite to each other, in this embodiment, the color filter substrate C1 is, for example, a color filter substrate C1, the array substrate T is, for example, an array substrate T, the color filter substrate C1 includes a plurality of first conductive terminals 301 and touch signal lines (not shown) connected to the first conductive terminals 301, and the array substrate T includes second conductive terminals 411; the color film substrate C1 further includes a planarization layer 302 on a side of the color film substrate C1 facing the array substrate T; the projection of the planarization layer 302 on the color filter substrate C1 is located within the projection range of the second adhesive 413 on the color filter substrate C1; alternatively, the planarization layer 302 covers the entire color filter substrate C1, and a projection of the second adhesive 413 on the color filter substrate C1 is located within a projection range of the planarization layer 302 on the color filter substrate C1.

The touch display panel further includes: the conductive first adhesive material 304 is located on one side of the color film substrate C1 facing the array substrate T, and the first adhesive material 304 covers the first conductive terminals 301; or the first adhesive material 304 is located on one side of the array substrate T facing the color film substrate C1, and the first adhesive material 304 covers the second conductive terminals 411; the second adhesive material 413 is in a frame shape, the second adhesive material 413 is located on one side of the color film substrate C1 facing the array substrate T, and the first conductive terminal 301 is located outside an area surrounded by the second adhesive material 413; or the second adhesive 413 is located on one side of the array substrate T facing the color filter substrate C1, and the second conductive terminal 411 is located outside an area surrounded by the second adhesive 413; the touch signal line is electrically connected to the touch driving unit through the first conductive terminal 301, the conductive first adhesive material 304 and the second conductive terminal 411 to receive a touch driving signal. Therefore, the projection of the first conductive terminal 301 and the second conductive terminal 411 on the color film substrate C1 (the first substrate) is located outside the projection range of the insulating second adhesive 413 on the color film substrate C1 (the first substrate), so that the influence of discharge, short circuit and the like of a circuit and a touch electrode of the touch display panel can be avoided, the normal work of a signal transmission circuit (signal transmission routing) of the whole touch display panel is maintained, the touch performance and the display performance of the touch display panel are improved, in addition, the TFT array substrate is prepared by adopting a 5mask or 6mask process, the preparation steps are reduced, the process preparation flow is simplified, and the yield and the productivity are improved.

The embodiment of the invention also provides a touch display device (not shown), which comprises a touch display panel, wherein the touch display panel adopts the touch display panel of any scheme; generally, the touch display device is a liquid crystal display device, but this is only an example and not a limitation, and the touch display device provided by the embodiment of the present invention includes but is not limited to: organic light emitting display devices, electronic paper, liquid crystal televisions, liquid crystal displays, digital photo frames, mobile phones, tablet computers and other products or devices.

While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. A preparation method of a touch display panel comprises the following steps:

providing a first substrate and a second substrate;

2. The method of manufacturing a touch display panel according to claim 1,

the first conductive terminals are electrically connected with the touch signal lines in a one-to-one correspondence manner, the first conductive terminals are positioned on one side of the first substrate facing the second substrate, the touch signal lines are positioned on one side of the first substrate facing the second substrate, or the touch signal lines are positioned on one side of the first substrate far away from the second substrate;

the plurality of second conductive terminals are located on one side of the second substrate, which faces the first substrate, wherein the second conductive terminals are arranged opposite to the first conductive terminals.

3. The method for manufacturing a touch display panel according to claim 1, further comprising:

4. The method according to claim 3, wherein the first conductive adhesive comprises a first support, the second insulating adhesive comprises a second support,

5. The method for manufacturing a touch display panel according to claim 1, further comprising:

6. The method according to claim 5, wherein the first conductive adhesive material comprises a first support, the second insulating adhesive materials each comprise a second support, the second support is made of the same material as the first support, and the diameter of the second support is: a difference between a diameter of the first support and a thickness of the planarization layer.

7. The method for manufacturing a touch display panel according to any one of claims 1 to 6, wherein the second substrate includes a display area and a non-display area, and the method for manufacturing a second substrate further includes:

providing a second substrate;

8. The method for manufacturing a touch display panel according to any one of claims 1 to 6, wherein the second substrate includes a display area and a non-display area, and the method for manufacturing a second substrate further includes:

providing a second substrate;

9. A touch display panel produced by the method for producing a touch display panel according to any one of claims 1 to 8, comprising: a first substrate and a second substrate arranged oppositely,

the first substrate includes:

the first conductive terminals are positioned on one side, facing the second substrate, of the first substrate; and

the touch control signal lines are positioned on one side of the first substrate, which faces the second substrate, or on one side of the first substrate, which is far away from the second substrate, wherein the first conductive terminals are electrically connected with the touch control signal lines in a one-to-one correspondence manner;

the second substrate includes:

a touch drive unit;

the plurality of second conductive terminals are positioned on one side of the second substrate, which faces the first substrate, and the second conductive terminals are electrically connected to the touch control driving unit;

the touch display panel further includes: the first conductive terminal is arranged on the first substrate, and the first conductive terminal is electrically connected with the first conductive terminal; or the first rubber material is positioned on one side of the second substrate facing the first substrate, and the first rubber material covers the second conductive terminals; and

the second adhesive material is insulated and is in a frame shape, the second adhesive material is positioned on one side of the first substrate, which faces the second substrate, and the first conductive terminals are positioned outside the area surrounded by the second adhesive material; or the second glue material is positioned on one side of the second substrate facing the first substrate, and the second conductive terminal is positioned outside the area surrounded by the second glue material;

10. A touch display device comprising the touch display panel according to claim 9.