CN104167480B - Method for manufacturing light-emitting diode - Google Patents
Method for manufacturing light-emitting diode Download PDFInfo
- Publication number
- CN104167480B CN104167480B CN201310185651.8A CN201310185651A CN104167480B CN 104167480 B CN104167480 B CN 104167480B CN 201310185651 A CN201310185651 A CN 201310185651A CN 104167480 B CN104167480 B CN 104167480B
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- CN
- China
- Prior art keywords
- light
- light emitting
- ultraviolet
- emitting diode
- glass shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Abstract
The invention provides a method for manufacturing a light-emitting diode. The method comprises the following steps: providing a metal support, wherein the metal support is provided with a plurality of first electrodes and a plurality of second electrodes; forming a cup housing which covers the metal support, wherein the cup housing comprises a plurality of reflection cups, a portion of each first electrode and a portion of the second electrode corresponding to the first electrode being exposed at the bottom portion of each reflection cup; providing an ultraviolet light debonding film which is arranged at the side, away from the reflection cups, of the cup housing, wherien the ultraviolet light debonding film can lose stickiness through an ultraviolet light irradiation manner; providing a plurality of light emitting diode crystalline grains, wherein each light emitting diode crystalline grain is arranged in one reflection cup and is electrically connected with the corresponding first electrode and second electrode; cutting the cup housing so as to enable a plurality of light emitting diode units to be separated; irradiating the ultraviolet light, so that the ultraviolet light debonding film loses stickiness under the irradiating of the ultraviolet light, the plurality of light emitting diode units are separated with the ultraviolet light debonding film, and a plurality of light emitting diodes are formed.
Description
Technical field
The present invention relates to a kind of manufacture method of light emitting diode.
Background technology
Compared to traditional luminous source, light emitting diode (light emitting diode, led) has lightweight, body
Long-pending little, pollution is low, life-span length the advantages of, it, as a kind of new luminous source, has been applied to each field more and more
Central, such as street lamp, traffic lights, signal lighties, shot-light and ornament lamp etc..
When making light emitting diode in the industry, by multipair electrode is formed with metal rack, and generally using being molded into
Type mode coats a macromolecular compound on metal rack, and wherein, macromolecular compound forms multiple reflectors, and each is anti-
Penetrate one LED crystal particle of setting in cup.Then, by the method for cutting, separate the plurality of LED crystal particle, with
Form multiple light emitting diodes.So, existing separation process is relatively complicated, thus have impact on the speed of processing procedure.
Content of the invention
In consideration of it, being necessary to provide a kind of method for manufacturing light-emitting of speed.
A kind of method for manufacturing light-emitting, comprises the following steps:
There is provided a metal rack, this metal rack is provided with multiple first electrodes and with the plurality of first electrode one
One corresponding multiple second electrodes；
Form a glass shell to be coated on this metal rack, this glass shell includes multiple reflectors, each first electrode and with
The bottom being partially exposed at this reflector of its corresponding second electrode；
There is provided a ultraviolet photolysis glued membrane, it is arranged on the side away from this reflector of this glass shell, this ultraviolet photolysis glued membrane
Viscosity can be lost by irradiation ultraviolet radiation mode；
There is provided multiple LED crystal particles, each LED crystal particle is arranged in a reflector, and respectively and
Corresponding first electrode and second electrode electrical connection, each reflector, the light emitting diode being arranged in this reflector
Crystal grain and the first electrode electrically connecting with this LED crystal particle form a light emitting diode with second electrode；
Cut this glass shell, so that the plurality of light emitting diode is separated from each other；
Irradiating ultraviolet light, this ultraviolet photolysis glued membrane loses viscosity under the irradiation of ultraviolet light, thus the plurality of light-emitting diodes
Pipe unit is separated with this ultraviolet photolysis glued membrane, thus forming multiple light emitting diodes.
Compared with prior art, ultraviolet photolysis glued membrane is adopted to carry in the method for manufacturing light-emitting of the present invention luminous
Diode, and by irradiating ultraviolet light so that ultraviolet photolysis glued membrane loses viscosity, thus forming multiple light emitting diodes.This
Invention loses the characteristic of viscosity under the irradiation of ultraviolet light using ultraviolet photolysis glued membrane, improves the speed manufacturing light emitting diode
Degree.
With reference to the accompanying drawings, in conjunction with specific embodiment, the invention will be further described.
Brief description
The schematic flow sheet of the method for manufacturing light-emitting that Fig. 1 to Fig. 9 provides for first embodiment of the invention.
The schematic flow sheet of the method for manufacturing light-emitting that Figure 10 provides for second embodiment of the invention.
Main element symbol description
| Metal rack | 10 |
| First electrode | 11 |
| Second electrode | 12 |
| First through hole | 110 |
| Second through hole | 120 |
| Glass shell | 20 |
| Reflector | 21 |
| First mould | 22 |
| Second mould | 23 |
| Cavity | 24 |
| Ultraviolet photolysis glued membrane | 30 |
| Light shield | 40、70 |
| Basket dummy section | 41、71 |
| Shaded areas | 42、72 |
| LED crystal particle | 50 |
| Light emitting diode | 51 |
| Groove | 60 |
| Defective material unit | 61 |
Following specific embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Specific embodiment
The method for manufacturing light-emitting that first embodiment of the invention provides comprises the following steps:
Refer to Fig. 1 and Fig. 2, a metal rack 10 is provided, this metal rack 10 is provided with multiple first electrodes 11
And with the plurality of first electrode 11 multiple second electrodes 12 correspondingly.In the present embodiment, the plurality of first electrode 11
With the plurality of second electrode 12 array and be intervally arranged.One first through hole 110 is had on each first electrode 11, each second
One the second through hole 120 is had on electrode 12.
Refer to Fig. 3 and Fig. 4, form a glass shell 20 and be coated on this metal rack 10, this glass shell 20 includes multiple reflections
Cup 21, the bottom being partially exposed at this reflector 21 of each first electrode 11 and corresponding second electrode 12.At this
In embodiment, this glass shell 20 is formed by way of injection mo(u)lding.Specifically, provide first mould 22 and one with should
The second mould 23 that first mould 22 matches.The section of this first mould 22 is in u-shaped, its be used for housing this metal rack 10 with
And this first electrode 11 and this second electrode 12.The section of this second mould 23 housing becomes u-shaped, and centre has one to u-shaped
The projection of raised trapezoidal shape at opening, it is resisted against in this first electrode 11 and second electrode 12.First mould 22 with should
Second mould 23 cooperatively forms a cavity 24, injects the macromolecular compound of liquid into this cavity 24, through being cooled into wrapping
It is overlying on the glass shell 20 of this metal rack 10.In the present embodiment, macromolecular compound can be polyphthalamide
(polyphthalamide, ppa), epoxy resin (epoxy), silicone (silicone) etc..
Refer to Fig. 5, a ultraviolet photolysis glued membrane 30 (uv tape) be provided, its be arranged on this glass shell 20 away from this reflection
The side of cup 21, this ultraviolet photolysis glued membrane 30 can lose viscosity by irradiation ultraviolet radiation mode.This ultraviolet photolysis glued membrane 30 is one
As in the case of there is viscosity, it closely can be connected with this glass shell 20, and after the irradiation of ultraviolet light, it can lose viscosity.
Refer to Fig. 6, a light shield 40 be provided, this light shield 40 be arranged on this ultraviolet photolysis glued membrane 30 away from this reflector
21 side, this light shield 40 includes multiple void region 41 being intervally arranged and shaded areas 42.
Please also refer to Fig. 7, provide multiple LED crystal particles 50, each LED crystal particle 50 is arranged on one
In reflector 21, and electrically connect with corresponding first electrode 11 and second electrode 12 respectively, each reflector 21, setting
LED crystal particle 50 in this reflector 21 and the first electrode 11 that electrically connects with this LED crystal particle 50 with
Second electrode 12 forms a light emitting diode 51.In the present embodiment, LED crystal particle 50 is arranged on the first electricity
On pole 11, and electrically connected with second electrode 12 by wire.Certainly, this LED crystal particle 50 can also be arranged on the second electricity
On pole 12, or be arranged on this glass shell 20 be exposed to partly going up of this reflector 21 bottom.In the present embodiment, this light shield 40
Each void region 41 corresponding with a light emitting diode 51.
Please also refer to Fig. 8, cut this glass shell 20, so that the plurality of light emitting diode 51 is separated from each other.Specifically,
Form multiple grooves 60 in this glass shell 20 away from the side of this ultraviolet photolysis glued membrane 30, so that the plurality of reflector 21 mutually divides
Open form becomes multiple independent light emitting diodes 51, and wherein, the depth of this groove 60 is equal to the thickness of this glass shell 20.In this reality
Apply in example, this glass shell 20 is separated by the plurality of groove 60, with the light emitting diode 51 arranged at interval and defective material list
Unit 61, wherein, every defective material unit 61 is arranged between two adjacent light emitting diodes 51.
Please also refer to Fig. 9, irradiating ultraviolet light, this ultraviolet photolysis glued membrane 30 loses viscosity under the irradiation of ultraviolet light, from
And the plurality of light emitting diode 51 is separated with this ultraviolet photolysis glued membrane 30, thus forming multiple light emitting diodes.Specifically,
This ultraviolet photolysis glued membrane 30 is irradiated in the void region 41 of this light shield 40 of this UV light permeability, so that this ultraviolet photolysis glued membrane 30 is lost viscous
Property, so that the plurality of light emitting diode 51 is separated with this ultraviolet photolysis glued membrane 30, and then form multiple light emitting diodes.
Ultraviolet photolysis glued membrane 30 is adopted to carry light emitting diode 51 in the method for manufacturing light-emitting of the present invention, and
By irradiating ultraviolet light so that the part of ultraviolet photolysis glued membrane 30 respective leds unit 51 loses viscosity, thus being formed many
Individual light emitting diode.Simultaneously as the part of the corresponding defective material unit 61 of ultraviolet photolysis glued membrane 30 is by the shaded areas 42 of light shield 40
Blocked and the irradiation without ultraviolet light, therefore possessed viscosity, so that defective material unit 61 is still bonded on ultraviolet photolysis glued membrane 30.
Thus, effectively light emitting diode 51 can be separated with defective material unit 61, substantially increase the speed manufacturing light emitting diode
Degree and yield.
Second embodiment of the invention provides another kind of method for manufacturing light-emitting, and it is luminous with what first embodiment provided
Diode fabricating method is essentially identical, and difference is: " provides a ultraviolet photolysis glued membrane 30, it is arranged on this cup in step
The side away from this reflector 21 of shell 20, this ultraviolet photolysis glued membrane 30 can lose viscosity by irradiation ultraviolet radiation mode " wrap afterwards
Include following steps:
Please also refer to Fig. 7, provide multiple LED crystal particles 50, each LED crystal particle 50 is arranged on one
In reflector 21, and electrically connect with corresponding first electrode 11 and second electrode 12 respectively, each reflector 21, setting
LED crystal particle 40 in this reflector 21 and the first electrode 11 that electrically connects with this LED crystal particle 50 with
Second electrode 12 forms a light emitting diode 51.
Please also refer to Fig. 8, cut this glass shell 20, so that the plurality of light emitting diode 51 is separated from each other.Specifically,
Form multiple grooves 60 in this glass shell 20 away from the side of this ultraviolet photolysis glued membrane 30 so that the plurality of reflector 21 and send out
Optical diode grain 50 is separated from each other the multiple independent light emitting diodes 51 of formation, and wherein, the depth of this groove 60 is equal to
The thickness of this glass shell 20.In the present embodiment, this glass shell 20 is separated by the plurality of groove 60, with arrange at interval luminous two
Pole pipe unit 51 and defective material unit 61, wherein, every defective material unit 61 is arranged between two adjacent light emitting diodes 51.
Please also refer to Figure 10, provide a light shield 70, this light shield 70 is arranged on contrary with this ultraviolet photolysis glued membrane 30
Side, this light shield 70 includes multiple void region 71 being intervally arranged and shaded areas 72.In the present embodiment, this light shield 70
Each void region 71 corresponding with a light emitting diode 51.Each defective material unit 61 then to should light shield 70 one
Individual shaded areas 72.In the present embodiment, each groove 60 to should light shield 70 shaded areas 72.Certainly, each groove 60
Can also to should light shield 70 void region 71.
To this ultraviolet photolysis glued membrane 30 irradiating ultraviolet light, this ultraviolet photolysis glued membrane 30 loses viscous under the irradiation of ultraviolet light
Property, thus the plurality of light emitting diode 51 is separated with this ultraviolet photolysis glued membrane 30, form multiple light emitting diodes.Specifically
Ground, this ultraviolet photolysis glued membrane 30 of this ultraviolet light, so that this ultraviolet photolysis glued membrane 30 and the plurality of light emitting diode 51
And the plurality of defective material unit 61 separates, take out the plurality of light emitting diode 51 through the plurality of void region 71 simultaneously.
In the present embodiment, can be from void region 71 adsorboluminescence diode 51 by way of absorption, so that luminous two
Pole pipe unit 51 is separated with defective material unit 61, forms light emitting diode.It is of course also possible to this said structure is placed upside down, from
And so that defective material unit 61 is carried in shaded areas 72, and light emitting diode 51 passes through void region 71 and defective material unit 61
Separate.
It is understood that for the person of ordinary skill of the art, can be done with technology according to the present invention design
Go out change and the deformation that other various pictures are answered, and all these change and deformation all should belong to the protection model of the claims in the present invention
Enclose.
Claims (7)
1. a kind of method for manufacturing light-emitting, comprises the following steps:
One metal rack is provided, this metal rack is provided with multiple first electrodes and with a pair of the plurality of first electrode 1
The multiple second electrodes answered；
Form a glass shell to be coated on this metal rack, this glass shell includes multiple reflectors, each first electrode and right with it
The bottom being partially exposed at this reflector of the second electrode answered；
There is provided a ultraviolet photolysis glued membrane, it is arranged on the side away from this reflector of this glass shell, this ultraviolet photolysis glued membrane passes through
Irradiation ultraviolet radiation mode can lose viscosity；
There is provided multiple LED crystal particles, each LED crystal particle is arranged in a reflector, and respectively and and its
Corresponding first electrode and second electrode electrical connection, each reflector, the LED crystal particle being arranged in this reflector,
And the first electrode electrically connecting and second electrode form a light emitting diode with this LED crystal particle；
Cut this glass shell, so that the plurality of light emitting diode is separated from each other, wherein, in this glass shell away from this ultraviolet photolysis
The side of glued membrane forms multiple grooves, so that the plurality of reflector is separated from each other the multiple independent light emitting diodes of formation,
The depth of this groove is equal to the thickness of this glass shell, and this glass shell is divided into multiple light emitting diodes and multiple by the plurality of groove
Defective material unit, each defective material unit is arranged between two adjacent light emitting diodes；
Irradiating ultraviolet light, this ultraviolet photolysis glued membrane loses viscosity under the irradiation of ultraviolet light, so that the plurality of light emitting diode
Unit is separated with this ultraviolet photolysis glued membrane.
2. it is characterised in that this glass shell is macromolecular material, it leads to method for manufacturing light-emitting as claimed in claim 1
The mode crossing injection mo(u)lding is coated on this metal rack.
3. method for manufacturing light-emitting as claimed in claim 1 is it is characterised in that " provide a ultraviolet light dispergation in step
Film, it is arranged on the side away from this reflector of this glass shell, and this ultraviolet photolysis glued membrane can be lost by irradiation ultraviolet radiation mode
Further include after viscosity ": provide a light shield, this light shield is arranged on the side away from this reflector of this glass shell, this light shield
Including multiple void region being intervally arranged and shaded areas, wherein, this void region is with this light emitting diode one by one
Corresponding.
4. method for manufacturing light-emitting as claimed in claim 3 is it is characterised in that the hollow out of this this light shield of UV light permeability
This ultraviolet photolysis glued membrane of area illumination, so that the plurality of light emitting diode is separated with this ultraviolet photolysis glued membrane.
5. method for manufacturing light-emitting as claimed in claim 1 is it is characterised in that " cut this glass shell, so that being somebody's turn to do in step
Multiple light emitting diodes are separated from each other " after further include: provide a light shield, this light shield be arranged on this glass shell away from
The side of this ultraviolet photolysis glued membrane, this light shield includes multiple void region being intervally arranged and shaded areas, wherein, this hollow out
Region is corresponded with this light emitting diode.
6. method for manufacturing light-emitting as claimed in claim 5 is it is characterised in that step " cutting this glass shell " is included at this
The side away from this ultraviolet photolysis glued membrane of glass shell forms multiple grooves, and this glass shell is divided into multiple light-emitting diodes by the plurality of groove
Pipe unit and multiple defective material unit, wherein, every defective material unit is arranged between two adjacent light emitting diodes, the plurality of
Light emitting diode respectively to should light shield void region, the plurality of defective material unit respectively to should light shield shielded area
Domain.
7. method for manufacturing light-emitting as claimed in claim 6 is it is characterised in that this ultraviolet light dispergation of this ultraviolet light
Film, so that this ultraviolet photolysis glued membrane is separated with the plurality of light emitting diode and the plurality of defective material unit, pass through should simultaneously
The plurality of light emitting diode is taken out in multiple void region.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310185651.8A CN104167480B (en) | 2013-05-20 | 2013-05-20 | Method for manufacturing light-emitting diode |
| TW102118654A TW201445777A (en) | 2013-05-20 | 2013-05-27 | Method for manufacturing LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310185651.8A CN104167480B (en) | 2013-05-20 | 2013-05-20 | Method for manufacturing light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104167480A CN104167480A (en) | 2014-11-26 |
| CN104167480B true CN104167480B (en) | 2017-01-25 |
Family
ID=51911218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310185651.8A Active CN104167480B (en) | 2013-05-20 | 2013-05-20 | Method for manufacturing light-emitting diode |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104167480B (en) |
| TW (1) | TW201445777A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1881561A (en) * | 2005-06-14 | 2006-12-20 | 探微科技股份有限公司 | Wafer cutting method |
| TW201104914A (en) * | 2009-07-21 | 2011-02-01 | Epistar Corp | Optoelectronic system |
| CN102456603A (en) * | 2010-10-21 | 2012-05-16 | 富士电机株式会社 | Semiconductor device manufacturing method and manufacturing apparatus |
| TWM446415U (en) * | 2012-07-20 | 2013-02-01 | Dow Corning Taiwan Inc | Leadframe assembly |
| CN103050583A (en) * | 2011-10-14 | 2013-04-17 | 展晶科技(深圳)有限公司 | Method for encapsulating light-emitting diode |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102222625A (en) * | 2010-04-16 | 2011-10-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof |
-
2013
- 2013-05-20 CN CN201310185651.8A patent/CN104167480B/en active Active
- 2013-05-27 TW TW102118654A patent/TW201445777A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1881561A (en) * | 2005-06-14 | 2006-12-20 | 探微科技股份有限公司 | Wafer cutting method |
| TW201104914A (en) * | 2009-07-21 | 2011-02-01 | Epistar Corp | Optoelectronic system |
| CN102456603A (en) * | 2010-10-21 | 2012-05-16 | 富士电机株式会社 | Semiconductor device manufacturing method and manufacturing apparatus |
| CN103050583A (en) * | 2011-10-14 | 2013-04-17 | 展晶科技(深圳)有限公司 | Method for encapsulating light-emitting diode |
| TWM446415U (en) * | 2012-07-20 | 2013-02-01 | Dow Corning Taiwan Inc | Leadframe assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104167480A (en) | 2014-11-26 |
| TW201445777A (en) | 2014-12-01 |
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