CN104152877B - 一种化学镀镍液 - Google Patents
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- 238000007747 plating Methods 0.000 title claims abstract description 42
- 239000000126 substance Substances 0.000 title claims abstract description 27
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003112 inhibitor Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000003381 stabilizer Substances 0.000 claims abstract description 10
- 150000002815 nickel Chemical class 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 18
- 239000011574 phosphorus Substances 0.000 claims description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 10
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- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 4
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- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 229940078494 nickel acetate Drugs 0.000 claims description 3
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical group [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 3
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 claims description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000005695 Ammonium acetate Substances 0.000 claims description 2
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 claims description 2
- DPWJHXHCEHPXGF-UHFFFAOYSA-N [amino(sulfanyl)methylidene]azanium;propane-1-sulfonate Chemical compound NC(S)=[NH2+].CCCS([O-])(=O)=O DPWJHXHCEHPXGF-UHFFFAOYSA-N 0.000 claims description 2
- 229940043376 ammonium acetate Drugs 0.000 claims description 2
- 235000019257 ammonium acetate Nutrition 0.000 claims description 2
- OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 claims description 2
- 229910000333 cerium(III) sulfate Inorganic materials 0.000 claims description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 2
- 229910001380 potassium hypophosphite Inorganic materials 0.000 claims description 2
- CRGPNLUFHHUKCM-UHFFFAOYSA-M potassium phosphinate Chemical compound [K+].[O-]P=O CRGPNLUFHHUKCM-UHFFFAOYSA-M 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- 229940087562 sodium acetate trihydrate Drugs 0.000 claims description 2
- 239000002738 chelating agent Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 14
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- 230000007935 neutral effect Effects 0.000 abstract description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract description 2
- 239000008139 complexing agent Substances 0.000 abstract 1
- 239000008367 deionised water Substances 0.000 description 14
- 229910021641 deionized water Inorganic materials 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Inorganic materials [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 10
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 238000005352 clarification Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
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- 238000005530 etching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000003760 magnetic stirring Methods 0.000 description 3
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- 229910001209 Low-carbon steel Inorganic materials 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229940053662 nickel sulfate Drugs 0.000 description 2
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 2
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 2
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- 238000004611 spectroscopical analysis Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- WQOXQRCZOLPYPM-UHFFFAOYSA-N Dimethyl disulfide Natural products CSSC WQOXQRCZOLPYPM-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 241000976924 Inca Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
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- 229910000085 borane Inorganic materials 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
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- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- -1 polydithio-dipropyl Polymers 0.000 description 1
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 description 1
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- 229940093930 potassium iodate Drugs 0.000 description 1
- 235000006666 potassium iodate Nutrition 0.000 description 1
- MQVMJSWYKLYFIG-UHFFFAOYSA-N propane-1-sulfonic acid;sodium Chemical compound [Na].CCCS(O)(=O)=O MQVMJSWYKLYFIG-UHFFFAOYSA-N 0.000 description 1
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- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
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- Chemically Coating (AREA)
Abstract
本发明公开了一种化学镀镍液,其特征在于,它的组分包括镍盐22‑35g/L、次磷酸盐15‑25g/L、复合络合剂200‑250mL/L、稳定剂0.5‑1.5mL/L、磷含量抑制剂0.5‑2.0mL/L。本发明的溶液工作在近中性条件下,对工件无明显碱蚀与酸蚀;所得镀层中磷的质量含量在0.3‑3.5%之间,镀层硬度高,可焊性好。
Description
技术领域
本发明涉及化学镀镍技术领域,更具体的是涉及一种化学镀镍液。
背景技术
化学镀中发展最快的一种。镀液一般以硫酸镍、乙酸镍等为主盐,次亚磷酸盐、硼氢化钠、硼烷等为还原剂,再添加各种助剂。在90℃的酸性溶液或接近常温的中性溶液、碱性溶液中进行作业,以使用还原剂的不同分为化学镀镍-磷、化学镀镍-硼两大类,本发明探讨的是化学镀镍-磷这类。目前,低磷化学镀镍磷合金,具有硬度高,可焊性好,耐磨耐碱蚀等优点,在很多领域得以应用。但现在使用的低磷化学镀镍液,主要存在两个问题:一是大多镀液工作pH值大于8,镀速偏低,无法处理一些不适宜处在碱性条件下的工件;二是多数化学镀镍液,难以获得磷的质量含量低于3.5%,特别是低于1.5%的镍磷镀层。
发明内容
本发明的目的就是为了解决现有技术之不足而提供的一种成本低,适用范围广,适合对碳纤维,高分子功能材料,硅材料等新材料进行金属化处理,提高其导电性、硬度、耐磨性能的化学镀镍液。
本发明是采用如下技术解决方案来实现上述目的:一种化学镀镍液,其特征在于,它的组分包括镍盐22-35g/L、次磷酸盐15-25g/L、复合络合剂200-250mL/L、稳定剂0.5-1.5mL/L、磷含量抑制剂0.5-2.0mL/L;
所述的磷含量抑制剂,组成为:
作为上述方案的进一步说明,所述的镍盐为硫酸镍、氯化镍或醋酸镍中的至少一种。
所述的次磷酸盐优选为次磷酸钠或次磷酸钾。
所述的复合络合剂,组成为:
所述的稳定剂,组成为:
本发明的化学镀镍液,其工作温度为78-98℃;工作pH值5.8-7.5,使用氨水,氢氧化钾或氢氧化钠进行调节。
本发明采用上述技术解决方案所能达到的有益效果是:
1、本发明采用复合络合剂,引入磷含量抑制剂,控制溶液pH值5.8-7.5之间,成功控制镀层中磷的质量含量在0.3-3.5%之间,不对工件产生明显酸蚀与碱蚀。
2、本发明所得溶液不含ROHS所限制使用的物质,产品环保;所用原料易得,成本低。
3、本发明提供的镀液均镀能力强,镀层形貌好。
4、本发明提供的镀液适用范围广,尤其适合对碳纤维,高分子功能材料,硅材料等新材料进行金属化处理,提高其导电性、硬度、耐磨性能。
附图说明
图1为实施例1所得试片镀层的扫描电子显微镜照片;
图2为实施例1所得试片镀层的能谱测试区域照片;
图3为图2对应区域的能谱图。
具体实施方式
以下结合具体实施例对本发明的具体实施方案作进一步的详述。
本发明是一种化学镀镍液,它的组分包括镍盐、次磷酸盐、复合络合剂、稳定剂、磷含量抑制剂;本发明通过优选复合络合剂,引入磷含量抑制剂,与控制溶液pH值5.8-7.5之间,成功控制镀层中磷的质量含量在0.3-3.5%之间,对工件无明显碱蚀与酸蚀。
本发明的化学镀镍液,其工作温度为78-98℃;工作pH值5.8-7.5,使用氨水,氢氧化钾或氢氧化钠进行调节。
实施例1
本实施例使用本发明的化学镀镍液对低碳钢进行化学镀镍,其操作过程如下:
1、将0.5g硫脲与2g碘酸钾置于烧杯中,加入去离子水,用磁力搅拌器搅拌直至澄清,在1L容量瓶中加去离子水定容,得到稳定剂溶液1L;
2、将2g聚二硫二丙烷磺酸钠与0.5g N,N-二甲基二硫代甲酰胺丙烷磺酸钠放入烧杯中,加入去离子水,用磁力搅拌器搅拌直至澄清,在1L容量瓶中加去离子水定容,得到磷含量抑制剂溶液1L;
3、将50g醋酸铵,50g乳酸,140g丁二酸放入烧杯中,加去离子水,用磁力搅拌器搅拌至澄清,在1L容量瓶中定容后得到复合络合剂1L;
其中,步骤1,2,3的先后次序可任意对调;
4、在1L烧杯中,加入六水硫酸镍27g,次亚磷酸钠20g,复合络合剂200mL,稳定剂溶液1.0mL,磷含量抑制剂1.0mL,加入去离子水,用磁力搅拌器搅拌至澄清;用氢氧化钾调节溶液pH至6.0左右,再用氨水调pH至6.8;加去离子水定容至1L,得到本发明的化学镀镍液1L;
5、将装有上述镀液的烧杯置于水浴锅中,恒温88℃,将7cm×7cm×0.2mm的低碳钢在除油液中除油2min,然后放入5%的硫酸溶液中活化3min后放入镀液,施镀0.5h。将施镀结束后的试片,洗净吹干。通过称重法确定化学镀镍沉积速率,使用JSM-6510扫描电子显微镜观察其表面形貌,并用附带的INCA X-ACT的能谱仪测试其元素含量。扫描电子显微镜照片见图1,其倍数为1000倍。能谱仪测试中测试区域见图2,对应的测试结果见图3。图3中镀层基体Fe元素对应的峰未标注。能谱仪分析得到的试样元素组成(重量)为:P0.69%,Ni99.31%,即镀层中P元素质量含量为0.69%。取镀层密度8.5g/cm3,由增重求得沉积速率为8.6μm/h。
实施例2
本实施例使用本发明的化学镀镍液对不锈钢进行化学镀镍,其操作过程如下:
1、将0.8g硫脲,1g碘化钾,0.5g硫酸铈放入烧杯中,加入去离子水,用磁力搅拌器搅拌直至澄清,在1L容量瓶中加去离子水定容,得到稳定剂溶液1L;
2、将0.5g甲基硫脲,4g异硫脲丙磺酸内盐放入烧杯中,加入去离子水,用磁力搅拌器搅拌直至澄清,在1L容量瓶中加去离子水定容,得到磷含量抑制剂溶液1L;
3、将40g醋酸钠,70g乳酸,100g丁二酸放入烧杯中,加去离子水,用磁力搅拌器搅拌至澄清,在1L容量瓶中定容后得到复合络合剂1L;
其中,步骤1,2,3的先后次序可任意对调;
4、在1L烧杯中,加入六水硫酸镍27g,次亚磷酸钠22g,复合络合剂200mL,稳定剂溶液0.8mL,磷含量抑制剂1.5mL,加入去离子水,用磁力搅拌器搅拌至澄清。用氢氧化钾调节溶液pH至6.0左右,再用氨水调pH至6.4。加去离子水定容至1L,得到本发明的化学镀镍液1L;
5、将装有上述镀液的烧杯置于水浴锅中,恒温到92℃,将4cm×10cm×0.2mm的不锈钢片在除油液中除油2min,然后在5%的硫酸溶液中活化2min后放入镀液,施镀0.5h。将施镀结束后的试片,洗净吹干。镀层磷含量通过原子吸收光谱(AAS)测试。原子吸收光谱测试磷含量步骤为:先把不锈钢试片上的镀层剥落,然后用精密天平称量镀层质量m,然后用硝酸溶解镀层,并定容至100mL。根据测试要求,将溶液稀释至一定倍数。用原子吸收光谱仪测试稀释液中镍离子质量,并根据稀释倍数计算出剥落镀层中镍的总质量m1。则可求得磷元素的质量含量为(m-m1)/m。
本实施例中,镀层中磷的质量含量为0.78%。
以上所述的仅是本发明的优选实施方式,应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。
Claims (3)
1.一种化学镀镍液,其特征在于,它的组分包括镍盐22-35g/L、次磷酸盐15-25 g/L、复合络合剂200-250 mL/L、稳定剂0.5-1.5 mL/L、磷含量抑制剂0.5-2.0 mL/L;
所述的磷含量抑制剂,组成为:
甲基硫脲 0.5g/L,
异硫脲丙磺酸内盐 4 g/L,
水 余量;
所述的复合络合剂,组成为:
醋酸铵或醋酸钠 40g/L,
乳酸 70g/L,
丁二酸 100g/L,
水 余量;
所述的稳定剂,组成为:
硫脲 0.8 g/L,
碘化钾 1 g/L,
硫酸铈 0.5 g/L,
水 余量。
2.根据权利要求1所述的一种化学镀镍液,其特征在于,所述的镍盐为硫酸镍、氯化镍或醋酸镍中的至少一种。
3.根据权利要求1所述的一种化学镀镍液,其特征在于,所述的次磷酸盐为次磷酸钠或次磷酸钾。
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