CN104148770B - Clamping device for automatic tin dipping machine - Google Patents
Clamping device for automatic tin dipping machine Download PDFInfo
- Publication number
- CN104148770B CN104148770B CN201410441802.6A CN201410441802A CN104148770B CN 104148770 B CN104148770 B CN 104148770B CN 201410441802 A CN201410441802 A CN 201410441802A CN 104148770 B CN104148770 B CN 104148770B
- Authority
- CN
- China
- Prior art keywords
- clamping device
- clamping plate
- clamping
- tin dipping
- turnover panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 6
- 238000007598 dipping method Methods 0.000 title abstract 5
- 238000005476 soldering Methods 0.000 claims description 12
- 230000007306 turnover Effects 0.000 claims description 12
- 210000000078 claw Anatomy 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410441802.6A CN104148770B (en) | 2014-09-02 | 2014-09-02 | Clamping device for automatic tin dipping machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410441802.6A CN104148770B (en) | 2014-09-02 | 2014-09-02 | Clamping device for automatic tin dipping machine |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104148770A CN104148770A (en) | 2014-11-19 |
CN104148770B true CN104148770B (en) | 2017-01-18 |
Family
ID=51874490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410441802.6A Active CN104148770B (en) | 2014-09-02 | 2014-09-02 | Clamping device for automatic tin dipping machine |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104148770B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105044399A (en) * | 2015-08-18 | 2015-11-11 | 中国兵器工业集团第二一四研究所苏州研发中心 | Universal test clamp for LTCC substrate |
CN110310819B (en) * | 2019-07-23 | 2023-11-14 | 安徽省和翰光电科技有限公司 | Full-automatic encapsulation device for inductor production and encapsulation method thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0775775B2 (en) * | 1991-08-23 | 1995-08-16 | 松下電器産業株式会社 | Corrugated surface management device for jet soldering device and soldering device using the same |
US7648056B1 (en) * | 2008-07-03 | 2010-01-19 | Sony Corporation | Selective soldering bath |
US20110139855A1 (en) * | 2009-12-16 | 2011-06-16 | Ristolainen Tero | Residual oxygen measurement and control in wave soldering process |
PL217764B1 (en) * | 2011-02-24 | 2014-08-29 | Fitech Spółka Z Ograniczoną Odpowiedzialnością | Transporter for dip soldering on a wave of power electronic components on PCB circuit boards |
CN202291746U (en) * | 2011-09-14 | 2012-07-04 | 中智环保科技江苏有限公司 | Air claw of clamping mechanism for combined dip soldering machine |
CN102935536B (en) * | 2012-11-27 | 2014-09-24 | 常熟泓淋电子有限公司 | Clamp rotating and clamping device of automatic tin wetting machine |
CN203696345U (en) * | 2013-11-14 | 2014-07-09 | 浙江世明电器有限公司 | Clamp for automatic tin dipping machine |
CN203622194U (en) * | 2013-12-17 | 2014-06-04 | 浙江金冠特种变压器有限公司 | Transformer iron core grinding fixture |
CN204148688U (en) * | 2014-09-02 | 2015-02-11 | 安徽省和翰光电科技有限公司 | A kind of clamping device for automatic soldering machine |
-
2014
- 2014-09-02 CN CN201410441802.6A patent/CN104148770B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104148770A (en) | 2014-11-19 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Clamping device for automatic tin dipping machine Effective date of registration: 20180320 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: ANHUI HEHAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2018340000075 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20190319 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: ANHUI HEHAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2018340000075 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Clamping device for automatic tin dipping machine Effective date of registration: 20190329 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: ANHUI HEHAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2019340000165 |
|
CP01 | Change in the name or title of a patent holder |
Address after: 233000 No. 1259 Changqing South Road, hi tech Zone, Anhui, Bengbu Patentee after: Anhui Hehan Photoelectric Technology Co.,Ltd. Address before: 233000 No. 1259 Changqing South Road, hi tech Zone, Anhui, Bengbu Patentee before: ANHUI HEHAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200807 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: ANHUI HEHAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2019340000165 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A clamping device for automatic tin dipping machine Effective date of registration: 20200810 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: Anhui Hehan Photoelectric Technology Co.,Ltd. Registration number: Y2020980004818 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220929 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: Anhui Hehan Photoelectric Technology Co.,Ltd. Registration number: Y2020980004818 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Clamping Device for Automatic Tin Dipping Machine Effective date of registration: 20221017 Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: Anhui Hehan Photoelectric Technology Co.,Ltd. Registration number: Y2022980018564 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170118 Pledgee: Bengbu financing guarantee Group Co.,Ltd. Pledgor: Anhui Hehan Photoelectric Technology Co.,Ltd. Registration number: Y2022980018564 |