CN104029112A

CN104029112A - Grinding method of chip reverse process

Info

Publication number: CN104029112A
Application number: CN201410292928.1A
Authority: CN
Inventors: 张明伦; 陈进来
Original assignee: Kunshan Yong Xuzhi Wealth Technology Service Co Ltd
Current assignee: Kunshan Yong Xuzhi Wealth Technology Service Co Ltd
Priority date: 2014-06-23
Filing date: 2014-06-23
Publication date: 2014-09-10

Abstract

The invention discloses a grinding method of a chip reverser process. The grinding method includes: allowing the surface to be ground of a chip to face down and be placed on a flat surface; respectively placing rectangular accompanying chips on all sides of the chip to be flush with the chip unilaterally; dripping curing adhesives on the chip and the accompanying chips; finally placing a fixing fixture on the chips and the accompanying chips for standing and curing to complete the process. Since the surfaces of the chip and the accompanying chips face down on the same plane for sample processing, coplane effect can be achieved during grinding regardless of height difference of the accompanying chips; since the edge to be ground, of the chip is as high as the accompany chips, pressure bearing and grinding speed of the accompanying chips are quite matched with that of the center of the chip, and grinding flatness of the chip is good.

Description

A kind of Ginding process of chip reverse process

Technical field

The invention belongs to chip manufacture technology field, relate in particular to a kind of Ginding process of chip reverse process.

Background technology

In integrated circuit fabrication process; reverse process is to understand self circuit and the most effective approach of competitor's circuit; and then as the important method of circuit studies and improved circuit; in traditional die reverse process, grind as one of the effective way of removing layer, but when traditional grinding chip; because chip edge is not protected; in the time grinding, to bear pressure larger at edge, often causes chip edge overgrinding, and form the uneven situation of chip.

Summary of the invention

The object of the present invention is to provide a kind of Ginding process of chip reverse process; when being intended to solve chip and grinding, because chip edge is not protected, in the time grinding, to bear pressure larger at edge; often cause chip edge overgrinding, and form the uneven problem of chip.

The present invention is achieved in that a kind of Ginding process of chip reverse process, first, is positioned over a flat surfaces by surface to be ground chip down; Again the sheet of accompanying of rectangle is positioned over respectively to aliging of chip all around and with chip is monolateral; Curable adhesive agent dripped in chip again and accompany on sheet; Finally put fixed jig leave standstill solidify after complete.

Further, described chip is the Gui sheet forming according to semiconductor technology, and it is shaped as rectangle.

Further, the described sheet of accompanying is that the rectangle corresponding with chip form to be ground accompanied sheet, and thickness is regardless of, and material can be the material of resistance to grinding, as pottery or metal, but taking Gui sheet as best.

Further, described curable adhesive agent and fixed jig, as fixing chip to be ground and accompany sheet use.

Further, the sample after having prepared, it accompanies sheet and chip surface to be ground for having plane surface altogether.

effect gathers

The Ginding process of chip reverse process of the present invention, due to chip with accompany sheet surface under same plane, to prepare sample all down, no matter accompany sheet difference in height, all can in the time grinding, reach coplanar effect; Due to chip edge to be ground with accompany sheet with high, in the time grinding, to bear pressure suitable with chip center, grinding rate is suitable, makes chip grinding flatness better.

Brief description of the drawings

Fig. 1 is normal chip and the chip sides enlarged drawing that the embodiment of the present invention provides;

Fig. 2 is the traditional die that provides of the embodiment of the present invention while grinding, and chip bears grinding pad pressure schematic diagram;

Fig. 3 is the traditional die that provides of the embodiment of the present invention while grinding, and chip bears grinding pad pressure and causes chip edge overgrinding schematic diagram;

Fig. 4 is the sample preparation flow chart that the embodiment of the present invention provides;

Fig. 5 be the embodiment of the present invention provide grind time, chip uniform stressed schematic diagram;

In figure: 1, chip; 2, fixed jig; 3, grinding pad; 4, accompany sheet; 4-1, first accompanies sheet; 4-2, second accompanies sheet; 4-3, escort services' sheet; 4-4, the 4th accompanies sheet; 5, curable adhesive agent.

Detailed description of the invention

In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.

Fig. 1 is normal chip and chip sides enlarged drawing; Chip 1 bottom surface is that integrated circuit technology forms multilayer circuit figure; Fig. 2 is traditional die while grinding, and chip bears grinding pad pressure schematic diagram, 2 fixed jigs that are carries chips, and 3 grinding pads that use for process of lapping, in figure, display chip edge is subject to the situation of the more pressure of grinding pad; When Fig. 3 is traditional die grinding, chip bears grinding pad pressure and causes chip edge overgrinding schematic diagram.

As shown in Figure 4, the present invention is achieved in that first by surface to be ground chip 1 down, is positioned over a flat surfaces, as glass; Accompany sheet 4-1 by first of rectangle again, second accompanies sheet 4-2, escort services' sheet 4-3, and the 4th accompanies sheet 4-4 to be positioned over respectively aliging of chip 1 all around and with chip 1 is monolateral; Again by 5 of curable adhesive agents in chip 1 and accompany on sheet 4; Finally putting fixed jig 2 leaves standstill after solidifying and completes.

Further, described chip 1 is the Gui sheet forming according to semiconductor technology, and it is shaped as rectangle.

Further, the described sheet 4 of accompanying is that the rectangle corresponding with chip 1 shape to be ground accompanied sheet, and thickness is regardless of, and material can be the material of resistance to grinding, as pottery or metal, but taking Gui sheet as best.

Further, described curable adhesive agent 5 and fixed jig 2, as fixing chip 1 to be ground and accompany sheet 4 use.

Further, the sample after having prepared, it accompanies sheet 4 and chip to be ground 1 surface is to have plane surface altogether, avoids chip edge to be ground to cause the overground problem of chip edge because pressure is inhomogeneous.

Fig. 5 is the present invention in the time grinding, chip uniform stressed schematic diagram; Sample after having prepared, it accompanies sheet 4 and chip to be ground 1 surface is to have plane surface altogether, can avoid chip edge to cause the overground problem of chip edge because pressure is inhomogeneous when grinding.

The Ginding process of chip reverse process of the present invention, due to chip 1 with accompany sheet 4 surfaces under same plane, to prepare sample all down, no matter accompany sheet 4 differences in height, all can in the time grinding, reach coplanar effect; Due to chip to be ground 1 edge with accompany sheet 4 with high, in the time grinding and to bear pressure suitable at chip 1 center, grinding rate is suitable, makes chip 1 grind flatness better.

By reference to the accompanying drawings the specific embodiment of the present invention is described although above-mentioned; but not limiting the scope of the invention; one of ordinary skill in the art should be understood that; on the basis of technical scheme of the present invention, those skilled in the art do not need to pay various amendments that performing creative labour can make or distortion still within protection scope of the present invention.

Claims

1. a Ginding process for chip reverse process, is characterized in that, first the Ginding process of described chip reverse process, is positioned over a flat surfaces by surface to be ground chip down; Again the sheet of accompanying of rectangle is positioned over respectively to aliging of chip all around and with chip is monolateral; Curable adhesive agent dripped in chip again and accompany on sheet; Finally put fixed jig leave standstill solidify after complete.

2. the Ginding process of chip reverse process as claimed in claim 1, is characterized in that, described chip is the Gui sheet forming according to semiconductor technology, and it is shaped as rectangle.

3. the Ginding process of chip reverse process as claimed in claim 1, is characterized in that, the described sheet of accompanying is that the rectangle corresponding with chip form to be ground accompanied sheet, and thickness is regardless of, and material can be the material of resistance to grinding, as pottery or metal, but taking Gui sheet as best.

4. the Ginding process of chip reverse process as claimed in claim 1, is characterized in that, described curable adhesive agent and fixed jig, as fixing chip to be ground and accompany sheet use.

5. the Ginding process of chip reverse process as claimed in claim 1, is characterized in that, the sample after having prepared, and it accompanies sheet and chip surface to be ground for having plane surface altogether.