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CH591762A5 - - Google Patents

Info

Publication number
CH591762A5
CH591762A5 CH355275A CH355275A CH591762A5 CH 591762 A5 CH591762 A5 CH 591762A5 CH 355275 A CH355275 A CH 355275A CH 355275 A CH355275 A CH 355275A CH 591762 A5 CH591762 A5 CH 591762A5
Authority
CH
Switzerland
Application number
CH355275A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH355275A priority Critical patent/CH591762A5/xx
Priority to DE19752518666 priority patent/DE2518666A1/de
Priority to DE19757513490 priority patent/DE7513490U/de
Priority to FR7607634A priority patent/FR2305021A1/fr
Priority to JP2976776A priority patent/JPS51118966A/ja
Publication of CH591762A5 publication Critical patent/CH591762A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH355275A 1975-03-20 1975-03-20 CH591762A5 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH355275A CH591762A5 (fr) 1975-03-20 1975-03-20
DE19752518666 DE2518666A1 (de) 1975-03-20 1975-04-26 Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen
DE19757513490 DE7513490U (de) 1975-03-20 1975-04-26 Haltevorrichtung
FR7607634A FR2305021A1 (fr) 1975-03-20 1976-03-17 Procede pour l'application de glacures sur la surface des parties actives d'elements a semi-conducteurs, dispositif de serrage pour la mise en oeuvre du procede et application de celui-ci a la passivation des jonctions pn
JP2976776A JPS51118966A (en) 1975-03-20 1976-03-18 Method of glazing activated surface of semiconductor * holder for practising thereby and application of passivating pn transition thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH355275A CH591762A5 (fr) 1975-03-20 1975-03-20

Publications (1)

Publication Number Publication Date
CH591762A5 true CH591762A5 (fr) 1977-09-30

Family

ID=4258446

Family Applications (1)

Application Number Title Priority Date Filing Date
CH355275A CH591762A5 (fr) 1975-03-20 1975-03-20

Country Status (4)

Country Link
JP (1) JPS51118966A (fr)
CH (1) CH591762A5 (fr)
DE (2) DE7513490U (fr)
FR (1) FR2305021A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5367363A (en) * 1976-11-27 1978-06-15 Mitsubishi Electric Corp Semiconductor device
FR2469000A1 (fr) * 1979-10-30 1981-05-08 Silicium Semiconducteur Ssc Structure de thyristor tres haute tension glassive et son procede de fabrication
FR2515874A1 (fr) * 1981-11-05 1983-05-06 Comp Generale Electricite Procede d'encapsulation plastique de cellules solaires
DE3832732A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterdiode
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1438826A (fr) * 1964-06-30 1966-05-13 Ibm Formation de films de verre par pulvérisation réactive
US3473959A (en) * 1964-08-10 1969-10-21 Licentia Gmbh Method for coating semiconductors and apparatus
US3437505A (en) * 1965-06-28 1969-04-08 Ibm Method for depositing glass particles on the entire exposed surface of an object
US3639975A (en) * 1969-07-30 1972-02-08 Gen Electric Glass encapsulated semiconductor device fabrication process

Also Published As

Publication number Publication date
JPS51118966A (en) 1976-10-19
DE2518666A1 (de) 1976-09-30
DE7513490U (de) 1977-05-26
FR2305021A1 (fr) 1976-10-15

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased