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CH557890A - Hochvakuum-bedampfungsanlage. - Google Patents

Hochvakuum-bedampfungsanlage.

Info

Publication number
CH557890A
CH557890A CH1550170A CH1550170A CH557890A CH 557890 A CH557890 A CH 557890A CH 1550170 A CH1550170 A CH 1550170A CH 1550170 A CH1550170 A CH 1550170A CH 557890 A CH557890 A CH 557890A
Authority
CH
Switzerland
Prior art keywords
high vacuum
vacuum evaporation
evaporation system
vacuum
evaporation
Prior art date
Application number
CH1550170A
Other languages
English (en)
Original Assignee
Weiner Hilmar
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weiner Hilmar filed Critical Weiner Hilmar
Priority to ES70385733A priority Critical patent/ES385733A1/es
Publication of CH557890A publication Critical patent/CH557890A/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CH1550170A 1969-11-18 1970-10-20 Hochvakuum-bedampfungsanlage. CH557890A (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES70385733A ES385733A1 (es) 1969-11-21 1970-11-20 Procedimiento para la preparacion de una composicion endu- recedora para las resinas epoxidas.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691958004 DE1958004A1 (de) 1969-11-18 1969-11-18 Hochvakuum-Bedampfungsanlage

Publications (1)

Publication Number Publication Date
CH557890A true CH557890A (de) 1975-01-15

Family

ID=5751471

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1550170A CH557890A (de) 1969-11-18 1970-10-20 Hochvakuum-bedampfungsanlage.

Country Status (2)

Country Link
CH (1) CH557890A (de)
DE (1) DE1958004A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2725334C2 (de) * 1975-11-07 1985-02-21 Mathbirk Ltd., Sutton-in-Ashfield, Nottinghamshire Kettelmaschine
US6086728A (en) * 1994-12-14 2000-07-11 Schwartz; Vladimir Cross flow metalizing of compact discs
DE19642852A1 (de) * 1996-10-17 1998-04-23 Leybold Systems Gmbh Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate

Also Published As

Publication number Publication date
DE1958004A1 (de) 1971-05-19

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Legal Events

Date Code Title Description
PL Patent ceased