CH557890A - Hochvakuum-bedampfungsanlage. - Google Patents
Hochvakuum-bedampfungsanlage.Info
- Publication number
- CH557890A CH557890A CH1550170A CH1550170A CH557890A CH 557890 A CH557890 A CH 557890A CH 1550170 A CH1550170 A CH 1550170A CH 1550170 A CH1550170 A CH 1550170A CH 557890 A CH557890 A CH 557890A
- Authority
- CH
- Switzerland
- Prior art keywords
- high vacuum
- vacuum evaporation
- evaporation system
- vacuum
- evaporation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
- C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES70385733A ES385733A1 (es) | 1969-11-21 | 1970-11-20 | Procedimiento para la preparacion de una composicion endu- recedora para las resinas epoxidas. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691958004 DE1958004A1 (de) | 1969-11-18 | 1969-11-18 | Hochvakuum-Bedampfungsanlage |
Publications (1)
Publication Number | Publication Date |
---|---|
CH557890A true CH557890A (de) | 1975-01-15 |
Family
ID=5751471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1550170A CH557890A (de) | 1969-11-18 | 1970-10-20 | Hochvakuum-bedampfungsanlage. |
Country Status (2)
Country | Link |
---|---|
CH (1) | CH557890A (de) |
DE (1) | DE1958004A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2725334C2 (de) * | 1975-11-07 | 1985-02-21 | Mathbirk Ltd., Sutton-in-Ashfield, Nottinghamshire | Kettelmaschine |
US6086728A (en) * | 1994-12-14 | 2000-07-11 | Schwartz; Vladimir | Cross flow metalizing of compact discs |
DE19642852A1 (de) * | 1996-10-17 | 1998-04-23 | Leybold Systems Gmbh | Vakuumbehandlungsanlage zum Aufbringen dünner Schichten auf dreidimensionale, schalenförmige oder prismatische Substrate |
-
1969
- 1969-11-18 DE DE19691958004 patent/DE1958004A1/de active Pending
-
1970
- 1970-10-20 CH CH1550170A patent/CH557890A/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE1958004A1 (de) | 1971-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |