CA2361399A1 - Metallizable moulded part - Google Patents
Metallizable moulded part Download PDFInfo
- Publication number
- CA2361399A1 CA2361399A1 CA002361399A CA2361399A CA2361399A1 CA 2361399 A1 CA2361399 A1 CA 2361399A1 CA 002361399 A CA002361399 A CA 002361399A CA 2361399 A CA2361399 A CA 2361399A CA 2361399 A1 CA2361399 A1 CA 2361399A1
- Authority
- CA
- Canada
- Prior art keywords
- plastic
- moulding
- particularly preferably
- plastics
- metallized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 claims abstract description 63
- 229920002647 polyamide Polymers 0.000 claims description 75
- 239000004952 Polyamide Substances 0.000 claims description 73
- 229920003023 plastic Polymers 0.000 claims description 69
- 239000004033 plastic Substances 0.000 claims description 69
- 238000000465 moulding Methods 0.000 claims description 64
- 239000000203 mixture Substances 0.000 claims description 54
- 230000008569 process Effects 0.000 claims description 53
- -1 polyethylene terephthalates Polymers 0.000 claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 229920001971 elastomer Polymers 0.000 claims description 38
- 239000000126 substance Substances 0.000 claims description 38
- 239000003365 glass fiber Substances 0.000 claims description 30
- 238000001746 injection moulding Methods 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 238000001465 metallisation Methods 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 21
- 239000000806 elastomer Substances 0.000 claims description 20
- 229920000728 polyester Polymers 0.000 claims description 20
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 16
- 238000007704 wet chemistry method Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 229920001577 copolymer Polymers 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229920001169 thermoplastic Polymers 0.000 claims description 8
- 239000004416 thermosoftening plastic Substances 0.000 claims description 8
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 7
- 206010070834 Sensitisation Diseases 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 5
- 230000036961 partial effect Effects 0.000 claims description 5
- 238000007788 roughening Methods 0.000 claims description 5
- 230000008313 sensitization Effects 0.000 claims description 5
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 4
- 239000012190 activator Substances 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 229920002215 polytrimethylene terephthalate Polymers 0.000 claims description 2
- 238000010137 moulding (plastic) Methods 0.000 claims 1
- 239000000178 monomer Substances 0.000 description 35
- 229920002292 Nylon 6 Polymers 0.000 description 34
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 22
- 239000000463 material Substances 0.000 description 22
- 239000005060 rubber Substances 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229920006055 Durethan® Polymers 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 239000000945 filler Substances 0.000 description 13
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 229920006097 Ultramide® Polymers 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 11
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 10
- 125000004432 carbon atom Chemical group C* 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000002347 injection Methods 0.000 description 10
- 229910052500 inorganic mineral Inorganic materials 0.000 description 10
- 239000011707 mineral Substances 0.000 description 10
- 235000010755 mineral Nutrition 0.000 description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 239000012764 mineral filler Substances 0.000 description 8
- 238000006116 polymerization reaction Methods 0.000 description 8
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 8
- 229920006659 PA12 Polymers 0.000 description 7
- 238000000227 grinding Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- WERYXYBDKMZEQL-UHFFFAOYSA-N 1,4-butanediol Substances OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 150000002118 epoxides Chemical group 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical group O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 229920002943 EPDM rubber Polymers 0.000 description 5
- 229920003620 Grilon® Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 229920000578 graft copolymer Polymers 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 238000005554 pickling Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000004609 Impact Modifier Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 229920003235 aromatic polyamide Polymers 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- 239000002667 nucleating agent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000004150 EU approved colour Substances 0.000 description 3
- 239000004908 Emulsion polymer Substances 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 150000003951 lactams Chemical class 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 229940006093 opthalmologic coloring agent diagnostic Drugs 0.000 description 3
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 150000003018 phosphorus compounds Chemical class 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 235000012222 talc Nutrition 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- 239000010456 wollastonite Substances 0.000 description 3
- 229910052882 wollastonite Inorganic materials 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000006085 branching agent Substances 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000019241 carbon black Nutrition 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 235000013980 iron oxide Nutrition 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 150000002830 nitrogen compounds Chemical class 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 150000002896 organic halogen compounds Chemical class 0.000 description 2
- 239000013110 organic ligand Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001748 polybutylene Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 150000003752 zinc compounds Chemical class 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical class C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- HFVMEOPYDLEHBR-UHFFFAOYSA-N (2-fluorophenyl)-phenylmethanol Chemical compound C=1C=CC=C(F)C=1C(O)C1=CC=CC=C1 HFVMEOPYDLEHBR-UHFFFAOYSA-N 0.000 description 1
- OWICEWMBIBPFAH-UHFFFAOYSA-N (3-diphenoxyphosphoryloxyphenyl) diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1)(=O)OC1=CC=CC=C1 OWICEWMBIBPFAH-UHFFFAOYSA-N 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- FQXGHZNSUOHCLO-UHFFFAOYSA-N 2,2,4,4-tetramethyl-1,3-cyclobutanediol Chemical compound CC1(C)C(O)C(C)(C)C1O FQXGHZNSUOHCLO-UHFFFAOYSA-N 0.000 description 1
- RLEQVGMLDNITBW-UHFFFAOYSA-N 2,4,4-trimethylhexanedioic acid Chemical compound OC(=O)C(C)CC(C)(C)CC(O)=O RLEQVGMLDNITBW-UHFFFAOYSA-N 0.000 description 1
- DSAYAFZWRDYBQY-UHFFFAOYSA-N 2,5-dimethylhexa-1,5-diene Chemical compound CC(=C)CCC(C)=C DSAYAFZWRDYBQY-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- QHVBLSNVXDSMEB-UHFFFAOYSA-N 2-(diethylamino)ethyl prop-2-enoate Chemical compound CCN(CC)CCOC(=O)C=C QHVBLSNVXDSMEB-UHFFFAOYSA-N 0.000 description 1
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- BEWCNXNIQCLWHP-UHFFFAOYSA-N 2-(tert-butylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNC(C)(C)C BEWCNXNIQCLWHP-UHFFFAOYSA-N 0.000 description 1
- RWLALWYNXFYRGW-UHFFFAOYSA-N 2-Ethyl-1,3-hexanediol Chemical compound CCCC(O)C(CC)CO RWLALWYNXFYRGW-UHFFFAOYSA-N 0.000 description 1
- YQPCHPBGAALCRT-UHFFFAOYSA-N 2-[1-(carboxymethyl)cyclohexyl]acetic acid Chemical compound OC(=O)CC1(CC(O)=O)CCCCC1 YQPCHPBGAALCRT-UHFFFAOYSA-N 0.000 description 1
- HYFFNAVAMIJUIP-UHFFFAOYSA-N 2-ethylpropane-1,3-diol Chemical compound CCC(CO)CO HYFFNAVAMIJUIP-UHFFFAOYSA-N 0.000 description 1
- RBQLGIKHSXQZTB-UHFFFAOYSA-N 3-methylpentane-2,4-diol Chemical compound CC(O)C(C)C(C)O RBQLGIKHSXQZTB-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 1
- NWPQAENAYWENSD-UHFFFAOYSA-N 5-butylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CCCC)CC1C=C2 NWPQAENAYWENSD-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-UHFFFAOYSA-N 5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=CC)CC1C=C2 OJOWICOBYCXEKR-UHFFFAOYSA-N 0.000 description 1
- DMGCMUYMJFRQSK-UHFFFAOYSA-N 5-prop-1-en-2-ylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C(=C)C)CC1C=C2 DMGCMUYMJFRQSK-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- 101100244083 Arabidopsis thaliana PKL gene Proteins 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 229920006050 Bergamid® Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 208000015943 Coeliac disease Diseases 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical class [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920003575 Durethan® A Polymers 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 102100037487 Histone H1.0 Human genes 0.000 description 1
- 101001026554 Homo sapiens Histone H1.0 Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- HNBNCTSBZBISGN-UHFFFAOYSA-N NC(C(C)(C1CCCCC1)C1CCCCC1)N Chemical class NC(C(C)(C1CCCCC1)C1CCCCC1)N HNBNCTSBZBISGN-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003188 Nylon 3 Polymers 0.000 description 1
- 229920001007 Nylon 4 Polymers 0.000 description 1
- 229920006528 PA66/6 Polymers 0.000 description 1
- 229910002666 PdCl2 Inorganic materials 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 239000012965 benzophenone Chemical class 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 235000011148 calcium chloride Nutrition 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- JYYOBHFYCIDXHH-UHFFFAOYSA-N carbonic acid;hydrate Chemical class O.OC(O)=O JYYOBHFYCIDXHH-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229920006039 crystalline polyamide Polymers 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical class C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- UCVPKAZCQPRWAY-UHFFFAOYSA-N dibenzyl benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC=2C=CC=CC=2)C=1C(=O)OCC1=CC=CC=C1 UCVPKAZCQPRWAY-UHFFFAOYSA-N 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- ISRJTGUYHVPAOR-UHFFFAOYSA-N dihydrodicyclopentadienyl acrylate Chemical compound C1CC2C3C(OC(=O)C=C)C=CC3C1C2 ISRJTGUYHVPAOR-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- VVYDVQWJZWRVPE-UHFFFAOYSA-L dimethyltin(2+);diiodide Chemical compound C[Sn](C)(I)I VVYDVQWJZWRVPE-UHFFFAOYSA-L 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002897 organic nitrogen compounds Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002979 perylenes Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003873 salicylate salts Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- HHJJPFYGIRKQOM-UHFFFAOYSA-N sodium;oxido-oxo-phenylphosphanium Chemical compound [Na+].[O-][P+](=O)C1=CC=CC=C1 HHJJPFYGIRKQOM-UHFFFAOYSA-N 0.000 description 1
- 239000012899 standard injection Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000003509 tertiary alcohols Chemical class 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000004415 thermoplastic moulding composition Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Thermistors And Varistors (AREA)
- Reinforced Plastic Materials (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
The invention relates to metallizeable moulded parts, to methods for producing them and to their use as a component with integrated electroconductive sections for electrical applications.
Description
~ CA 02361399 2001-07-31 -1- , Metallizable moulding The invention relates to metallizable mouldings, processes for their produciton and S their use as a component part with integrated electically conductive sections for electrical applications.
Mouldings, processes and uses of component parts of thermoplastics with integrated electrically conductive sections are known in principle.
These component parts are known in the literature as Mm (moulded interconnection device). Some patents also relate to a similar technique.
The production of three-dimensional component parts (3-D Mm technology) in recent years has chiefly been concentrated on combinations of metallizable (by currentless wet chemistry, electrogalvanically) and non-metallizable polyamides. ,-' Materials which were used in particular here were PA12 as the non-metallizable component and polyamides based on s-caprolactam and/or hexamethylenediamine and adipic acid as the metallizable component, the two components being employed in the form of glass fibre-reinforced compounds in most cases.
DE 44 16 986 thus describes a process for the production of a specific component part of a non-metallizable or poorly metallizable plastic K1 from the group consisting of PA6, PA66, PA11, PA12 and PPA and a metallizable plastic K2 from the group consisting of PA6, PA66, PA66/6, PMMA, ABS, PVC, PU and UP.
This technical solution has various disadvantages. Inter alia, the water uptake of the polyamide under certain circumstances lead to the formation of bubbles during IR
soldering and a lack of dimensional stability and thermal dimensional stability, especially at temperatures of about 50°C. Another disadvantage is that in mouldings produced, for example, by 2-component injection moulding, PA12 often adheres ' CA 02361399 2001-07-31
Mouldings, processes and uses of component parts of thermoplastics with integrated electrically conductive sections are known in principle.
These component parts are known in the literature as Mm (moulded interconnection device). Some patents also relate to a similar technique.
The production of three-dimensional component parts (3-D Mm technology) in recent years has chiefly been concentrated on combinations of metallizable (by currentless wet chemistry, electrogalvanically) and non-metallizable polyamides. ,-' Materials which were used in particular here were PA12 as the non-metallizable component and polyamides based on s-caprolactam and/or hexamethylenediamine and adipic acid as the metallizable component, the two components being employed in the form of glass fibre-reinforced compounds in most cases.
DE 44 16 986 thus describes a process for the production of a specific component part of a non-metallizable or poorly metallizable plastic K1 from the group consisting of PA6, PA66, PA11, PA12 and PPA and a metallizable plastic K2 from the group consisting of PA6, PA66, PA66/6, PMMA, ABS, PVC, PU and UP.
This technical solution has various disadvantages. Inter alia, the water uptake of the polyamide under certain circumstances lead to the formation of bubbles during IR
soldering and a lack of dimensional stability and thermal dimensional stability, especially at temperatures of about 50°C. Another disadvantage is that in mouldings produced, for example, by 2-component injection moulding, PA12 often adheres ' CA 02361399 2001-07-31
-2-inadequately at the interface to the second polyamide component. The higher costs of PA12 compared with PA6 are furthermore disadvantages of the above material combination for 3-D MID. An undesirable uptake of water or moisture can also occur in component parts of the material combination of PA12/PA6, under certain circumstances having an adverse influence on the anchoring at the interface of the two materials. For these reasons, alternatives are sought for the non-galvanizable component, in particular PA12. Constant electrical and mechanical properties (e.g.
rigidity) and stability, e.g. to chemicals, play a prominent role here.
Partly aromatic polyamides e.g. are non-metallizable under the conditions typical for PA6. However, the reinforcement of such polyamides with glass fibres, which is necessary to achieve an adequate rigidity and similar shrinkage ratios, such as e.g. in the case of glass fibre-reinforced PA6, leads to galvanizability in part of corresponding moulding surfaces. Durethan T40 (commercial product from Bayer AG, partly aromatic polyamide, moulding composition code according to ISO
1874:
PA6I,MT,12-030), which is not metallizable under the conventional conditions for ,-' PA6, thus becomes galvanizable in part by melt compounding with 30% glass fibres, so that the material is unsuitable as an alternative to PA12.
_ It is furthermore known that partly aromatic polyesters, such as, for example, polybutylene terep'hthalate (PBT), and polyamides (PA) are insoluble in one another in the melt and therefore show no miscibility. Because of this incompatibility, no blends of polyester (including PBT) and PA (including PA6) of commercial importance are as yet known (Z. Xiaochuan et al, Polymers and Polymer Composites, vol. S, no. 7, 1997, p. 501 - 505). For this reason indeed, also no PBT / PA
blends are mentioned in Kunststoff Handbuch Polyamide 3 / 4, Carl Hanser Verlag, 1998, ISBN 3-446-16486-3, p. 131 - 165. It has therefore been assumed to date that combinations of PBT and PA are unsuitable in two-component injection moulding for 3-D MID applications.
' CA 02361399 2001-07-31
rigidity) and stability, e.g. to chemicals, play a prominent role here.
Partly aromatic polyamides e.g. are non-metallizable under the conditions typical for PA6. However, the reinforcement of such polyamides with glass fibres, which is necessary to achieve an adequate rigidity and similar shrinkage ratios, such as e.g. in the case of glass fibre-reinforced PA6, leads to galvanizability in part of corresponding moulding surfaces. Durethan T40 (commercial product from Bayer AG, partly aromatic polyamide, moulding composition code according to ISO
1874:
PA6I,MT,12-030), which is not metallizable under the conventional conditions for ,-' PA6, thus becomes galvanizable in part by melt compounding with 30% glass fibres, so that the material is unsuitable as an alternative to PA12.
_ It is furthermore known that partly aromatic polyesters, such as, for example, polybutylene terep'hthalate (PBT), and polyamides (PA) are insoluble in one another in the melt and therefore show no miscibility. Because of this incompatibility, no blends of polyester (including PBT) and PA (including PA6) of commercial importance are as yet known (Z. Xiaochuan et al, Polymers and Polymer Composites, vol. S, no. 7, 1997, p. 501 - 505). For this reason indeed, also no PBT / PA
blends are mentioned in Kunststoff Handbuch Polyamide 3 / 4, Carl Hanser Verlag, 1998, ISBN 3-446-16486-3, p. 131 - 165. It has therefore been assumed to date that combinations of PBT and PA are unsuitable in two-component injection moulding for 3-D MID applications.
' CA 02361399 2001-07-31
-3- , It has been found, surprisingly, that a combination of PBT as the non-metallizable w component and PA6 as the metallizable component does not have the abovementioned disadvantages for 3-D MID components in the injection moudling process. The preferred metallizing process here is the Baygamid~ process (process of Bayer AG).
The Application accordingly relates to a moulding comprising at least two thermoplastics K (I) and K (II), at least one plastic K (I) being a partly aromatic polyester and at least one plastic K (II) being a polyamide.
It is a particular feature here that the two plastics do not mix with one another and form blurred interfaces under the conventional process conditions of plastics processing. This would considerably impair the precision of the metallization.
It is . therefore preferable if the plastic or plastics K (I) and the plastic or plastics K (II) are present macroscopically in separate phases to the extent of more than 90 wt.%, based on the particular type of plastic.
The partly aromatic polyester according to the invention is chosen from the group consisting of derivatives of polyalkylidene terephthalates, preferably chosen from the group consisting of polyethylene terephthalates, polytrimethylene terephthalates and polybutylene terephthalates, particularly preferably polybutylene terephthalates, very particularly preferably polybutylene terephthalate.
Partly aromatic polyesters is understood as meaning materials which also contain aliphatic molecular moieties in addition to aromatic molecular moities.
Polyalkylene terephthalates in the context of the invention are reaction products of aromatic dicarboxylic acids or their reactive derivatives (e.g. dimethyl esters or anhydrides) and aliphatic, cycloaliphatic or araliphatic diols and mixtures of these reaction products.
" CA 02361399 2001-07-31
The Application accordingly relates to a moulding comprising at least two thermoplastics K (I) and K (II), at least one plastic K (I) being a partly aromatic polyester and at least one plastic K (II) being a polyamide.
It is a particular feature here that the two plastics do not mix with one another and form blurred interfaces under the conventional process conditions of plastics processing. This would considerably impair the precision of the metallization.
It is . therefore preferable if the plastic or plastics K (I) and the plastic or plastics K (II) are present macroscopically in separate phases to the extent of more than 90 wt.%, based on the particular type of plastic.
The partly aromatic polyester according to the invention is chosen from the group consisting of derivatives of polyalkylidene terephthalates, preferably chosen from the group consisting of polyethylene terephthalates, polytrimethylene terephthalates and polybutylene terephthalates, particularly preferably polybutylene terephthalates, very particularly preferably polybutylene terephthalate.
Partly aromatic polyesters is understood as meaning materials which also contain aliphatic molecular moieties in addition to aromatic molecular moities.
Polyalkylene terephthalates in the context of the invention are reaction products of aromatic dicarboxylic acids or their reactive derivatives (e.g. dimethyl esters or anhydrides) and aliphatic, cycloaliphatic or araliphatic diols and mixtures of these reaction products.
" CA 02361399 2001-07-31
-4- , Preferred polyalkylene terephthalates can be prepared from terephthalic acid (or its reactive derivatives) and aliphatic or cycloaliphatic diols having 2 to 10 C
atoms by known methods (Kunststoff Handbuch, vol. VIII, p. 695 et seq., Karl-Hanser-Verlag, Munich 1973).
Preferred polyalkylene terephthalates contain at least 80, preferably 90 mol%, based on the dicarboxylic acid, of terephthalic acid radicals and at least 80, preferbaly at least 90 mol%, based on the diol component, of ethylene glycol and/or propane-1,3-diol and/or butane-1,4-diol radicals.
In addition to terephthalic acid radicals, the preferred polyalkylene terephthalates can contain up to 20 mol% of radicals of other aromatic dicarboxylic acids having 8 to 14 C atoms or aliphatic dicarboxylic acids having 4 to 12 C atoms, such as radicals of . phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, succinic, adipic, sebacic or azelaic acid or cyclohexanediacetic acid.
In addition to ethylene glycol or propane-1,3-diol or butane-1,4-diol radicals, the preferred polyalkylene terephthalates can contain up to 20 mol% of other aliphatic diols having 3 to 12 C atoms or cycloaliphatic diols having 6 to 21 C atoms, e.g.
radicals of propane-1,3-diol, 2-ethylpropane-1,3-diol, neopentylglycol, pentane-1,5-diol, hexane-1,6-diol, cyclohexane-1,4-dimethanol, 3-methylpentane-2,4-diol, 2-methylpentane-2,4-diol, 2,2,4-trimethylpentane-1,3- and -1,6-diol, 2-ethylhexane-1,3-diol, 2,2-diethylpropane-1,3-diol, hexane-2,5-diol, 1,4-di-((3-hydroxyethoxy)-benzene, 2,2-bis-(4-hydroxycyclohexyl)-propane, 2,4-dihydroxy-1,1,3,3-tetramethyl-cyclobutane, 2,2-bis-(3-13-hydroxyethoxyphenyl)-propane and 2,2-bis-(4-hydroxypro-poxyphenyl)-propane (DE-OS 24 07 674, 24 07 776, 27 15 932).
The polyalkylene terephthalates can be branched by incorporation of relatively small amounts of 3- or 4-hydric alcohols or 3- or 4-basic carboxylic acids, such as are described e.g. in DE-OS 19 00 270 and US-PS 3 692 744. Examples of preferred ' CA 02361399 2001-07-31
atoms by known methods (Kunststoff Handbuch, vol. VIII, p. 695 et seq., Karl-Hanser-Verlag, Munich 1973).
Preferred polyalkylene terephthalates contain at least 80, preferably 90 mol%, based on the dicarboxylic acid, of terephthalic acid radicals and at least 80, preferbaly at least 90 mol%, based on the diol component, of ethylene glycol and/or propane-1,3-diol and/or butane-1,4-diol radicals.
In addition to terephthalic acid radicals, the preferred polyalkylene terephthalates can contain up to 20 mol% of radicals of other aromatic dicarboxylic acids having 8 to 14 C atoms or aliphatic dicarboxylic acids having 4 to 12 C atoms, such as radicals of . phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, succinic, adipic, sebacic or azelaic acid or cyclohexanediacetic acid.
In addition to ethylene glycol or propane-1,3-diol or butane-1,4-diol radicals, the preferred polyalkylene terephthalates can contain up to 20 mol% of other aliphatic diols having 3 to 12 C atoms or cycloaliphatic diols having 6 to 21 C atoms, e.g.
radicals of propane-1,3-diol, 2-ethylpropane-1,3-diol, neopentylglycol, pentane-1,5-diol, hexane-1,6-diol, cyclohexane-1,4-dimethanol, 3-methylpentane-2,4-diol, 2-methylpentane-2,4-diol, 2,2,4-trimethylpentane-1,3- and -1,6-diol, 2-ethylhexane-1,3-diol, 2,2-diethylpropane-1,3-diol, hexane-2,5-diol, 1,4-di-((3-hydroxyethoxy)-benzene, 2,2-bis-(4-hydroxycyclohexyl)-propane, 2,4-dihydroxy-1,1,3,3-tetramethyl-cyclobutane, 2,2-bis-(3-13-hydroxyethoxyphenyl)-propane and 2,2-bis-(4-hydroxypro-poxyphenyl)-propane (DE-OS 24 07 674, 24 07 776, 27 15 932).
The polyalkylene terephthalates can be branched by incorporation of relatively small amounts of 3- or 4-hydric alcohols or 3- or 4-basic carboxylic acids, such as are described e.g. in DE-OS 19 00 270 and US-PS 3 692 744. Examples of preferred ' CA 02361399 2001-07-31
-5- , branching agents are trimesic acid, trimellitic acid, trimethylolethane and -propane and pentaerythritol.
It is advisable to use not more than 1 mol% of the branching agent, based on the acid component.
Polyalkylene terephthalates which have been prepared solely from terephthalic acid and reactive derivatives thereof (e.g. dialkyl esters thereof) and ethylene glycol and/or propane-1,3-diol and/or butane-1,4-diol (polyethylene terephthalate and polybutylene terephpthalate) and mixtures of these polyalkylene terephthalates are particularly preferred.
Copolyesters which are prepared from at least two of the abovementioned acid components and/or from at least two of the abovementioned alcohol components are 1 S also preferred polyalkylene terephthalates, and particularly preferred copolyesters are poly-(ethylene glycol/butane-1,4-diol)-terephthalates. ,.
The polyalkylene terephthalates in general have an intrinsic viscosity of approx. 0.4 to 1.5, preferably 0.5 to 1.3, in each case measured in phenol/o-dichlorobenzene ( 1:1 parts by wt.) at 25°C.
The partly aromatic polyesters can furthermore comprise additives, such as e.g fillers and reinforcing substances, such as e.g. glass fibres or mineral fillers, flameproofing agents, processing auxiliaries, stabilizers, flow auxiliaries, antistatics, dyestuffs, pigments and other conventional additives.
Fibrous or particulate fillers and reinforcing substances which can be added for the moulding compositions according to the invention are glass fibres, glass beads, glass fabric, glass mats, carbon fibres, aramid fibres, potassium titanate fibres, natural fibres, amorphous silica, magnesium carbonate, barium sulfate, feldspar, mica, silicates, quartz, talc, kaolin, titanium dioxide, wollastonite and the like, which can ' CA 02361399 2001-07-31
It is advisable to use not more than 1 mol% of the branching agent, based on the acid component.
Polyalkylene terephthalates which have been prepared solely from terephthalic acid and reactive derivatives thereof (e.g. dialkyl esters thereof) and ethylene glycol and/or propane-1,3-diol and/or butane-1,4-diol (polyethylene terephthalate and polybutylene terephpthalate) and mixtures of these polyalkylene terephthalates are particularly preferred.
Copolyesters which are prepared from at least two of the abovementioned acid components and/or from at least two of the abovementioned alcohol components are 1 S also preferred polyalkylene terephthalates, and particularly preferred copolyesters are poly-(ethylene glycol/butane-1,4-diol)-terephthalates. ,.
The polyalkylene terephthalates in general have an intrinsic viscosity of approx. 0.4 to 1.5, preferably 0.5 to 1.3, in each case measured in phenol/o-dichlorobenzene ( 1:1 parts by wt.) at 25°C.
The partly aromatic polyesters can furthermore comprise additives, such as e.g fillers and reinforcing substances, such as e.g. glass fibres or mineral fillers, flameproofing agents, processing auxiliaries, stabilizers, flow auxiliaries, antistatics, dyestuffs, pigments and other conventional additives.
Fibrous or particulate fillers and reinforcing substances which can be added for the moulding compositions according to the invention are glass fibres, glass beads, glass fabric, glass mats, carbon fibres, aramid fibres, potassium titanate fibres, natural fibres, amorphous silica, magnesium carbonate, barium sulfate, feldspar, mica, silicates, quartz, talc, kaolin, titanium dioxide, wollastonite and the like, which can ' CA 02361399 2001-07-31
-6- , also be treated on the surface. Commercially available glass fibres are preferred reinforcing substances. The glass fibres, which in general have a fibre diameter of between 8 and 18 pm, can be added as continuous fibres or as cut or ground glass fibres, it being possible for the fibres to be finished with a suitable size system and an adhesion promoter or adhesion promoter system, e.g. based on silane.
Needle-shaped mineral fillers are also suitable. Needle-shaped mineral fillers is understood in the context of the invention as meaning a mineral filler with a highly pronounced needle-shaped character. Needle-shaped wollastonite may be mentioned as an example. The mineral preferably has an L/D (length/diameter) ratio of 8:1 to 35:1, preferably 8:1 to 11:1. The mineral filler can optionally be treated on the surface.
The polyester moulding composition preferably comprises 0 to 50 parts by wt., preferaby 0 - 40, in particular 10 - 30 parts by wt. of added fillers and reinforcing substances. Polyester moulding compositions without fillers and/or reinforcing .~
substances can also be used.
Suitable flameproofing agents are commercially available organic compounds or _ halogen compounds with synergists or commercially available organic nitrogen compounds or organic/inorganic phosphorus compounds. Mineral flameproofing additives, such as rrlagnesium hydroxide or Ca-Mg carbonate hydrates (e.g. DE-236 122), can also be employed. Examples of halogen-containing, in particular brominated and chlorinated compounds which may be mentioned are: ethylene-1,2-bistetrabromophthalimide, epoxidized tetrabromobisphenol A resin, tetra-bromobisphenol A oligocarbonate, tetrachlorobisphenol A oligocarbonate, penta-bromopolyacrylate and brominated polystyrene. Suitable organic phopshorus compounds are the phosphorus compounds according to W098/17720 (PCT/EP/05705), e.g. triphenyl phosphate (TPP), resorcinol bis-(diphenyl phosphate), including oligomers (RDP), and bisphenol A bis-diphenyl phosphate, including oligomers (BDP), melamine phosphate, melamine pyrophosphate, ' CA 02361399 2001-07-31 ~ WO 00/46419 PCT/EP00/00445 _7_ melamine polyphosphate and mixtures thereof. Possible nitrogen compounds are, in particular, melamine and melamine cyanurate. Suitable synergists are e.g.
antimony compounds, in particular antimony trioxide and antimony pentoxide, zinc compounds, tin compounds, such as e.g zinc stannate, and borates. Carbon-forming agents and tetrafluoroethylene polymers can be added.
The partly aromatic polyesters according to the invention can comprise conventional additives, such as agents against thermal decomposition, agents against thermal crosslinking, agents against damage caused by ultraviolet light, plasticizers, lubricants and mould release agents, nucleating agents, antistatics, stabilizers and dyestuffs and pigments.
Examples of oxidation retardants and heat stabilizers which are mentioned are sterically hindered phenols andlor phosphites, hydroquinones, aromatic secondary amines, such as diphenylamines, various substituted representatives of these groups and mixtures thereof, in concentrations of up to 1 wt.%, based on the weight of the ,, thermoplastic moulding compositions.
UV stabilizers, which are in general used in amounts of up to 2 wt.%, based on the 20. moulding composition, which may be mentioned are various substituted resorcinols, salicylates, benzotriazoles and benzophenones.
Inorganic pigments, such as titanium dioxide, ultramarine blue, iron oxide and carbon black, and furthermore organic pigments, such as phthalocyanines, quinacridones, perylenes, and dyestuffs, such as nigrosin and anthraquinone, as colouring agents, and other colouring agents can be added.
Sodium phenyl-phosphinate, aluminium oxide, silicon dioxide and, preferably, talc can be employed e.g. as nucleating agents.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -8_ Lubricants and mould release agents, which are conventionally employed in amounts of up to 1 wt.%, are preferably ester waxes, pentaerithrytol stearate (PETS), long-chain fatty acids (e.g. stearic acid or behenic acid), salts thereof (e.g. Ca or Zn stearate) and amide derivatives (e.g. ethylene-bis-stearylamide) or montan waxes (mixtures of straight-chain, saturated carboxylic acids having chain lengths of 28 to 32 C atoms) and low molecular weight polyethylene waxes or polypropylene waxes.
Examples of plasticizers which may be mentioned are dioctyl phthalate, dibenzyl phthalate, butyl benzyl phthalate, hydrocarbon oils and N-(n butyl)benzenesulfonamide.
The additional use of rubber-elastic polymers (often also called impact modifiers, elastomer or rubber) is particularly preferred.
Quite generally, these are copolymers which are preferably built up from at least two of the following monomers: ethylene, propylene, butadiene, isobutene, isoprene, ,.' chloroprene, vinyl acetate, styrene, acrylonitrile and acrylic or methacrylic acid esters having 1 to 18 C atoms in the alcohol component. , Such polymers are described e.g. in Houben-Weyl, Methoden der organischen Chemie, vol. 14/1 (Georg-Thieme-Verlag, Stuttgart, 1961), pages 392 to 406 and in the monograph by C.B. Bucknall, "Toughened Plastics" (Applied Science Publishers, London, 1977).
Some preferred types of such elastomers are described in the following.
Preferred types of such elastomers are the so-called ethylene/propylene (EPM) or ethylene/propylene/diene (EPDM) rubbers.
EPM rubbers in general have practically no more double bonds, while EPDM
rubbers can contain 1 to 20 double bonds per 100 C atoms.
' CA 02361399 2001-07-31 -9- , Diene monomers which may be mentioned for EPDM rubbers are, for example, conjugated dimes, such as isoprene and butadiene, non-conjugated dimes having to 25 C atoms, such as penta-1,4-dime, hexa-1,4-dime, hexa-1,5-dime, 2,5-dimethylhexa-1,5-diene and octa-1,4-dime, cyclic dimes, such as cyclopentadiene, cyclohexadienes, cyclooctadienes and dicyclopentadiene, and alkenylnorbornenes, such as S-ethylidene-2-norbornene, 5-butylidene-2-norbornene, 2-methallyl-5-norbornene, 2-isopropenyl-5-norbornene, and tricyclodienes, such as 3-methyl-tricyclo-(5.2.1Ø2.6)-3,8-decadiene, or mixtures thereof. Hexa-1,5-dime, 5-ethylidenenorbornene and dicyclopentadiene are preferred. The dime content of the EPDM rubbers is preferably 0.5 to 50, in particular 1 to 8 wt.%, based on the total weight of the rubber.
EPM or EPDM rubbers can preferably also be grafted with reactive carboxylic acids or derivatives thereof. There may be mentioned here e.g. acrylic acid, methacrylic acid and derivatives thereof, e.g. glycidyl (meth)acrylate, and malefic anhydride.
Another group of preferred rubbers are copolymers of ethylene with acrylic acid and/or methacrylic acid and/or the esters of these acids. The rubbers can additionally also comprise dicarboxylic acids, such as malefic acid and fumaric acid, or derivatives _ of these acids, e.g. esters and anhydrides, and/or monomers containing epoxide groups. These dicarboxylic acid derivatives or monomers containing epoxide groups are preferably incorporated into the rubber by addition of monomers containing dicarboxylic acid or epoxide groups, of the general formulae (I) or (II) or (III) or (N), to the monomer mixture R1C(COOR2) = C(COOR3)R4 (I) RFC CSR
CO~ ~~O
O
. , WO 00/46419 PCT/EP00/00445 O "' CHR~CH (CH ) O- CHR6 -CH
2 m ( )q CHR
CHz CR9 COO-(-CH2)p-CH CHRe (N) O
S
wherein R' to R9 represent hydrogen or alkyl groups having 1 to 6 C atoms and m is an integer from 0 to 20, g is an integer from 0 to 10 and p is an integer from 0 to 5.
Preferably, the radicals R' to R9 denote hydrogen, where m represents 0 or 1 and g represents 1. The corresponding compounds are malefic acid, fumaric acid, malefic ' anhydride, allyl glycidyl ether and vinyl glycidyl ether.
Preferred compounds of the formulae (17, (B) and (1V) are malefic acid, malefic anhydride and esters of acrylic acid and/or methacrylic acid containing epoxide groups, such as glycidyl acrylate and glycidyl methacrylate, and the esters with tertiary alcohols, such as t-butyl acrylate. The latter indeed contain no free carboxyl groups, but come close in their properties to the free acids and are therefore called monomers with latent carboxyl groups. -The copolymers advantageously comprise 50 to 98 wt.% ethylene, 0.1 to 20 wt.%
monomers containing epoxide groups and/or methacrylic acid and/or monomers containing acid anhydride goups and the the remaining amount as (meth)acrylic acid esters.
Particularly preferred copolymers are those of 50 to 98, in particular 55 to 95 wt.% ethylene, -11- , 0.1 to 40, in particular 0.3 to 20 wt.% glycidyl acrylate and/or glycidyl methacrylate, (meth)acrylic acid and/or malefic anhydride, and 1 to 45, in particular 10 to 40 wt.% n-butyl acrylate and/or 2-ethylhexyl acrylate.
Further preferred esters of acrylic and/or methacrylic acid are the methyl, ethyl, propyl and i- or t-butyl ester.
In addition, vinyl esters and vinyl ethers can also be employed as comonomers.
The ethylene copolymers described above can be prepared by processes known per se, preferably by random copolymerization under a high pressure and elevated temperature. Corresponding processes are generally known.
Emulsion polymers, the preparation of which is described e.g. by Blackley in the ,~' monograph "Emulsion Polymerization", are also preferred. The emulsifiers and catalysts which can be used are known per se.
In principle, homogeneously built up elastomers and also those with a shell structure can be employed. fihe shell structure is determined by the sequence of addition of the individual monomers; the morphology of the polymers is also influenced by this sequence of addition.
Monomers which may be mentioned here merely representatively for the preparation of the rubber part of the elastomers are acrylates, such as e.g. n-butyl acrylate and 2-ethylhexyl acrylate, corresponding methacrylates, butadiene and isoprene and mixtures thereof. These monomers can be copolymerized with further monomers, such as e.g. styrene, acrylonitrile, vinyl ethers and further acrylates or methacrylates, such as methyl methacrylate, methyl acrylate, ethyl acrylate and propyl acrylate.
The soft or rubber phase (with a glass transition temperature below 0°C) of the elastomers can be the core, the outer shell or a middle shell (in the case of elastomers with more than a two-shell structure); in mufti-shell elastomers, it is also possible for several shells to consist of one rubber phase.
If one or more hard components (with glass transition temperatures above 20°C) participate, in addtion to the rubber phase, in the build-up of the elastomers, these are in general prepared by polymerization of styrene, acrylonitrile, methacrylonitrile, a-methylstyrene, p-methylstyrene and acrylic acid esters and methacrylic acid esters, such as methyl acrylate, ethyl acrylate and methyl methacrylate, as the main monomers. In addition, minor amounts of further comonomers can also be employed here.
In some cases it has proved advantageous to employ emulstion polymers which have reactive groups on the surface. Such groups are e.g. epoxide, carboxyl, latent carboxyl, amino or amide groups and functional groups which can be introduced by ,~
co-using monomers of the general formula R' ° R"
CH- ~ -X ~ -C-R'z O _ wherein the substituents can have the following meaning:
R'° hydrogen or a C1- to C4-alkyl group;
R' ~ hydrogen, a C~- to C8-alkyl group or an aryl group, in particular phenyl, R~Z hydrogen, a C1- to Ci°-alkyl or a C6- to Clz-aryl group or -OR~3, -13- , R13 a C1- to Cg-alkyl or C6- to Clz-aryl group, which can optionally be substituted w by O- or N-containing groups, X a chemical bond, a C~- to Coo-alkylene or a C6- to C,2-arylene group or O
-C-Y
Y O-Z or NH-Z and Z a C1- to Cla-alkylene or a C6- to CIZ-arylene group.
The grafting monomers described in EP-A 208 187 are also suitable for introducing reactive groups on to the surface.
Further examples which may also be mentioned are acrylamide, methacrylamide and substituted esters of acrylic acid or methacrylic acid, such as (N-t-butylamino)-ethyl methacrylate, (N,N-dimethylamino)ethyl acrylate, (N,N-dimethylamino)-methyl '~
acrylate and (N,N-diethylamino)ethyl acrylate.
The particles of the rubber phase may furthermore also be crosslinked.
Monomers which act as crosslinking agents are, for example, buta-1,3-dime, divinylbenzene, diallyl phthalate and dihydrodicyclopentadienyl acrylate, as well as the compounds described in EP-A 50 265).
So-called graftlinking monomers can furthermore also be used, i.e. monomers with two or more polymerizable double bonds which react at different rates during the polymerization. Those compounds in which at least one reactive group polymerizes at about the same rate as the other monomers, while the other reactive group (or reactive groups) e.g. polymerizes (polymerize) significantly more slowly, are preferably used. The different polymerization rates have the effect of a certain content of unsaturated double bonds in the rubber. If another phase is then grafted on to such a rubber, the double bonds present in the rubber thus at least partly react with - 14- , the grafting monomers to form chemical bonds, i.e. the grafted-on phase is at least partly linked to the graft base via chemical bonds.
Examples of such graftlinking monomers are monomers containing allyl groups, in particular allyl esters of ethylenically unsaturated carboxylic acids, such as allyl acrylate, allyl methacrylate, diallyl maleate, diallyl fumarate, diallyl itaconate or the corresponding monoallyl compounds of these dicarboxylic acids. In addition, there are a large number of further suitable graftlinking monomers; for further details reference may be made here, for example, to US-PS 4 148 846.
The content of these crosslinking monomers in the impact-modifying polymer is in general up to 5 wt.%, preferably not more than 3 wt.%, based on the impact-modifying polymer.
Some preferred emulsion polymers are listed in the following. Graft polymers which have a core and at least one outer shell and have the following build-up are to be ,-mentioned first here:
Type Monomers for the care Monomers for the shell I buta-1,3-dime, isoprene, styrene, acrylonitrile, n-butyl methyl methacrylate acrylate, ethyl-hexyl acrylate or mixtures thereof II as I, but with the co-use as I
of crosslinking a ents DI as I or II n-butyl acrylate, ethyl acrylate, methyl acrylate, buta-1,3-dime, isoprene, eth lhex 1 ac late IV as I or II as I or III, but with the co-use of monomers with reactive groups as described herein V styrene, acryloniMle, methylfirst shell of monomers as described for methacrylate or mixtures the core under I and II
thereof second shell as described for the shell under I or IV
-15- , These graft polymers, in particular ABS and/or ASA polymers, are preferably "' employed for impact modification of PBT, optionally as a mixture.
Instead of graft polymers with a mufti-shell build-up, homogeneous, i.e.
single-shell, elastomers of buts-1,3-dime, isoprene and n-butyl acrylate or copolymers thereof can also be employed. These products can also be prepared by co-using crosslinking monomers or monomers with reactive groups.
Examples of preferred emulsion polymers are n-butyl acrylate/(meth)acrylic acid copolymers, n-butyl acrylate/glycidyl acrylate or n-butyl acrylate/glycidyl methacrylate copolymers, graft polymers with an inner core of n-butyl acrylate or based on butadiene and an outer shell of the abovementioned copolymers and copolymers of ethylene with comonomers which provide reactive groups.
The elastomers described can also be prepared by other conventional processes, e.g.
by suspension polymerization. ,~' Silicone rubbers such as are described in DE-A 37 25 576, EP-A 235 690, DE-A
00 603 and EP-A 319 290 are also preferred.
It is of course also possible to employ mixtures of the rubber types listed above.
, The polyester moulding composition preferably comprises between 0 and 40 wt.%, preferably between 0 and 30 wt.% and particularly preferably between 0 and 20 wt.%
of rubber-elastic polymers.
The partly aromatic polyester moulding compositions according to the invention are prepared by mixing the particular constituents in a known manner and subjecting the mixture to melt compounding or melt extrusion at temperatures of 200°C
to 330°C in conventional units, such as e.g. internal kneaders, extruders or twin-screw extruders.
Further additives, such as e.g. reinforcing substances, rubber-elastic polymers, - 16- , stabilizers, dyestuffs, pigments, lubricants and mould release agents, nucleating agents, compatibilizing agents and other additives, can be added during the melt compounding or melt extrusion step.
The polyamide according to the invention is preferably chosen from the group consisting of derivatives of polyamides which contain 3 to 8 methylene groups in the polymer chain per polyamide group, particularly preferably chosen from the group formed by PA6 and PA66, very particularly preferably from the group consisting of PA6 and its copolymers.
The polyamides according to the invention can be prepared here by various processes and synthesized from very different units, and in the specific instance of use can be finished, by themselves or in combination with processing auxiliaries, stabilizers, polymeric blending partners (e.g. elastomers) or also reinforcing materials (such as e.g. mineral fillers or glass fibres), to give materials with specifically established combinations of properties. Blends e.g. with contents of polyethylene, polypropylene ,~
or ABS are also suitable. The properties of the polyamides can be improved, e.g. in respect of the impact strength of e.g. reinforced polyamides, by addition of elastomers.
The large number of possible combinations allows a very large number of products with widely varying properties.
A large number of procedures have been disclosed for the preparation of polyamides, different monomer units, various chain regulators for establishing a required molecular weight or also monomers with reactive groups for after-treatments intended later being employed, depending on the desired end product.
The industrially relevant processes for the preparation of polyamides proceed without exception via polycondensation in the melt. In this context, the hydrolytic polymerization of lactams is also understood as polycondensation.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 1~ -Preferred polyamides for the combinations K(17/K(II) according to the invention are partly crystalline polyamides, which can be prepared starting from diamines and dicarboxylic acids and/or lactams having at least 5 ring members or corresponding amino acids.
Possible starting substances are, preferably aliphatic dicarboxylic acids, such as adipic acid, 2,2,4- and 2,4,4-trimethyladipic acid, azelaic acid and sebacic acid, aliphatic diamines, such as hexamethylenediamine. 2.2.4- and 2_4_4-trimethylhexamethylenediamine, the isomeric diamino-dicyclohexylinethanes and diamino-dicyclohexylpropanes and bis-aminomethyl-cyclohexane, and aminocarboxylic acids, such as aminocaproic acid, and the corresponding lactams.
Copolyamides of several of the monomers mentioned are included.
Caprolactams are particularly preferably employed, very particularly preferably s-caprolactam.
,, Most compounds based on PA6, PA66 and other aliphatic polyamides or copolyamides in which 3 to 8 methylene groups are present in the polymer chain per one polyamide group are furthermore particularly suitable.
Polyamide 6 or polyamide 6,6 or polyamide 4,6 or polyamide 6,10 or a copolyamide of the units of the homopolyamides mentioned or a copolyamide of caprolactam units and units derived from hexamethylenediamine and adipic acid are particularly preferably used. Polyamide 6 or copolyamides with polyamide 6 are very particularly preferably used.
The polyamides prepared according to the invention can also be employed as a mixture with other polyamides and/or further polymers.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 1g -The polyamide moulding compositions according to the invention can comprise additives, e.g. rubber-elastic polymers as already described above for the polyester moulding compositions.
The polyamide moulding compositions can additionally also comprise fireproofing agents, such as e.g. phosphorus compounds, organic halogen compounds, nitrogen compounds and/or magnesium hydroxide, stabilizers, colouring agents, dyestuffs or pigments, processing auxiliaries, such as e.g. lubricants, nucleating agents, stabilizers, impact modifiers, such as e.g. rubbers or polyolefins, and the like.
Possible fibrous reinforcing substances are, in addition to glass fibres, carbon fibres, aramid fibres, mineral fibres and whisker. Suitable mineral fillers which may be mentioned by way of example are calcium carbonate, dolomite, calcium sulfate, mica, fluorinated mica, wollastonite, talc and kaolin. However, other oxides or oxide hydrates of an element chosen from the group consisting of boron, aluminium, gallium, indium, silicon, tin, titanium, zirconium, zinc, yttrium or iron can also be ,~' employed. The fibrous reinforcing substances and the mineral fillers can be treated on the surface to improve the mechanical properties.
_ To obtain conductive polyamides, conductive carbon blacks, carbon fibrils, conductive polymers, metal fibres and conventional additives can be added to increase the conductpity.
The polyester moulding composition according to the invention preferably comprises fillers and/or reinforcing substances, preferably in amounts of 1 - 50 wt.%, particularly preferably between 2 - 40 wt.%, especially preferably between 5 -wt.%, based on the total weight of the polyamide moulding composition. PA
moulding compositions without fillers and/or reinforcing substances can also be employed.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -19- , The fillers can be added before, during or after the polymerization of the monomers to w give the polyamide. If the fillers according to the invention are added after the polymerization, the addition is preferably carried out by addition to the polyamide melt in an extruder. If the fillers according to the invention are added before or during the polymerization, the polymerization can include phases which are carried out in the presence of 1 to 50 per cent by weight of water.
During the addition, the fillers can already be present as particles with the particle size finally occurring in the moulding composition. Alternatively, the fillers can be added in the form of precursors, from which the particles finally occurring in the moulding composition are formed only in the course of the addition or incorporation.
Possible fire- or flameproofing agents are, for example, red phosphorus (DE-A-3 713 746 A 1 (= US-A-4 877 823) and EP-A-299 444 (= US-A-5 081 222), brominated diphenyls or diphenyl ethers in combination with antimony trioxide, and chlorinated cycloaliphatic hydrocarbons (Dechlorane~ plus from Occidental Chemical ,-' Co.), brominated styrene oligomers (e.g. in DE-A-2 703 419) and polystyrenes brominated on the nucleus (e.g. Pyro-Chek 68~ from FERRO Chemicals).
. Zinc compounds or iron oxides are also employed as a synergist to the halogen compounds mentioned.
As further alternatives, melamine salts above all have proved to be suitable flameproofing agents, especially for non-reinforced polyamides.
Magnesium hydroxide has moreover for a long time proved to be a suitable flameproofing agent for polyamide.
Polyamide moulding compositions which, in addition to glass fibres, additionally comprise rubber-elastic polymers (often also called impact modifier, elastomer or -20- , rubber) are preferred. Rubber-elastic polymers are understood here as already described above for the polyester moulding compositions.
Preferably, the polyamide moulding composition comprises 0 - 40, preferably 0 -30, S particularly preferably 3 - 20 parts by wt. of impact modifier, elastomer or rubber.
Graft polymers with a core based on acrylates and a shell based on styrene and acrylates are very particularly suitable.
Polyamide moulding compositions which are both glass fibre-reinforced and elastomer-modified are particularly preferred.
Possible polyamide types are, for example:
Polyamide type ManufacturerFibre content PA 46 TW 300 FO-F6 DSM 0 - 30% GF
PA 6 or Durethan BKV 115 Bayer 15% GF
PA 6 copoly-Durethan BKV 130 Bayer 30% GF ,' amides Durethan BKV 30 Bayer 30% GF
H
Durethan BM-240 Bayer 40% mineral Ultramid B3 EG BASF 1 S% GF
Ultramid 6 EG 3 BASF 30% GF
Ultramid B3 M 6 BASF 30% GF
Grilon PVZ - 3H Ems-Chemie 30% GF
Grilon PVS - 3H Ems-Chemie 30% GF
PA 6 + FR GrilQn XE 3524 Ems-Chemie 30% GF
Grilon PMV-SH VO Ems-Chemie 15% GF+ mineral PA 66 AKV 30 Bayer 30% GF
Ultramid A3 WG BASF 30% GF
Ultramid A3 X1 BASF 25% GF
GS
Ultramid A3 X2 BASF 24% GF
GS
Ultramid A3 X3 BASF 25% GF
GS
Ultramid A3 EG BASF 15% GF
Ultramid A3 EG BASF 30% GF
Minion 13 T 1 DuPont 30% mineral Minion 13 T 2 DuPont 30% mineral Minion 11 C 140 DuPont 40% mineral (Blend) Bergamid A70 Bergmann 15% GB
Grilon TV - 3H Ems-Chemie 30/a GF
-21 - , Polyamide type ManufacturerFibre content PA 66 + FR Grilon XE 3525 Ems-Chemie 20% GF
Ultramid A3 X1 BASF 25% GF
GS
Ultramid A3 X2 BASF 25% GF
Ultramid A3 X3 BASF 25% GF
GS
PA 66/6 72 G 30 L DuPont 30% GF
C 3 ZM 6 BASF 30% GF
M>D is understood in general as meaning the following:
"Moulded interconnect devices", abbreviated to MID, is a term introduced internationally since the beginning of the 1990s to describe three-dimensionally injection-moulded circuit carriers. They are based on the idea of producing electrical . connecting elements based on thermoplastics in a three-dimensional spatial arrangement. MIDs conduct current, form shielding or emitting surfaces, carry electronic component parts and integrate mechanical elements. The MID
technique extends the conventional printed circuit board technique which is limited to one '~
spatial plane. It competes with it in part.
There is now a wide range of MID production processes. These include hot embossing of electrically conductive films, laser structuring of strip conductcus in combination with wet chemistry metallization processes or injection moulding thermoplastic around'preformed metal structures.
One of the production processes used most frequently for MIDs is the two-component injection moulding technique with subsequent wet chemistry metallization of a component of plastic. This process allows the greatest freedom of geometrical shape in the production of MIl7s. A composite of two thermoplastics is produced, one component of which is metallizable, while the other component remains completely unaffected by the chemical action of the metallizing electrolytes.
Component parts of plastic to which partly metallic properties can be imparted by a suitable coating can be produced in this way. The metallizable plastic can be ' CA 02361399 2001-07-31 -22- , structured in the form of electrical strip conductors. However, it can also be w structured with a large surface area and thus, after the metallization, contribute towards shielding of electromagnetic interference fields, remove heat of friction in a controlled manner or itself become more wear-resistant. The structure fineness, that is to say, for example, the width of electronic strip conductors, can be reduced to about 500 p.m. Such fine strip conductor structures are achieved if the metallizable plastic is injection moulded in the first shot and the non-metallizable plastic is injection moulded around it in the second shot. However, the reverse sequence is also possible. The position and number of sprues, the costs of the material and the adhesion between the two components of plastic, inter alia, depend on the nature of the sequence.
Most of the MIDs series-produced to date are based on high performance plastics, such as polyether-sulfone (PES), polyether-imide (PEI) or liquid crystal polymers (LCP). They have been chosen in order to withstand the temperatures which arise during soldering processes, which can be up to 260°C in the short term.
Reinforced ,~
polyamides have recently moved into the foreground as an MID material, these being considerably less expensive than the high performance plastics. Some polyamide types which are suitable for soldering processes such as are used for MIDs are available.
Adhesive metallizability of plastics is a decisive point in the production of Mms. A
process (Baygamid~ process, inter alia) for adhesive metallization is used specifically for polyamides by AHC, Kerpen, a supplier of functional surface technology.
Coating is carried out by wet chemistry routes by dipping the workpieces in suitable electrolytes. A metallic stop layer about 2 ~m thick is first applied. It can be further reinforced chemically (for example with chemical nickel) or galvanically (for example with copper). Chemical and galvanic layers can also be combined with one another.
Polyamides of types PA 6, PA 66, PA 66/6 and PA 46 and copolyamides with a glass fibre or mineral fibre filler content of up to 40% can be metallized.
The WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 23 - , adhesive strength of the metal layers applied is more than 1 N/mm. Individual w chemically nickel-plated polyamide types pass temperature change tests, for example .
three cycles from +140°C to -40°C. There is no flaking of the layer at all in these.
The production of MIDs based on polyamide by means of the two-component injection moulding technique and subsequent wet chemistry metallization is therefore an interesting alternative to the other MID production processes on the basis of the wide freedom of geometric shape, the low costs of the material and the small number of production steps. Two applications from the automobile industry demonstrate this statement.
It was possible to reduce the production costs of a car door lock support by this MID
technique to almost half the costs of conventional production. The door lock support is in the car door behind the door handle. Depending on the extent to which the vehicle is fitted out, it is equipped with lock heating, central locking control and actuation of the automatic interior light. In conventional construction, current- ,~' conducting cords, microswitches and resistance wire must be mounted on an aluminium diecasting in an expensive manner.
In production as an MID based on polyamide, the support structure produced in the first shot already comprises all the bearing and fixing elements relevant for the later function. The metallizable component is injection moulded around this in the second shot, and after the metallization replaces the current-conducting cords of conventional production.
Another application is production of a car sliding roof control as an MID
based on polyamide. Here, first fine strip conductor structures and later also plug contacts are produced in the first shot. The second shot produces the non-metallizable base body of another polyamide type. It comprises all the mechanical component parts.
After metallization of the two-component polyamide, assembly is limited merely to equipping with the electrical component parts and soldering thereof. Compared with WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -24- , the conventional printed circuit board solution, the number of mechanical component elements is reduced and the expenditure on assembly is minimized. However, the conventional assembly technology, in particular in the area of equipping and soldering, can be retained.
' Particular advantages are accordingly:
1. Freedom in shape The use of thermoplastics for the production of circuit carriers offers the almost unlimited freedom of shape such as is rendered possible by the injection moulding technique for construction of electronic component groups. The miniaturized and lighter M>l7 component groups allow new functions and shaping of any desired forms.
2. The huh rationalization effect ,a The rationalization effect of this innovative technology and therefore the high profitability are convincing.
- By reducing the number of parts, the costs for material, production, acquisition and logistics of the mechanical and electronic component parts substituted are eliminated.
- The miniaturized Mm component groups reduce the amount of material otherwise necessary.
- By the elimination of subsequent working steps, in particular the previous introduction of through-holes, process chains for the production are shortened, and significant savings are therefore WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -25- , achieved. Compared with conventional construction, cost advantages w of more than 30% can result.
3. Environment friendliness M>D technology is distinguished in respect of its environment friendliness by a number of improvements. Highly oxidizing acids can in some cases be omitted in the pretreatment of the most important plastics suitable for M>D.
In addition to the environment-friendly production, the reduction in the diversity of the materials also plays a decisive role. Recycling of the base materials and non-critical disposal of residual materials are thereby favoured. By employing thermoplastics, the use of thermosetting resins can be dispensed with in many applications.
Process:
., The mouldings can be produced by a process in which (A) a plastic K (n or K
(I)] is first introduced into a mould so that a partial shaped article T (17 or T (II) is formed, and (B) the other plastic K (In or K (17 is then applied at least at one point of the _ surface of the partial shaped article. In a preferred process, the mouldings are produced by two-component inj ection moulding.
Preferably, in an additional step, part of the surface of the shaped article is metallized by the conventional wet chemistry, electrolytic processes known to the expert, particularly preferably by the Baygamid~ process (Bayer AG), this additional step being carned out between steps (A) and (B), or preferably after the two steps.
In a particular embodiment, the metallization step on the metallizable plastic K (II) can preferably comprise the following steps: Chemical roughening of the surface, e.g.
with a calcium chloride solution. Deposition of an activator, e.g. palladium ions.
Sensitization, e.g. by reducing the palladium cations to palladium. Chemical -26- , deposition of a conductive material, e.g. nickel or copper, by e.g. palladium-catalysed reduction of soluble nickel or copper ion complexes. Electrochemical conversion (electrogalvanization, optionally with a mufti-layer build-up). This is all carried out as is described e.g. in DE 43 28 883 or EP 146 723 or EP 146 724, which are hereby incorporated into this specification by reference. Further descriptions of these or similar processes are to be found in the literature (G. D. Wolf, F. Fiinger, Metalli-sierte Polyamid-Spritzgul3teile, Bayer SN 19038, May 1989; U. Tyszka, Die serienmaf3ige, grol3technische galvanische Metallisierung von Spritzgul3teilen aus Polyamid, Galvanotechnik 80, 1989, p.2 et seq.; and the literature cited there).
The metallization of surfaces of plastics can be achieved by physical metallization (preferably vapour deposition of metal, vacuum metallization) or chemical metallization, preferably wet chemistry currentless or wet chemistry electrogalvanic metallization (galvanization), chemical metallization, in particular wet chemistry (currentless or electrogalvanic) metallization being particularly preferred for this invention.
l~
For mouldings of polyamides, a special process has been developed which takes into account the chemical character of the polyamide in the breakdown/roughening step - and carries out the activation step with complex compounds of palladium and platinum and complexing agents which guarantee a high affinity for the polyamide surface. An embodirpent is described in the following.
The core of the process is a relatively simple pretreatment process with organometallic activators which have been developed for use in novel metallization processes. They are complex compounds of noble metals, preferably of palladium or platinum, with various organic ligands.
The organic ligands have been chosen such that a particular affinity for the polyamide surface results, which provides a considerable contribution towards the - adhesive strength of the metal layer to be applied. On the basis of this novel ' WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 activation principle, it has been possible to achieve the situation where only a very w slight roughening of the polyamide surface has to be carried out as an additional measure for a very good adhesion of the metal.
The total pretreatment before the chemical nickel-plating specifically comprises the following stages:
- roughening of the polyamide surface in a pretreatment bath, - activation in an activating bath comprising the palladium complex, - sensitization of the activated substrate surface.
The residence time in the baths is 5 to 10 minutes at approx. 40°C.
After activation and sensitization, the substrate is in each case rinsed thoroughly.
Thereafter, the first metal layer can be deposited directly in any desired chemical nickel bath.
When a first adhesive conductive metal layer has been applied, the conventional galvanizing process, i.e. the galvanic layer build-up of nickel/copper/nickel/chromium, can ,~' follow without problems.
Adhesive metallization of various commercially available polyamides is possible with the process. For example, the use of the process is not linked to polyamide 6 types. Injection-moulded components of polyamide 66 can also be metallized without problems by adhering to the optimized process parameters.
Tailor-made metallizable polyamide types which are reinforced with glass fibres for the requirements of high rigidity and heat distortion point or with mineral fibres to establish a reduced tendency to warp are now available. Products which have been rendered flame-retardant are also available in this way.
To achieve a particularly good galvanizability, polyamide types with a specific elastomer modification have been developed. The class of elastomer-modified, glass - fibre-reinforced polyamides is particularly suitable for components which must meet WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 _28_ the highest requirements in respect of dimensional stability, dynamic fatigue strength and heat distortion point, for example for use in motor vehicle engine spaces.
The glass fibre reinforcement significantly reduces the thermal expansion coefficients of the injection-moulded components, so that the adhesive bond between the metal surface and substrate of plastic is guaranteed even during extreme changes in temperature.
In a particular embodiment, the galvanization step preferably on the metallizable plastic K (II] comprises the following steps: G(n Breaking down of the surface by superficially dissolving baths comprising preferably calcium salts, G(II) chemical deposition of metals, preferably palladium, to produce a conductive surface, particularly preferably by activators and G(IIn electrogalvanization, optionally with a multi-layer build-up, such as is described e.g, in DE 43 28 883 or EP 146 723 or EP
146 724, which are hereby incorporated into this specification by reference.
For example, a partial shaped article or a shaped article is treated analogously to the following process:
A 90 x 150 x 3 mm thick glass fibre-reinforced (30% glass fibres) sheet of polyamide 6 was treated in a pretreatment bath with a flash point of >110°C of the following composition:
64 parts by wt. ~ CaCl2 (anhydrous, dissolved in 100 parts by vol. water) plus 100 parts by vol. HCl (37%) and 800 parts by vol. ethylene glycol (glycol) for 10 minutes at 40°C.
This is followed by rinsing in glycol at room temperature (RT) and then activation in a bath comprising WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 0.7 part by wt. PdCl2,
Needle-shaped mineral fillers are also suitable. Needle-shaped mineral fillers is understood in the context of the invention as meaning a mineral filler with a highly pronounced needle-shaped character. Needle-shaped wollastonite may be mentioned as an example. The mineral preferably has an L/D (length/diameter) ratio of 8:1 to 35:1, preferably 8:1 to 11:1. The mineral filler can optionally be treated on the surface.
The polyester moulding composition preferably comprises 0 to 50 parts by wt., preferaby 0 - 40, in particular 10 - 30 parts by wt. of added fillers and reinforcing substances. Polyester moulding compositions without fillers and/or reinforcing .~
substances can also be used.
Suitable flameproofing agents are commercially available organic compounds or _ halogen compounds with synergists or commercially available organic nitrogen compounds or organic/inorganic phosphorus compounds. Mineral flameproofing additives, such as rrlagnesium hydroxide or Ca-Mg carbonate hydrates (e.g. DE-236 122), can also be employed. Examples of halogen-containing, in particular brominated and chlorinated compounds which may be mentioned are: ethylene-1,2-bistetrabromophthalimide, epoxidized tetrabromobisphenol A resin, tetra-bromobisphenol A oligocarbonate, tetrachlorobisphenol A oligocarbonate, penta-bromopolyacrylate and brominated polystyrene. Suitable organic phopshorus compounds are the phosphorus compounds according to W098/17720 (PCT/EP/05705), e.g. triphenyl phosphate (TPP), resorcinol bis-(diphenyl phosphate), including oligomers (RDP), and bisphenol A bis-diphenyl phosphate, including oligomers (BDP), melamine phosphate, melamine pyrophosphate, ' CA 02361399 2001-07-31 ~ WO 00/46419 PCT/EP00/00445 _7_ melamine polyphosphate and mixtures thereof. Possible nitrogen compounds are, in particular, melamine and melamine cyanurate. Suitable synergists are e.g.
antimony compounds, in particular antimony trioxide and antimony pentoxide, zinc compounds, tin compounds, such as e.g zinc stannate, and borates. Carbon-forming agents and tetrafluoroethylene polymers can be added.
The partly aromatic polyesters according to the invention can comprise conventional additives, such as agents against thermal decomposition, agents against thermal crosslinking, agents against damage caused by ultraviolet light, plasticizers, lubricants and mould release agents, nucleating agents, antistatics, stabilizers and dyestuffs and pigments.
Examples of oxidation retardants and heat stabilizers which are mentioned are sterically hindered phenols andlor phosphites, hydroquinones, aromatic secondary amines, such as diphenylamines, various substituted representatives of these groups and mixtures thereof, in concentrations of up to 1 wt.%, based on the weight of the ,, thermoplastic moulding compositions.
UV stabilizers, which are in general used in amounts of up to 2 wt.%, based on the 20. moulding composition, which may be mentioned are various substituted resorcinols, salicylates, benzotriazoles and benzophenones.
Inorganic pigments, such as titanium dioxide, ultramarine blue, iron oxide and carbon black, and furthermore organic pigments, such as phthalocyanines, quinacridones, perylenes, and dyestuffs, such as nigrosin and anthraquinone, as colouring agents, and other colouring agents can be added.
Sodium phenyl-phosphinate, aluminium oxide, silicon dioxide and, preferably, talc can be employed e.g. as nucleating agents.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -8_ Lubricants and mould release agents, which are conventionally employed in amounts of up to 1 wt.%, are preferably ester waxes, pentaerithrytol stearate (PETS), long-chain fatty acids (e.g. stearic acid or behenic acid), salts thereof (e.g. Ca or Zn stearate) and amide derivatives (e.g. ethylene-bis-stearylamide) or montan waxes (mixtures of straight-chain, saturated carboxylic acids having chain lengths of 28 to 32 C atoms) and low molecular weight polyethylene waxes or polypropylene waxes.
Examples of plasticizers which may be mentioned are dioctyl phthalate, dibenzyl phthalate, butyl benzyl phthalate, hydrocarbon oils and N-(n butyl)benzenesulfonamide.
The additional use of rubber-elastic polymers (often also called impact modifiers, elastomer or rubber) is particularly preferred.
Quite generally, these are copolymers which are preferably built up from at least two of the following monomers: ethylene, propylene, butadiene, isobutene, isoprene, ,.' chloroprene, vinyl acetate, styrene, acrylonitrile and acrylic or methacrylic acid esters having 1 to 18 C atoms in the alcohol component. , Such polymers are described e.g. in Houben-Weyl, Methoden der organischen Chemie, vol. 14/1 (Georg-Thieme-Verlag, Stuttgart, 1961), pages 392 to 406 and in the monograph by C.B. Bucknall, "Toughened Plastics" (Applied Science Publishers, London, 1977).
Some preferred types of such elastomers are described in the following.
Preferred types of such elastomers are the so-called ethylene/propylene (EPM) or ethylene/propylene/diene (EPDM) rubbers.
EPM rubbers in general have practically no more double bonds, while EPDM
rubbers can contain 1 to 20 double bonds per 100 C atoms.
' CA 02361399 2001-07-31 -9- , Diene monomers which may be mentioned for EPDM rubbers are, for example, conjugated dimes, such as isoprene and butadiene, non-conjugated dimes having to 25 C atoms, such as penta-1,4-dime, hexa-1,4-dime, hexa-1,5-dime, 2,5-dimethylhexa-1,5-diene and octa-1,4-dime, cyclic dimes, such as cyclopentadiene, cyclohexadienes, cyclooctadienes and dicyclopentadiene, and alkenylnorbornenes, such as S-ethylidene-2-norbornene, 5-butylidene-2-norbornene, 2-methallyl-5-norbornene, 2-isopropenyl-5-norbornene, and tricyclodienes, such as 3-methyl-tricyclo-(5.2.1Ø2.6)-3,8-decadiene, or mixtures thereof. Hexa-1,5-dime, 5-ethylidenenorbornene and dicyclopentadiene are preferred. The dime content of the EPDM rubbers is preferably 0.5 to 50, in particular 1 to 8 wt.%, based on the total weight of the rubber.
EPM or EPDM rubbers can preferably also be grafted with reactive carboxylic acids or derivatives thereof. There may be mentioned here e.g. acrylic acid, methacrylic acid and derivatives thereof, e.g. glycidyl (meth)acrylate, and malefic anhydride.
Another group of preferred rubbers are copolymers of ethylene with acrylic acid and/or methacrylic acid and/or the esters of these acids. The rubbers can additionally also comprise dicarboxylic acids, such as malefic acid and fumaric acid, or derivatives _ of these acids, e.g. esters and anhydrides, and/or monomers containing epoxide groups. These dicarboxylic acid derivatives or monomers containing epoxide groups are preferably incorporated into the rubber by addition of monomers containing dicarboxylic acid or epoxide groups, of the general formulae (I) or (II) or (III) or (N), to the monomer mixture R1C(COOR2) = C(COOR3)R4 (I) RFC CSR
CO~ ~~O
O
. , WO 00/46419 PCT/EP00/00445 O "' CHR~CH (CH ) O- CHR6 -CH
2 m ( )q CHR
CHz CR9 COO-(-CH2)p-CH CHRe (N) O
S
wherein R' to R9 represent hydrogen or alkyl groups having 1 to 6 C atoms and m is an integer from 0 to 20, g is an integer from 0 to 10 and p is an integer from 0 to 5.
Preferably, the radicals R' to R9 denote hydrogen, where m represents 0 or 1 and g represents 1. The corresponding compounds are malefic acid, fumaric acid, malefic ' anhydride, allyl glycidyl ether and vinyl glycidyl ether.
Preferred compounds of the formulae (17, (B) and (1V) are malefic acid, malefic anhydride and esters of acrylic acid and/or methacrylic acid containing epoxide groups, such as glycidyl acrylate and glycidyl methacrylate, and the esters with tertiary alcohols, such as t-butyl acrylate. The latter indeed contain no free carboxyl groups, but come close in their properties to the free acids and are therefore called monomers with latent carboxyl groups. -The copolymers advantageously comprise 50 to 98 wt.% ethylene, 0.1 to 20 wt.%
monomers containing epoxide groups and/or methacrylic acid and/or monomers containing acid anhydride goups and the the remaining amount as (meth)acrylic acid esters.
Particularly preferred copolymers are those of 50 to 98, in particular 55 to 95 wt.% ethylene, -11- , 0.1 to 40, in particular 0.3 to 20 wt.% glycidyl acrylate and/or glycidyl methacrylate, (meth)acrylic acid and/or malefic anhydride, and 1 to 45, in particular 10 to 40 wt.% n-butyl acrylate and/or 2-ethylhexyl acrylate.
Further preferred esters of acrylic and/or methacrylic acid are the methyl, ethyl, propyl and i- or t-butyl ester.
In addition, vinyl esters and vinyl ethers can also be employed as comonomers.
The ethylene copolymers described above can be prepared by processes known per se, preferably by random copolymerization under a high pressure and elevated temperature. Corresponding processes are generally known.
Emulsion polymers, the preparation of which is described e.g. by Blackley in the ,~' monograph "Emulsion Polymerization", are also preferred. The emulsifiers and catalysts which can be used are known per se.
In principle, homogeneously built up elastomers and also those with a shell structure can be employed. fihe shell structure is determined by the sequence of addition of the individual monomers; the morphology of the polymers is also influenced by this sequence of addition.
Monomers which may be mentioned here merely representatively for the preparation of the rubber part of the elastomers are acrylates, such as e.g. n-butyl acrylate and 2-ethylhexyl acrylate, corresponding methacrylates, butadiene and isoprene and mixtures thereof. These monomers can be copolymerized with further monomers, such as e.g. styrene, acrylonitrile, vinyl ethers and further acrylates or methacrylates, such as methyl methacrylate, methyl acrylate, ethyl acrylate and propyl acrylate.
The soft or rubber phase (with a glass transition temperature below 0°C) of the elastomers can be the core, the outer shell or a middle shell (in the case of elastomers with more than a two-shell structure); in mufti-shell elastomers, it is also possible for several shells to consist of one rubber phase.
If one or more hard components (with glass transition temperatures above 20°C) participate, in addtion to the rubber phase, in the build-up of the elastomers, these are in general prepared by polymerization of styrene, acrylonitrile, methacrylonitrile, a-methylstyrene, p-methylstyrene and acrylic acid esters and methacrylic acid esters, such as methyl acrylate, ethyl acrylate and methyl methacrylate, as the main monomers. In addition, minor amounts of further comonomers can also be employed here.
In some cases it has proved advantageous to employ emulstion polymers which have reactive groups on the surface. Such groups are e.g. epoxide, carboxyl, latent carboxyl, amino or amide groups and functional groups which can be introduced by ,~
co-using monomers of the general formula R' ° R"
CH- ~ -X ~ -C-R'z O _ wherein the substituents can have the following meaning:
R'° hydrogen or a C1- to C4-alkyl group;
R' ~ hydrogen, a C~- to C8-alkyl group or an aryl group, in particular phenyl, R~Z hydrogen, a C1- to Ci°-alkyl or a C6- to Clz-aryl group or -OR~3, -13- , R13 a C1- to Cg-alkyl or C6- to Clz-aryl group, which can optionally be substituted w by O- or N-containing groups, X a chemical bond, a C~- to Coo-alkylene or a C6- to C,2-arylene group or O
-C-Y
Y O-Z or NH-Z and Z a C1- to Cla-alkylene or a C6- to CIZ-arylene group.
The grafting monomers described in EP-A 208 187 are also suitable for introducing reactive groups on to the surface.
Further examples which may also be mentioned are acrylamide, methacrylamide and substituted esters of acrylic acid or methacrylic acid, such as (N-t-butylamino)-ethyl methacrylate, (N,N-dimethylamino)ethyl acrylate, (N,N-dimethylamino)-methyl '~
acrylate and (N,N-diethylamino)ethyl acrylate.
The particles of the rubber phase may furthermore also be crosslinked.
Monomers which act as crosslinking agents are, for example, buta-1,3-dime, divinylbenzene, diallyl phthalate and dihydrodicyclopentadienyl acrylate, as well as the compounds described in EP-A 50 265).
So-called graftlinking monomers can furthermore also be used, i.e. monomers with two or more polymerizable double bonds which react at different rates during the polymerization. Those compounds in which at least one reactive group polymerizes at about the same rate as the other monomers, while the other reactive group (or reactive groups) e.g. polymerizes (polymerize) significantly more slowly, are preferably used. The different polymerization rates have the effect of a certain content of unsaturated double bonds in the rubber. If another phase is then grafted on to such a rubber, the double bonds present in the rubber thus at least partly react with - 14- , the grafting monomers to form chemical bonds, i.e. the grafted-on phase is at least partly linked to the graft base via chemical bonds.
Examples of such graftlinking monomers are monomers containing allyl groups, in particular allyl esters of ethylenically unsaturated carboxylic acids, such as allyl acrylate, allyl methacrylate, diallyl maleate, diallyl fumarate, diallyl itaconate or the corresponding monoallyl compounds of these dicarboxylic acids. In addition, there are a large number of further suitable graftlinking monomers; for further details reference may be made here, for example, to US-PS 4 148 846.
The content of these crosslinking monomers in the impact-modifying polymer is in general up to 5 wt.%, preferably not more than 3 wt.%, based on the impact-modifying polymer.
Some preferred emulsion polymers are listed in the following. Graft polymers which have a core and at least one outer shell and have the following build-up are to be ,-mentioned first here:
Type Monomers for the care Monomers for the shell I buta-1,3-dime, isoprene, styrene, acrylonitrile, n-butyl methyl methacrylate acrylate, ethyl-hexyl acrylate or mixtures thereof II as I, but with the co-use as I
of crosslinking a ents DI as I or II n-butyl acrylate, ethyl acrylate, methyl acrylate, buta-1,3-dime, isoprene, eth lhex 1 ac late IV as I or II as I or III, but with the co-use of monomers with reactive groups as described herein V styrene, acryloniMle, methylfirst shell of monomers as described for methacrylate or mixtures the core under I and II
thereof second shell as described for the shell under I or IV
-15- , These graft polymers, in particular ABS and/or ASA polymers, are preferably "' employed for impact modification of PBT, optionally as a mixture.
Instead of graft polymers with a mufti-shell build-up, homogeneous, i.e.
single-shell, elastomers of buts-1,3-dime, isoprene and n-butyl acrylate or copolymers thereof can also be employed. These products can also be prepared by co-using crosslinking monomers or monomers with reactive groups.
Examples of preferred emulsion polymers are n-butyl acrylate/(meth)acrylic acid copolymers, n-butyl acrylate/glycidyl acrylate or n-butyl acrylate/glycidyl methacrylate copolymers, graft polymers with an inner core of n-butyl acrylate or based on butadiene and an outer shell of the abovementioned copolymers and copolymers of ethylene with comonomers which provide reactive groups.
The elastomers described can also be prepared by other conventional processes, e.g.
by suspension polymerization. ,~' Silicone rubbers such as are described in DE-A 37 25 576, EP-A 235 690, DE-A
00 603 and EP-A 319 290 are also preferred.
It is of course also possible to employ mixtures of the rubber types listed above.
, The polyester moulding composition preferably comprises between 0 and 40 wt.%, preferably between 0 and 30 wt.% and particularly preferably between 0 and 20 wt.%
of rubber-elastic polymers.
The partly aromatic polyester moulding compositions according to the invention are prepared by mixing the particular constituents in a known manner and subjecting the mixture to melt compounding or melt extrusion at temperatures of 200°C
to 330°C in conventional units, such as e.g. internal kneaders, extruders or twin-screw extruders.
Further additives, such as e.g. reinforcing substances, rubber-elastic polymers, - 16- , stabilizers, dyestuffs, pigments, lubricants and mould release agents, nucleating agents, compatibilizing agents and other additives, can be added during the melt compounding or melt extrusion step.
The polyamide according to the invention is preferably chosen from the group consisting of derivatives of polyamides which contain 3 to 8 methylene groups in the polymer chain per polyamide group, particularly preferably chosen from the group formed by PA6 and PA66, very particularly preferably from the group consisting of PA6 and its copolymers.
The polyamides according to the invention can be prepared here by various processes and synthesized from very different units, and in the specific instance of use can be finished, by themselves or in combination with processing auxiliaries, stabilizers, polymeric blending partners (e.g. elastomers) or also reinforcing materials (such as e.g. mineral fillers or glass fibres), to give materials with specifically established combinations of properties. Blends e.g. with contents of polyethylene, polypropylene ,~
or ABS are also suitable. The properties of the polyamides can be improved, e.g. in respect of the impact strength of e.g. reinforced polyamides, by addition of elastomers.
The large number of possible combinations allows a very large number of products with widely varying properties.
A large number of procedures have been disclosed for the preparation of polyamides, different monomer units, various chain regulators for establishing a required molecular weight or also monomers with reactive groups for after-treatments intended later being employed, depending on the desired end product.
The industrially relevant processes for the preparation of polyamides proceed without exception via polycondensation in the melt. In this context, the hydrolytic polymerization of lactams is also understood as polycondensation.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 1~ -Preferred polyamides for the combinations K(17/K(II) according to the invention are partly crystalline polyamides, which can be prepared starting from diamines and dicarboxylic acids and/or lactams having at least 5 ring members or corresponding amino acids.
Possible starting substances are, preferably aliphatic dicarboxylic acids, such as adipic acid, 2,2,4- and 2,4,4-trimethyladipic acid, azelaic acid and sebacic acid, aliphatic diamines, such as hexamethylenediamine. 2.2.4- and 2_4_4-trimethylhexamethylenediamine, the isomeric diamino-dicyclohexylinethanes and diamino-dicyclohexylpropanes and bis-aminomethyl-cyclohexane, and aminocarboxylic acids, such as aminocaproic acid, and the corresponding lactams.
Copolyamides of several of the monomers mentioned are included.
Caprolactams are particularly preferably employed, very particularly preferably s-caprolactam.
,, Most compounds based on PA6, PA66 and other aliphatic polyamides or copolyamides in which 3 to 8 methylene groups are present in the polymer chain per one polyamide group are furthermore particularly suitable.
Polyamide 6 or polyamide 6,6 or polyamide 4,6 or polyamide 6,10 or a copolyamide of the units of the homopolyamides mentioned or a copolyamide of caprolactam units and units derived from hexamethylenediamine and adipic acid are particularly preferably used. Polyamide 6 or copolyamides with polyamide 6 are very particularly preferably used.
The polyamides prepared according to the invention can also be employed as a mixture with other polyamides and/or further polymers.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 1g -The polyamide moulding compositions according to the invention can comprise additives, e.g. rubber-elastic polymers as already described above for the polyester moulding compositions.
The polyamide moulding compositions can additionally also comprise fireproofing agents, such as e.g. phosphorus compounds, organic halogen compounds, nitrogen compounds and/or magnesium hydroxide, stabilizers, colouring agents, dyestuffs or pigments, processing auxiliaries, such as e.g. lubricants, nucleating agents, stabilizers, impact modifiers, such as e.g. rubbers or polyolefins, and the like.
Possible fibrous reinforcing substances are, in addition to glass fibres, carbon fibres, aramid fibres, mineral fibres and whisker. Suitable mineral fillers which may be mentioned by way of example are calcium carbonate, dolomite, calcium sulfate, mica, fluorinated mica, wollastonite, talc and kaolin. However, other oxides or oxide hydrates of an element chosen from the group consisting of boron, aluminium, gallium, indium, silicon, tin, titanium, zirconium, zinc, yttrium or iron can also be ,~' employed. The fibrous reinforcing substances and the mineral fillers can be treated on the surface to improve the mechanical properties.
_ To obtain conductive polyamides, conductive carbon blacks, carbon fibrils, conductive polymers, metal fibres and conventional additives can be added to increase the conductpity.
The polyester moulding composition according to the invention preferably comprises fillers and/or reinforcing substances, preferably in amounts of 1 - 50 wt.%, particularly preferably between 2 - 40 wt.%, especially preferably between 5 -wt.%, based on the total weight of the polyamide moulding composition. PA
moulding compositions without fillers and/or reinforcing substances can also be employed.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -19- , The fillers can be added before, during or after the polymerization of the monomers to w give the polyamide. If the fillers according to the invention are added after the polymerization, the addition is preferably carried out by addition to the polyamide melt in an extruder. If the fillers according to the invention are added before or during the polymerization, the polymerization can include phases which are carried out in the presence of 1 to 50 per cent by weight of water.
During the addition, the fillers can already be present as particles with the particle size finally occurring in the moulding composition. Alternatively, the fillers can be added in the form of precursors, from which the particles finally occurring in the moulding composition are formed only in the course of the addition or incorporation.
Possible fire- or flameproofing agents are, for example, red phosphorus (DE-A-3 713 746 A 1 (= US-A-4 877 823) and EP-A-299 444 (= US-A-5 081 222), brominated diphenyls or diphenyl ethers in combination with antimony trioxide, and chlorinated cycloaliphatic hydrocarbons (Dechlorane~ plus from Occidental Chemical ,-' Co.), brominated styrene oligomers (e.g. in DE-A-2 703 419) and polystyrenes brominated on the nucleus (e.g. Pyro-Chek 68~ from FERRO Chemicals).
. Zinc compounds or iron oxides are also employed as a synergist to the halogen compounds mentioned.
As further alternatives, melamine salts above all have proved to be suitable flameproofing agents, especially for non-reinforced polyamides.
Magnesium hydroxide has moreover for a long time proved to be a suitable flameproofing agent for polyamide.
Polyamide moulding compositions which, in addition to glass fibres, additionally comprise rubber-elastic polymers (often also called impact modifier, elastomer or -20- , rubber) are preferred. Rubber-elastic polymers are understood here as already described above for the polyester moulding compositions.
Preferably, the polyamide moulding composition comprises 0 - 40, preferably 0 -30, S particularly preferably 3 - 20 parts by wt. of impact modifier, elastomer or rubber.
Graft polymers with a core based on acrylates and a shell based on styrene and acrylates are very particularly suitable.
Polyamide moulding compositions which are both glass fibre-reinforced and elastomer-modified are particularly preferred.
Possible polyamide types are, for example:
Polyamide type ManufacturerFibre content PA 46 TW 300 FO-F6 DSM 0 - 30% GF
PA 6 or Durethan BKV 115 Bayer 15% GF
PA 6 copoly-Durethan BKV 130 Bayer 30% GF ,' amides Durethan BKV 30 Bayer 30% GF
H
Durethan BM-240 Bayer 40% mineral Ultramid B3 EG BASF 1 S% GF
Ultramid 6 EG 3 BASF 30% GF
Ultramid B3 M 6 BASF 30% GF
Grilon PVZ - 3H Ems-Chemie 30% GF
Grilon PVS - 3H Ems-Chemie 30% GF
PA 6 + FR GrilQn XE 3524 Ems-Chemie 30% GF
Grilon PMV-SH VO Ems-Chemie 15% GF+ mineral PA 66 AKV 30 Bayer 30% GF
Ultramid A3 WG BASF 30% GF
Ultramid A3 X1 BASF 25% GF
GS
Ultramid A3 X2 BASF 24% GF
GS
Ultramid A3 X3 BASF 25% GF
GS
Ultramid A3 EG BASF 15% GF
Ultramid A3 EG BASF 30% GF
Minion 13 T 1 DuPont 30% mineral Minion 13 T 2 DuPont 30% mineral Minion 11 C 140 DuPont 40% mineral (Blend) Bergamid A70 Bergmann 15% GB
Grilon TV - 3H Ems-Chemie 30/a GF
-21 - , Polyamide type ManufacturerFibre content PA 66 + FR Grilon XE 3525 Ems-Chemie 20% GF
Ultramid A3 X1 BASF 25% GF
GS
Ultramid A3 X2 BASF 25% GF
Ultramid A3 X3 BASF 25% GF
GS
PA 66/6 72 G 30 L DuPont 30% GF
C 3 ZM 6 BASF 30% GF
M>D is understood in general as meaning the following:
"Moulded interconnect devices", abbreviated to MID, is a term introduced internationally since the beginning of the 1990s to describe three-dimensionally injection-moulded circuit carriers. They are based on the idea of producing electrical . connecting elements based on thermoplastics in a three-dimensional spatial arrangement. MIDs conduct current, form shielding or emitting surfaces, carry electronic component parts and integrate mechanical elements. The MID
technique extends the conventional printed circuit board technique which is limited to one '~
spatial plane. It competes with it in part.
There is now a wide range of MID production processes. These include hot embossing of electrically conductive films, laser structuring of strip conductcus in combination with wet chemistry metallization processes or injection moulding thermoplastic around'preformed metal structures.
One of the production processes used most frequently for MIDs is the two-component injection moulding technique with subsequent wet chemistry metallization of a component of plastic. This process allows the greatest freedom of geometrical shape in the production of MIl7s. A composite of two thermoplastics is produced, one component of which is metallizable, while the other component remains completely unaffected by the chemical action of the metallizing electrolytes.
Component parts of plastic to which partly metallic properties can be imparted by a suitable coating can be produced in this way. The metallizable plastic can be ' CA 02361399 2001-07-31 -22- , structured in the form of electrical strip conductors. However, it can also be w structured with a large surface area and thus, after the metallization, contribute towards shielding of electromagnetic interference fields, remove heat of friction in a controlled manner or itself become more wear-resistant. The structure fineness, that is to say, for example, the width of electronic strip conductors, can be reduced to about 500 p.m. Such fine strip conductor structures are achieved if the metallizable plastic is injection moulded in the first shot and the non-metallizable plastic is injection moulded around it in the second shot. However, the reverse sequence is also possible. The position and number of sprues, the costs of the material and the adhesion between the two components of plastic, inter alia, depend on the nature of the sequence.
Most of the MIDs series-produced to date are based on high performance plastics, such as polyether-sulfone (PES), polyether-imide (PEI) or liquid crystal polymers (LCP). They have been chosen in order to withstand the temperatures which arise during soldering processes, which can be up to 260°C in the short term.
Reinforced ,~
polyamides have recently moved into the foreground as an MID material, these being considerably less expensive than the high performance plastics. Some polyamide types which are suitable for soldering processes such as are used for MIDs are available.
Adhesive metallizability of plastics is a decisive point in the production of Mms. A
process (Baygamid~ process, inter alia) for adhesive metallization is used specifically for polyamides by AHC, Kerpen, a supplier of functional surface technology.
Coating is carried out by wet chemistry routes by dipping the workpieces in suitable electrolytes. A metallic stop layer about 2 ~m thick is first applied. It can be further reinforced chemically (for example with chemical nickel) or galvanically (for example with copper). Chemical and galvanic layers can also be combined with one another.
Polyamides of types PA 6, PA 66, PA 66/6 and PA 46 and copolyamides with a glass fibre or mineral fibre filler content of up to 40% can be metallized.
The WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 - 23 - , adhesive strength of the metal layers applied is more than 1 N/mm. Individual w chemically nickel-plated polyamide types pass temperature change tests, for example .
three cycles from +140°C to -40°C. There is no flaking of the layer at all in these.
The production of MIDs based on polyamide by means of the two-component injection moulding technique and subsequent wet chemistry metallization is therefore an interesting alternative to the other MID production processes on the basis of the wide freedom of geometric shape, the low costs of the material and the small number of production steps. Two applications from the automobile industry demonstrate this statement.
It was possible to reduce the production costs of a car door lock support by this MID
technique to almost half the costs of conventional production. The door lock support is in the car door behind the door handle. Depending on the extent to which the vehicle is fitted out, it is equipped with lock heating, central locking control and actuation of the automatic interior light. In conventional construction, current- ,~' conducting cords, microswitches and resistance wire must be mounted on an aluminium diecasting in an expensive manner.
In production as an MID based on polyamide, the support structure produced in the first shot already comprises all the bearing and fixing elements relevant for the later function. The metallizable component is injection moulded around this in the second shot, and after the metallization replaces the current-conducting cords of conventional production.
Another application is production of a car sliding roof control as an MID
based on polyamide. Here, first fine strip conductor structures and later also plug contacts are produced in the first shot. The second shot produces the non-metallizable base body of another polyamide type. It comprises all the mechanical component parts.
After metallization of the two-component polyamide, assembly is limited merely to equipping with the electrical component parts and soldering thereof. Compared with WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -24- , the conventional printed circuit board solution, the number of mechanical component elements is reduced and the expenditure on assembly is minimized. However, the conventional assembly technology, in particular in the area of equipping and soldering, can be retained.
' Particular advantages are accordingly:
1. Freedom in shape The use of thermoplastics for the production of circuit carriers offers the almost unlimited freedom of shape such as is rendered possible by the injection moulding technique for construction of electronic component groups. The miniaturized and lighter M>l7 component groups allow new functions and shaping of any desired forms.
2. The huh rationalization effect ,a The rationalization effect of this innovative technology and therefore the high profitability are convincing.
- By reducing the number of parts, the costs for material, production, acquisition and logistics of the mechanical and electronic component parts substituted are eliminated.
- The miniaturized Mm component groups reduce the amount of material otherwise necessary.
- By the elimination of subsequent working steps, in particular the previous introduction of through-holes, process chains for the production are shortened, and significant savings are therefore WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 -25- , achieved. Compared with conventional construction, cost advantages w of more than 30% can result.
3. Environment friendliness M>D technology is distinguished in respect of its environment friendliness by a number of improvements. Highly oxidizing acids can in some cases be omitted in the pretreatment of the most important plastics suitable for M>D.
In addition to the environment-friendly production, the reduction in the diversity of the materials also plays a decisive role. Recycling of the base materials and non-critical disposal of residual materials are thereby favoured. By employing thermoplastics, the use of thermosetting resins can be dispensed with in many applications.
Process:
., The mouldings can be produced by a process in which (A) a plastic K (n or K
(I)] is first introduced into a mould so that a partial shaped article T (17 or T (II) is formed, and (B) the other plastic K (In or K (17 is then applied at least at one point of the _ surface of the partial shaped article. In a preferred process, the mouldings are produced by two-component inj ection moulding.
Preferably, in an additional step, part of the surface of the shaped article is metallized by the conventional wet chemistry, electrolytic processes known to the expert, particularly preferably by the Baygamid~ process (Bayer AG), this additional step being carned out between steps (A) and (B), or preferably after the two steps.
In a particular embodiment, the metallization step on the metallizable plastic K (II) can preferably comprise the following steps: Chemical roughening of the surface, e.g.
with a calcium chloride solution. Deposition of an activator, e.g. palladium ions.
Sensitization, e.g. by reducing the palladium cations to palladium. Chemical -26- , deposition of a conductive material, e.g. nickel or copper, by e.g. palladium-catalysed reduction of soluble nickel or copper ion complexes. Electrochemical conversion (electrogalvanization, optionally with a mufti-layer build-up). This is all carried out as is described e.g. in DE 43 28 883 or EP 146 723 or EP 146 724, which are hereby incorporated into this specification by reference. Further descriptions of these or similar processes are to be found in the literature (G. D. Wolf, F. Fiinger, Metalli-sierte Polyamid-Spritzgul3teile, Bayer SN 19038, May 1989; U. Tyszka, Die serienmaf3ige, grol3technische galvanische Metallisierung von Spritzgul3teilen aus Polyamid, Galvanotechnik 80, 1989, p.2 et seq.; and the literature cited there).
The metallization of surfaces of plastics can be achieved by physical metallization (preferably vapour deposition of metal, vacuum metallization) or chemical metallization, preferably wet chemistry currentless or wet chemistry electrogalvanic metallization (galvanization), chemical metallization, in particular wet chemistry (currentless or electrogalvanic) metallization being particularly preferred for this invention.
l~
For mouldings of polyamides, a special process has been developed which takes into account the chemical character of the polyamide in the breakdown/roughening step - and carries out the activation step with complex compounds of palladium and platinum and complexing agents which guarantee a high affinity for the polyamide surface. An embodirpent is described in the following.
The core of the process is a relatively simple pretreatment process with organometallic activators which have been developed for use in novel metallization processes. They are complex compounds of noble metals, preferably of palladium or platinum, with various organic ligands.
The organic ligands have been chosen such that a particular affinity for the polyamide surface results, which provides a considerable contribution towards the - adhesive strength of the metal layer to be applied. On the basis of this novel ' WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 activation principle, it has been possible to achieve the situation where only a very w slight roughening of the polyamide surface has to be carried out as an additional measure for a very good adhesion of the metal.
The total pretreatment before the chemical nickel-plating specifically comprises the following stages:
- roughening of the polyamide surface in a pretreatment bath, - activation in an activating bath comprising the palladium complex, - sensitization of the activated substrate surface.
The residence time in the baths is 5 to 10 minutes at approx. 40°C.
After activation and sensitization, the substrate is in each case rinsed thoroughly.
Thereafter, the first metal layer can be deposited directly in any desired chemical nickel bath.
When a first adhesive conductive metal layer has been applied, the conventional galvanizing process, i.e. the galvanic layer build-up of nickel/copper/nickel/chromium, can ,~' follow without problems.
Adhesive metallization of various commercially available polyamides is possible with the process. For example, the use of the process is not linked to polyamide 6 types. Injection-moulded components of polyamide 66 can also be metallized without problems by adhering to the optimized process parameters.
Tailor-made metallizable polyamide types which are reinforced with glass fibres for the requirements of high rigidity and heat distortion point or with mineral fibres to establish a reduced tendency to warp are now available. Products which have been rendered flame-retardant are also available in this way.
To achieve a particularly good galvanizability, polyamide types with a specific elastomer modification have been developed. The class of elastomer-modified, glass - fibre-reinforced polyamides is particularly suitable for components which must meet WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 _28_ the highest requirements in respect of dimensional stability, dynamic fatigue strength and heat distortion point, for example for use in motor vehicle engine spaces.
The glass fibre reinforcement significantly reduces the thermal expansion coefficients of the injection-moulded components, so that the adhesive bond between the metal surface and substrate of plastic is guaranteed even during extreme changes in temperature.
In a particular embodiment, the galvanization step preferably on the metallizable plastic K (II] comprises the following steps: G(n Breaking down of the surface by superficially dissolving baths comprising preferably calcium salts, G(II) chemical deposition of metals, preferably palladium, to produce a conductive surface, particularly preferably by activators and G(IIn electrogalvanization, optionally with a multi-layer build-up, such as is described e.g, in DE 43 28 883 or EP 146 723 or EP
146 724, which are hereby incorporated into this specification by reference.
For example, a partial shaped article or a shaped article is treated analogously to the following process:
A 90 x 150 x 3 mm thick glass fibre-reinforced (30% glass fibres) sheet of polyamide 6 was treated in a pretreatment bath with a flash point of >110°C of the following composition:
64 parts by wt. ~ CaCl2 (anhydrous, dissolved in 100 parts by vol. water) plus 100 parts by vol. HCl (37%) and 800 parts by vol. ethylene glycol (glycol) for 10 minutes at 40°C.
This is followed by rinsing in glycol at room temperature (RT) and then activation in a bath comprising WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 0.7 part by wt. PdCl2,
7 part by wt. CaCl2 (anhydrous) and 1,000 parts by vol. glycol.
Residence time in this bath 5 minutes at RT. The flash point of the activation solution is >_ 100°C.
After renewed rinsing in glycol at RT, the sensitization was carried out at RT
in a bath of the following composition:
1.5 parts by wt. dimethylaminborane, cryst. (DMAB), 1.5 parts by wt. NaOH lozenges and 1000 parts by vol. glycol.
Thereafter, the sheet was rinsed very thoroughly in water at RT and then nickel-plated in a commercially available hypophosphite-containing nickel-plating bath ,~
from Blasberg AG, Solingen at 30°C for 15 minutes. It was striking that the nickel-plating took place very uniformly. The adhesive strength of the metal deposit, determined by the peel strength according to DIN 53 494, is >_ 60 N/25 mm. The _ galvanic reinforcement of the abovementioned polyamide sheet for determination of the peel strength was carried out as follows:
a) pickling in 10% H2S04 for half a minute, b) rinsing, c) S minutes in semi-bright nickel bath, voltage 9 volt, bath temperature 60°C, d) rinsing, e) pickling for half a minute, f) 90 minutes in a copper bath; voltage 1.9 volt, bath temperature 28°C, g) rinsing.
-30- , A metal coating with outstanding adhesion is obtained. The adhesive strength according to DIN 53 494 is 60 N/25 mm.
Alternatively:
A moulding of a polyamide 6 reinforced with 30 wt.% glass fibres was pretreated according to example 1, activated, sensitized, nickel-plated by a chemical route and then reinforced galvanically. The galvanic layer build-up of Ni/Cu/Ni/Cr was obtained as follows:
a) pickling in IO% H2S04 for half a minute, b) rinsing, c) 5 minutes in a semi-bright nickel bath, voltage 4 volt, bath temperature 60°C, . semi-bright nickel layer deposited: approx. 4 to S p, d) rinsing, e) pickling for half a minute, fj 30 minutes in a copper bath; voltage 1.9 volt, bath temperature 28°C, copper l' layer applied 15 to 16 p., g) rinsing.
h) pickling for half a minute, . i) 8 minutes in a bright nickel bath, voltage 5.5 volt, bath temperature 52°C, nickel layer deposited: approx. 20 ~,, j) rinsing, , k) dipping in oxalic acid (0.5% aqueous solution), 1) 3 minutes in a bright chromium bath, voltage 4.5 volt, bath temperature 40°C, chromium layer deposited: approx. 0.3 p, m) rinsing, n) decontamination in a 40% bisulfate solution, o) rinsing in distilled water.
The shaped article metallized in this way was exposed to the temperature change test according to DIN 53 496, the hot storage taking place at + 110°C and the cold storage -31 - , at -40°C. The metal deposit adheres so firmly to the surface of the shaped article that °"
it shows no change.
The most favourable process for the production of the mouldings is carried out by a two-component injection moulding process and subsequent galvanization.
Previously, two-component injection moulding process designated only the process in which two materials are injection moulded into one another. In the present case, however, two plastics are injection moulded on to one another. This process in turn was previously called two-colour injection moulding. Typewriter keys, gearswitch knobs and the like have preferably been produced by this process by first injection moulding a cap with a blank area in the form of the symbol to be represented.
A
material of a different colour was then injection moulded behind this, the blank area for the symbol being filled.
The process to be described here is carried out in a similar manner. A
metallizable ,~' plastic which is not electrically conductive is as a rule used for the first "shot". The strip conductor geometry of the MID is imaged in relief during this operation.
In the second shot, the areas between the strip conductors are filled with a non-. metallizable plastic.
Alternatively, the strip conductor structure can be injection-moulded as a depression from the non-metallizable component in the first shot, and filled with the metallizable component in the second shot. After the second shot, the MID base part has its final geometric shape, and the metallizable component is metallized in the subsequent steps.
Two-component injection moulding offers the greatest geometric freedom of all the Mm production processes. Difficult strip conductor geometries and through-platings can be realized in this process. Structuring of the strip conductor geometry takes place during the injection moulding. The smallest strip conductor width is 0.25 mm.
CA 02361399 2001-07-31 pCT/EP00/00445 -32- , It depends on the flow properties of the plastic and the flow lengths in the mould.
Because of the short process chains, low piece costs result for large series.
Different cavities are necessary for injection of the first and second shot. The plastics used here must have a goad so-called melt compatibility so that a good adhesion results when S they are inj ection moulded on to ore another.
Two-component injection moulding is characterized by the following points:
- greatest geometric freedom of all the MID production processes - geometric freedom limited only by the injection mouldability - structuring takes place by two mould cavities - high currents can be realized - short process chain - low piece costs for large series - through-platings without problems - fine pitch possible to a limited extent ,, - decorative surfaces possible to a limited extent Use The component pmts with integrated electrically conductive sections can preferably be used for electrical applications, particularly preferably in vehicle engineering, machine construction, computer engineering, domestic electronics. domestic electrical appliances, illumination engineering and installation engineering.
In principle, however, it is possible to realize all possible shape possibilities and therefore also all uses which exist for parts of plastic with the moulding according to the invention and the processes according to the invention, including metal surfaces and strip conductors, e.g. also snap and click elements, for example snap hooks for fixing microswitches etc.
WO 00/46419 CA 02361399 2001-07-31 pCTBP00/00445 -33- , Examples The experiments were carried out (injection moulding, metallization) on conventional shaped articles produced by 2-component injection moulding for 3D
MID applications, such as, for example, plug boards (Plastics in Practice 1/98, Bayer AG Leverkusen, issue 30.04.98, KU 11501-9804 d,e/4822818, p 17), boards for controlling sliding roofs (Der Vorgriff auf die Zukunft: Bayer-Thermoplaste fiir die 3-D MID-Technologie, Bayer AG Leverkusen, KU 46052d/4260437, issue 03.97, p.
7) or lamp carrier plates.
The two components were processed under the conventional conditions for the particular moulding compositions (PA: ISO 1874; PBT: ISO 7792).
. Generally for PA6: material temperature 260 - 280°C, mould temperature approx. 70 - 90°C.
Generally for PBT: material temperature 240 - 280°C, mould temperature approx. 70 ~.~
- 90°C. Generally, for PET: material temperature 270 - 310°, mould temperature 80 -140°C.
Polyester types which have been investigated for galvanizability by the Baygamid process under the conventional conditions for PA with the aid of injection-moulded test specimens (60 * 40 * 4 mm3) and show good results:
Pocan B3235: 30% glass fibres (PBT, MHMR, 10 - 100, GF 30) Pocan B4235: 30% glass fibres, flameproofed (PBT, MFHR, 10 - 110, GF 30) Pocan KU2-7033: 30% glass fibres, elastomer-modified (PBT, MHPR, - 080, GF 30) None of the three types can be galvanized. AFM photographs do not indicate serious changes to the surface.
. WO 00/46419 PCT/EP00/00445 Reinforced polyester types which also show good results:
Pocan B3215: 10% glass fibres (PBT, MHMR, 10 - 070, GF 10) Pocan KL1-7265: 15% glass fibres (PBT, MHMR, 10 -0 60, GF 15) Pocan B3225: 20% glass fibres (PBT, MHMR, 10 - 070, GF 20) Pocan B4225: 20% glass fibres, flameproofed (PBT, MFHR, 10 - 070, GF 20) Non-reinforced polyester types which can also be taken in principle:
Pocan B 1305: medium viscosity (PBT, MHMR, 10 - 030, N) Pocan B1505: medium to high viscosity (PBT, MHMR, 14 - 030, N) Pocan B1800: high viscosity (PBT, EN, 16 - 030) Metallizability or galvanizability of polyamide types or Durethan types by the Baygamid~ process:
,, Outstanding galvanizability (particularly good adhesive strength between the metal and polyamide) is shown e.g. by the following polyamide types or Durethan types:
_ Durethan BKV 130: 30% glass fibres, elastomer-modified; moulding composition code according to ISO 1874: PA6,MPR,14-090,GF30 Durethan BKV 115: IS% glass fibres, elastomer-modified, moulding composition code according to ISO 1874: PA6,MPR,14-060,GF1 S
Very good galvanizability is shown e.g. by the following polyamide types or Durethan types:
Durethan BKV 230: PA 6 injection moulding type with 30% glass fibres, elastomer modified, moulding composition code according to ISO 1874: PA6,MPR,14 080,GF30 -35- , Durethan BKV 215: PA 6 injection moulding type with 15% glass fibres, elastomer-modified, moulding composition code according to ISO 1874: PA6,MPR,14-040,GF 15 Durethan BKV 30 H1.0: PA 6 injection moulding type with 30% glass fibres, heat-stabilized, moulding composition code according to ISO 1874: PA6,MHR,14-1 OO,GF30 Durethan AKV 30: PA 66 injection moulding type with 30% glass fibres; moulding composition code according to ISO 1874: PA66,MR,14-090,GF30 Durethan B 30 S: PA 6 injection moulding type, good flow properties, easily removed from the mould, rapidly solidifying; moulding composition code according to ISO 1874: PA6,MR,14-030,N
Durethan A 30 S: PA 66 standard injection moulding type, non-reinforced, very ,~
easily removed from the mould; moulding composition code according to ISO
1874:
PA66, MR, 14-040N
_ The mouldings according to the invention show advantages in three established tests for M117. ' Adhesive strength Adhesion of a layer comprising 2 p,m of chemical nickel (stop layer) and 40 p,m of galvanic copper according to DIN 53 494. The adhesive strength of metal layers on plastics is tested according to this standard. In the present case, the test indicates the adhesive strength of chemical nickel on the polyamide component directly. The adhesion was more than 40 N/25 mm ' WO 00/46419 CA 02361399 2001-07-31 pCT1EP00/00445 -36- , Temperature char e~ests The layer system of 2 ~,m of chemical nickel (stop layer) and 10 ~.m of chemical nickel (top layer) was investigated under various conditions.
Cross-hatch test Using a carbide pin, two parallel lines are scratched in the surface two millimetres apart, and two further lines are scratched in perpendicular to these the same distance apart. The squares enclosed by the lines must not flake off in this test.
The layer system of 2 pm of chemical nickel (stop layer) and 10 pm of chemical nickel (top layer) passed the test.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 Particular advantages resulted in the tests on shaped articles produced by 2C
injection moulding of the following material combinations.
No. Component ComponentGalvanizabilityGalvanizabilityCompatibility at K(I) K(11) K(n K(I)7 the interface 1 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 galvanizationN/mm twisting the moulding 2 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 galvanizationN/mm twisting the moulding 3 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 black galvanizationN/mm twisting the moulding 4 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 215 surface afterstrength noises on > 1 black galvanizationN/mm twisting the moulding Pocan , DurethanUnchanged Very good No grinding peel KL 1-7265 BKV 115 surface afterstrength noises -> 1 on ' galvanizationN/mm twisting the moulding Comp. Grilamid DurethanUnchanged Very good Severe grinding 1 LV- peel 3H (PA BKV 115 surface afterstrength noises on 12) > 1 galvanizationN/mm twisting the moulding - 3g _ , Particular advantages of the process found in the context of the examples are:
- 100% non-galvanizability of Pocan by the Baygamid process, and in particular both of non-reinforced, reinforced, elastomer-modified and/or flameproofed S types.
- Compared with PA 12, only a very low uptake of water by polyesters (PBT).
- The combination PBT / PA6 shows, when using PBT and PA6 compounds with similar shrinkage values (can be established by adjusting the amounts of filler), no problems in releasing from the mould in 2C injection moulding and no grinding noises when the shaped articles are twisted, which indicates a decidedly good bonding of the materials. As a result, undesirable penetration of constituents of the metallizing baths into the contact zone between K (I) and K (I)) cannot occur. Combination 5 of the table is particularly preferred, since Pocan KL1-and BKV 115 have very similar shrinkage values because of the same glass fibre e' contents.
Residence time in this bath 5 minutes at RT. The flash point of the activation solution is >_ 100°C.
After renewed rinsing in glycol at RT, the sensitization was carried out at RT
in a bath of the following composition:
1.5 parts by wt. dimethylaminborane, cryst. (DMAB), 1.5 parts by wt. NaOH lozenges and 1000 parts by vol. glycol.
Thereafter, the sheet was rinsed very thoroughly in water at RT and then nickel-plated in a commercially available hypophosphite-containing nickel-plating bath ,~
from Blasberg AG, Solingen at 30°C for 15 minutes. It was striking that the nickel-plating took place very uniformly. The adhesive strength of the metal deposit, determined by the peel strength according to DIN 53 494, is >_ 60 N/25 mm. The _ galvanic reinforcement of the abovementioned polyamide sheet for determination of the peel strength was carried out as follows:
a) pickling in 10% H2S04 for half a minute, b) rinsing, c) S minutes in semi-bright nickel bath, voltage 9 volt, bath temperature 60°C, d) rinsing, e) pickling for half a minute, f) 90 minutes in a copper bath; voltage 1.9 volt, bath temperature 28°C, g) rinsing.
-30- , A metal coating with outstanding adhesion is obtained. The adhesive strength according to DIN 53 494 is 60 N/25 mm.
Alternatively:
A moulding of a polyamide 6 reinforced with 30 wt.% glass fibres was pretreated according to example 1, activated, sensitized, nickel-plated by a chemical route and then reinforced galvanically. The galvanic layer build-up of Ni/Cu/Ni/Cr was obtained as follows:
a) pickling in IO% H2S04 for half a minute, b) rinsing, c) 5 minutes in a semi-bright nickel bath, voltage 4 volt, bath temperature 60°C, . semi-bright nickel layer deposited: approx. 4 to S p, d) rinsing, e) pickling for half a minute, fj 30 minutes in a copper bath; voltage 1.9 volt, bath temperature 28°C, copper l' layer applied 15 to 16 p., g) rinsing.
h) pickling for half a minute, . i) 8 minutes in a bright nickel bath, voltage 5.5 volt, bath temperature 52°C, nickel layer deposited: approx. 20 ~,, j) rinsing, , k) dipping in oxalic acid (0.5% aqueous solution), 1) 3 minutes in a bright chromium bath, voltage 4.5 volt, bath temperature 40°C, chromium layer deposited: approx. 0.3 p, m) rinsing, n) decontamination in a 40% bisulfate solution, o) rinsing in distilled water.
The shaped article metallized in this way was exposed to the temperature change test according to DIN 53 496, the hot storage taking place at + 110°C and the cold storage -31 - , at -40°C. The metal deposit adheres so firmly to the surface of the shaped article that °"
it shows no change.
The most favourable process for the production of the mouldings is carried out by a two-component injection moulding process and subsequent galvanization.
Previously, two-component injection moulding process designated only the process in which two materials are injection moulded into one another. In the present case, however, two plastics are injection moulded on to one another. This process in turn was previously called two-colour injection moulding. Typewriter keys, gearswitch knobs and the like have preferably been produced by this process by first injection moulding a cap with a blank area in the form of the symbol to be represented.
A
material of a different colour was then injection moulded behind this, the blank area for the symbol being filled.
The process to be described here is carried out in a similar manner. A
metallizable ,~' plastic which is not electrically conductive is as a rule used for the first "shot". The strip conductor geometry of the MID is imaged in relief during this operation.
In the second shot, the areas between the strip conductors are filled with a non-. metallizable plastic.
Alternatively, the strip conductor structure can be injection-moulded as a depression from the non-metallizable component in the first shot, and filled with the metallizable component in the second shot. After the second shot, the MID base part has its final geometric shape, and the metallizable component is metallized in the subsequent steps.
Two-component injection moulding offers the greatest geometric freedom of all the Mm production processes. Difficult strip conductor geometries and through-platings can be realized in this process. Structuring of the strip conductor geometry takes place during the injection moulding. The smallest strip conductor width is 0.25 mm.
CA 02361399 2001-07-31 pCT/EP00/00445 -32- , It depends on the flow properties of the plastic and the flow lengths in the mould.
Because of the short process chains, low piece costs result for large series.
Different cavities are necessary for injection of the first and second shot. The plastics used here must have a goad so-called melt compatibility so that a good adhesion results when S they are inj ection moulded on to ore another.
Two-component injection moulding is characterized by the following points:
- greatest geometric freedom of all the MID production processes - geometric freedom limited only by the injection mouldability - structuring takes place by two mould cavities - high currents can be realized - short process chain - low piece costs for large series - through-platings without problems - fine pitch possible to a limited extent ,, - decorative surfaces possible to a limited extent Use The component pmts with integrated electrically conductive sections can preferably be used for electrical applications, particularly preferably in vehicle engineering, machine construction, computer engineering, domestic electronics. domestic electrical appliances, illumination engineering and installation engineering.
In principle, however, it is possible to realize all possible shape possibilities and therefore also all uses which exist for parts of plastic with the moulding according to the invention and the processes according to the invention, including metal surfaces and strip conductors, e.g. also snap and click elements, for example snap hooks for fixing microswitches etc.
WO 00/46419 CA 02361399 2001-07-31 pCTBP00/00445 -33- , Examples The experiments were carried out (injection moulding, metallization) on conventional shaped articles produced by 2-component injection moulding for 3D
MID applications, such as, for example, plug boards (Plastics in Practice 1/98, Bayer AG Leverkusen, issue 30.04.98, KU 11501-9804 d,e/4822818, p 17), boards for controlling sliding roofs (Der Vorgriff auf die Zukunft: Bayer-Thermoplaste fiir die 3-D MID-Technologie, Bayer AG Leverkusen, KU 46052d/4260437, issue 03.97, p.
7) or lamp carrier plates.
The two components were processed under the conventional conditions for the particular moulding compositions (PA: ISO 1874; PBT: ISO 7792).
. Generally for PA6: material temperature 260 - 280°C, mould temperature approx. 70 - 90°C.
Generally for PBT: material temperature 240 - 280°C, mould temperature approx. 70 ~.~
- 90°C. Generally, for PET: material temperature 270 - 310°, mould temperature 80 -140°C.
Polyester types which have been investigated for galvanizability by the Baygamid process under the conventional conditions for PA with the aid of injection-moulded test specimens (60 * 40 * 4 mm3) and show good results:
Pocan B3235: 30% glass fibres (PBT, MHMR, 10 - 100, GF 30) Pocan B4235: 30% glass fibres, flameproofed (PBT, MFHR, 10 - 110, GF 30) Pocan KU2-7033: 30% glass fibres, elastomer-modified (PBT, MHPR, - 080, GF 30) None of the three types can be galvanized. AFM photographs do not indicate serious changes to the surface.
. WO 00/46419 PCT/EP00/00445 Reinforced polyester types which also show good results:
Pocan B3215: 10% glass fibres (PBT, MHMR, 10 - 070, GF 10) Pocan KL1-7265: 15% glass fibres (PBT, MHMR, 10 -0 60, GF 15) Pocan B3225: 20% glass fibres (PBT, MHMR, 10 - 070, GF 20) Pocan B4225: 20% glass fibres, flameproofed (PBT, MFHR, 10 - 070, GF 20) Non-reinforced polyester types which can also be taken in principle:
Pocan B 1305: medium viscosity (PBT, MHMR, 10 - 030, N) Pocan B1505: medium to high viscosity (PBT, MHMR, 14 - 030, N) Pocan B1800: high viscosity (PBT, EN, 16 - 030) Metallizability or galvanizability of polyamide types or Durethan types by the Baygamid~ process:
,, Outstanding galvanizability (particularly good adhesive strength between the metal and polyamide) is shown e.g. by the following polyamide types or Durethan types:
_ Durethan BKV 130: 30% glass fibres, elastomer-modified; moulding composition code according to ISO 1874: PA6,MPR,14-090,GF30 Durethan BKV 115: IS% glass fibres, elastomer-modified, moulding composition code according to ISO 1874: PA6,MPR,14-060,GF1 S
Very good galvanizability is shown e.g. by the following polyamide types or Durethan types:
Durethan BKV 230: PA 6 injection moulding type with 30% glass fibres, elastomer modified, moulding composition code according to ISO 1874: PA6,MPR,14 080,GF30 -35- , Durethan BKV 215: PA 6 injection moulding type with 15% glass fibres, elastomer-modified, moulding composition code according to ISO 1874: PA6,MPR,14-040,GF 15 Durethan BKV 30 H1.0: PA 6 injection moulding type with 30% glass fibres, heat-stabilized, moulding composition code according to ISO 1874: PA6,MHR,14-1 OO,GF30 Durethan AKV 30: PA 66 injection moulding type with 30% glass fibres; moulding composition code according to ISO 1874: PA66,MR,14-090,GF30 Durethan B 30 S: PA 6 injection moulding type, good flow properties, easily removed from the mould, rapidly solidifying; moulding composition code according to ISO 1874: PA6,MR,14-030,N
Durethan A 30 S: PA 66 standard injection moulding type, non-reinforced, very ,~
easily removed from the mould; moulding composition code according to ISO
1874:
PA66, MR, 14-040N
_ The mouldings according to the invention show advantages in three established tests for M117. ' Adhesive strength Adhesion of a layer comprising 2 p,m of chemical nickel (stop layer) and 40 p,m of galvanic copper according to DIN 53 494. The adhesive strength of metal layers on plastics is tested according to this standard. In the present case, the test indicates the adhesive strength of chemical nickel on the polyamide component directly. The adhesion was more than 40 N/25 mm ' WO 00/46419 CA 02361399 2001-07-31 pCT1EP00/00445 -36- , Temperature char e~ests The layer system of 2 ~,m of chemical nickel (stop layer) and 10 ~.m of chemical nickel (top layer) was investigated under various conditions.
Cross-hatch test Using a carbide pin, two parallel lines are scratched in the surface two millimetres apart, and two further lines are scratched in perpendicular to these the same distance apart. The squares enclosed by the lines must not flake off in this test.
The layer system of 2 pm of chemical nickel (stop layer) and 10 pm of chemical nickel (top layer) passed the test.
WO 00/46419 CA 02361399 2001-07-31 pCT/EP00/00445 Particular advantages resulted in the tests on shaped articles produced by 2C
injection moulding of the following material combinations.
No. Component ComponentGalvanizabilityGalvanizabilityCompatibility at K(I) K(11) K(n K(I)7 the interface 1 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 galvanizationN/mm twisting the moulding 2 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 galvanizationN/mm twisting the moulding 3 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 115 surface afterstrength noises on > 1 black galvanizationN/mm twisting the moulding 4 Pocan B DurethanUnchanged Very good No grinding 3225 peel BKV 215 surface afterstrength noises on > 1 black galvanizationN/mm twisting the moulding Pocan , DurethanUnchanged Very good No grinding peel KL 1-7265 BKV 115 surface afterstrength noises -> 1 on ' galvanizationN/mm twisting the moulding Comp. Grilamid DurethanUnchanged Very good Severe grinding 1 LV- peel 3H (PA BKV 115 surface afterstrength noises on 12) > 1 galvanizationN/mm twisting the moulding - 3g _ , Particular advantages of the process found in the context of the examples are:
- 100% non-galvanizability of Pocan by the Baygamid process, and in particular both of non-reinforced, reinforced, elastomer-modified and/or flameproofed S types.
- Compared with PA 12, only a very low uptake of water by polyesters (PBT).
- The combination PBT / PA6 shows, when using PBT and PA6 compounds with similar shrinkage values (can be established by adjusting the amounts of filler), no problems in releasing from the mould in 2C injection moulding and no grinding noises when the shaped articles are twisted, which indicates a decidedly good bonding of the materials. As a result, undesirable penetration of constituents of the metallizing baths into the contact zone between K (I) and K (I)) cannot occur. Combination 5 of the table is particularly preferred, since Pocan KL1-and BKV 115 have very similar shrinkage values because of the same glass fibre e' contents.
Claims (18)
1. Moulding comprising at least two thermoplastics K (I) and K (II), characterized in that at least one plastic K (I) is a partly aromatic polyester and at least one plastic K (II) is a polyamide.
2. Moulding according to claim 1, characterized in that the plastic or plastics K (I) and the plastic or plastics K (II) are present macroscopically in separate phases to the extent of more than 90 wt.%, based on the particular type of plastic.
3. Moulding according to at least one of the preceding claims, characterized in that the partly aromatic polyester is chosen from the group consisting of derivatives of polyalkylidene terephthalates, preferably chosen from the group consisting of polyethylene terephthalates, polytrimethylene terephthalates and polybutylene terephthalates, particularly preferably polybutylene terephthalates, very particularly preferably polybutylene terephthalate.
4. Moulding according to at least one of the preceding claims, characterized in that the polyamide is chosen from the group consisting of derivatives of polyamides which contain 3 to 8 methylene groups in the polymer chain per polyamide group, particularly preferably chosen from the group formed by PA6 and PA66, very particularly preferably from the group consisting of PA6 and its copolymers.
5. Moulding according to at least one of the preceding claims, characterized in that part of the surface is metallized and/or galvanized, preferably metallized by a currentless wet chemistry means, particularly preferably metallized by a currentless wet chemistry means and then electrogalvanically, preferably less than 98%, particularly preferably less than 70%, very particularly preferably less than 40%.
6. Moulding according to at least one of the preceding claims, characterized in that only one of the two plastics K (I) and K (II) is metallized, preferably metallized by a currentless wet chemistry means, particularly preferably metallized by a currentless wet chemistry means and then electrogalvanically, preferably plastic K (II), particularly preferably the polyamide part of plastic K (II).
7. Moulding according to at least one of the preceding claims, characterized in that the weight ratio between plastic K (I) and K (II) is greater than 10:90, preferably greater than 50:50, particularly preferably greater than 70:30, very particularly preferably between 80:20 and 99:1.
8. Moulding according to at least one of the preceding claims, characterized in that one of the two or both plastics or mixtures of plastics K (I) or K (II) comprise one or more reinforcing substances V (I) in plastic K (I), or one or more reinforcing substances V (II) in plastic K (II), preferably in amounts of between 1 and 50 wt.%, preferably between 2 and 40 wt.%, particularly preferably between 5 and 35 wt.%, in each case based on the total weight of the particular plastics moulding compositions.
9. Moulding according to at least one of the preceding claims, characterized in that the two plastics comprise reinforcing substances, preferably in a weight ratio of V (I) to V (II) of between 90:10 and 10:90, particularly preferably between 70:30 and 30:70, very particularly preferably between 60:40 and 40:60, and extremely preferably between 55:45 and 45:55.
10. Moulding according to at least one of the preceding claims, characterized in that the two plastics comprise glass fibres, preferably in a weight ratio of V
(I) to V (II) of between 90:10 and 10:90, particularly preferably between 70:30 and 30:70, very particularly preferably between 60:40 and 40:60, and extremely preferably between 55:45 and 45:55.
(I) to V (II) of between 90:10 and 10:90, particularly preferably between 70:30 and 30:70, very particularly preferably between 60:40 and 40:60, and extremely preferably between 55:45 and 45:55.
11. Moulding according to at least one of the preceding claims, characterized in that one of the two or both plastics or mixtures of plastics K (I) or K (II) comprise one or more elastomer modifying agents E (I) in plastic K (I), or one or more elastomer modifying agents E (II) in plastic K (II), preferably in amounts of between 0 and 40 wt.%, preferably between 0 and 30 wt.%, particularly preferably between 3 and 20 wt.%, in each case based on the total weight of the particular plastics moulding compositions.
12. Moulding according to at least one of the preceding claims, characterized in that plastic K (I) is a glass fibre-reinforced PBT and plastic K (II) is a glass fibre-reinforced, elastomer-modified PA, plastic K (I) and K (II) in each case preferably comprising 10 - 30 wt.% of glass fibres and plastic K (II) preferably comprising 3 - 10 wt.% of elastomer modifying agent, based on the total weight of the particular plastic moulding compositions.
13. Moulding according to at least one of the preceding claims, characterized in that either plastic K (I) and/or plastic K (II) also additionally comprises further conventional additives in amounts of up to 5 wt.%, based on the particular plastic.
14. Process for the production of a moulding according to at least one of claims 1 to 13, characterized in that (A) a plastic K (I) or K (II) is first introduced into a mould so that a partial shaped article T (I) or T (II) is formed, and (B) the other plastic K (II) or K (I) is then applied at least at one point of the surface of the partial shaped article, the process preferably being two-component injection moulding.
15. Process according to claim 14, characterized in that, in an additional step, part of the surface of the shaped article is metallized, preferably metallized by a currentless wet chemistry means, particularly preferably metallized by a currentless wet chemistry means and then metallized electrogalvanically, this additional step being carried out between steps (A) and (B), or preferably after the two steps.
16. Process according to at least one of the preceding claims 14 and/or 15, characterized in that the metallization step, preferably of the metallizable plastic K (II), comprises the following steps: chemical roughening of the surface, preferably with a calcium chloride solution, deposition of an activator, preferably palladium ions, sensitization, preferably by reducing the palladium cations to palladium, chemical deposition of a conductive material, preferably nickel or copper, electrochemical conversion (galvanization) and possibly build-up of further layers.
.17. Process according to at least one of the preceding claims 14 to 16, characterized in that it is carried out by at least one two-component injection moulding process and subsequent metallization.
18. Use of one of the mouldings according to at least one of claims 1 to 13 and/or at least one process product according to at least one of claims 14 to 17 as a component part with integrated electrically conductive sections, preferably in vehicle engineering, machine construction, computer engineering, domestic electronics, domestic electrical appliances, illumination engineering and installation engineering.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19904217A DE19904217A1 (en) | 1999-02-03 | 1999-02-03 | Metallizable molded part for molded interconnection devices, e.g. in cars, machines or computers, comprises a combination of partly aromatic polyester and polyamide, made by two-component injection molding |
DE19904217.9 | 1999-02-03 | ||
DE1999107245 DE19907245A1 (en) | 1999-02-19 | 1999-02-19 | Metallizable molded part for molded interconnection devices, e.g. in cars, machines or computers, comprises a combination of partly aromatic polyester and polyamide, made by two-component injection molding |
DE19907245.0 | 1999-02-19 | ||
PCT/EP2000/000445 WO2000046419A2 (en) | 1999-02-03 | 2000-01-21 | Metallizable moulded part |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2361399A1 true CA2361399A1 (en) | 2000-08-10 |
Family
ID=26051642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002361399A Abandoned CA2361399A1 (en) | 1999-02-03 | 2000-01-21 | Metallizable moulded part |
Country Status (11)
Country | Link |
---|---|
EP (1) | EP1155162A2 (en) |
JP (1) | JP2002536503A (en) |
KR (1) | KR20010101932A (en) |
CN (1) | CN1345383A (en) |
AU (1) | AU2439400A (en) |
BR (1) | BR0008005A (en) |
CA (1) | CA2361399A1 (en) |
CZ (1) | CZ20012837A3 (en) |
HK (1) | HK1044969A1 (en) |
PL (1) | PL350124A1 (en) |
WO (1) | WO2000046419A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130338272A1 (en) * | 2012-06-18 | 2013-12-19 | Basf Se | Flame-retardant polyesters with polyacrylonitriles |
CN109810498A (en) * | 2018-12-21 | 2019-05-28 | 宁国市加能密封件有限公司 | A kind of electronic vacuum pump diaphragm injection molding body framework material and preparation method thereof |
US11208555B2 (en) | 2016-12-30 | 2021-12-28 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition for laser direct structuring process and molded article produced therefrom |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4569478B2 (en) * | 2006-01-17 | 2010-10-27 | 村田機械株式会社 | Tray transport system |
JP5110560B2 (en) * | 2007-01-19 | 2012-12-26 | 国立大学法人 東京大学 | Method for forming conductive spring |
CN101873766B (en) * | 2010-06-02 | 2011-07-27 | 上海律图表面处理有限公司 | Method for manufacturing conductor track structure |
JP6329415B2 (en) * | 2014-03-31 | 2018-05-23 | 株式会社アツミテック | Speed change operation device for vehicle |
CN110983764B (en) * | 2019-12-20 | 2022-04-05 | 上海大学 | A kind of conductive aramid fiber with composite metal coating structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IN167760B (en) * | 1986-08-15 | 1990-12-15 | Kollmorgen Tech Corp | |
AU610555B2 (en) * | 1987-02-06 | 1991-05-23 | Mitsubishi Gas Chemical Company, Inc. | Parison and blow-moulded containers and processes for production thereof |
JPH0788027B2 (en) * | 1989-10-26 | 1995-09-27 | ポリプラスチックス株式会社 | Two-color molded product for circuit formation |
DE4112668A1 (en) * | 1991-04-18 | 1992-10-22 | Huels Chemische Werke Ag | THERMOPLASTIC MULTILAYER COMPOSITION |
-
2000
- 2000-01-21 CZ CZ20012837A patent/CZ20012837A3/en unknown
- 2000-01-21 WO PCT/EP2000/000445 patent/WO2000046419A2/en not_active Application Discontinuation
- 2000-01-21 AU AU24394/00A patent/AU2439400A/en not_active Abandoned
- 2000-01-21 EP EP00902624A patent/EP1155162A2/en not_active Withdrawn
- 2000-01-21 CN CN00805634A patent/CN1345383A/en active Pending
- 2000-01-21 KR KR1020017009742A patent/KR20010101932A/en not_active Application Discontinuation
- 2000-01-21 JP JP2000597476A patent/JP2002536503A/en active Pending
- 2000-01-21 BR BR0008005-5A patent/BR0008005A/en not_active IP Right Cessation
- 2000-01-21 CA CA002361399A patent/CA2361399A1/en not_active Abandoned
- 2000-01-21 PL PL00350124A patent/PL350124A1/en unknown
-
2002
- 2002-09-10 HK HK02106644.5A patent/HK1044969A1/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130338272A1 (en) * | 2012-06-18 | 2013-12-19 | Basf Se | Flame-retardant polyesters with polyacrylonitriles |
US11208555B2 (en) | 2016-12-30 | 2021-12-28 | Lotte Advanced Materials Co., Ltd. | Thermoplastic resin composition for laser direct structuring process and molded article produced therefrom |
CN109810498A (en) * | 2018-12-21 | 2019-05-28 | 宁国市加能密封件有限公司 | A kind of electronic vacuum pump diaphragm injection molding body framework material and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN1345383A (en) | 2002-04-17 |
EP1155162A2 (en) | 2001-11-21 |
AU2439400A (en) | 2000-08-25 |
JP2002536503A (en) | 2002-10-29 |
WO2000046419A3 (en) | 2000-12-07 |
KR20010101932A (en) | 2001-11-15 |
PL350124A1 (en) | 2002-11-04 |
CZ20012837A3 (en) | 2002-03-13 |
BR0008005A (en) | 2001-12-04 |
WO2000046419A2 (en) | 2000-08-10 |
HK1044969A1 (en) | 2002-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI797069B (en) | A thermoplastic polymer composition, an article made thereof and a process for preparing the same | |
CA2812366C (en) | Polyamide moulding composition and use thereof | |
EP0187176B1 (en) | Metal-plated molding | |
EP3303477B1 (en) | A thermoplastic polymer composition, an article made thereof and a process for preparing the same | |
EP2899235B1 (en) | Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having plated layer | |
JP2015120909A (en) | Plastic moulding composition and use of the same | |
JP2012521486A (en) | Plastic articles optionally with partial metal coating | |
JP7480450B2 (en) | Method for overmolding plastic onto metal surfaces and plastic-metal hybrid parts | |
KR20110110217A (en) | Chromium-free method of conditioning and etching of thermoplastic substrates for metal plating | |
CA2361399A1 (en) | Metallizable moulded part | |
US20200198198A1 (en) | Process for plastic overmolding on a metal surface and plastic-metal hybride part | |
DE19907245A1 (en) | Metallizable molded part for molded interconnection devices, e.g. in cars, machines or computers, comprises a combination of partly aromatic polyester and polyamide, made by two-component injection molding | |
KR101941343B1 (en) | Thermoplastic resin composition for laser direct structuring and article manufactured using the same | |
DE19904217A1 (en) | Metallizable molded part for molded interconnection devices, e.g. in cars, machines or computers, comprises a combination of partly aromatic polyester and polyamide, made by two-component injection molding | |
KR101941342B1 (en) | Thermoplastic resin composition for laser direct structuring and article manufactured using the same | |
EP3390537B1 (en) | A thermoplastic polymer composition, an article made thereof and a process for preparing the same | |
JPS63273659A (en) | polyester resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued |