CA1271819A - Electrically shielding - Google Patents
Electrically shieldingInfo
- Publication number
- CA1271819A CA1271819A CA000536842A CA536842A CA1271819A CA 1271819 A CA1271819 A CA 1271819A CA 000536842 A CA000536842 A CA 000536842A CA 536842 A CA536842 A CA 536842A CA 1271819 A CA1271819 A CA 1271819A
- Authority
- CA
- Canada
- Prior art keywords
- hole
- base
- shield
- shielding
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
- H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Contacts (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Abstract A shielding device, as for spring pins, is provided by providing a base having shielding holes, grounding holes, and a trough connecting them with an interconnected covering, providing within the shielding holes insulators with element holes therethrough.
Description
1;~71~1~
ELECTRICAL~Y SHIELDING
Field of the Invention This invention relates to electrically shielding, and more particularly, in preferred embodlments, to the coaxlal ~hielding of sprlng pins.
Backaround of the Invention The desirablllty of shleldlng elements of electrlcal clrcults, ln approprlate lnstances, ls well known. Coaxially shlelded ~prlng plns for u6e ln connectlon wlth prlnted circuit boards ("PCB~") are known.
Su-marY of the Invention I have discovered that coaxlal 6hieldlng may be provlded, reliably, at low expense and consi6tently wlth hlgh ~hlelded element denslty, by provldlng an lnsulator base having shlelded element and groundlng element mountlng holes, the lnner wall of a grounding element mountlng hole belng ln conductlve electrlcal communlcatlon with a shield around a shlelded element mountlng hole and spaced therefrom by lnsulatlng materlal.
Accordlng to a broad aspect of the lnventlon there ls 0 provlded an electrlcally shleldlng devlce which comprises~
a base, said base belng formed of in~ulating materlal and havlng thereln a shleldJng hole and a shleld connectlng hole, . sald ~hleldlng hole havlng posltioned thereln a metalllc shleld therearound, ~ 1 an insulator wlthin ~aid shield, and an element hole in said insulator, and said shield connecting hole having positioned therein an electrically conductive layer, said layer being in electrical communication with said shield.
According to another broad aspect of the invention there i8 provided the method of fabricating a æhielding device which comprlses forming an lnsulatlng base, provlding thereln a flrst hole and a second hole, coating said base over said holes with a layer of conductlve materlal, placing in said first hole an insulatlng material with a third hole therethrough, and electrlcally interconnecting the coatlngs in said first and second holes.
In preferred embodlments, the insulator base is a unltary ~tructure molded from polyphenylene sulfide reinforced with glass and containing a multlpllcity of spring pin mountlng holes orlented ln pairs, one sprlng pln mountlng hole of each palr belng spaced by a polytetrafluoroethylene lnsulatlng annulus from an electroless nlckel ghleld around the annulus, the other sprlng pin mountlng hole of each palr belng conductlvely connected to the ~hleld by a contlnuum of the electroless nlckel.
In another aspect of the inventlon, I have dlscovered that such a coaxlal shleldlng devlce may be provlded by formlng an ln~ulatlng base containlng a palr of holes therethrough, platlng the base wlth metal, removlng the metal from top and bottom surfaces of the base, and formlng ln one of the holes an annulus of lnsulatlng materlal. In a preferred embodlment a bllnd slot ls ~d ~.27181~
provided between the two holes before plating.
Preferred E~bodiment Following is a description of preferred embodiments of the device and method of the invention.
Drawing~
There is shown in:
Flgure 1 an lsometric view of a broken-away portion showing one shleld portion of the preferred embodiment of the device.
Flgure 2 a correspondlng lsometric view illustrating an earlier stage ln the preferred embodlment of the method.
Flgure 3 a dlagrammatlc plan vlew of a broken away portlon of the devlce.
Flgure 4 a plan vlew on a smaller scale of an arrangement of sald devices.
Figure 5 a sectional view taken at 5-5 of Figure 3.
Figure 6 a correspondlng sectlonal vlew showlng a second devlce cooperatlng wlth a flrst in order to ~ecure therebetween a sprlng pln.
8tructure There i~ shown ln Flgure 3 an enlarged plan vlew, and ln Flgure 1 an lsometrlc vlew, of a portlon of one of the devlce~, indlcated generally at 10, of the lnventlon. In use, elght of these devlce~ 10, the lnner and outer walls 12 and 14 of whlch are coaxlally arcuate (O.D. 10 lnches) are abutted to form an arrangement annular ln horlzontal cro~s-sectlon, as shown in plan vlew ln Flgure 4.
~ 3 71~
Referring to Figures 2 and 5, each devlce 10 has a base 16 formed by lnjection molding of glass-filled (40%) polyphenylene sulfide (sold by Phillips Chemlcal Company under the trademark RYTON R-4). ~xtending through base 16 are cylindrically annular layers 18, 20 of dull (for better adhesion) electroless nlckel.
The layer extends ln a continuum along the floor 22 and sides 24, 26 of bllnd slot 27 and therefrom in portlons 28, 30 of counterbore 32 and cylindrlcal portion 34 wlthin hole 36. Annular ca~t tetrafluoroethylene lnsulator 38 ca~tlng materlal ~sold by DuPont under the trademark TEFZEL) iB wlthln electroless nlckel layer 18, 20 and fill~ slot 27. Hole 40 wlth counterbores 42 is provlded ln lnsulator 38.
As ~hown in Flgure 6, two unlt~ 10 are brought together wlth sprlng plns indlcated generally at 43 held therebetween ln one set of counterbores 32, 42 for each sprlng pln. (Counterbores 32, 42 are provided at each end of holes 36, 40 80 that the ring 44 made up of unlts 10 may be used with either surface up, to permlt moldlng a slngle base 16 even though two configurations of base 16 are needed, for example alternatlng around the annulus, one belng a mlrror lmage of the other. The rlng 44 may be held together and down on a PCB (not shown) by screws (not ~hown), and permlts easlly releasably connectlon therethrough wlth another PCB
(not shown).
OPeration Current passlng through sprlng plns 43 ln lnsulator 38 18 electrically shlelded by electrodless nickel completely therearound, the latter belng electrlcally connected wlth the ~ 4 ~ 7181~
ad~acent ground spring pin through a continuing layer of electroless nickel. Hole 36, in which the ground spring pin is located, thus is a shield connecting hole, in that the layer of nickel electrically connects the pin in it to the shield of the adjacent shielded pln.
Hethod The device is made by first molding the base 16, giving it an overall thickness about 0.020 inches greater than ultimately wanted. The entire piece is then given a coating of dull electroless nickel, which extends over top, bottom and throughout the large and snall hole, counterbore, and slot as ~hown ln the uncoated piece ~hown ln Figure 2. About 0.010 inch thlckness ls then removed ~rom top and bottom, removlng wlth lt the nlckel coating thereover. Bushing 38 is then cast.
Other E-bodi~ents Other embodlments wlll occur to those skllled ln the art.
4a , .~,~, , , , ;
ELECTRICAL~Y SHIELDING
Field of the Invention This invention relates to electrically shielding, and more particularly, in preferred embodlments, to the coaxlal ~hielding of sprlng pins.
Backaround of the Invention The desirablllty of shleldlng elements of electrlcal clrcults, ln approprlate lnstances, ls well known. Coaxially shlelded ~prlng plns for u6e ln connectlon wlth prlnted circuit boards ("PCB~") are known.
Su-marY of the Invention I have discovered that coaxlal 6hieldlng may be provlded, reliably, at low expense and consi6tently wlth hlgh ~hlelded element denslty, by provldlng an lnsulator base having shlelded element and groundlng element mountlng holes, the lnner wall of a grounding element mountlng hole belng ln conductlve electrlcal communlcatlon with a shield around a shlelded element mountlng hole and spaced therefrom by lnsulatlng materlal.
Accordlng to a broad aspect of the lnventlon there ls 0 provlded an electrlcally shleldlng devlce which comprises~
a base, said base belng formed of in~ulating materlal and havlng thereln a shleldJng hole and a shleld connectlng hole, . sald ~hleldlng hole havlng posltioned thereln a metalllc shleld therearound, ~ 1 an insulator wlthin ~aid shield, and an element hole in said insulator, and said shield connecting hole having positioned therein an electrically conductive layer, said layer being in electrical communication with said shield.
According to another broad aspect of the invention there i8 provided the method of fabricating a æhielding device which comprlses forming an lnsulatlng base, provlding thereln a flrst hole and a second hole, coating said base over said holes with a layer of conductlve materlal, placing in said first hole an insulatlng material with a third hole therethrough, and electrlcally interconnecting the coatlngs in said first and second holes.
In preferred embodlments, the insulator base is a unltary ~tructure molded from polyphenylene sulfide reinforced with glass and containing a multlpllcity of spring pin mountlng holes orlented ln pairs, one sprlng pln mountlng hole of each palr belng spaced by a polytetrafluoroethylene lnsulatlng annulus from an electroless nlckel ghleld around the annulus, the other sprlng pin mountlng hole of each palr belng conductlvely connected to the ~hleld by a contlnuum of the electroless nlckel.
In another aspect of the inventlon, I have dlscovered that such a coaxlal shleldlng devlce may be provlded by formlng an ln~ulatlng base containlng a palr of holes therethrough, platlng the base wlth metal, removlng the metal from top and bottom surfaces of the base, and formlng ln one of the holes an annulus of lnsulatlng materlal. In a preferred embodlment a bllnd slot ls ~d ~.27181~
provided between the two holes before plating.
Preferred E~bodiment Following is a description of preferred embodiments of the device and method of the invention.
Drawing~
There is shown in:
Flgure 1 an lsometric view of a broken-away portion showing one shleld portion of the preferred embodiment of the device.
Flgure 2 a correspondlng lsometric view illustrating an earlier stage ln the preferred embodlment of the method.
Flgure 3 a dlagrammatlc plan vlew of a broken away portlon of the devlce.
Flgure 4 a plan vlew on a smaller scale of an arrangement of sald devices.
Figure 5 a sectional view taken at 5-5 of Figure 3.
Figure 6 a correspondlng sectlonal vlew showlng a second devlce cooperatlng wlth a flrst in order to ~ecure therebetween a sprlng pln.
8tructure There i~ shown ln Flgure 3 an enlarged plan vlew, and ln Flgure 1 an lsometrlc vlew, of a portlon of one of the devlce~, indlcated generally at 10, of the lnventlon. In use, elght of these devlce~ 10, the lnner and outer walls 12 and 14 of whlch are coaxlally arcuate (O.D. 10 lnches) are abutted to form an arrangement annular ln horlzontal cro~s-sectlon, as shown in plan vlew ln Flgure 4.
~ 3 71~
Referring to Figures 2 and 5, each devlce 10 has a base 16 formed by lnjection molding of glass-filled (40%) polyphenylene sulfide (sold by Phillips Chemlcal Company under the trademark RYTON R-4). ~xtending through base 16 are cylindrically annular layers 18, 20 of dull (for better adhesion) electroless nlckel.
The layer extends ln a continuum along the floor 22 and sides 24, 26 of bllnd slot 27 and therefrom in portlons 28, 30 of counterbore 32 and cylindrlcal portion 34 wlthin hole 36. Annular ca~t tetrafluoroethylene lnsulator 38 ca~tlng materlal ~sold by DuPont under the trademark TEFZEL) iB wlthln electroless nlckel layer 18, 20 and fill~ slot 27. Hole 40 wlth counterbores 42 is provlded ln lnsulator 38.
As ~hown in Flgure 6, two unlt~ 10 are brought together wlth sprlng plns indlcated generally at 43 held therebetween ln one set of counterbores 32, 42 for each sprlng pln. (Counterbores 32, 42 are provided at each end of holes 36, 40 80 that the ring 44 made up of unlts 10 may be used with either surface up, to permlt moldlng a slngle base 16 even though two configurations of base 16 are needed, for example alternatlng around the annulus, one belng a mlrror lmage of the other. The rlng 44 may be held together and down on a PCB (not shown) by screws (not ~hown), and permlts easlly releasably connectlon therethrough wlth another PCB
(not shown).
OPeration Current passlng through sprlng plns 43 ln lnsulator 38 18 electrically shlelded by electrodless nickel completely therearound, the latter belng electrlcally connected wlth the ~ 4 ~ 7181~
ad~acent ground spring pin through a continuing layer of electroless nickel. Hole 36, in which the ground spring pin is located, thus is a shield connecting hole, in that the layer of nickel electrically connects the pin in it to the shield of the adjacent shielded pln.
Hethod The device is made by first molding the base 16, giving it an overall thickness about 0.020 inches greater than ultimately wanted. The entire piece is then given a coating of dull electroless nickel, which extends over top, bottom and throughout the large and snall hole, counterbore, and slot as ~hown ln the uncoated piece ~hown ln Figure 2. About 0.010 inch thlckness ls then removed ~rom top and bottom, removlng wlth lt the nlckel coating thereover. Bushing 38 is then cast.
Other E-bodi~ents Other embodlments wlll occur to those skllled ln the art.
4a , .~,~, , , , ;
Claims (11)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An electrically shielding device which comprises:
a base, said base being formed of insulating material and having therein a shielding hole and a shield connecting hole, said shielding hole having positioned therein a metallic shield therearound, an insulator within said shield, and an element hole in said insulator, and said shield connecting hole having positioned therein an electrically conductive layer, said layer being in electrical communication with said shield.
a base, said base being formed of insulating material and having therein a shielding hole and a shield connecting hole, said shielding hole having positioned therein a metallic shield therearound, an insulator within said shield, and an element hole in said insulator, and said shield connecting hole having positioned therein an electrically conductive layer, said layer being in electrical communication with said shield.
2. The device of claim 1 in which said shield and said layer are coatings.
3. The device of claim 2 in which one continuous coating provides said coatings and said electrical communication.
4. The device of claim 3 in which said continuous coating is of plated metal.
5. The device of claim 4 in which said metal is electroless nickel.
6. The device of claim 2 in which said base and said insulator are of plastic.
7. The device of claim 6 in which said insulator is glass-loaded polyphenylene sulfide and said insulator is of castable polytetrafluoroethylene, and said metal is electroless nickel.
8. The device of claim 3 in which a trough connecting said shielding hole and said shield connection hole is covered by said continuous coating.
9. The method of fabricating a shielding device which comprises forming an insulating base, providing therein a first hole and a second hole, coating said base over said holes with a layer of conductive material, placing in said first hole an insulating material with a third hole therethrough, and electrically interconnecting the coatings in said first and second holes.
10. The method of claim 9 in which said base is coated overall, and top and bottom surfaces are thereafter cut to electrically segregate said first and second holes.
11. The method of claim 10 in which a channel connecting said first hole and said second hole is coated therewith to provide said electrically interconnecting.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89322186A | 1986-08-05 | 1986-08-05 | |
US893,221 | 1986-08-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA1271819C CA1271819C (en) | 1990-07-17 |
CA1271819A true CA1271819A (en) | 1990-07-17 |
Family
ID=25401228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000536842A Expired - Lifetime CA1271819A (en) | 1986-08-05 | 1987-05-11 | Electrically shielding |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS6342199A (en) |
CA (1) | CA1271819A (en) |
DE (1) | DE3723968A1 (en) |
FR (1) | FR2602630B1 (en) |
GB (1) | GB2193604B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5672062A (en) * | 1991-01-30 | 1997-09-30 | Labinal Components And Systems, Inc. | Electrical connectors |
US5597313A (en) | 1986-06-19 | 1997-01-28 | Labinal Components And Systems, Inc. | Electrical connectors |
US5704794A (en) * | 1986-12-29 | 1998-01-06 | Labinal Components And Systems, Inc. | Electrical connectors |
DE8806100U1 (en) * | 1988-05-07 | 1988-06-30 | Standard Elektrik Lorenz AG, 70435 Stuttgart | Miniature plug-in coupling for coaxial cables |
DE69230313T9 (en) * | 1991-01-30 | 2004-09-09 | Cinch Connectors, Inc., Lombard | ELECTRICAL CONNECTORS |
US5169320A (en) * | 1991-09-27 | 1992-12-08 | Hercules Defense Electronics Systems, Inc. | Shielded and wireless connector for electronics |
HUT68195A (en) * | 1993-09-14 | 1995-05-29 | Gaertner Karl Telegaertner | Connecting box and connecting cable for forming connecting device for a data network |
JP3923889B2 (en) * | 2002-12-11 | 2007-06-06 | シチズン電子株式会社 | Manufacturing method of surface mount type spring connector |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB564836A (en) * | 1943-01-15 | 1944-10-16 | John Edward Cope | Improvements in or relating to holders for thermionic and like valves |
GB863141A (en) * | 1958-05-01 | 1961-03-15 | Ass Elect Ind | Improvements relating to electrical terminal assemblies |
DE1466310C3 (en) * | 1965-01-18 | 1975-07-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Shielded assembly for electrical communications and measurement technology |
US3351953A (en) * | 1966-03-10 | 1967-11-07 | Bunker Ramo | Interconnection means and method of fabrication thereof |
FR2045077A5 (en) * | 1969-05-30 | 1971-02-26 | Francelco Sa | |
DE6931004U (en) * | 1969-08-05 | 1970-01-29 | Siemens Ag | SHIELDED ASSEMBLY FOR EQUIPMENT FOR ELECTRICAL COMMUNICATION AND MEASUREMENT TECHNOLOGY |
US3848164A (en) * | 1972-07-11 | 1974-11-12 | Raychem Corp | Capacitive electrical connectors |
DE3426278C2 (en) * | 1984-07-17 | 1987-02-26 | Schroff Gmbh, 7541 Straubenhardt | Circuit board |
CA1238959A (en) * | 1984-08-09 | 1988-07-05 | Robert R. Rohloff | Area-bonding tape |
-
1987
- 1987-05-11 CA CA000536842A patent/CA1271819A/en not_active Expired - Lifetime
- 1987-06-05 GB GB8713172A patent/GB2193604B/en not_active Expired - Lifetime
- 1987-06-19 JP JP62153208A patent/JPS6342199A/en active Granted
- 1987-07-20 DE DE19873723968 patent/DE3723968A1/en active Granted
- 1987-08-05 FR FR8711140A patent/FR2602630B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2602630B1 (en) | 1995-06-23 |
CA1271819C (en) | 1990-07-17 |
DE3723968A1 (en) | 1988-04-21 |
JPS6342199A (en) | 1988-02-23 |
GB2193604A (en) | 1988-02-10 |
GB8713172D0 (en) | 1987-07-08 |
JPH0239119B2 (en) | 1990-09-04 |
DE3723968C2 (en) | 1991-05-29 |
FR2602630A1 (en) | 1988-02-12 |
GB2193604B (en) | 1990-09-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4724180A (en) | Electrically shielded connectors | |
CN101743667B (en) | Electrical connector assembly | |
EP0604398A2 (en) | Electromagnetically shielded cable | |
CN101529650B (en) | Impedance matched circuit board | |
US4871883A (en) | Electro-magnetic shielding | |
KR920009848B1 (en) | Glat cable | |
US3818415A (en) | Electrical connections to conductors having thin film insulation | |
CA1271819A (en) | Electrically shielding | |
US20020157865A1 (en) | Flexible flat circuitry with improved shielding | |
CN103620898B (en) | Busbar assembly and manufacture method | |
EP0547838A1 (en) | Flexible electrical interconnect | |
CN106415944A (en) | Electrical connector with shield cap and shielded terminals | |
US4455448A (en) | Housing for microwave electronic devices | |
EP0976530A3 (en) | Mold for forming a microlens and method of fabricating the same | |
EP1225664B1 (en) | Electrical component with conductive tracks | |
WO2023160407A1 (en) | High-voltage connector | |
EP2067216B1 (en) | Connection element for communications and data technology | |
EP0257737A3 (en) | Printed circuit precursor | |
CA2216679A1 (en) | Transition adapter for conductor cable | |
US5030114A (en) | Shield overcoat | |
EP0185303A3 (en) | Electrically conducting copper layers and process for their production | |
WO1984004428A3 (en) | Coaxial cables and couplings therefor | |
US4923410A (en) | Low-permittivity connector and flat-cable | |
JPS5536915A (en) | Electronic circuit and its manufacturing | |
CN203932516U (en) | There is the wafer assemblies and the connector that comprises this type of wafer assemblies of screened film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKLA | Lapsed | ||
MKEC | Expiry (correction) | ||
MKEC | Expiry (correction) |
Effective date: 20121205 |