CA1156771A - Integrated circuit device and sub-assembly - Google Patents
Integrated circuit device and sub-assemblyInfo
- Publication number
- CA1156771A CA1156771A CA000383371A CA383371A CA1156771A CA 1156771 A CA1156771 A CA 1156771A CA 000383371 A CA000383371 A CA 000383371A CA 383371 A CA383371 A CA 383371A CA 1156771 A CA1156771 A CA 1156771A
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- CA
- Canada
- Prior art keywords
- capacitor
- portions
- leg
- plane
- mounting portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/10161—Shape being a cuboid with a rectangular active surface
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- H01L2924/14—Integrated circuits
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19041—Component type being a capacitor
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
The present invention relates to an integrated circuit device particularly of the type carrying multiple memory circuits or the like. The device incorporates a lead frame of the sort which includes an elongate metallic web and is characterized by the lead frame providing an integral seat or platform whereon is mounted a capacitor device which is connected or adapted to be connected in shunting relation of the power supply inputs to the integrated circuit device, whereby the capacitor provides a convenient mounting platform for the circuit bearing elements and also assures minimal lead lengths between the capacitor and the power supply inputs of the circuit bearing chip.
Due to the shortness of such lead lengths and consequent reduction of the inductance reactance of the power supply circuit, efficient dampening of switching transients is achieved with the use of capacitors of much smaller values, in less area than heretofore required in external dampening applications.
The present invention relates to an integrated circuit device particularly of the type carrying multiple memory circuits or the like. The device incorporates a lead frame of the sort which includes an elongate metallic web and is characterized by the lead frame providing an integral seat or platform whereon is mounted a capacitor device which is connected or adapted to be connected in shunting relation of the power supply inputs to the integrated circuit device, whereby the capacitor provides a convenient mounting platform for the circuit bearing elements and also assures minimal lead lengths between the capacitor and the power supply inputs of the circuit bearing chip.
Due to the shortness of such lead lengths and consequent reduction of the inductance reactance of the power supply circuit, efficient dampening of switching transients is achieved with the use of capacitors of much smaller values, in less area than heretofore required in external dampening applications.
Description
, 1070-128 , ~` ( ' (J C~
I;
Tltle- INTEGRATED CIRCUIT DEVICE AND SUBASSEMBLY
, Background of the Invention Field of the Invention The present invention is in the field of integrated circuit (IC) devices and particularly IC devices utilized as memory circuits.
Still more particularly, the present invention pertains to an improved IC device and lead frame subassembly therefor having improved decoupling characteristics and enabling the formation of more compact memory assemblies.
The Prior ~rt The use of IC devices, particularly as components of memory circuits, is widespread. ~hen one or more of the switching circuit elements of an IC are activated, current and voltage transients are generated, which transients are in~ected into the power supply circuit which is in turn linked to other elements of the memory system. Where the transient energy of the pulses approaches the characteristics of a functional signal, it is possible to obtain a false reading or transmission of false information, resulting in what is known in the industry as "soft error."
In order to reduce the lnstances of soft error, it is conventional to employ decoupling or by-passing capacitors bridging the po~er supply inputs of the IC, whereby transient 1l5677l energy (noise) is absorbed rather than being transmitted to the rest of the IC circuits through the power supply connections.
Heretofore, in circuits employing ICs of ~he lead frame type, the decoupling has been effected by mounting a capacitor on the printed circuit (PC) board adjacent to and externally of each IC, the leads of the capacitor being connected via the PC wiring across the power supply terminals of the IC. The series combination of lead length and wiring increases the effective impedance of the capacitor, rendering it less effecti~e, especially for shunting high frequency current transients such as are typically produced by dynamic IC memory circuits. Yet, these circuits require that the p~ er supply be maintained I 10~ to correctly maintain data stored within the memory. The value of the capacitors heretofore required to be employed has been substantial, on the order of O.l to 2 mfd.
Capacitors having such relatively high electrical values, in addition to being expensive, are bulky, whereby the desired goal of circuit compactness is frustrated.
SUMMARY OF THE INVENTION
11 The present invention may be summarized as directed to an improved lead frame subassembly of the type which is fabricated from a punched-out or etched elongate metal band or web and is characterized in that the metal frame components of the lead frame are constructed and arranged mechanically to support a capacitor ~hich is electrically shunted across the l 15~771 power supply conductors of the lead frame, the capacitor serving as the support for an IC die or chip. The power supply terminals of said IC die are conventionally connected to the power supply conductors of the lead frame through short lead sections or jumpers or wire bond thread.
It has been established that the lead length in de-coupling circuits heretofore known is a significant factor in adversely increasi~gthe magnitude of the unwanted power supply pulses or transients generated due to the inductive reactance created by the long leads, and that by juxtaposing the capacitor intimately adjacent the power supply terminals of the IC chip, with consequent reduced lead length in the decoupling circuit, small capacitance values are able to effect pulse dampening.
By way of example and without limitation, a capacitance value of 0.05 mfd inserted next to the IC chip and shunted internally across the power supply terminals thereof, is capable of effec-tively dampening current pulses which theretofore required between 0.1 and 2 mfd, of external capacitance depending on the frequency of the current pulse.
The invention more specifically is directed to a lead frame of the type comprising a web punched to define a lattice-work of spaced metal components which will ultimately act as conductors, at least one of the components of the lead frame being deflected from the plane of the metal web and defining a seat for the mounting of a capacitor which is both electrically and mechanically supported thereon. The capacitor provides a mounting platform for a IC die or chip, the power supply terminals of which are electrically connected to components of the lead frame, which are in electrical connection with and provide physical support for the terminals of the capacitor. Under such circumstances, the lead length between the decoupling capacitor and the power supply terminals of the chip is rendered extremely short, whereby the inductance reactance normally added by conventional leads and PC wiring is minimized.
Accordingly, the present invention provides an integrated circuit device comprising, in combination, a mass of polymeric insulating material; a latticework of metal formed from an integral web embedded in said mass, said latticework including a plurality of conductor members having portions disposed in coplanar alignment within said mass, said conductor members including contact portions extending outwardly of said mass, a pair of said conductor members within said mass having spaced inner terminal ends defining a support platform, said platform including a pair of spaced mounting portions displaced from the plane of said conductor portions; a capacitor having a pair of electrode terminations, each said termination being electrically and mechanically connected to one of said spaced mounting portions, said mounting portions each including a leg member extending perpendicularly away from said plane of said conductor portions and a leg member extending from the free end of said first leg substantially parallel to said plane of said conductor portions, said second leg members being in mutually opposed relation and said capacitor being seated on said second leg members, said capacitor having an upper surface defining a mounting area; a silicon chip member supported by said upper surface portion, said upper surface of said capacitor being displaced at a level below the plane of said latticework; the combination including .
an adhesive layer disposed atop said surface, said layer having a surface portion in coplanar alignment with said plane of said latticework, said silicon chip being mounted on said upper surface of said adhesive layer, said chip member including a plurality of circuit means and a pair of power supply contacts;
first circuit conductor means for respectively connecting said power supply contacts with a respective one of said spaced mount-ing portions, within said mass, whereby said power supply contacts are electrically shunted by said capacitor; and second circuit conductor means for connecting said circuit means of said chip member with others of said conductor members.
Figure 1 is a plan view of a short section of an elongated web defining a series of IC lead frames;
Figure 2 is a vertical section taken on the line 2 - 2 of Figure l;
Figure 3 is a fragmentary plan view of the lead frame subassembly after the capacitor has been integrated thereinto;
Figure 4 is a vertical section taken on the line 4 - 4 of Figure 3;
Figure 5 is a magnified perspective view of the lead frame with an IC silicon chip applied thereto showing connections extending to the chip;
-~ - 5 ( ` 3 1 5~i~7 ~ ( Figure 6 is a plan view of a completed IC device according to the invention; and Figure 7 is a plan view of a completed IC device according to the prior art.
Turning now to the drawings, there is shown ln Figure 1, an elongate web of metal 10 which has been etched or punched, in a manner known per se, to provide a multiplicity of blanked out areas, the metal componenta M remaining between the blanked out portions B~ being employed to form conductors for attachment internally to an IC chip 12 and externally between the IC device and a PC board or the like.
The lead frame web 10 may include a plurality of drive apertures or sprocket openings 13 adapted to be engaged with automatic processing equipment for the carrying out of the various subsequent steps necessary for the conversion of the metalliclattice work to a finished IC device.
The lead frame includes a series of conductor portions 14a, 14b, 14c, etc. and 15a, 15b, 15c, etc., which, in the finished IC device depicted in Figure 6, are substantially embedded within a mass of polymeric material 36.
It will be understood, as is conventional, that the conductor portions 14a, 14b, 14c etc., and 15a, 15b, 15c, etc.
have inner terminal portions 14'a, 14'b, 14'c, etc. and 15'a, 15'b, 15'c, etc. to which the terminals of the IC chip 12 will be connected in the manner hereinafter described, The conductor portions also have intermediate terminal portions 14"a, 14"b, 14"c, etc and 15"a, 15"b, l~"c, etc., which lead to the external terminal portions 14"~a, 14~l~bg and 15"'a, 15"'b, etc. that protrude from the f~nished IC device as shown in Fig. 6 for connection to the external circuit.
1 15~77 1 As thus far described, the lead frame per se is' essentially conventional.
In accordance with the invention, the conductor portions 14a, 15a, which will ultimately define the inputs to the power supply circuit have their inner terminal ends 14'a, 15'a, initially linked by a central bridge 16.
. The next step in the manufacture of the lead frame subassembly according to the invention, resides in severing ` the central bridge 16, substantially along with-a central -severance region 17, Fig. 1, to define two discrete metal components 18, 19. By the use of a suitable forming tool, the components 18, 19 are then bent to define vertical legs 21, 22 and horizontal legs 23, 24.
As best seen in Figs. 4 and 5, horizontal legs 23, 24, define support platforms for a capacitor C, which is preferably of the multi-layer ceramic type. The end terminations 25, 26 of the capacitor are electrically and mechanically connected, as by soldering to the vertical legs 21, 22 and horizontal legs 23, 24.
The capacitor C incorporates an upper surface portion 27, which provides a bed or support for the IC chip 12. Optionally, but preferably the chip 12 is seated on an epoxy or like adhesive layer 28 mounted atop the upper surface 27 of the capacitor C.
Thereupon, the inner terminal ends 14'a, and 15'a, are connected to the respective po~er terminals P of chip 12 in conventional manner by leads 30.
From the foregoing descrlptlon, it will be evident that the outer termlnal portlon l4n'a,through conductor portion 14a ls now electrically connected to end terminatlon 26 of the capacitor C. In slmllar manner, the outer terminal portions 15"'a, through conductor portion 15a, is electrically connected to the end termlnation 25 of the capacitor, whereby the capacltor will be disposed in bridging relation of the power supply termlnals P
of the IC chip.
Thereupon, the other termlnals T of the chip 12 are connected in conventional manner by leads 30' to the respective lnner terminal ends 14~ and 15' of the lead frame lO, and the latticewor~ is severed to remove shuntlng portions S between the conductors (Fig. 1).
After completion of the subassembly, including the lead frame, capacitor and IC chip 12, the subassembly is then embedded in the polymeric mass 36 thereby defining a block. The polymeric block hermetically seals the components snd retains the conductor portions ln fixed position. Each unit is then severed along lines 31, 31, shown in Fig. 1 so that the conductor portion 14a, 14b~ 15a, 15b, etc. will be separated from the remaining portions of the web and only the ends 14na, 15na, etc. of the conductor .
portions and the leadR 14"ta and 15" a etc. protrude from the polymeric block 16. Then the leads 14nla and 15n'a etc~ are bent to enable insertion in the PC board mounting holes.
As will be recognized by those skilled in the art, a lead frame subassembly comprising one or a series of inter-connected lead frames, each with a capacitor ~ounted thereon, may be supplied to manufacturers of lntegrated circuit devices 1 ~5~77~
as a useful article of manufacture. The manufacturer may process the lead frame subassemblies in a manner similar to the prior conventional procedures. However, instead of mounting the IC
chip on a metal portion of the lead frame as in the prior conven-tional procedure, the IC chip is mounted on an epoxy layer 28 which may be applied to the surface 27 of the capacitor C just prior to emplacement of the IC chip thereon, the epoxy affording a means of securing the IC chip in fixed position. ~ubsequent processing steps as carried out by the manufacturer are identical to those now practiced in respect of conventional IC devices be-ing manufactured. That is to say, after emplacement and fastening of the IC chip, the various connections as by leads 30 and 30' are made between appropriate ones of ths inner terminals 14'a, 14'b, 14'c, etc. and 15'a, 15'b, 15'c, etc. of the metal lead frame and the respective terminals P and T of the IC chip 12. The unit is then embedded in a polymeric mass to form a block and the unit is then severed from the remaining portion of the web and the leads formed.
From the foregoing description, it will be appreciated that there is disclosed in accordance with the invention, an im-proved lead frame subassembly adapted for the mounting of an IC
chip characterized in that a capacitor is incorporated in inti-mate juxtaposition to the IC chip and the power supply terminals ( `I 1 15~7~71 thereof. Since the connection between the capacitor and the power supply terminals P of the chip is limited merely to the length of the short leads 30 rather than the relatively long leads 32, 33 of the prior art device, Fig. 7, the inductive components of the circuit are reduced to a minimum, whereby the capacitance necessary for dampening switching pulses generated is reduced substantially compared to externally placed decoupling capacitors.
It will further be observed that, in accordance with the invention, there is disclosed an improved IC device carrying an internal dampening capacitor, the external dimensions of the IC being no greater than those of a conventionally fabricated IC device. The use of an external decoupling capacitor rnay be entirely dispensed with, with resultant space and cost savings.
As will be understood by those skilled in the art and familiarized with the instant disclosure, numerous vari~tions and modifications may be made therein without departing from the spirit thereof, which is considered to reside in the concept of employing in a conventional metallic lead frame device, a capacitor member which at once defines a structural support for the clrcuit bearing components of the devlce, i.e. the IC chip, and functions as a decoupling capacitor. Accordingly, the invention is to be broadly construed within the scope of the appended claims.
_ 10 --
I;
Tltle- INTEGRATED CIRCUIT DEVICE AND SUBASSEMBLY
, Background of the Invention Field of the Invention The present invention is in the field of integrated circuit (IC) devices and particularly IC devices utilized as memory circuits.
Still more particularly, the present invention pertains to an improved IC device and lead frame subassembly therefor having improved decoupling characteristics and enabling the formation of more compact memory assemblies.
The Prior ~rt The use of IC devices, particularly as components of memory circuits, is widespread. ~hen one or more of the switching circuit elements of an IC are activated, current and voltage transients are generated, which transients are in~ected into the power supply circuit which is in turn linked to other elements of the memory system. Where the transient energy of the pulses approaches the characteristics of a functional signal, it is possible to obtain a false reading or transmission of false information, resulting in what is known in the industry as "soft error."
In order to reduce the lnstances of soft error, it is conventional to employ decoupling or by-passing capacitors bridging the po~er supply inputs of the IC, whereby transient 1l5677l energy (noise) is absorbed rather than being transmitted to the rest of the IC circuits through the power supply connections.
Heretofore, in circuits employing ICs of ~he lead frame type, the decoupling has been effected by mounting a capacitor on the printed circuit (PC) board adjacent to and externally of each IC, the leads of the capacitor being connected via the PC wiring across the power supply terminals of the IC. The series combination of lead length and wiring increases the effective impedance of the capacitor, rendering it less effecti~e, especially for shunting high frequency current transients such as are typically produced by dynamic IC memory circuits. Yet, these circuits require that the p~ er supply be maintained I 10~ to correctly maintain data stored within the memory. The value of the capacitors heretofore required to be employed has been substantial, on the order of O.l to 2 mfd.
Capacitors having such relatively high electrical values, in addition to being expensive, are bulky, whereby the desired goal of circuit compactness is frustrated.
SUMMARY OF THE INVENTION
11 The present invention may be summarized as directed to an improved lead frame subassembly of the type which is fabricated from a punched-out or etched elongate metal band or web and is characterized in that the metal frame components of the lead frame are constructed and arranged mechanically to support a capacitor ~hich is electrically shunted across the l 15~771 power supply conductors of the lead frame, the capacitor serving as the support for an IC die or chip. The power supply terminals of said IC die are conventionally connected to the power supply conductors of the lead frame through short lead sections or jumpers or wire bond thread.
It has been established that the lead length in de-coupling circuits heretofore known is a significant factor in adversely increasi~gthe magnitude of the unwanted power supply pulses or transients generated due to the inductive reactance created by the long leads, and that by juxtaposing the capacitor intimately adjacent the power supply terminals of the IC chip, with consequent reduced lead length in the decoupling circuit, small capacitance values are able to effect pulse dampening.
By way of example and without limitation, a capacitance value of 0.05 mfd inserted next to the IC chip and shunted internally across the power supply terminals thereof, is capable of effec-tively dampening current pulses which theretofore required between 0.1 and 2 mfd, of external capacitance depending on the frequency of the current pulse.
The invention more specifically is directed to a lead frame of the type comprising a web punched to define a lattice-work of spaced metal components which will ultimately act as conductors, at least one of the components of the lead frame being deflected from the plane of the metal web and defining a seat for the mounting of a capacitor which is both electrically and mechanically supported thereon. The capacitor provides a mounting platform for a IC die or chip, the power supply terminals of which are electrically connected to components of the lead frame, which are in electrical connection with and provide physical support for the terminals of the capacitor. Under such circumstances, the lead length between the decoupling capacitor and the power supply terminals of the chip is rendered extremely short, whereby the inductance reactance normally added by conventional leads and PC wiring is minimized.
Accordingly, the present invention provides an integrated circuit device comprising, in combination, a mass of polymeric insulating material; a latticework of metal formed from an integral web embedded in said mass, said latticework including a plurality of conductor members having portions disposed in coplanar alignment within said mass, said conductor members including contact portions extending outwardly of said mass, a pair of said conductor members within said mass having spaced inner terminal ends defining a support platform, said platform including a pair of spaced mounting portions displaced from the plane of said conductor portions; a capacitor having a pair of electrode terminations, each said termination being electrically and mechanically connected to one of said spaced mounting portions, said mounting portions each including a leg member extending perpendicularly away from said plane of said conductor portions and a leg member extending from the free end of said first leg substantially parallel to said plane of said conductor portions, said second leg members being in mutually opposed relation and said capacitor being seated on said second leg members, said capacitor having an upper surface defining a mounting area; a silicon chip member supported by said upper surface portion, said upper surface of said capacitor being displaced at a level below the plane of said latticework; the combination including .
an adhesive layer disposed atop said surface, said layer having a surface portion in coplanar alignment with said plane of said latticework, said silicon chip being mounted on said upper surface of said adhesive layer, said chip member including a plurality of circuit means and a pair of power supply contacts;
first circuit conductor means for respectively connecting said power supply contacts with a respective one of said spaced mount-ing portions, within said mass, whereby said power supply contacts are electrically shunted by said capacitor; and second circuit conductor means for connecting said circuit means of said chip member with others of said conductor members.
Figure 1 is a plan view of a short section of an elongated web defining a series of IC lead frames;
Figure 2 is a vertical section taken on the line 2 - 2 of Figure l;
Figure 3 is a fragmentary plan view of the lead frame subassembly after the capacitor has been integrated thereinto;
Figure 4 is a vertical section taken on the line 4 - 4 of Figure 3;
Figure 5 is a magnified perspective view of the lead frame with an IC silicon chip applied thereto showing connections extending to the chip;
-~ - 5 ( ` 3 1 5~i~7 ~ ( Figure 6 is a plan view of a completed IC device according to the invention; and Figure 7 is a plan view of a completed IC device according to the prior art.
Turning now to the drawings, there is shown ln Figure 1, an elongate web of metal 10 which has been etched or punched, in a manner known per se, to provide a multiplicity of blanked out areas, the metal componenta M remaining between the blanked out portions B~ being employed to form conductors for attachment internally to an IC chip 12 and externally between the IC device and a PC board or the like.
The lead frame web 10 may include a plurality of drive apertures or sprocket openings 13 adapted to be engaged with automatic processing equipment for the carrying out of the various subsequent steps necessary for the conversion of the metalliclattice work to a finished IC device.
The lead frame includes a series of conductor portions 14a, 14b, 14c, etc. and 15a, 15b, 15c, etc., which, in the finished IC device depicted in Figure 6, are substantially embedded within a mass of polymeric material 36.
It will be understood, as is conventional, that the conductor portions 14a, 14b, 14c etc., and 15a, 15b, 15c, etc.
have inner terminal portions 14'a, 14'b, 14'c, etc. and 15'a, 15'b, 15'c, etc. to which the terminals of the IC chip 12 will be connected in the manner hereinafter described, The conductor portions also have intermediate terminal portions 14"a, 14"b, 14"c, etc and 15"a, 15"b, l~"c, etc., which lead to the external terminal portions 14"~a, 14~l~bg and 15"'a, 15"'b, etc. that protrude from the f~nished IC device as shown in Fig. 6 for connection to the external circuit.
1 15~77 1 As thus far described, the lead frame per se is' essentially conventional.
In accordance with the invention, the conductor portions 14a, 15a, which will ultimately define the inputs to the power supply circuit have their inner terminal ends 14'a, 15'a, initially linked by a central bridge 16.
. The next step in the manufacture of the lead frame subassembly according to the invention, resides in severing ` the central bridge 16, substantially along with-a central -severance region 17, Fig. 1, to define two discrete metal components 18, 19. By the use of a suitable forming tool, the components 18, 19 are then bent to define vertical legs 21, 22 and horizontal legs 23, 24.
As best seen in Figs. 4 and 5, horizontal legs 23, 24, define support platforms for a capacitor C, which is preferably of the multi-layer ceramic type. The end terminations 25, 26 of the capacitor are electrically and mechanically connected, as by soldering to the vertical legs 21, 22 and horizontal legs 23, 24.
The capacitor C incorporates an upper surface portion 27, which provides a bed or support for the IC chip 12. Optionally, but preferably the chip 12 is seated on an epoxy or like adhesive layer 28 mounted atop the upper surface 27 of the capacitor C.
Thereupon, the inner terminal ends 14'a, and 15'a, are connected to the respective po~er terminals P of chip 12 in conventional manner by leads 30.
From the foregoing descrlptlon, it will be evident that the outer termlnal portlon l4n'a,through conductor portion 14a ls now electrically connected to end terminatlon 26 of the capacitor C. In slmllar manner, the outer terminal portions 15"'a, through conductor portion 15a, is electrically connected to the end termlnation 25 of the capacitor, whereby the capacltor will be disposed in bridging relation of the power supply termlnals P
of the IC chip.
Thereupon, the other termlnals T of the chip 12 are connected in conventional manner by leads 30' to the respective lnner terminal ends 14~ and 15' of the lead frame lO, and the latticewor~ is severed to remove shuntlng portions S between the conductors (Fig. 1).
After completion of the subassembly, including the lead frame, capacitor and IC chip 12, the subassembly is then embedded in the polymeric mass 36 thereby defining a block. The polymeric block hermetically seals the components snd retains the conductor portions ln fixed position. Each unit is then severed along lines 31, 31, shown in Fig. 1 so that the conductor portion 14a, 14b~ 15a, 15b, etc. will be separated from the remaining portions of the web and only the ends 14na, 15na, etc. of the conductor .
portions and the leadR 14"ta and 15" a etc. protrude from the polymeric block 16. Then the leads 14nla and 15n'a etc~ are bent to enable insertion in the PC board mounting holes.
As will be recognized by those skilled in the art, a lead frame subassembly comprising one or a series of inter-connected lead frames, each with a capacitor ~ounted thereon, may be supplied to manufacturers of lntegrated circuit devices 1 ~5~77~
as a useful article of manufacture. The manufacturer may process the lead frame subassemblies in a manner similar to the prior conventional procedures. However, instead of mounting the IC
chip on a metal portion of the lead frame as in the prior conven-tional procedure, the IC chip is mounted on an epoxy layer 28 which may be applied to the surface 27 of the capacitor C just prior to emplacement of the IC chip thereon, the epoxy affording a means of securing the IC chip in fixed position. ~ubsequent processing steps as carried out by the manufacturer are identical to those now practiced in respect of conventional IC devices be-ing manufactured. That is to say, after emplacement and fastening of the IC chip, the various connections as by leads 30 and 30' are made between appropriate ones of ths inner terminals 14'a, 14'b, 14'c, etc. and 15'a, 15'b, 15'c, etc. of the metal lead frame and the respective terminals P and T of the IC chip 12. The unit is then embedded in a polymeric mass to form a block and the unit is then severed from the remaining portion of the web and the leads formed.
From the foregoing description, it will be appreciated that there is disclosed in accordance with the invention, an im-proved lead frame subassembly adapted for the mounting of an IC
chip characterized in that a capacitor is incorporated in inti-mate juxtaposition to the IC chip and the power supply terminals ( `I 1 15~7~71 thereof. Since the connection between the capacitor and the power supply terminals P of the chip is limited merely to the length of the short leads 30 rather than the relatively long leads 32, 33 of the prior art device, Fig. 7, the inductive components of the circuit are reduced to a minimum, whereby the capacitance necessary for dampening switching pulses generated is reduced substantially compared to externally placed decoupling capacitors.
It will further be observed that, in accordance with the invention, there is disclosed an improved IC device carrying an internal dampening capacitor, the external dimensions of the IC being no greater than those of a conventionally fabricated IC device. The use of an external decoupling capacitor rnay be entirely dispensed with, with resultant space and cost savings.
As will be understood by those skilled in the art and familiarized with the instant disclosure, numerous vari~tions and modifications may be made therein without departing from the spirit thereof, which is considered to reside in the concept of employing in a conventional metallic lead frame device, a capacitor member which at once defines a structural support for the clrcuit bearing components of the devlce, i.e. the IC chip, and functions as a decoupling capacitor. Accordingly, the invention is to be broadly construed within the scope of the appended claims.
_ 10 --
Claims (4)
OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. An integrated circuit device comprising, in combination, a mass of polymeric insulating material; a latticework of metal formed from an integral web embedded in said mass, said lattice-work including a plurality of conductor members having portions disposed in coplanar alignment within said mass, said conductor members including contact portions extending outwardly of said mass, a pair of said conductor members within said mass having spaced inner terminal ends defining a support platform, said platform including a pair of spaced mounting portions displaced from the plane of said conductor portions; a capacitor having a pair of electrode terminations, each said termination being electrically and mechanically connected to one of said spaced mounting portions, said mounting portions each including a leg member extending perpendicularly away from said plane of said conductor portions and a leg member extending from the free end of said first leg substantially parallel to said plane of said conductor portions, said second leg members being in mutually opposed relation and said capacitor being seated on said second leg members, said capacitor having an upper surface defining a mounting area; a silicon chip member supported by said upper surface portion, said upper surface of said capacitor being displaced at a level below the plane of said latticework; the combination including an adhesive layer disposed atop said surface, said layer having a surface portion in coplanar align-ment with said plane of said latticework, said silicon chip being mounted on said upper surface of said adhesive layer, said chip member including a plurality of circuit means and a pair of power supply contacts; first circuit conductor means for respect-ively connecting said power supply contacts with a respective one of said spaced mounting portions, within said mass, whereby said power supply contacts are electrically shunted by said capacitor; and second circuit conductor means for connecting said circuit means of said chip member with others of said conductor members.
2. A lead frame subassembly for the formation of integrated circuit components comprising, in combination, an elongate metal web defining a multiplicity of lead frames, each said lead frame including an open latticework of metal defining a plurality of conductive paths including portions arrayed in a plane; a central platform structure formed on said lead frames, said platform structure including a spaced pair of mounting portions formed integrally of said web, each of said mounting portions having a depending leg member extending perpendicularly to the plane of said latticework and a second leg member extending from the free end of said first leg parallel to said plane to define spaced mounting portions; a capacitor member having a contact portion at each end, each said contact portion being secured to one of said leg mounting portions in mechanical and electrical contact therewith, each of said leg mounting portions being in electrical contact with a different one of said conductive paths, said capacitor having an upper surface and a silicon chip secured to said upper surface, said chip having a pair of power supply terminals and means for electrically connecting said power supply terminals of said chip to the leg mounting portions for said capacitor; the combination having an adhesive layer secured to the upper surface of said capacitor, and the upper surface of said adhesive layer being in coplanar alignment with the plane of said latticework.
3. A lead frame device adapted for the reception of a silicon chip or the like having multiple circuit members thereon comprising, in combination, an integral metal web having a latticework defining a plurality of conductor members having portions arrayed in a plane; a central platform structure formed on said web, said platform structure including a spaced pair of support mount-ing portions formed integrally of said web, each said mounting portion having a depending leg portion displaced from said plane;
a capacitor member having a contact portion at each end, said contact portions being secured to one of said leg portions in mechanical and electrical contact therewith, each said leg being in electrical contact with a different one of said conductor members, said capacitor having a generally planar surface portion providing a mounting platform for the support of such silicon chip, said legs of said support fixtures being disposed substanti-ally normal to said plane, said leg portions including opposed spaced support legs disposed in parallel alignment with said plane, and said capacitor being supported on said support legs.
a capacitor member having a contact portion at each end, said contact portions being secured to one of said leg portions in mechanical and electrical contact therewith, each said leg being in electrical contact with a different one of said conductor members, said capacitor having a generally planar surface portion providing a mounting platform for the support of such silicon chip, said legs of said support fixtures being disposed substanti-ally normal to said plane, said leg portions including opposed spaced support legs disposed in parallel alignment with said plane, and said capacitor being supported on said support legs.
4. A lead frame comprising, a web having a latticework of metal defining a plurality of conductor paths including portions arrayed in a plane; a central platform structure formed on said web, said platform structure including a spaced pair of mounting portions formed integrally of said web, each of said mounting portions having a depending leg member extending perpendicularly to the plane of said latticework and a second leg member extend-ing from the free end of said first leg parallel to said plane to define spaced mounting portions; a capacitor member having a contact portion at each end, said contact portions being secured to one of said leg mounting portions respectively in mechanical and electrical contact therewith, each of said leg mounting portions being in electrical contact with a different one of said conductive paths, said capacitor having an upper surface;
a silicon chip being secured to said upper surface, and said silicon chip having a pair of power supply contacts and means for electrically connecting said power supply contacts of said chip respectively to each of said leg mounting portions.
a silicon chip being secured to said upper surface, and said silicon chip having a pair of power supply contacts and means for electrically connecting said power supply contacts of said chip respectively to each of said leg mounting portions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22412781A | 1981-01-12 | 1981-01-12 | |
| US224,127 | 1981-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1156771A true CA1156771A (en) | 1983-11-08 |
Family
ID=22839370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000383371A Expired CA1156771A (en) | 1981-01-12 | 1981-08-07 | Integrated circuit device and sub-assembly |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS57126157A (en) |
| CA (1) | CA1156771A (en) |
| DE (1) | DE3130072A1 (en) |
| FR (1) | FR2499768B1 (en) |
| GB (1) | GB2091035B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954249A (en) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | Semiconductor device |
| JPS5966157A (en) * | 1982-10-08 | 1984-04-14 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
| FR2550009B1 (en) * | 1983-07-29 | 1986-01-24 | Inf Milit Spatiale Aeronaut | ELECTRONIC COMPONENT HOUSING PROVIDED WITH A CAPACITOR |
| US4534105A (en) * | 1983-08-10 | 1985-08-13 | Rca Corporation | Method for grounding a pellet support pad in an integrated circuit device |
| JPH0828447B2 (en) * | 1983-10-05 | 1996-03-21 | 富士通株式会社 | Method for manufacturing semiconductor device |
| DE3410196A1 (en) * | 1984-03-20 | 1985-09-26 | Siemens AG, 1000 Berlin und 8000 München | Conductor strip for the mounting of integrated circuits |
| US4612564A (en) * | 1984-06-04 | 1986-09-16 | At&T Bell Laboratories | Plastic integrated circuit package |
| JPS61151349U (en) * | 1985-03-11 | 1986-09-18 | ||
| FR2584865B1 (en) * | 1985-07-12 | 1988-06-17 | Inf Milit Spatiale Aeronaut | ELECTRONIC COMPONENT HAVING A CAPACITOR |
| DE4017217A1 (en) * | 1990-05-29 | 1991-12-19 | Texas Instruments Deutschland | ELECTRONIC COMPONENT |
| US5281846A (en) * | 1990-05-29 | 1994-01-25 | Texas Instruments Deutschland Gmbh | Electronic device having a discrete capacitor adherently mounted to a lead frame |
| US5140496A (en) * | 1991-01-02 | 1992-08-18 | Honeywell, Inc. | Direct microcircuit decoupling |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3802069A (en) * | 1972-05-04 | 1974-04-09 | Gte Sylvania Inc | Fabricating packages for use in integrated circuits |
| US3880493A (en) * | 1973-12-28 | 1975-04-29 | Burroughs Corp | Capacitor socket for a dual-in-line package |
| JPS558286Y2 (en) * | 1974-11-20 | 1980-02-23 | ||
| FR2456388A1 (en) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | ELECTRONIC CIRCUIT MICROBOX, AND HYBRID CIRCUIT HAVING SUCH A MICROBOX |
| JPS55179055U (en) * | 1979-06-07 | 1980-12-23 |
-
1981
- 1981-06-16 GB GB8118481A patent/GB2091035B/en not_active Expired
- 1981-07-27 JP JP56117561A patent/JPS57126157A/en active Granted
- 1981-07-30 DE DE19813130072 patent/DE3130072A1/en not_active Withdrawn
- 1981-08-07 CA CA000383371A patent/CA1156771A/en not_active Expired
- 1981-08-07 FR FR8115382A patent/FR2499768B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB2091035A (en) | 1982-07-21 |
| GB2091035B (en) | 1985-01-09 |
| FR2499768B1 (en) | 1985-12-20 |
| FR2499768A1 (en) | 1982-08-13 |
| DE3130072A1 (en) | 1982-08-05 |
| JPS57126157A (en) | 1982-08-05 |
| JPS6316906B2 (en) | 1988-04-11 |
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