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BR112016029780A2 - composições adesivas de epóxi de cura rápida - Google Patents

composições adesivas de epóxi de cura rápida

Info

Publication number
BR112016029780A2
BR112016029780A2 BR112016029780A BR112016029780A BR112016029780A2 BR 112016029780 A2 BR112016029780 A2 BR 112016029780A2 BR 112016029780 A BR112016029780 A BR 112016029780A BR 112016029780 A BR112016029780 A BR 112016029780A BR 112016029780 A2 BR112016029780 A2 BR 112016029780A2
Authority
BR
Brazil
Prior art keywords
present disclosure
adhesive compositions
epoxy adhesive
compositions
fast curing
Prior art date
Application number
BR112016029780A
Other languages
English (en)
Inventor
Elgimiabi Sohaib
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR112016029780A2 publication Critical patent/BR112016029780A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/28—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

resumo ?composições adesivas de epóxi de cura rápida? a presente revelação refere-se a uma composição curável que compreende: a) uma resina epóxi; b) um agente de cura epóxi que compreende ao menos uma amina cicloali-fática; c) ao menos 3% em peso de um catalisador de triflato metálico; d) opcionalmente, uma poliamida de ácido graxo; e e) opcionalmente, um material de carga. as composições da presente revelação são particularmente adequadas para uso em uma montagem estrutural, e em particular para operações de encaixe e pre-enchimento em estruturas em sanduíche. a presente revelação refere-se também a um conjunto composto e a métodos de uso de tais composições curáveis à base de resina epóxi.
BR112016029780A 2014-06-17 2015-06-17 composições adesivas de epóxi de cura rápida BR112016029780A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14172755.2A EP2957584B1 (en) 2014-06-17 2014-06-17 Rapid curing epoxy adhesive compositions
PCT/US2015/036189 WO2015195775A1 (en) 2014-06-17 2015-06-17 Rapid curing epoxy adhesive compositions

Publications (1)

Publication Number Publication Date
BR112016029780A2 true BR112016029780A2 (pt) 2017-08-22

Family

ID=50942204

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016029780A BR112016029780A2 (pt) 2014-06-17 2015-06-17 composições adesivas de epóxi de cura rápida

Country Status (10)

Country Link
US (1) US10882947B2 (pt)
EP (1) EP2957584B1 (pt)
JP (1) JP6626012B2 (pt)
KR (1) KR20170018912A (pt)
CN (1) CN106414546A (pt)
BR (1) BR112016029780A2 (pt)
CA (1) CA2952248A1 (pt)
ES (1) ES2625552T3 (pt)
PL (1) PL2957584T3 (pt)
WO (1) WO2015195775A1 (pt)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3275915B1 (en) * 2016-07-29 2022-11-30 3M Innovative Properties Company Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties
EP3275914B1 (en) * 2016-07-29 2022-05-11 3M Innovative Properties Company Flame retardant adhesive composition
EP3385297A1 (en) * 2017-04-04 2018-10-10 3M Innovative Properties Company Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications
CN108929518B (zh) * 2017-05-26 2022-11-25 洛阳尖端技术研究院 一种环氧树脂吸波复合材料及其制备方法
US10792884B2 (en) * 2017-06-15 2020-10-06 The Boeing Company Composite panel sandwich structures with integrated joints
US11286335B2 (en) * 2018-05-17 2022-03-29 Evonik Operations Gmbh Fast-curing epoxy systems
US11359048B2 (en) 2018-05-17 2022-06-14 Evonik Operations Gmbh Fast-curing epoxy systems
EP3569630B1 (de) 2018-05-17 2022-08-03 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3569629B1 (de) 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
WO2020033037A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP3626757A1 (de) * 2018-09-19 2020-03-25 Hilti Aktiengesellschaft Verwendung von salzen als beschleuniger in einer epoxidharzmasse zur chemischen befestigung
EP3660069B1 (de) 2018-11-29 2024-01-03 Evonik Operations GmbH Schnell härtende epoxysysteme
EP3733731A1 (de) * 2019-04-30 2020-11-04 Hilti Aktiengesellschaft Härterzusammensetzung für eine epoxidharzmasse, epoxidharzmasse und mehrkomponenten-epoxidharzsystem mit verbesserter tieftemperaturhärtung
WO2021019741A1 (ja) * 2019-07-31 2021-02-04 昭和電工マテリアルズ株式会社 接着剤セット
EP4011978A4 (en) * 2019-08-06 2023-07-19 Kaneka Corporation CURABLE COMPOSITION
CN110530924A (zh) * 2019-08-08 2019-12-03 西安交通大学 一种可施加电场的dsc电极系统
US11453744B2 (en) 2019-10-15 2022-09-27 Evonik Operations Gmbh Compositions consisting of BrØnsted acids and monoamines
US20220372347A1 (en) * 2020-04-09 2022-11-24 Kolon Industries, Inc. Adhesive composition and rubber reinforcing material
CN111748079A (zh) * 2020-07-14 2020-10-09 道生天合材料科技(上海)股份有限公司 一种可快速固化的固化剂及使用该固化剂的环氧树脂系统
US20220112321A1 (en) * 2020-10-09 2022-04-14 Rohm And Haas Electronic Materials Llc High refractive index materials
EP3981817A1 (de) 2020-10-12 2022-04-13 Evonik Operations GmbH Zusammensetzungen umfassend brönstedtsäuren und monoamine
EP4194516A1 (en) 2021-12-09 2023-06-14 Jotun A/S Coatings

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3282015A (en) 1962-04-20 1966-11-01 Frederick W Rohe Moldable insert fastener with dual potting ports in head
US3271498A (en) 1964-01-27 1966-09-06 Rohe Method of installation of moldable insert in sandwich panel
GB1500206A (en) * 1975-10-23 1978-02-08 Ciba Geigy Ag Compositions for curing epoxide resins
CA1249691A (en) * 1984-07-18 1989-01-31 Janis Robins Fast curing epoxy resin compositions
US4668736A (en) * 1984-07-18 1987-05-26 Minnesota Mining And Manufacturing Company Fast curing epoxy resin compositions
DE3674902D1 (de) 1985-06-26 1990-11-15 Dow Chemical Co Mit rubber modifizierte epoxyzusammensetzungen.
US4941785A (en) 1989-09-13 1990-07-17 Witten Donald W Potted insert for honeycomb panels
EP2011825B1 (en) 2006-04-24 2018-08-08 Toray Industries, Inc. Use of epoxy resin composition for fibre-reinforced material and its production
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof
WO2008099858A1 (ja) * 2007-02-13 2008-08-21 Kaneka Corporation 硬化性組成物
US8853309B2 (en) * 2008-09-29 2014-10-07 Kaneka Corporation Curable composition and cured product thereof
WO2010091072A1 (en) * 2009-02-06 2010-08-12 3M Innovative Properties Company Room temperature curing epoxy adhesive
EP2223966B1 (en) * 2009-02-25 2017-08-16 3M Innovative Properties Company Epoxy adhesive compositions with high mechanical strength over a wide temperature range
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
CN103068946B (zh) * 2010-08-10 2015-05-06 3M创新有限公司 环氧树脂结构粘合剂
US9139699B2 (en) * 2012-10-04 2015-09-22 Dow Corning Corporation Metal containing condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts
DE102012203794A1 (de) * 2012-03-12 2013-09-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisch lösbarer Polyamid-Klebstoff
JP2014139293A (ja) * 2012-12-20 2014-07-31 Dow Global Technologies Llc エポキシ樹脂組成物、それを製造する方法、およびその物品

Also Published As

Publication number Publication date
CN106414546A (zh) 2017-02-15
JP6626012B2 (ja) 2019-12-25
EP2957584B1 (en) 2017-03-01
US10882947B2 (en) 2021-01-05
US20170088664A1 (en) 2017-03-30
CA2952248A1 (en) 2015-12-23
JP2017519869A (ja) 2017-07-20
KR20170018912A (ko) 2017-02-20
EP2957584A1 (en) 2015-12-23
WO2015195775A1 (en) 2015-12-23
PL2957584T3 (pl) 2017-08-31
ES2625552T3 (es) 2017-07-19

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements