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BR112014026062A2 - módulo de eletrônica integrado - Google Patents

módulo de eletrônica integrado

Info

Publication number
BR112014026062A2
BR112014026062A2 BR112014026062A BR112014026062A BR112014026062A2 BR 112014026062 A2 BR112014026062 A2 BR 112014026062A2 BR 112014026062 A BR112014026062 A BR 112014026062A BR 112014026062 A BR112014026062 A BR 112014026062A BR 112014026062 A2 BR112014026062 A2 BR 112014026062A2
Authority
BR
Brazil
Prior art keywords
electronics module
substrate
integrated electronics
conductive layer
heat conductive
Prior art date
Application number
BR112014026062A
Other languages
English (en)
Inventor
Juhani Brusila Ari
Original Assignee
Koninklijke Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Nv filed Critical Koninklijke Philips Nv
Publication of BR112014026062A2 publication Critical patent/BR112014026062A2/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
    • G01R33/34—Constructional details, e.g. resonators, specially adapted to MR
    • G01R33/34015—Temperature-controlled RF coils
    • G01R33/3403—Means for cooling of the RF coils, e.g. a refrigerator or a cooling vessel specially adapted for housing an RF coil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

resumo módulo de eletrônica integrado um módulo de eletrônica integrado compreendendo um substrato com componentes eletrônicos montados em uma superfície de montagem do substrato. uma camada condutora de calor é disposta em uma superfície de resfriamento do substrato. a superfície de resfriamento e a superfície de montagem estão em lados opostos do substrato. uma estrutura para o resfriamento do fluido de material não magnético e um conduto de fluido são montados em contato térmico com a camada condutora de calor. 1/1
BR112014026062A 2012-04-23 2013-04-11 módulo de eletrônica integrado BR112014026062A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261636933P 2012-04-23 2012-04-23
PCT/IB2013/052876 WO2013160788A1 (en) 2012-04-23 2013-04-11 Integrated electronics module with cooling structure

Publications (1)

Publication Number Publication Date
BR112014026062A2 true BR112014026062A2 (pt) 2017-06-27

Family

ID=48483116

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014026062A BR112014026062A2 (pt) 2012-04-23 2013-04-11 módulo de eletrônica integrado

Country Status (7)

Country Link
US (1) US20150123663A1 (pt)
EP (1) EP2842162A1 (pt)
JP (1) JP6267686B2 (pt)
CN (1) CN104428891B (pt)
BR (1) BR112014026062A2 (pt)
RU (1) RU2640574C2 (pt)
WO (1) WO2013160788A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016210148A1 (en) * 2015-06-23 2016-12-29 Cubic Corporation Plastic chassis for liquid cooled electronic components
US10237967B2 (en) * 2015-10-02 2019-03-19 Analogic Corporation Cooling assembly for electronics assembly of imaging system
US11010326B2 (en) 2018-09-20 2021-05-18 Western Digital Technologies, Inc. Universal serial bus voltage reducing adaptor

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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SU1325963A1 (ru) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Радиоэлектронный блок
EP0225108B1 (en) * 1985-11-19 1989-10-25 Nec Corporation Liquid cooling system for integrated circuit chips
EP0236065B1 (en) * 1986-02-25 1990-11-28 Nec Corporation Liquid cooling system for integrated circuit chips
JPS6351454U (pt) * 1986-09-22 1988-04-07
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
JPH06209060A (ja) * 1992-10-15 1994-07-26 Sun Microsyst Inc 半導体チップを冷却する装置及び方法
JPH08103426A (ja) * 1994-10-06 1996-04-23 Toshiba Corp 磁気共鳴イメージング装置の遮蔽シート
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
US6011245A (en) * 1999-03-19 2000-01-04 Bell; James H. Permanent magnet eddy current heat generator
JP2002200055A (ja) * 2000-12-28 2002-07-16 Toshiba Medical System Co Ltd 磁気共鳴イメージング装置
JP2002094192A (ja) * 2000-09-12 2002-03-29 Denki Kagaku Kogyo Kk 回路基板の冷却構造
DE20115922U1 (de) * 2001-01-11 2002-01-17 Siemens AG, 80333 München Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
US20060293727A1 (en) * 2002-05-09 2006-12-28 Greg Spooner System and method for treating exposed tissue with light emitting diodes
JP2005288044A (ja) * 2004-04-06 2005-10-20 Hitachi Medical Corp 磁気共鳴イメージング装置
GB2419417B (en) * 2004-10-20 2007-05-16 Gen Electric Gradient bore cooling and RF shield
US7397665B2 (en) 2004-12-08 2008-07-08 Optherm - Thermal Solutions Ltd. Integral heat-dissipation system for electronic boards
US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger
RU53072U1 (ru) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") Устройство для охлаждения и термостатирования полупроводниковых приборов
JP4759384B2 (ja) * 2005-12-20 2011-08-31 昭和電工株式会社 半導体モジュール
RU2474444C2 (ru) 2006-08-30 2013-02-10 Конинклейке Филипс Электроникс Н.В. Устройство для термотерапии ткани
ATE505067T1 (de) * 2006-10-27 2011-04-15 Agie Charmilles Sa Leiterplatteneinheit und verfahren zur herstellung dazu
JP5222735B2 (ja) * 2007-02-06 2013-06-26 株式会社日立メディコ 磁気共鳴イメージング装置および傾斜磁場コイル
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
DE102009005915B4 (de) * 2009-01-23 2013-07-11 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
US10357667B2 (en) 2009-09-24 2019-07-23 Profound Medical Inc. High intensity focused ultrasound positioning mechanism
DE102009046321B4 (de) * 2009-11-03 2013-10-17 Bruker Biospin Ag Kühlvorrichtung zur kryogenen Kühlung eines NMR-Detektionssystems mit Hilfe eines mit kryogenen Fluid gefüllten Behälters
CN201667332U (zh) * 2010-03-29 2010-12-08 比亚迪股份有限公司 一种半导体功率模块
DE102010032078B4 (de) * 2010-07-23 2012-02-16 Siemens Aktiengesellschaft Leistungselektronik-Baueinheit für eine Magnetresonanzeinrichtung und Magnetresonanzeinrichtung

Also Published As

Publication number Publication date
RU2014146775A (ru) 2016-06-10
RU2640574C2 (ru) 2018-01-10
JP2015518660A (ja) 2015-07-02
US20150123663A1 (en) 2015-05-07
WO2013160788A1 (en) 2013-10-31
CN104428891B (zh) 2018-03-13
JP6267686B2 (ja) 2018-01-24
CN104428891A (zh) 2015-03-18
EP2842162A1 (en) 2015-03-04

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements