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AU7564381A - Unhoused single-in-line circuit modules - Google Patents

Unhoused single-in-line circuit modules

Info

Publication number
AU7564381A
AU7564381A AU75643/81A AU7564381A AU7564381A AU 7564381 A AU7564381 A AU 7564381A AU 75643/81 A AU75643/81 A AU 75643/81A AU 7564381 A AU7564381 A AU 7564381A AU 7564381 A AU7564381 A AU 7564381A
Authority
AU
Australia
Prior art keywords
unhoused
line circuit
circuit modules
modules
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU75643/81A
Inventor
Robert Bradish
Herbert Prussas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19803036196 external-priority patent/DE3036196A1/en
Priority claimed from DE19813121000 external-priority patent/DE3121000A1/en
Priority claimed from DE19813121515 external-priority patent/DE3121515A1/en
Priority claimed from DE19813123201 external-priority patent/DE3123201A1/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of AU7564381A publication Critical patent/AU7564381A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU75643/81A 1980-09-25 1981-09-24 Unhoused single-in-line circuit modules Abandoned AU7564381A (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
DE19803036196 DE3036196A1 (en) 1980-09-25 1980-09-25 Single in=line circuit module with no package - has metal plate heat sink, and is used esp. as coder-decoder in digital telecommunications systems
DE30361967 1980-09-25
DE19813121000 DE3121000A1 (en) 1981-05-26 1981-05-26 Single-in-line circuit module which has no housing and can be plugged in vertically
DE31210007 1981-05-26
DE19813121515 DE3121515A1 (en) 1981-05-29 1981-05-29 Single-in-line circuit module which has no housing and can be plugged in vertically
DE31215157 1981-05-29
DE19813123201 DE3123201A1 (en) 1981-06-11 1981-06-11 Single-in-line circuit module which has no housing and can be plugged in vertically
DE31232019 1981-06-11

Publications (1)

Publication Number Publication Date
AU7564381A true AU7564381A (en) 1983-03-31

Family

ID=27432577

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75643/81A Abandoned AU7564381A (en) 1980-09-25 1981-09-24 Unhoused single-in-line circuit modules

Country Status (6)

Country Link
EP (1) EP0048938B1 (en)
AR (1) AR229102A1 (en)
AU (1) AU7564381A (en)
BR (1) BR8106123A (en)
DE (1) DE3175034D1 (en)
LU (1) LU83439A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2522917A1 (en) * 1982-03-05 1983-09-09 Lignes Telegraph Telephon Telecommunications equipment rack with component cooling system - is partic. applicable to optical communication laser diode cooling and confines cooled space in narrow vertical channels
FR2567324B1 (en) * 1984-07-06 1986-11-28 Telemecanique Electrique MOUNTING DEVICE FOR A HYBRID COMPONENT WITH A THICK LAYER, ESPECIALLY FOR AN ELECTRONIC MODULE
EP0216174A1 (en) * 1985-09-25 1987-04-01 Siemens Aktiengesellschaft Light-directive coupling unit
DE3605692A1 (en) * 1986-02-21 1986-11-06 Siemens AG, 1000 Berlin und 8000 München TEMPERATURE CHANGES EXPOSED ARRANGEMENT
EP0268935B1 (en) * 1986-11-28 1991-12-18 Siemens Aktiengesellschaft Vertically pluggable single-in-line circuit module
DE3722119A1 (en) * 1987-07-03 1989-01-12 Siemens Ag CIRCUIT MODULE WITH A PLATE-SHAPED CIRCUIT BRACKET MADE OF GLASS OR CERAMIC
DE3738506A1 (en) * 1987-11-13 1989-06-01 Dornier System Gmbh ANTENNA STRUCTURE
FR2663809B1 (en) * 1990-06-21 1996-07-19 Siemens Automotive Sa MULTIPLE SPRING RETAINER AND MANUFACTURING METHOD THEREOF.
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
DE4240755A1 (en) * 1992-12-03 1994-06-16 Siemens Ag Electronic control device for motor vehicle engine or ABS system - has cooling plate with PCBs fixed on both sides and with housing fixing section which extends out of housing
DE4240754A1 (en) * 1992-12-03 1994-06-16 Siemens Ag Electronic control device for motor vehicle engine or ABS system - has edge walls of cooling plate, plug connector and housing frame or cover forming four narrow sides of housing
DE9319473U1 (en) * 1993-12-17 1994-06-23 Siemens AG, 80333 München Hybrid circuit arrangement
CN111669923A (en) * 2020-07-03 2020-09-15 常州索维尔电子科技有限公司 Controller heat dissipation device and installation method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1243254B (en) * 1964-08-07 1967-06-29 Telefunken Patent Support body for microcircuits
DE2107786C3 (en) * 1971-02-18 1983-01-27 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Semiconductor component
DE2165649A1 (en) * 1971-12-30 1973-07-12 Staver Co HEAT SINK
DE2344145A1 (en) * 1973-09-01 1975-03-13 Bosch Gmbh Robert Central electronic unit for vehicles - has control element with support having contact springs
DE2516007A1 (en) * 1974-04-16 1975-11-06 Lucas Electrical Co Ltd ELECTRONIC UNIT
DE7434817U (en) * 1974-10-17 1975-01-23 Siemens Ag Circuit board for insertion in chassis or chassis-like support bodies of control systems
US4041524A (en) * 1974-12-30 1977-08-09 The Staver Company, Inc. Heat dissipating device for transistor with outwardly extending heat conductive tab
IN148328B (en) * 1977-04-18 1981-01-17 Rca Corp
DE2806518A1 (en) * 1978-02-16 1979-08-30 Bosch Gmbh Robert ARRANGEMENT FOR CONNECTING AND PACKING AT LEAST ONE SEMICONDUCTOR BODY

Also Published As

Publication number Publication date
EP0048938B1 (en) 1986-07-30
DE3175034D1 (en) 1986-09-04
BR8106123A (en) 1982-06-15
AR229102A1 (en) 1983-06-15
LU83439A1 (en) 1981-10-29
EP0048938A1 (en) 1982-04-07

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